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caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. hlmp-lm65, hlmp-lb65 precision optical performance green and blue new 4mm standard oval leds data sheet description this precision optical performance oval leds are speci?- cally designed for full color/video and passenger infor- mation signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide ?eld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains both uv-a and uv-b inhibi- tors to reduce the e?ects of long term exposure to direct sunlight. applications full color signs features well de?ned spatial radiation pattern high brightness material available in green and blue color green ingan 525nm blue ingan 470nm superior resistance to moisture stando? package tinted and di?used typical viewing angle 50 x100 package dimensions notes: all dimensions in millimeters (inches). tolerance is 0.20mm unless other speci?ed 7.26 0.20 0.286 0.008 10.00 0.50 0.394 0.020 3.80 0.20 0.1496 0.008 1.25 0.20 0.049 0.008 sq typ. 2.54 0.30 0.100 0.012 1.0 0.039 3.00 0.20 0.118 0.008 min. 0.80 0.031 max. epoxy meniscus cathode lead 21.0 0.827 min. note: 1. measured at base of lens. 0.50 0.10 0.020 0.004
2 device selection guide part number color and dominant wavelength d (nm) typ luminous intensity iv (mcd) at 20 ma-min [1] luminous intensity iv (mcd) at 20 ma-max [1] hlmp-lm65-z30xx green 525 2400 5040 hlmp-lb65-ru0xx blue 470 550 1150 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. part numbering system note: please refer to ab 5337 for complete information about part numbering system h lmp - l x 65 - x x x xx pac k aging op t ion dd: ammo packs co l or bin se l ec t ion 0: fu ll distribution maximum i n t ensi t y bin refer to se l ection guide minimum i n t ensi t y bin refer to device se l ection guide. co l or m: green 525 b: b l ue 470 pac k age l: 4mm standard ova l 50x 1 00 zz : f l exi ammopacks
3 absolute maximum ratings t j = 25c parameter green/ blue unit dc forward current [1] 30 ma peak forward current 100 [2] ma power dissipation 114 mw reverse voltage 5 (i r =10a) v led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 2. 2. duty factor 10%, frequency 1khz. electrical / optical characteristics t j = 25c parameter symbol min. typ. max. units test conditions forward voltage green blue v f 2.8 2.8 3.2 3.2 3.8 3.8 vi f = 20 ma reverse voltage green blue v r 5 5 vi r = 10 a dominant wavelength [1] green blue d 520 460 525 470 540 480 nm i f = 20 ma peak wavelength green blue peak 516 464 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-cathode lead luminous e?cacy [2] green blue v 530 65 lm/w emitted luminous power/emitted radiant power luminous e?ciency [3] green blue e 60 13 luminous flux/ electrical power i f = 20 ma notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp 2. the radiant intensity, ie in watts per steradian, may be found from the equation ie = i v / v where i v is the luminous intensity in candelas and v is the luminous e?cacy in lumens/watt. 3. e = v / i f x v f , where v is the emitted luminous ?ux, i f is electrical forward current and v f is the forward voltage.
4 ingan green figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative intensity vs forward current f igure 4. maximum forward current vs ambient temperature figure 5. relative dominant wavelength vs forward current 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 wavelength - nm relative intensity green blue 0 5 10 15 20 25 30 35 0 20 40 60 80 100 t a - ambienttemperature - c i f max - maximum forward current - ma 0 20 40 60 80 100 012345 forward voltage - v forward current - ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 20 40 60 80 100 120 dc forward current - ma relative luminous intensity (normalized at 20ma) blue -10 -8 -6 -4 -2 0 2 4 6 8 10 0 20406080100 forward current - ma relative dominant wavelength shift - nm green blue green
5 figure 6. radiation pattern C major axis figure 7. radiation pattern C minor axis intensity bin limit table (1.2: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max r 550 660 s 660 800 t 800 960 u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 tolerance for each bin limit is 15% 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 angular displacement - degree normalized intensity green blue 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 angular displacement - degree normalized intensity gree blue figure 8. relative light output vs junction temperature figure 9. relative forward voltage vs junction temperature -0.3 -0.2 -0.1 0 0.1 0.2 0.3 -40 -20 0 20 40 60 80 100 120 t j - junction temperature - c forward voltage shift-v 0.1 1 10 -40 -20 0 20 40 60 80 100 120 t j - junction temperature - c relative light output (normalized at t j =25c) blue green green blue
6 avago color bin on cie 1931 chromaticity diagram 0.000 0.200 0.400 0.600 0.800 1 .000 0.000 0.200 0.400 0.600 0.800 x y 3 4 5 b l ue 2 1 1 2 3 4 5 green blue color bin table bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerance for each bin limit is 0.5nm note: 1. all bin categories are established for classi?cation of products. products may not be available in all bin categories. pleas e contact your avago representative for further information. green color bin table bin min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 tolerance for each bin limit is 0.5nm
7 precautions: lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: care must be taken during pcb assembly and soldering process to prevent damage to the led component. led component may be e?ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1 .59mm esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105c max. - preheat time 60 sec max - peak temperature 260c max. 260c max. dwell time 5 sec max. 5 sec max note: 1. above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2. it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering pro?le to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with di?erent size and design (component density) will have di?erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering pro?le again before loading a new type of pcb. avago technologies led con?guration any alignment ?xture that is being applied during wave soldering should be loosely ?tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment ?xture or pallet. if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using re?ow soldering prior to insertion the th led. recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause di?culty inserting the th led. refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. ca th ode i ngan device
8 ammo packs drawing 6.35 1 .30 0.250.05 1 2 9. 1 250.625 0.35930.025 1 8.000.50 0.70870.0 1 97 1 2.700.30 0.500.0 11 8 20.5 1 .00 0.807 1 0.0394 1 2.70 1 .00 0.500.0394 v i ew a - a 0.700.20 0.2760.0079 4.000.20 0. 1 5750.0079 ? t yp. ca th ode example of wave soldering temperature pro?le for th led recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 255c 5c (maximum peak temperature = 260c) dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. 60 sec max time (sec) 260c max 105c max temperature (c)
9 packaging box for ammo packs note: for ingan device, the ammo pack packaging box contain esd logo packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) label on thi s s i de o f box f rom le ft s i de o f box ad h es i ve t ape mus t be f ac i ng upwards. anode lead leaves th e box fi rs t .

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disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main- tenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its sup- pliers, for all loss, damage, expense or liability in connection with such use. (ii) avago baby label (only available on bulk packaging) '+3
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for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-1148en - february 10, 2010

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