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scds118c ? january 2003 ? revised october 2003 1 post office box 655303 ? dallas, texas 75265 member of the texas instruments widebus ? family undershoot protection for off-isolation on a and b ports up to ?2 v b-port outputs are precharged by bias voltage (biasv) to minimize signal distortion during live insertion and hot-plugging supports pci hot plug bidirectional data flow, with near-zero propagation delay low on-state resistance (r on ) characteristics (r on = 3 ? typical) low input/output capacitance minimizes loading and signal distortion (c io(off) = 5.5 pf typical) data and control inputs provide undershoot clamp diodes low power consumption (i cc = 3 a max) v cc operating range from 4 v to 5.5 v data i/os support 0 to 5-v signaling levels (0.8-v, 1.2-v, 1.5-v, 1.8-v, 2.5-v, 3.3-v, 5-v) control inputs can be driven by ttl or 5-v/3.3-v cmos outputs i off supports partial-power-down mode operation latch-up performance exceeds 100 ma per jesd 78, class ii esd performance tested per jesd 22 ? 2000-v human-body model (a114-b, class ii) ? 1000-v charged-device model (c101) supports both digital and analog applications: pci interface, memory interleaving, bus isolation, low-distortion signal gating description/ordering information the sn74cbt16811c is a high-speed ttl-compatible fet bus switch with low on-state resistance (r on ), allowing for minimal propagation delay. active undershoot-protection circuitry on the a and b ports of the sn74cbt16811c provides protection for undershoot up to ?2 v by sensing an undershoot event and ensuring that the switch remains in the proper off state. the device also precharges the b port to a user-selectable bias voltage (biasv) to minimize live-insertion noise. copyright ? 2003, texas instruments incorporated please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. dgg, dgv, or dl package (top view) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 biasv 1a1 1a2 1a3 1a4 1a5 1a6 gnd 1a7 1a8 1a9 1a10 1a11 1a12 2a1 2a2 v cc 2a3 gnd 2a4 2a5 2a6 2a7 2a8 2a9 2a10 2a11 2a12 1oe 2oe 1b1 1b2 1b3 1b4 1b5 gnd 1b6 1b7 1b8 1b9 1b10 1b11 1b12 2b1 2b2 2b3 gnd 2b4 2b5 2b6 2b7 2b8 2b9 2b10 2b11 2b12 widebus is a trademark of texas instruments.
scds118c ? january 2003 ? revised october 2003 2 post office box 655303 ? dallas, texas 75265 description/ordering information (continued) the sn74cbt16811c is organized as two 12-bit bus switches with separate output-enable (1oe , 2oe ) inputs. it can be used as two 12-bit bus switches or as one 24-bit bus switch. when oe is low, the associated 12-bit bus switch is on, and the a port is connected to the b port, allowing bidirectional data flow between ports. when oe is high, the associated 12-bit bus switch is off, and a high-impedance state exists between the a and b ports. the b port is precharged to biasv through the equivalent of a 10-k ? resistor when oe is high, or if the device is powered down (v cc = 0 v). during insertion (or removal) of a card into (or from) an active bus, the card?s output voltage may be close to gnd. when the connector pins make contact, the card?s parasitic capacitance tries to force the bus signal to gnd, creating a possible glitch on the active bus. this glitching effect can be reduced by using a bus switch with precharged bias voltage (biasv) of the bus switch equal to the input threshold voltage level of the receivers on the active bus. this method will ensure that any glitch produced by insertion (or removal) of the card will not cross the input threshold region of the receivers on the active bus, minimizing the ef fects of live-insertion noise. this device is fully specified for partial-power-down applications using i off . the i off feature ensures that damaging current will not backflow through the device when it is powered down. the device has isolation during power off. to ensure the high-impedance state during power up or power down, oe should be tied to v cc through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ordering information t a package ? orderable part number top-side marking ssop ? dl tube sn74cbt16811cdl cbt16811c ssop ? dl tape and reel sn74cbt16811cdlr cbt16811c ?40 c to 85 c tssop ? dgg tube sn74cbt16811cdgg cbt16811c ?40 c to 85 c tssop ? dgg tape and reel sn74cbt16811cdggr cbt16811c tvsop ? dgv tape and reel sn74cbt16811cdgvr cy811c ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. function table (each 12-bit bus switch) input input/output function input oe input/output a function l b a port = b port h z disconnect b port = biasv
scds118c ? january 2003 ? revised october 2003 3 post office box 655303 ? dallas, texas 75265 logic diagram (positive logic) 1a1 1b1 1a12 1oe 1b12 biasv sw sw 2 14 56 1 54 42 2a1 2b1 2a12 2oe 2b12 sw sw 15 28 55 41 29 simplified schematic, each fet switch (sw) a en ? b ? en is the internal enable signal applied to the switch. undershoot protection circuit
scds118c ? january 2003 ? revised october 2003 4 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . bias supply voltage range, biasv ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . control input voltage range, v in (see notes 1 and 2) ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . switch i/o voltage range, v i/o (see notes 1, 2, and 3) ?0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . control input clamp current, i ik (v in < 0) ?50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i/o port clamp current, i i/ok (v i/o < 0) ?50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . on-state switch current, i i/o (see note 4) 128 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous current through v cc or gnd terminals 100 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see note 5): dgg package 64 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . dgv package 48 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . dl package 56 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. all voltages are with respect to ground unless otherwise specified. 2. the input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. v i and v o are used to denote specific conditions for v i/o . 4. i i and i o are used to denote specific conditions for i i/o . 5. the package thermal impedance is calculated in accordance with jesd 51-7. recommended operating conditions (see note 6) min max unit v cc supply voltage 4 5.5 v biasv bias supply voltage 0 v cc v v ih high-level control input voltage 2 5.5 v v il low-level control input voltage 0 0.8 v v i/o data input/output voltage 0 5.5 v t a operating free-air temperature ?40 85 c note 6: all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs , literature number scba004. biasv is a supply voltage, not a control input.
scds118c ? january 2003 ? revised october 2003 5 post office box 655303 ? dallas, texas 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions min typ ? max unit v ik control inputs v cc = 4.5 v, i in = ?18 ma ?1.8 v v iku data inputs v cc = 5 v, 0 ma > i i ?50 ma, v in = v cc or gnd, switch off ?2 v v o(usp) ? v cc = biasv = 5 v, i i = ?10 ma, v in = v cc or gnd, switch off 3 v v o b port v cc = 0 v, biasv = v x , i o = 0 v x ?0.1 v x v i in control inputs v cc = 5.5 v, v in = v cc or gnd 1 a i o b port v cc = 4.5 v, biasv = 2.4 v, v o = 0, switch off, v in = v cc or gnd 0.25 ma i oz v cc = 5.5 v, v o = 0 to 5.5 v, v i = 0, switch off, v in = v cc or gnd 10 a i off v cc = 0, v o = 0 to 5.5 v, v i = 0 10 a i cc v cc = 5.5 v, i i/o = 0, v in = v cc or gnd, switch on or off 3 a ? i cc ? control inputs v cc = 5.5 v, one input at 3.4 v, other inputs at v cc or gnd 2.5 ma c in control inputs v in = 3 v or 0 4.5 pf c io(off) a port v i/o = 3 v or 0, switch off, v in = v cc or gnd 5.5 pf c io(on) v i/o = 3 v or 0, switch on, v in = v cc or gnd 15.5 pf v cc = 4 v, typ at v cc = 4 v v i = 2.4 v, i o = ?15 ma 8 12 r on # v i = 0 i o = 64 ma 3 6 ? r on # v cc = 4.5 v v i = 0 i o = 30 ma 3 6 ? c. ? v o(usp) = a-port undershoot static protection. for i/o ports, the parameter i oz includes the input leakage current. ? this is the increase in supply current for each input that is at the specified voltage level, rather than v cc or gnd. # measured by the voltage drop between the a and b terminals at the indicated current through the switch. on-state resistance is determined by the lower of the voltages of the two (a or b) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see figure 1) parameter test conditions from (input) to (output) v cc = 4 v v cc = 5 v 0.5 v unit parameter conditions (input) (output) min max min max unit t pd || a or b b or a 0.24 0.15 ns t pzh biasv = gnd oe a or b 6.5 1.5 6 ns t pzl biasv = 3 v oe a or b 6.5 1.5 6 ns t phz biasv = gnd oe a or b 6.5 1.5 6 ns t plz biasv = 3 v oe a or b 6.5 1.5 6 ns || the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified loa d capacitance, when driven by an ideal voltage source (zero output impedance).
scds118c ? january 2003 ? revised october 2003 6 post office box 655303 ? dallas, texas 75265 parameter measurement information v oh v ol c l (see note a) test circuit s1 7 v open gnd r l r l t plh t phl output waveform 1 s1 at 7 v (see note b) output waveform 2 s1 at open (see note b) t pzl t pzh t plz t phz 3 v 0 v v oh v ol 0 v v ol + v ? v oh ? v ? 0 v output control (v in ) 3 v 3.5 v voltage waveforms propagation delay times (t pd(s) ) voltage waveforms enable and disable times output notes: a. c l includes probe and jig capacitance. b. waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 ? , t r 2.5 ns, t f 2.5 ns . d. the outputs are measured one at a time with one transition per measurement. e. t plz and t phz are the same as t dis . f. t pzl and t pzh are the same as t en . g. t plh and t phl are the same as t pd(s) . the tpd propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). h. all parameters and waveforms are not applicable to all devices. 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 50 ? v g1 v cc dut 50 ? v in 50 ? v g2 50 ? v i test r l s1 v ? c l 5 v 0.5 v 4 v v cc v i t phz /t pzh t plz /t pzl t pd(s) 5 v 0.5 v 4 v 5 v 0.5 v 4 v open open 7 v 7 v open open 500 ? 500 ? 500 ? 500 ? 500 ? 500 ? v cc or gnd v cc or gnd gnd gnd v cc v cc 50 pf 50 pf 50 pf 50 pf 50 pf 50 pf 0.3 v 0.3 v 0.3 v 0.3 v output control (v in ) input generator input generator v o figure 1. test circuit and voltage waveforms
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 74cbt16811cdggre4 active tssop dgg 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbt16811cdggrg4 active tssop dgg 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbt16811cdgvre4 active tvsop dgv 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbt16811cdgvrg4 active tvsop dgv 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbt16811cdggr active tssop dgg 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbt16811cdgvr active tvsop dgv 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbt16811cdl active ssop dl 56 20 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbt16811cdlg4 active ssop dl 56 20 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbt16811cdlr active ssop dl 56 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbt16811CDLRG4 active ssop dl 56 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 27-sep-2007 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74cbt16811cdggr tssop dgg 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 q1 sn74cbt16811cdgvr tvsop dgv 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 q1 sn74cbt16811cdlr ssop dl 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74cbt16811cdggr tssop dgg 56 2000 346.0 346.0 41.0 sn74cbt16811cdgvr tvsop dgv 56 2000 346.0 346.0 41.0 sn74cbt16811cdlr ssop dl 56 1000 346.0 346.0 49.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2
mechanical data msso001c ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 dl (r-pdso-g**) plastic small-outline package 4040048 / e 12/01 48 pins shown 56 0.730 (18,54) 0.720 (18,29) 48 28 0.370 (9,40) (9,65) 0.380 gage plane dim 0.420 (10,67) 0.395 (10,03) a min a max 0.010 (0,25) pins ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) seating plane 0.020 (0,51) 0.040 (1,02) 25 24 0.008 (0,203) 0.0135 (0,343) 48 1 0.008 (0,20) min a 0.110 (2,79) max 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) m 0.005 (0,13) 0.025 (0,635) 0 ? 8 0.005 (0,13) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). d. falls within jedec mo-118
mechanical data mtss003d january 1995 revised january 1998 post office box 655303 ? dallas, texas 75265 dgg (r-pdso-g**) plastic small-outline package 4040078 / f 12/97 48 pins shown 0,25 0,15 nom gage plane 6,00 6,20 8,30 7,90 0,75 0,50 seating plane 25 0,27 0,17 24 a 48 1 1,20 max m 0,08 0,10 0,50 0 8 56 14,10 13,90 48 dim a max a min pins ** 12,40 12,60 64 17,10 16,90 0,15 0,05 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold protrusion not to exceed 0,15. d. falls within jedec mo-153
mechanical data mpds006c february 1996 revised august 2000 post office box 655303 ? dallas, texas 75265 dgv (r-pdso-g**) plastic small-outline 24 pins shown 14 3,70 3,50 4,90 5,10 20 dim pins ** 4073251/e 08/00 1,20 max seating plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 112 24 13 4,30 4,50 0,16 nom gage plane a 7,90 7,70 38 24 16 4,90 5,10 3,70 3,50 a max a min 6,60 6,20 11,20 11,40 56 9,60 9,80 48 0,08 m 0,07 0,40 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. d. falls within jedec: 24/48 pins mo-153 14/16/20/56 pins mo-194
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband clocks and timers www.ti.com/clocks digital control www.ti.com/digitalcontrol interface interface.ti.com medical www.ti.com/medical logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony rf/if and zigbee? solutions www.ti.com/lprf video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2008, texas instruments incorporated

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