1 ?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: february 15, 2012 SRV05 SRV05 series low capacitance esd protection - SRV05 series description applications the SRV05 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each i/o pin against esd and high surge events. this robust device can safely absorb surge current per iec61000-4-5 (t p =8/20s) without performance degradation and a minimum 20kv esd per iec61000-4-2. their very low loading capacitance also makes them ideal for protecting high speed signal pins. features ? esd, iec6100 0-4-2, 20kv contact, 30kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec6100 0-4-5, 10a (8/20s) ? low capacitance of 2pf (typ) per i/o ? low leakage current of 0.5a (max) at 5v ? small sot23-6 ( jedec mo-178) packaging ? lcd/pdp tvs ? monitors ? notebooks ? 10/100/1000 ethernet ? firewire ? set top boxes ? flat panel displays ? portable medical pinout i/o 1 gnd i/o 2 i/o 4 v cc i/o 3 functional block diagram 1 2 3 6 5 4 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application examples v bu s v bu s v bu s v bu s d + d + d - d - gnd gnd c t r t r t r t r t c t c t c t usb port usb port usb controller v bu s SRV05-4htg usb dual po rt protection vc c 10/100 ethernet phy tx + tx - rx + rx - vcc gnd SRV05-4htg tx + tx - rx + rx - unused unused unused rj45 unused to twisted-pair networ k 75 75 75 75 1 2 3 6 5 4 10/1 00 ethernet dif fe rential protection vc c 10/100/1000 ethernet phy tx + tx - rx + rx - vcc gnd tx + tx - rx + rx - unused unused unused rj45 unused to twisted-pair networ k 75 75 75 75 10/100/1 000 ethernet protection SRV05-4htg 1 2 3 6 5 4 SRV05 series 6v 10a diode array
?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 2 tvs diode arrays (spa ? family of products) revision: february 15, 2012 SRV05 series low capacitance esd protection - SRV05 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. 1 non-repetitive pulse per waveform on page 3 absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 1 10 a p pk peak pulse power (t p =8/20s) 150 w t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) 260 c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6.0 v reverse voltage drop v r i r = 1ma 8.0 v reverse leakage current i leak v r =5v 0.1 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, i/o to gnd 2 8.8 10.0 v i pp =5a, t p =8/20s, i/o to gnd 2 11. 5 13.0 v i pp =8a, t p =8/20s, i/o to gnd 2 13.2 15.0 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 0.7 esd withstand voltage 1 v esd iec61000-4-2 (contact) 20 kv iec61000-4-2 (air) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v 2.4 3.0 pf reverse bias=1.65v 2.0 pf diode capacitance 1 c i/o-i/o reverse bias=0v 1. 2 pf notes: 1 parameter is guaranteed by design and/or device characterization. 2 repetitive pulse per waveform on page 3. clamping voltage vs. i pp 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1 2 3 4 5 6 7 8 9 10 peak pulse current-i pp (a) clamp voltage (v c ) product characteristics lead plating matte tin lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy flammability ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13.
3 ?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: february 15, 2012 SRV05 SRV05 series low capacitance esd protection - SRV05 series pulse waveform capacitance vs. reverse bias 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 dc bias (v) capacitance (pf) v cc =float v cc =5v v cc =3.3v 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp ti me temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters ordering information part number package marking min. order qty. SRV05-4htg sot23-6 l*4 3000 part numbering system part marking system SRV05 4 h t g series number of channels package h: sot23-6 t= tape & reel g= green ? l*4 l * 4 product series l = srv0 5 number of chan ne ls assembly site (varies ) l = s (varies )
?2012 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 4 tvs diode arrays (spa ? family of products) revision: february 15, 2012 SRV05 series low capacitance esd protection - SRV05 series embossed carrier tape & reel speci?cation sot23-6 8mm tape and reel general information 1. 30 00 pieces per reel. 2. order in multiples of full reels on ly . 3. meets eia-481 revision "a" specifications. 2.0mm 4.0mm c l 1.75mm 1.5mm dia. hole 8mm 4.0mm 8.4mm 180mm 14.4mm 13mm 60mm access hole cover tape user direction of feed pin 1 sot-23 (8mm pocket pitch) package dimensions sot23-6 package sot23-6 pins 6 jedec mo-178 millimeters inches notes min max min max a 0.900 1.450 0.035 0.057 - a1 0.000 0.150 0.000 0.006 - a2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - c 0.080 0.220 0.0031 0.009 - d 2.800 3.000 0.11 0.118 3 e 2.600 3.000 0.102 0.118 - e1 1.500 1.750 0.06 0.069 3 e 0.95 ref 0.0374 ref - e1 1.9 ref 0.0748 ref - l 0.100 0.600 0.004 0.023 4,5 n 6 6 6 a 0o 10o 0o 10o - m 2.590 0.102 - o 0.690 .027 typ - p 0.990 .039 typ - r 0.950 0.038 - o p r m recommended solder pad layout notes: 1. dimensioning and tolerances per ansi 14.5m-1 982. 2. package conf orms to eiaj sc-74 (1992). 3. dimensions d and e1 are exclusiv e of mold fash, protrusions, or gate burrs. 4. footlenth l measured at reference to seating plane. 5. l is the length of fat f oot surface for soldering to substrate. 6. n is the number of terminal positions. 7. controling dimension: millimeter. conv erted inch dimensions are not necessarily exact.
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