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| to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics. the mark data sheet m14466ej7v0ds 2 pd448012- x ordering information part number package access time o perating operating remark ns (max.) supply voltage temperature v c pd448012gy-b55x-mjh 48-pin plastic tsop (i) 55 2.7 to 3.6 ? 25 to +85 b version pd448012gy-b70x-mjh (12x18) (normal bent) 70 pd448012gy-b85x-mjh 85 pd448012gy-b10x-mjh 100 pd448012gy-c70x-mjh 70 2.2 to 3.6 c version pd448012gy-c85x-mjh 85 pd448012gy-c10x-mjh 100 pd448012gy-c12x-mjh 120 pd448012gy-b55x-mjh-a 55 2.7 to 3.6 b version pd448012gy-b70x-mjh-a 70 pd448012gy-b85x-mjh-a 85 pd448012gy-b10x-mjh-a 100 pd448012gy-c70x-mjh-a 70 2.2 to 3.6 c version pd448012gy-c85x-mjh-a 85 pd448012gy-c10x-mjh-a 100 pd448012gy-c12x-mjh-a 120 remark products with -a at the end of t he part number are lead-free products. data sheet m14466ej7v0ds 3 pd448012- x pin configuration (marking side) /xxx indicates active low signal. 48-pin plastic tsop (i) (12x18) (normal bent) [ pd448012gy-bxxx-mjh ] [ pd448012gy-cxxx-mjh ] [ pd448012gy-bxxx-mjh-a ] [ pd448012gy-cxxx-mjh-a ] a15 a14 a13 a12 a11 a10 a9 a8 nc nc /we ce2 nc /ub /lb a18 a17 a7 a6 a5 a4 a3 a2 a1 a16 nc gnd i/o16 i/o8 i/o15 i/o7 i/o14 i/o6 i/o13 i/o5 v cc i/o12 i/o4 i/o11 i/o3 i/o10 i/o2 i/o9 i/o1 /oe gnd /ce1 a0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 a0 - a18 : address inputs i/o1 - i/o16 : data inputs / outputs /ce1, ce2 : chip enable 1, 2 /we : write enable /oe : output enable /lb, /ub : byte data select v cc : power supply gnd : ground nc : no connection remark refer to package drawing for the 1-pin index mark. data sheet m14466ej7v0ds 4 pd448012- x block diagram address buffer address buffer row decoder memory cell array 8,388,608 bits input data controller a0 a18 i/o9 - i/o16 /ce1 /we /oe ce2 /ub /lb output data controller i/o1 - i/o8 v cc gnd sense amplifier / switching circuit column decoder truth table /ce1 ce2 /oe /we /lb /ub mode i/o supply current i/o1 - i/o8 i/o9 - i/o16 h not selected high impedance high impedance i sb l l h h h output disable hi gh impedance high impedance i cca l h l l word read d out d out l h lower byte read d out high impedance h l upper byte read high impedance d out l l l word write d in d in l h lower byte write d in high impedance h l upper byte write high impedance d in h h not selected high impedance high impedance i sb remark : v ih or v il data sheet m14466ej7v0ds 5 pd448012- x electrical specifications absolute maximum ratings parameter symbol condition rating unit supply voltage v cc ?0.5 note to +4.0 v input / output voltage v t ?0.5 note to v cc + 0.4 (4.0 v max.) v operating ambient temperature t a ?25 to +85 c storage temperature t stg ?55 to +125 c note ?3.0 v (min.) (pulse width : 30 ns) caution exposing the device to stress above those listed in absolute maximum rating could cause permanent damage. the device is not meant to be operated under conditions outside the limits described in the operational section of this speci fication. exposure to absolute maximum rating conditions for extended periods may affect device reliability. recommended operating conditions parameter symbol condition pd448012-bxxx pd448012-cxxx unit min. max. min. max. supply voltage v cc 2.7 3.6 2.2 3.6 v high level input voltage v ih 2.7 v v cc 3.6 v 2.4 v cc + 0.4 2.4 v cc + 0.4 v 2.2 v v cc < 2.7 v ? ? 2.0 v cc + 0.3 low level input voltage v il ?0.3 note +0.5 ?0.3 note +0.3 v operating ambient temperature t a ?25 +85 ?25 +85 c note ?1.5 v (min.) (pulse width: 30 ns) capacitance (t a = 25 c, f = 1 mhz) parameter symbol test condition min. typ. max. unit input capacitance c in v in = 0 v 8 pf input / output capacitance c i/o v i/o = 0 v 10 pf remarks 1. v in : input voltage, v i/o : input / output voltage 2. these parameters ar e not 100% tested. data sheet m14466ej7v0ds 6 pd448012- x dc characteristics (recommended operating c onditions unless otherwise noted) (1/2) parameter symbol test condition v cc 2.7 v unit pd448012-bxxx min. typ. max. input leakage current i li v in = 0 v to v cc ?1.0 +1.0 a i/o leakage current i lo v i/o = 0 v to v cc , /ce1 = v ih or ?1.0 +1.0 a ce2 = v il or /we = v il or /oe = v ih operating supply current i cca1 /ce1 = v il , ce2 = v ih , cycle time = 55 ns ? 50 ma minimum cycle time, cycle time 70 ns ? 45 i i/o = 0 ma i cca2 /ce1 = v il , ce2 = v ih , i i/o = 0 ma, ? 4 cycle time = i cca3 /ce1 0.2 v, ce2 v cc ? 0.2 v, ? 6 cycle time = 1 s, i i/o = 0 ma, v il 0.2 v, v ih v cc ? 0.2 v standby supply current i sb /ce1 = v ih or ce2 = v il or /lb = /ub = v ih ? 0.6 ma i sb1 /ce1 v cc ? 0.2 v, ce2 v cc ? 0.2 v 1.0 15 a i sb2 ce2 0.2 v 1.0 15 i sb3 /lb = /ub v cc ? 0.2 v, 1.0 15 /ce1 0.2 v, ce2 v cc ? 0.2 v high level output voltage v oh i oh = ?0.5 ma 2.4 v low level output voltage v ol i ol = 1.0 ma 0.4 v remarks 1. v in : input voltage, v i/o : input / output voltage 2. these dc characteristics are in common regardless of product classification. data sheet m14466ej7v0ds 7 pd448012- x dc characteristics (recommended operating c onditions unless otherwise noted) (2/2) parameter symbol test condition v cc 2.2 v unit pd448012-cxxx min. typ. max. input leakage current i li v in = 0 v to v cc ?1.0 +1.0 a i/o leakage current i lo v i/o = 0 v to v cc , /ce1 = v ih or ?1.0 +1.0 a ce2 = v il or /we = v il or /oe = v ih operating supply current i cca1 /ce1 = v il , ce2 = v ih , minimum cycle time, ? 45 ma i i/o = 0 ma v cc 2.7 v ? 30 i cca2 /ce1 = v il , ce2 = v ih , i i/o = 0 ma, ? 4 cycle time = v cc 2.7 v ? 2 i cca3 /ce1 0.2 v, ce2 v cc ? 0.2 v, ? 6 cycle time = 1 s, i i/o = 0 ma, v il 0.2 v, v ih v cc ? 0.2 v v cc 2.7 v ? 5 standby supply current i sb /ce1 = v ih or ce2 = v il or ? 0.6 ma /lb = /ub = v ih v cc 2.7 v ? 0.6 i sb1 /ce1 v cc ? 0.2 v, 1.0 15 a ce2 v cc ? 0.2 v v cc 2.7 v 0.9 13 i sb2 ce2 0.2 v 1.0 15 v cc 2.7 v 0.9 13 i sb3 /lb = /ub v cc ? 0.2 v, /ce1 0.2 v, 1.0 15 ce2 v cc ? 0.2 v v cc 2.7 v 0.9 13 high level output voltage v oh i oh = ?0.5 ma 2.4 v v cc 2.7 v 1.8 low level output voltage v ol i ol = 1.0 ma 0.4 v remarks 1. v in : input voltage, v i/o : input / output voltage 2. these dc characteristics are in comm on regardless of product classification. data sheet m14466ej7v0ds 8 pd448012- x ac characteristics (recommended operati ng conditions unless otherwise noted) ac test conditions [ pd448012-b55x, pd448012-b70x, pd448012-b85x, pd448012-b10x ] input waveform (rise and fall time 5 ns) 0.1 v cc 0.9 v cc test points v cc /2 v cc /2 output waveform test points v cc /2 v cc /2 output load 1ttl + 50 pf [ pd448012-c70x, pd448012-c85x, pd448012-c10x, pd448012-c12x ] input waveform (rise and fall time 5 ns) 0.1 v cc 0.9 v cc test points v cc /2 v cc /2 output waveform test points v cc /2 v cc /2 output load 1ttl + 30 pf data sheet m14466ej7v0ds 9 pd448012- x read cycle (1/2) (b version) parameter symbol v cc 2.7 v unit condition pd448012 pd448012 pd448012 pd448012 -b55x -b70x -b85x -b10x min. max. min. max. min. max. min. max. read cycle time t rc 55 70 85 100 ns address access time t aa 55 70 85 100 ns note 1 /ce1 access time t co1 55 70 85 100 ns ce2 access time t co2 55 70 85 100 ns /oe to output valid t oe 30 35 40 50 ns /lb, /ub to output valid t ba 55 70 85 100 ns output hold from address change t oh 10 10 10 10 ns /ce1 to output in low impedance t lz1 10 10 10 10 ns note 2 ce2 to output in low impedance t lz2 10 10 10 10 ns /oe to output in low impedance t olz 0 0 0 0 ns /lb, /ub to output in low impedance t blz 10 10 10 10 ns /ce1 to output in high impedance t hz1 20 25 30 35 ns ce2 to output in high impedance t hz2 20 25 30 35 ns /oe to output in high impedance t ohz 20 25 30 35 ns /lb, /ub to output in high impedance t bhz 20 25 30 35 ns notes 1. the output load is 1ttl + 50 pf. 2. the output load is 1ttl + 5 pf. read cycle (2/2) (c version) parameter symbol v cc 2.2 v unit condition pd448012 pd448012 pd448012 pd448012 -c70x -c85x -c10x -c12x min. max. min. max. min. max. min. max. read cycle time t rc 70 85 100 120 ns address access time t aa 70 85 100 120 ns note 1 /ce1 access time t co1 70 85 100 120 ns ce2 access time t co2 70 85 100 120 ns /oe to output valid t oe 35 40 50 60 ns /lb, /ub to output valid t ba 70 85 100 120 ns output hold from address change t oh 10 10 10 10 ns /ce1 to output in low impedance t lz1 10 10 10 10 ns note 2 ce2 to output in low impedance t lz2 10 10 10 10 ns /oe to output in low impedance t olz 0 0 0 0 ns /lb, /ub to output in low impedance t blz 10 10 10 10 ns /ce1 to output in high impedance t hz1 25 30 35 40 ns ce2 to output in high impedance t hz2 25 30 35 40 ns /oe to output in high impedance t ohz 25 30 35 40 ns /lb, /ub to output in high impedance t bhz 25 30 35 40 ns notes 1. the output load is 1ttl + 30 pf. 2. the output load is 1ttl + 5 pf. data sheet m14466ej7v0ds 10 pd448012- x read cycle timing chart t hz2 t rc t oh t hz1 t blz t ba t lz2 t co2 t lz1 t co1 t bhz t aa high impedance data out /lb, /ub (input) ce2 (input) /ce1 (input) address (input) i/o (output) t olz t oe t ohz /oe (input) remark in read cycle, /we should be fixed to high level. data sheet m14466ej7v0ds 11 pd448012- x write cycle (1/2) (b version) parameter symbol v cc 2.7 v unit condition pd448012 pd448012 pd448012 pd448012 -b55x -b70x -b85x -b10x min. max. min. max. min. max. min. max. write cycle time t wc 55 70 85 100 ns /ce1 to end of write t cw1 50 55 70 80 ns ce2 to end of write t cw2 50 55 70 80 ns /lb, /ub to end of write t bw 50 55 70 80 ns address valid to end of write t aw 50 55 70 80 ns address setup time t as 0 0 0 0 ns write pulse width t wp 45 50 55 60 ns write recovery time t wr 0 0 0 0 ns data valid to end of write t dw 25 30 35 40 ns data hold time t dh 0 0 0 0 ns /we to output in high impedance t whz 20 25 30 35 ns note output active from end of write t ow 5 5 5 5 ns note the output load is 1ttl + 5 pf. write cycle (2/2) (c version) parameter symbol v cc 2.2v unit condition pd448012 pd448012 pd448012 pd448012 -c70x -c85x -c10x -c12x min. max. min. max. min. max. min. max. write cycle time t wc 70 85 100 120 ns /ce1 to end of write t cw1 55 70 80 100 ns ce2 to end of write t cw2 55 70 80 100 ns /lb, /ub to end of write t bw 55 70 80 100 ns address valid to end of write t aw 55 70 80 100 ns address setup time t as 0 0 0 0 ns write pulse width t wp 50 55 60 85 ns write recovery time t wr 0 0 0 0 ns data valid to end of write t dw 30 35 40 60 ns data hold time t dh 0 0 0 0 ns /we to output in high impedance t whz 25 30 35 40 ns note output active from end of write t ow 5 5 5 5 ns note the output load is 1ttl + 5 pf. data sheet m14466ej7v0ds 12 pd448012- x write cycle timing chart 1 (/we controlled) t wc t cw1 t bw t whz t dw t dh t ow indefinite data out high impe- dance high impe- dance data in indefinite data out address (input) /ce1 (input) /lb, /ub (input) i/o (input / output) ce2 (input) t cw2 t aw t wp t as t wr /we (input) cautions 1. during address transition, at least one of pins /ce1, ce2, /we should be inactivated. 2. do not input data to the i/o pins while they are in the output state. remarks 1. write operation is done during the ov erlap time of a low level /ce1, /we, /lb and/or /ub, and a high level ce2. 2. if /ce1 changes to low level at the same time or after the change of /we to low level, or if ce2 changes to high level at the same time or after the change of /we to low level, the i/o pins will remain high impedance state. 3. when /we is at low level, t he i/o pins are always high impedance. when /we is at high level, read operation is executed. ther efore /oe should be at high level to make the i/o pins high impedance. data sheet m14466ej7v0ds 13 pd448012- x write cycle timing chart 2 (/ce1 controlled) t wc t as t cw1 t dw t dh data in high impedance address (input) /ce1 (input) /lb, /ub (input) i/o (input) high impedance ce2 (input) t cw2 t aw t wp t wr /we (input) t bw cautions 1. during address transition, at least one of pins /ce1, ce2, /we should be inactivated. 2. do not input data to the i/o pins while they are in the output state. remark write operation is done during the ov erlap time of a low level /ce1, /we, /lb and/or /ub, and a high level ce2. data sheet m14466ej7v0ds 14 pd448012- x write cycle timing chart 3 (ce2 controlled) t wc t as t cw2 t bw t dw t dh data in high impedance address (input) ce2 (input) /lb, /ub (input) i/o (input) high impedance /ce1 (input) t cw1 t aw t wp t wr /we (input) cautions 1. during address transition, at least one of pins /ce1, ce2, /we should be inactivated. 2. do not input data to the i/o pins while they are in the output state. remark write operation is done during the ov erlap time of a low level /ce1, /we, /lb and/or /ub, and a high level ce2. data sheet m14466ej7v0ds 15 pd448012- x write cycle timing chart 4 (/lb, /ub controlled) t wc t dw t dh data in high impedance address (input) /lb, /ub (input) i/o (input) high impedance ce2 (input) t cw2 t aw t wp t wr /we (input) t as t bw /ce1 (input) t cw1 cautions 1. during address transition, at least one of pins /ce1, ce2, /we should be inactivated. 2. do not input data to the i/o pins while they are in the output state. remark write operation is done during the ov erlap time of a low level /ce1, /we, /lb and/or /ub, and a high level ce2. data sheet m14466ej7v0ds 16 pd448012- x low v cc data retention characteristics (t a = ?25 to +85 c) parameter symbol test condition v cc 2.7 v v cc 2.2 v unit pd448012 pd448012 -b x -c x min. typ. max. min. typ. max. data retention v ccdr1 /ce1 v cc ? 0.2 v, ce2 v cc ? 0.2 v 1.0 3.6 1.0 3.6 v supply voltage v ccdr2 ce2 0.2 v 1.0 3.6 1.0 3.6 v ccdr3 /lb = /ub v cc ? 0.2 v, 1.0 3.6 1.0 3.6 /ce1 0.2 v, ce2 v cc ? 0.2 v data retention i ccdr1 v cc = 1.5 v, /ce1 v cc ? 0.2 v, 0.5 6.0 0.5 6.0 a supply current ce2 v cc ? 0.2 v i ccdr2 v cc = 1.5 v, ce2 0.2 v 0.5 6.0 0.5 6.0 i ccdr3 v cc = 1.5 v, /lb = /ub v cc ? 0.2 v, 0.5 6.0 0.5 6.0 /ce1 0.2 v, ce2 v cc ? 0.2 v chip deselection t cdr 0 0 ns to data retention mode operation t r t rc note t rc note ns recovery time note t rc : read cycle time data sheet m14466ej7v0ds 17 pd448012- x data retention timing chart (1) /ce1 controlled v ih (min.) v ccdr (min.) v il (max.) v cc /ce1 /ce1 v cc ? 0.2 v gnd v cc (min.) note t cdr data retention mode t r note b version : 2.7 v, c version : 2.2 v remark on the data retention mode by controlling /ce1, the i nput level of ce2 must be v cc ? 0.2 v or 0.2 v. the other pins (address, i/o, /we, /oe, /l b, /ub) can be in high impedance state. (2) ce2 controlled v ih (min.) v ccdr (min.) v il (max.) v cc ce2 ce2 0.2 v gnd v cc (min.) note t cdr data retention mode t r note b version : 2.7 v, c version : 2.2 v remark on the data retention mode by controlling ce2, the other pins (/ce1, address, i/o, /we, /oe, /lb, /ub) can be in high impedance state. data sheet m14466ej7v0ds 18 pd448012- x (3) /lb, /ub controlled t cdr data retention mode v ih (min.) v ccdr (min.) v il (max.) t r v cc /lb, /ub /lb, /ub v cc ? 0.2 v gnd v cc (min.) note note b version : 2.7 v, c version : 2.2 v remark on the data retention mode by c ontrolling /lb and /ub, the input le vel of /ce1 and ce2 must be v cc ? 0.2 v or 0.2 v. the other pins (address, i/o, /we, /oe) can be in high impedance state. data sheet m14466ej7v0ds 19 pd448012- x package drawing notes 48-pin plastic tsop( i ) (12x18) item millimeters a b c e i 12.0 + ? s48gy-50-mjh1-1 s 0.60 data sheet m14466ej7v0ds 20 pd448012- x recommended soldering conditions please consult with our sales offi ces for soldering conditions of the pd448012-x. types of surface mount device pd448012gy-bxxx-mjh : 48-pin plastic tsop (i) (12x18) (normal bent) pd448012gy-cxxx-mjh : 48-pin plastic tsop (i) (12x18) (normal bent) pd448012gy-bxxx-mjh-a : 48-pin plastic tsop (i) (12x18) (normal bent) pd448012gy-cxxx-mjh-a : 48-pin plastic tsop (i) (12x18) (normal bent) quality grade ? a quality grade of the products is ?standard?. ? anti-radioactive design is not implemented in the products. ? semiconductor devices have the possibilit y of unexpected defects by affection of cosmic ray that reach to the ground and so forth. data sheet m14466ej7v0ds 21 pd448012- x revision history edition/ page type of location description date this previous revi sion (previous edition this edition) edition edition 7th edition/ p.20 p.20 addition quality grade section of quality grade has been added. sep. 2006 data sheet m14466ej7v0ds 22 pd448012- x [ memo ] data sheet m14466ej7v0ds 23 pd448012- x 1 2 3 4 voltage application waveform at input pin waveform distortion due to input noise or a reflected wave may cause malfunction. if the input of the cmos device stays in the area between v il (max) and v ih (min) due to noise, etc., the device may malfunction. take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between v il (max) and v ih (min). handling of unused input pins unconnected cmos device inputs can be cause of malfunction. if an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd via a resistor if there is a possibility that it will be an output pin. all handling related to unused pins must be judged separately for each device and according to related specifications governing the device. precaution against esd a strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. environmental control must be adequate. when it is dry, a humidifier should be used. it is recommended to avoid using insulators that easily build up static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work benches and floors should be grounded. the operator should be grounded using a wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with mounted semiconductor devices. status before initialization power-on does not necessarily define the initial status of a mos device. immediately after the power source is turned on, devices with reset functions have not yet been initialized. hence, power-on does not guarantee output pin levels, i/o settings or contents of registers. a device is not initialized until the reset signal is received. a reset operation must be executed immediately after power-on for devices with reset functions. power on/off sequence in the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. when switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. the correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. input of signal during power off state do not input signals or an i/o pull-up power supply while the device is not powered. the current injection that results from input of such a signal or i/o pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. notes for cmos devices 5 6 pd448012- x the information in this document is current as of september, 2006. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1 |
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