applications ? server/notebook power ? high power led driver, portable devices ? base station, telecom, and networking ? battery chargers, ram power supply ? industrial and automotive power systems ? noise filtering output filter chokes ? buck/boost converters, output converters environmental data ? storage temperature range: -40c to +125c ? operating temperature range: -40c to +125c (ambient plus self temperature rise) ? solder reflow temperature: j-std-020d compliant packaging ? supplied in tape and reel packaging, 750 parts per 13 inch dia. reel halogen hf free pb description ? halogen free, lead free ? 125c maximum total temperature operation ? low-profile surface mount inductor ? 9.5 x 8.3 x 4.5mm shielded drum core ? ferrite core material ? inductance range from 1.5h to 100h ? current range from 0.8 amps to 9.1 amps ? frequency range up to 1mhz ? rohs compliant shielded power inductors sd8350 series 0911 bu-sb111111 page 1 of 4 data sheet: pm-4146 smd device product specifications rated ocl 1 i rms 2 i sat 3 dcr m dcr m part number inductance (h) h30% (amps) (amps) @ 20c typical @ 20c maximum k-factor 4 sd8350-1r8-r 1.8 1.5 5.50 9.1 11.8 14.0 16.0 sd8350-3r9-r 3.9 3.2 4.50 6.3 16.2 19.0 9.6 sd8350-4r7-r 4.7 4.2 4.10 5.5 18.5 22.0 8.5 sd8350-6r8-r 6.8 6.8 3.90 4.4 20.8 25.0 7.6 sd8350-100-r 10 9.9 3.20 4.0 31.4 36.0 6.3 sd8350-150-r 15 13.6 2.30 2.9 45.0 53.0 5.3 sd8350-220-r 22 20.4 1.80 2.6 63.5 75.0 4.4 SD8350-330-R 33 31.4 1.40 2.2 111.4 125.0 3.5 sd8350-470-r 47 44.9 1.30 1.8 130.0 150.0 2.9 sd8350-680-r 68 65.1 1.00 1.5 200.8 240.0 2.4 sd8350-101-r 100 99.7 0.80 1.3 308.0 360.0 2.0 1. open circuit inductance test parameters: 100khz, 0.1v, 0.0adc. 2. i rms : dc current for an approximate t of 40c without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 125c under worst case operating conditions verified in the end application. 3. i sat amps peak for approximately 35% rolloff (@25c) 4. k-factor: used to determine b p-p for core loss (see graph). b p-p = k*l* i, b p-p (mt), k: (k factor from table), l: (inductance in h), i (peak to peak ripple current in amps). 5. part number definition: sd8350-xxx-r sd8350 = product code and size; -xxx = inductance value in h; r = decimal point; if no r is present, third character = # of zeros. -r suffix = rohs compliant
recommended pcb layout schematic 1 2 9.5 max. 8.3 max. 4.5 max. 2.5 1.2 6.3 xx x wwlly r top view front view bottom view 5.7 2.9 1.8 1 2 left view d d i i m m e e n n s s i i o o n n s s - - m m m m 0 20 40 60 80 100 120 140 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 temp eratu re rise (?) total loss (w) part marking: coiltronics logo xxx = inductance value in h. (r = decimal point). if no r is present, third character = number of zeros wwlly - or - wwllyy = date code r = revision level supplied in tape-and-reel packaging, 750 parts per reel, 13? diameter reel. packaging information - mm temperature rise vs.total loss 0911 bu-sb111111 page 2 of 4 data sheet: pm-4146
0911 bu-sb111111 page 3 of 4 data sheet: pm-4146 1mhz 500khz 300khz 200khz 100khz 0.0001 0. 001 0. 01 0. 1 1 10 1 10 100 100 0 bp-p (mt) core loss (w) ocl vs. isat 0% 20% 40% 60% 80% 100% 120% 0% 20% 40% 60% 80% 100% 120% 140% % is at % ocl +85 deg. c +25 deg. c -40 deg. c inductance characteristics core loss
0911 bu-sb111111 page 4 of 4 data sheet: pm-4146 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. a ll other copies of this document are by definition uncon- trolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. cooper bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. once a product has been selected, it sh ould be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or syste ms without the express written approval of an officer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me package mm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me package mm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tan d ar d s np b s ol d er lea d (p b ) free s ol d er pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s a v e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** a v e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ? 2011 cooper bussmann www.cooperbussmann.com
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