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asmt-ytb0-0xxxx plcc-6 surface mount tricolor led data sheet caution: leds are class 1c esd sensitive. please observe appropriate precautions during handling and processing. please refer to avago application note an-1142 for additional details. description this family of surface mount tricolor leds are housed in a plcc-6 package. they are designed with a separate heat path for each led die, enabling them to be driven at higher current. the high reliability package is able to with- stand a wide range of environmental conditions making them ideally suited for interior and exterior full color sign applications. a super wide viewing angle of 115 combined with a built in reflector increase the intensity of the light output making these leds suitable for interior electronics signs applications. the black surface top provides better con- trast enhancement especially in the full color sign applica- tions. these leds are compatible with reflow soldering process and to facilitate easy pick & place assembly, the leds are packed in eia-compliant tape and reel. each reel will be shipped in single intensity and color bin; except red color to provide close uniformity. features industry standard plcc-6 package (plastic leaded chip carrier) with individual addressable pin-out for higher flexibility of driving configuration high reliability led package with silicone encapsulation high brightness using alingap and ingan dice technologies wide viewing angle at 115 compatible with reflow soldering process jedec msl 2a water-resistant (ipx6*) per iec 60529:2001 * the test is conducted on component level by mounting the components on pcb with proper potting to protect the leads. it is strongly recommended that customers perform necessary tests on the components for their final application. applications indoor and outdoor full color display
2 4.000.20 4.400.20 3.700.20 4.400.20 0.65 0.80 red green blue 0.90.2 1.35 3.500.20 1 2 3 4 5 6 1 2 3 4 5 6 0.900.20 2.600.20 3.90 3.40 pin 1 table 1. device selection guide part number color 1 color 2 color 3 asmt-ytb0-0xxxx alingap red ingan green ingan blue part number color 1 - red color 2 - green color 3 - blue min. iv @20ma typ. iv @20ma min. iv @ 20ma typ. iv @ 20ma min. iv @ 20ma typ. iv @ 20ma bin id (mcd) (mcd) bin id (mcd) (mcd) bin id (mcd) (mcd) ASMT-YTB0-0AA02 u1 450 648 v2 900 1243 s2 224 238 notes: 1. the luminous intensity iv, is measured at the mechanical axis of the led package. the actual peak of the spatial radiation p attern may not be aligned with this axis. 2. tolerance = 12 % notes: 1. all dimensions are in millimeters 2. tolerance = 0.2 mm unless otherwise specified 3. terminal finish: ag plating 4. encapsulantion material: silicone resin lead configuration 1 cathode blue 2 cathode green 3 cathode red 4 anode red 5 anode green 6 anode blue figure 1. package drawing. package dimensions
3 part numbering system a s m t Cy t b 0C x 1 x 2 x 3 x 4 x 5 packaging option color bin selection intensity bin limit intensity bin selection device speci?cation con?guration table 2. absolute maximum ratings (t a = 25c) parameter red green & blue unit dc forward current [1] 50 30 ma peak forward current [2] 100 100 ma power dissipation 120 117 mw reverse voltage 4v [3] v maximum junction temperature tj max 125 c operating temperature range - 40 to + 110 [4] c storage temperature range - 40 to + 110 c note: 1. derate linearly as shown in figure 5a & 5b. 2 duty factor = 0.5%, frequency = 500hz 3. driving the led in reverse bias condition is suitable for short term only 4 refer to figure 5a and figure 5b for more information table 3. optical characteristics (t a = 25c) color dominant wavelength, d (nm) [5] peak wavelength, p (nm) viewing angle 2 ? [6] (degrees) luminous efficac v [7] (lm/w) luminous efficiency e (lm/w) total flux / luminous intensity [8] v / i v (lm/cd) min typ. max typ. typ. typ. typ. typ. red 618 621 628 629 115 200 40 2.60 green 525 528 535 521 115 530 50 2.60 blue 465 470 475 465 115 70 10 2.60 notes: 5. the dominant wavelength is derived from the cie chromaticity diagram and represents the perceived color of the device. 6. ? is the off axis angle where the luminous intensity is ? the peak intensity 7. radiant intensity, ie in watts / ster adian, may be calculated from the equation ie = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens / watt. 8. v is the total luminous flux output as measured with an integrating sphere at mono pulse condition.
4 table 4. electrical characteristics (t a = 25c) color forward voltage, v f (v) [1] reverse voltage v r @ 100a reverse voltage v r @ 10a min typ. max. min. min. red 1.80 2.10 2.40 4 - green 2.80 3.20 3.90 - 4 blue 2.80 3.20 3.90 - 4 note: 1. tolerance 0.1v. 0.0 0.2 0.4 0.6 0.8 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity alingap red ingan green ingan blue 0 5 10 15 20 25 30 35 40 45 50 0 1 2 3 4 forward voltage - v forward current C ma alingap ingan 0.00 0.50 1.00 1.50 2.00 2.50 3.00 0 102030405060 dc forward current - ma relative luminous intensity (normalization at 20 ma) i n g a n ali n g a p figure 2. relative intensity vs. wavelength figure 3. forward current vs. forward voltage figure 4. relative intensity vs. forward current
5 -3 -2 -1 0 1 2 3 4 5 6 7 0 10 20 30 40 50 forward current - ma dominant wavelength shift (normalized at 20ma) - nm green blue red 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensit y red green blue 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensit y red green blue 0 10 20 30 40 50 60 0 20 40 60 80 100 120 ambient temperature (c) max. allowable dc current (ma) ingan 0 10 20 30 40 50 60 0 20 40 60 80 100 120 ambient temperature (c) max. allowable dc current (ma) ingan alingap alingap figure 5a. maximum forward current vs. ambient temperature. derated based on t j max = 125c.(3 chips) figure 5b. maximum forward current vs. ambient temperature. derated based on t j max = 125c. (single chip) figure 6. dominant wavelength shift (normalized at 20ma) figure 7a. component axis for radiation patterns figure 7b. radiation pattern for x axis figure 7c. radiation pattern for y axis
6 figure 8. relative intensity vs junction temperature 0.1 1 10 -50 -25 0 25 50 75 100 125 t j - junction temperature - c normalized luminous intensity -0.40 -0.30 -0.20 -0.10 0.00 0.10 0.20 0.30 -50 -25 0 25 50 75 100 125 t j - junction temperature - c forward voltage shift - v red green blue red green blue re?ow soldering direction 4.20 1.60 2.60 1.10 4.20 0.40 1.60 1.10 4.20 4.20 3.15 0.80 0.65 3.15 +ve +ve +ve 8.40 -ve -ve -ve 0.80 solder mask h l dimension of lxh should be > 3.9mm x 3.4mm figure 9. forward voltage vs junction temperature figure 10. recommended soldering land pattern. figure 11. recommended pick and place nozzle tip
7 figure 12. recommended leaded reflow soldering profile 240c max. 20 sec. max. 3c/sec. max. 120 sec. max. time temperature 183c 100-150c -6c/sec. max. 60-150 sec. 3c/sec. max. 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. 10 to 30 sec. time temperature 8.00 0.10 4.00 0.10 1.75 0.10 2.00 0.05 ?1.50 +0.10 ?1.50 +0.25 0.32 0.02 3.83 0.10 4.85 0.10 12.00 +0.30 -0.10 5.50 0.05 figure 13. recommended pb-free reflow soldering profile. note: for detail information on reflow soldering of avago surface mount leds, do refer to avago application note an 1060 surface mount ing smt led indicator components figure 14. carrier tape dimension
8 ?3.500.50 2.500.50 label area 2.30 2.30 330.0 ?330.0+1.0 ?99.5+1.0 figure 15. reel dimension pin 1 printed label figure 16. reeling orientation
9 intensity bin limits bin id min (mcd) max (mcd) s2 224.0 285.0 t1 285.0 355.0 t2 355.0 450.0 u1 450.0 560.0 u2 560.0 715.0 v1 715.0 900.0 v2 900.0 1125.0 w1 1125.0 1400.0 w2 1400.0 1800.0 x1 1800.0 2240.0 tolerance of each bin limit 12% color bin limits red min (nm) max (nm) full distribution 618.0 628.0 green min (nm) max (nm) c 525.0 530.0 d 530.0 535.0 blue min (nm) max (nm) b 465.0 470.0 c 470.0 475.0 tolerance of each bin limit is 1 nm intensity bin select (x 2 , x 3 ) individual reel will contain parts from 1 half bin only x 2 min iv bin (minimum intensity bin) red green blue 0000 au1v2s2 x 3 number of half bin from x 2 red green blue 0000 a444 note: 0 represents no maximum bin limit color bin select (x 4 ) individual reel will contain part from 1 full bin only x 4 color bin combinations red green blue 0 full distribution c & d b & c
10 packaging option (x 5 ) option test current package type reel size 2 20ma top mount 13 inch note: each reel contains 1000pcs led 0.00 0. 1 0 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 0.00 0. 1 0 0.20 0.30 0.40 0.50 0.60 0.70 0.80 x - coord i na t e y - coord i na t e cd b c red green b l ue
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-1095en - april 15, 2010 handling precaution the encapsulation material of the product is made of sili- cone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly of handling, the unit should be held on the body only. please refer to avago application note an 5288 for detail infor- mation. moisture sensitivity this product is qualified as moisture sensitive level 2a per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reli- ability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to reflow the leds per the original msl rating. it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb the humidity indicator card (hic) shall be read immediately upon opening of mbb. the leds must be kept at <30c / 60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. c. control for unfinished reel for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their floor life of 672 hours e. baking is required if: the hic indicator is not green at 10% and is azure at 5% the leds are exposed to condition of >30c / 60% rh at any time. the led floor life exceeded 672hrs. recommended baking condition: 605c for 20hrs.

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