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ds04-23510-2e fujitsu semiconductor data sheet assp 1.0 ghz band low power i/q modulator for direct conversion mb54608l/MB54608B n description the mb54608l/b is an i/q modulator for direct conversion method, and is used for up to 1.0 ghz band digital cellular phones such as gsm, pdc and so on. mb54608l consists of a frequency doubler, a flip-flop type quadrature phase shifter, i/q modulator and a mixer for frequency offset with a separate power supply. fujitsus advanced bipolar process has realized very low current operation(i cc = 16.5 ma @3 v). ssop-20 and bcc-16 package are available.(mb54608l: ssop-20, MB54608B: bcc-16) n features ? supporting gsm frequency band output frequency: 1.0 ghz (max.) output power: C4 dbm(typical, v bb = 1.0 vp-p input) ? low voltage operation: v cc = 2.6 v to 3.8 v (continued) n packages 20-pin plastic ssop (fpt-20p-m03) 16-pad plastic bcc (lcc-16p-m04)
2 mb54608l/MB54608B (continued) ? low current: please refer to below table. ? offset mixer on-chip: the separate power supply control is possible. (only mb54608l) ? output power level switch (mode) enables high power mode note:typical values further increase of the output power is possible by attaching a resistor at pcnt pin. ? operating temperature range: ta = C20 to +75 c offset mixer not used offset mixer used mode = open mode = gnd mode = open mode = gnd normal operation icc 16.5 ma 19.0 ma 22.5 ma 25.0 ma pout(v bb =1.0 vpCp) C4 dbm C2 dbm C4 dbm C2 dbm power down ips 0.22 ma 0.44 ma
3 mb54608l/MB54608B n pin assignments rfin (top view) (fpt-20p-m03) 1 gnd ifin v cc m l o l ox v cc gnd gnd gnd 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 pcnt psq out psm v cc mode i xi xq q 14 1 16 15 78 psq n.c. 2 3 4 5 6 xq xi i mode v cc out 13 12 11 10 9 gnd v cc l ox l o n.c. gnd q gnd (top view) (lcc-16p-m04) ? mb54608l (ssop-20) ? MB54608B (bbc-16) note: MB54608B doesnt have the off-set mixer and pcnt pin.
4 mb54608l/MB54608B n pin descriptions ? mb54608l (ssop-20) pin no. symbol i/o descriptions 1rfini rf input for the offset mixer. when the offset mixer is not used, this pin should be opened. 2 gnd ground. 3ifini if input for the offset mixer. when the offset mixer is not used, this pin should be opened. 4 vccm power supply for the offset mixer. power-on/off is possible indepently to the modulator. when the offset mixer is not used, this pin should be switched off. 5 lo i/o lo input for the i/q modulator (output for the offset mixer.) 6loxi/o lo complementary input for the i/q modulator (complementary output for the offset mixer.) 7 vcc power supply for the i/q modulator. 8 gnd ground. 9 gnd ground. 10 gnd ground. 11 q i q signal input for the i/q modulator. 12 xq i q signal complementary input for the i/q modulator. 13 xi i i signal complementary input for the i/q modulator. 14 i i i signal input for the i/q modulator. 15 mode output mode switch. mode = open: low power mode. mode = gnd: high power mode. this pin should be connected to ground or left open. 16 vcc power supply for the i/q modulator. 17 psm i power saving control for the offset mixer. when psm = l(gnd), power down mode is selected. when the offset mixer is not used, this pin should be connected to vcc voltage level or ground. 18 out o output for the i/q modulator. (open collector) open is prohibited when power is supplied to vcc pin. 19 psq i power saving control for the i/q modulator. when psq = l(gnd), power down mode is selected. 20 pcnt further, increasing the output power level is possible by attaching a resistor between pcnt pin and ground externally.
5 mb54608l/MB54608B ? MB54608B (bcc-16) pin no. pin nane i/o descriptions 1 xq i q signal complementary input for the i/q modulator. 2 xi i i signal complementary input for the i/q modulator. 3 i i i signal input for the i/q modulator. 4mode output mode switch. mode=open: low power mode. mode=gnd: high power mode. this pin should be connected to ground or left open. 5 vcc power supply for the i/q modulator. 6outo output for the i/q modulator. (open collector) open is prohibited when power is supplied to vcc pin. 7 psq i power saving control for the i/q modulator. when psq = l(gnd), power down mode is selected. 8 n.c. no connection. 9 gnd ground. 10 n.c. no connection. 11 lo i/o lo input for the i/q modulator (output for the offset mixer.) 12 lox i/o lo complementary input for the i/q modulator (complementary output for the offset mixer.) 13 vcc power supply for the i/q modulator. 14 gnd ground. 15 gnd ground. 16 q i q signal input for the i/q modulator.
6 mb54608l/MB54608B n block diagram 2 s f 1/2 - 90 0 v cc ml o v cc i psm xi xq q gnd ifin rfin offset mixer i/q modulator l ox psq out pcnt mode note: MB54608B doesnt have v cc m, psm, rfin, ifin and pcnt pins.
7 mb54608l/MB54608B n absolute maximum ratings warning: semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. do not exceed these ratings. n recommended operating conditions warning: the recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. all of the devices electrical characteristics are warranted when the device is operated within these ranges. always use semiconductor devices within their recommended operating conditionranges. operation outside these ranges may adversely affect reliability and could result in device failure. no warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. users considering application outside the listed conditions are advised to contact their fujitsu representatives beforehand. parameter symbol rating unit remarks min. max. power supply voltage v cc C0.5 +5.0 v output voltage v o C0.5 v cc + 0.5 (<5.0) v input voltage v i C0.5 v cc + 0.5 (<5.0) v allowed voltage on the open collector pin v oc v cc C 0.3 (C0.5) v cc + 0.3 (5.0) v out pin, open is prohibited. output current i o 0+10ma storage temperature tstg C55 +125 c parameter symbol value unit remarks min. typ. max. power supply voltage v cc 2.6 3.0 3.8 v input voltage v i gnd v cc v allowed voltage on the open collector pin v oc v cc C 0.2 v cc + 0.2 v out pin. open is prohibited. operating temperature ta C20 +75 v ambient temperature.
8 mb54608l/MB54608B n electrical characteristics 1. dc characteristics (mb54608l, MB54608B) (ta = +25 c, v cc = 3.0 v) note: MB54608B doesnt have offset mix., so please refer to offset mix. = not used column in regard to power supply current. parameter symbol value unit remarks min. typ. max. power supply current i cc offset mix. mode pin dc. no ac signal input. 12.0 16.5 24.5 ma not used open 13.5 19.0 28.0 ma not used gnd 16.0 22.5 33.5 ma used open 18.0 25.0 37.0 ma used gnd power down current i ps 220 310 m a not used dont care 440 620 m aused power down pin input voltage vih ps v cc 0.7 v vil ps v cc 0.3 v power down pin input current iih ps 5.0 m av ih = v cc psm, psq value iil ps C50 m av il = gnd pcnt pin load resistance rcnt 50 w
9 mb54608l/MB54608B 2. ac characteristics ? a case of the offset mixer is used. (only mb54608l) (ta = +25 c, v cc = 3.0 v) parameter symbol value unit remarks min. typ. max. baseband input operating band f bb dc 10 mhz input amplitude v bb 0.3 1.0 1.3 vp-p single ended input offset voltage v os 1.4 1.5 1.6 v external offset voltage offset current i os 3.04.0 m a offset mixer operating band f rf 1078.5 1100 mhz f if 130.5 500 mhz f lo 800 948 1000 mhz output input power level p rf C15 C10 0 dbm p if C15 C10 0 dbm rf output operating band f out 800 948 1000 mhz ssb output power level p out C8 C4 C dbm mode pin is opened v bb = 1.0 vp-p (single ended input) f rf = 1078.5 mhz p rf = C10 dbm f if = 130.5 mhz p if = C10 dbm f out = 948 mhz C6 C2 C dbm mode pin is grounded modulation accuracy amplitude error a err 2.03.0%rms value phase error p err 1.5 2.0 deg. rms value vector error v err 3.04.0%rms value carrier suppression cs C35 C27 dbc external offset. no offset adjustment. image rejection ir C40 C28 dbc adjucent channel power acp C65 C60 db d f = 50 khz if 7 spurious if 7 C65 C60 dbc
10 mb54608l/MB54608B ? a case of the offset mixer is not used. (mb54608l, MB54608B) (ta = +25 c, v cc = 3.0 v) notes: ? spec. of MB54608B is identical with mb54608l. ? when the offset mixer is not used, using a differential balun is recommended for input. (when the balun is not used, the changing carrier suppression may happen depending on the timing of powering up.) parameter symbol value unit remarks min. typ. max. baseband input operating band f bb dc 10 mhz input amplitude v bb 0.3 1.0 1.3 vp-p single ended input offset voltage v os 1.4 1.5 1.6 v external offset voltage offset current i os 3.04.0 m a lo input operating band f lo 800 948 1000 mhz differential input with balun. input power p lo C15 C10 0 dbm rf output operating band f out 800 948 1000 mhz ssb output power level p out C8 C4 dbm mode pin is opened v bb = 1.0 vp-p (single ended input) f lo = 948 mhz p lo = C10 dbm (differential input with balun). C6 C2 dbm mode pin is grounded modulation accuracy amplitude error a err 2.03.0%rms value phase error p err 1.5 2.0 deg. rms value vector error v err 3.04.0%rms value carrier suppression cs C35 C27 dbc external offset. no offset ajustment. image rejection ir C40 C28 dbc adjucent channel power acp C65 C60 db d f = 50 khz
11 mb54608l/MB54608B n application example (mb54608l) (continued) output pcnt psq out psm rfin gnd ifin gnd gnd gnd 3.0 v l ox v cc v cc m l o 0.1 m f 0.1 m f 3.9 nh 1.5-5 pf mode i xi xq q 1 k w 1 k w 1 k w 1 k w v cc v cc open vbi vbix vbqx vbq iq v cc f rf = 1078.5 mhz f rf = 130.5 mhz s.g. 100 pf 1000 pf s.g. 100 m f 100 m f 100 m f 100 m f 15 nh 18 nh 10 pf mb54608l 20 19 18 17 16 15 14 13 12 11 12345678910 0.1 m f output pcnt psq out psm rfin gnd ifin gnd gnd gnd 3.0 v l ox l o v cc v cc m 0.1 m f mode i xi xq q 1 k w 1 k w 1 k w 1 k w v cc v cc v cc open vbi vbix vbqx vbq iq 100 m f 100 pf 100 pf 100 m f 100 m f 100 m f 15 nh 18 nh 10 pf 0.1 m f mb54608l 20 19 18 17 16 15 14 13 12 11 12345678910 ldb25c201a0950 f lo = 948 mhz s.g. 1) a case of the offset mixer is used. 2) a case of the offset mixer is not used. note: ldb25c201a0950: murata mfg. co., ltd.
12 mb54608l/MB54608B (continued) n ordering information part number package remarks mb54608l pfv 20-pin, plastic ssop (fpt-20p-m03) mb54608l mb54608l pv1 16-pad, plastic bcc (lcc-16p-m04) MB54608B 14 15 16 1 23456 7 8 13 12 11 10 9 MB54608B gnd xq xi i mode v cc out psq n.c. gnd q q 1 k w 1 k w 1 k w 1 k w 100 m f 100 m f 0.1 m f 30 pf 100 m f 100 m f vbq v cc l ox l o n.c. gnd vbqx vbix vbi i open 22 nh output 100 pf 100 pf f lo = 948 mhz v cc = 3.0 v 0.1 m f 18 nh (mb54608l)
13 mb54608l/MB54608B n package dimension (continued) 20-pin plastic ssop (fpt-20p-m03) c 1999 fujitsu limited f20012s-3c-5 6.50?.10(.256?004) * 4.40?.10 6.40?.20 (.252?008) (.173?004) * .049 ?004 +.008 ?.10 +0.20 1.25 (mounting height) 0.10(.004) 0.65(.026) 0.24?.08 (.009?003) 1 10 20 11 "a" 0.10?.10 (stand off) 0.17?.03 (.007?001) m 0.13(.005) (.004?004) details of "a" part 0~8 (.018/.030) 0.45/0.75 (.020?008) 0.50?.20 0.25(.010) lead no. index dimensions in mm (inches) note 1) *:this dimension does not include resin protrusion. note 2) pins width and pins thickness include plating thickness.
14 mb54608l/MB54608B (continued) 16-pad plastic bcc (lcc-16p-m04) c 1 999 f uj it su limited c 1 60 1 5s -1 c -1 0.325?.10 (.013?004) 3.40(.134)typ "a" 0.40?.10 (.016?004) 3.25(.128) 0.80(.031) ref typ 4.20?.10 (.165?004) 4.55?.10 (.179?004) 0.80(.031)max mounting height 0.075?.025 (.003?001) (stand off) 0.05(.002) 6 9 1 14 9 14 1 6 0.40?.10 (.016?004) 0.75?.10 (.030?004) details of "a" part 1.725(.068) ref 1.55(.061) ref "b" details of "b" part (.024?004) 0.60?.10 (.024?004) 0.60?.10 0.65(.026) typ index area dimensions in mm (inches)
mb54608l/MB54608B fujitsu limited for further information please contact: japan fujitsu limited corporate global business support division electronic devices kawasaki plant, 4-1-1, kamikodanaka, nakahara-ku, kawasaki-shi, kanagawa 211-8588, japan tel: +81-44-754-3763 fax: +81-44-754-3329 http://www.fujitsu.co.jp/ north and south america fujitsu microelectronics, inc. 3545 north first street, san jose, ca 95134-1804, usa tel: +1-408-922-9000 fax: +1-408-922-9179 customer response center mon. - fri.: 7 am - 5 pm (pst) tel: +1-800-866-8608 fax: +1-408-922-9179 http://www.fujitsumicro.com/ europe fujitsu microelectronics europe gmbh am siebenstein 6-10, d-63303 dreieich-buchschlag, germany tel: +49-6103-690-0 fax: +49-6103-690-122 http://www.fujitsu-fme.com/ asia pacific fujitsu microelectronics asia pte ltd #05-08, 151 lorong chuan, new tech park, singapore 556741 tel: +65-281-0770 fax: +65-281-0220 http://www.fmap.com.sg/ f0001 ? fujitsu limited printed in japan all rights reserved. the contents of this document are subject to change without notice. customers are advised to consult with fujitsu sales representatives before ordering. the information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. also, fujitsu is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. the contents of this document may not be reproduced or copied without the permission of fujitsu limited. fujitsu semiconductor devices are intended for use in standard applications (computers, office automation and other office equipments, industrial, communications, and measurement equipments, personal or household devices, etc.). caution: customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with fujitsu sales representatives before such use. the company will not be responsible for damages arising from such use without prior approval. any semiconductor devices have inherently a certain rate of failure. you must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. if any products described in this document represent goods or technologies subject to certain restrictions on export under the foreign exchange and foreign trade control law of japan, the prior authorization by japanese government should be required for export of those products from japan.

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