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1. general description the nx3dv42 is a double-pole double-throw analog switch suitable for use as an analog or digital multiplexer/demultip lexer. its wide bandwidth and lo w bit-to-bit skew allows the nx3dv42 to pass high-speed differential si gnals with good signal integrity. its high channel to channel crosstalk rejection re sults in minimal nois e interference. the bandwidth is wide enough to pass high-speed usb 2.0 differential signals (480 mb/s). it consist of two switches, each with two in dependent input/outputs (hsdn+ and hsdn ? ) and a common input/output (d+ or d ? ). one digital inputs (s) is used to select the switch position. when pin oe is high, the switches are turned off. schmitt trigger action at the select input (s) and enable input (oe ) makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 3.0 v to 4.3 v. 2. features and benefits ? supply voltage range from 3.0 v to 4.3 v ? 4 ? typical on resistance ? 7.3 pf typical on capacitance ? 950 mhz typical bandwidth or data frequency ? low crosstalk of ? 30 db at 240 mhz ? break-before-make switching ? esd protection: ? hbm jesd22-a114f class 3a exceeds 4000 v ? cdm aec-q100-011 revision b exceeds 1000 v ? hbm exceeds 12000 v for power to gnd protection ? latch-up performance exceeds 100 ma per jesd 78 class ii level a ? specified from ? 40 ? c to +85 ? c 3. applications ? cell phone, pda, digital camera and notebook ? lcd monitor, tv and set-top box nx3dv42 dual high-speed usb 2.0 dou ble-pole double-throw analog switch rev. 1 ? 3 january 2012 product data sheet
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 2 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 4. ordering information 5. marking 6. functional diagram table 1. ordering information type number package temperature range name description version NX3DV42GM ? 40 ? c to +85 ? c xqfn10u plastic extremely thin quad flat package; no leads; 10 terminals; utlp based; body 2 ? 1.55 ? 0.5 mm sot1049-2 nx3dv42gu ? 40 ? c to +85 ? c xqfn10 plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.40 x 1.80 x 0.50 mm sot1160-1 table 2. marking type number marking code NX3DV42GM x4 nx3dv42gu x4 fig 1. logic symbol aaa-001356 d- d+ s oe hsd1+ hsd2+ hsd1- hsd2-
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 3 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 7. pinning information 7.1 pinning 7.2 pin description 8. functional description [1] h = high voltage level; l = low voltage level; x = don?t care. fig 2. pin configuration sot1049-2 (xqfn10u) f ig 3. pin configuration sot1160-1 (xqfn10) aaa-001358 hsd1+ transparent top view hsd2- hsd2+ oe d+ d- gnd s hsd1- nx3dv42 2 3 46 7 8 9 1 51 0 v cc nx3dv42 5 hsd1+ gnd 4 hsd1- 3 oe 8 10 v cc 9 s 7 hsd2+ 6 hsd2- d+ 1 d- 2 terminal 1 index area aaa-001357 transparent top view table 3. pin description symbol pin description sot1049-2 sot1160-1 hsd1 ? , hsd2 ? 5, 7 4, 6 independent input or output hsd1+, hsd2+ 6, 8 5, 7 independent input or output d+, d ? 2, 3 1, 2 common output or input gnd 4 3 ground (0 v) oe 9 8 output enable input (active-low) s 1 10 select input v cc 10 9 supply voltage table 4. function table [1] input channel on s oe l l hsd1+ and hsd1 ? h l hsd2+ and hsd2 ? x h switch off
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 4 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 9. limiting values [1] the minimum input voltage rating may be exceeded if the input current rating is observed. 10. recommended operating conditions [1] to avoid sinking gnd cu rrent from terminals d ? and d ? when switch current flows in terminals hsdn ? and hsdn ? , the voltage drop across the bidirectional switch must not exceed 0.4 v. if the switch current flows into terminals d ? and d? , no gnd current will flow from terminals hsdn ? and hsdn ? . in this case, there is no limit for the voltage drop across the switch. 11. static characteristics table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +5.5 v v i input voltage pins s and oe [1] ? 0.5 v cc v v sw switch voltage ? 0.5 +5.5 v i ik input clamping current v i < ? 0.5 v ? 50 - ma i sk switch clamping current v i < ? 0.5 v - ? 50 ma i sw switch current - ? 100 ma i cc supply current - +50 ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? cto+85 ?c- 2 5 0 m w table 6. recommended operating conditions symbol parameter conditions min max unit v cc supply voltage 3.0 4.3 v v i input voltage pins s and oe 0v cc v v sw switch voltage [1] 04.5v t amb ambient temperature ? 40 +85 ?c table 7. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground 0 v). symbol parameter conditions t amb = ? 40 ? c to +85 ?c unit min typ [1] max v ih high-level input voltage v cc = 3.0 v to 3.6 v 1.3 - - v v cc = 4.3 v 1.7 - - v v il low-level input voltage v cc = 3.0 v to 3.6 v - - 0.5 v v cc = 4.3 v - - 0.7 v v ik input clamping voltage v cc =3.0v; i i = ? 18 ma - - ? 1.2 v i i input leakage current pins s and oe ; v i =gndto4.3v; v cc =4.3v -- ? 1 ? a i s(off) off-state leakage current v cc = 4.3 v; see figure 4 -- ? 2 ? a
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 5 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch [1] typical values are measured at t amb = 25 ? c and v cc = 3.3 v. 11.1 test circuits 11.2 on resistance [1] typical values are measured at t amb = 25 ? c. [2] measured at identical v cc , temperature and input voltage. i off power-off leakage current v i or v o =0vto4.3v; v cc =0v - - ? 2 ? a i cc supply current v i =v cc or gnd; v sw = gnd or v cc ; v cc =4.3v --1 ? a ? i cc additional supply current v i = 2.6 v; v sw =gndorv cc ; v cc =4.3v --10 ? a v i = 1.8 v; v sw =gndorv cc ; v cc =4.3v --15 ? a c i input capacitance pins s and oe - 1.0 - pf c s(off) off-state capacitance pins hsdn+ and hsdn ??? v cc = 3.3 v; v i = 0 v to 3.3 v -2.8-pf c s(on) on-state capacitance pins d+ and d ??? v cc = 3.3 v; v i = 0 v to 3.3 v -7.3-pf table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground 0 v). symbol parameter conditions t amb = ? 40 ? c to +85 ?c unit min typ [1] max v i = v cc or gnd and v o = gnd or v cc . test circuit also applies for d+, hsd1+ and hsd2+. fig 4. test circuit for measuring off-state leakage current i s aaa-001365 2 1 hsd2- v il or v ih v ih hsd1- s d- switch v i v o gnd oe v cc v il v ih 1 2 s switch table 8. on resistance at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v). symbol parameter conditions ? 40 ? c to +85 ?c unit min typ [1] max r on on resistance v i = 0.4 v; i sw = 8 ma; see figure 5 v cc =3.0v - 3.9 6.5 ? ? r on on resistance mismatch between channels v i = 0.4 v; i sw =8 ma [2] v cc = 3.0 v - 0.65 - ?
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 6 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 11.3 on resistance t est circuit and graphs 12. dynamic characteristics [1] typical values are measured at t amb = 25 ? c, c l = 5 pf and v cc = 3.3 v. [2] t pd is the same as t plh and t phl . [3] guaranteed by design. [4] t en is the same as t pzh [5] t dis is the same as t phz r on =v sw / i sw . test circuit also applies for d+, hsd1+ and hsd2+. fig 5. test circuit for measuring on resistance aaa-001366 2 1 hsd2- v il or v ih v il hsd1- s d- switch v i i sw gnd oe v cc v il v ih 1 2 s switch v v sw table 9. dynamic characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v); for load circuit see figure 9 . symbol parameter conditions t amb = ? 40 ? c to +85 ?c unit min typ [1] max t pd propagation delay hsdn+ to d+ or hsdn ? to d ?? or d+ to hsdn+ or d ? to hsdn ? ; see figure 6 [2] [3] v cc = 3.3 v - 0.25 - ns t en enable time s or oe to d+ or d ? ; see figure 7 [4] v cc = 3.0 v to 3.6 v - 11.2 30 ns t dis disable time s or oe to d+ or d ? ; see figure 7 [5] v cc = 3.0 v to 3.6 v - 3.9 25 ns t b-m break-before-make time see figure 8 [3] v cc = 3.0 v to 3.6 v 2.0 5.9 - ns t sk(p) pulse skew time see figure 6 v cc = 3.0 v to 3.6 v [3] -20-ps t jit jitter time r l =50 ? ; c l = 5 pf; t r , t f = 500 ps (10% to 90 %) at 480 mbs (prbs = 2 15 ? 1) [3] -200-ps
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 7 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 12.1 waveform and test circuits logic levels: v ol and v oh are typical output voltage levels that occur with the output load. t sk(p) = |t phl ? t plh |. fig 6. the data input to output propagation delay times and pulse skew times aaa-001359 t phl t plh 50% 50% input 400 mv gnd v oh v ol output measurement points are given in table 10 . logic level: v oh and v ol are typical output voltage levels that occur with the output load. fig 7. enable and disable times aaa-001361 t phz switch disabled switch enabled switch enabled output high to off off to high s, oe input v oh gnd gnd v i t pzh v m v x v x table 10. measurement points supply voltage input output v cc v m v i v x 3.0 v to 3.6 v 0.5v cc v cc 0.9v oh
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 8 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch a. test circuit. b. input and output measurement points test circuit also applies for d+, hsd1+ and hsd2+. fig 8. test circuit for measuri ng break-before-make timing aaa-001364 r l v o s gnd oe d- v cc v i v il c l g v ext = 0.8 v hsd1- hsd2- v 001aag572 v i t b-m v o 0.9v o 0.9v o 0.5v i test circuit also applies for d+, hsd1+ and hsd2+. test data is given in table 11 . definitions test circuit: r t = termination resistance (shoul d be equal to output impedance z o of the pulse generator). r l = load resistance. c l = load capacitance including jig and probe capacitance. v ext = external voltage for measuring switching times. v i may be connected to s or oe . fig 9. test circuit for measuring switching times aaa-001363 r l s gnd oe d- v cc v i v il c l g v ext = 0.8 v hsd1- hsd2-
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 9 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 12.2 additional dynami c characteristics [1] f i is biased at 0.5v cc . [2] typical values are measured at t amb = 25 ? c and v cc = 3.3 v. 12.3 test circuits table 11. test data supply voltage input load v cc v i t r , t f c l r l 3.0 v to 3.6 v v cc ? 2.5 ns 5 pf 50 ? table 12. additional dynamic characteristics at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v); v i = gnd or v cc (unless otherwise specified); t r = t f ?? 2.5 ns. symbol parameter conditions t amb = 25 ?c unit min typ [2] max f ( ? 3db) ? 3 db frequency response r l =50 ? ; see figure 10 [1] c l = 0 pf; v cc = 3.0 v to 3.6 v - 950 - mhz c l = 5 pf; v cc = 3.0 v to 3.6 v - 450 - mhz ? iso isolation (off-state) f i = 240 mhz; r l =50 ? ; see figure 11 [1] v cc = 3.0 v to 3.6 v - ? 30 - db xtalk crosstalk between switches; f i = 240 mhz; r l =50 ? ;see figure 12 [1] v cc = 3.0 v to 3.6 v - ? 30 - db adjust f i voltage to obtain 0 dbm level at output. increase f i frequency until db meter reads ? 3db. test circuit also applies for d+, hsd1+ and hsd2+. fig 10. test circuit for measuring the frequency response when channel is in on-state db aaa-001360 2 1 hsd2- v il or v ih v il hsd1- s 0.5v cc d- switch f i c l r l gnd oe v cc v il v ih 1 2 s switch
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 10 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch adjust f i voltage to obtain 0 dbm level at input. test circuit also applies for d+, hsd1+ and hsd2+. fig 11. test circuit for measuring isolation (off-state) aaa-001367 2 1 hsd2- v il or v ih v ih hsd1- s d- switch f i r l r l gnd oe v cc 0.5v cc v ih v il 1 2 s switch db 0.5v cc 20 log 10 (v o2 /v o1 ) or 20 log 10 (v o1 /v o2 ). fig 12. test circuit for measuri ng crosstalk between switches v aaa-001362 r l f i v o2 0.5v cc v r l r i 50 50 v o1 0.5v cc channel on hsd1+ or hsd2+ hsd1 or hsd2 d+ d s v il channel off
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 11 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 13. package outline fig 13. package outline sot1049-2 (xqfn10u) references outline version european projection issue date iec jedec jeita sot1049-2 - - - mo-255 - - - unit mm max nom min 0.50 0.05 0.03 0.00 1.65 1.55 1.45 2.1 2.0 1.9 0.58 0.5 1.5 0.4 0.3 0.2 0.1 a dimensions (mm are the original dimensions) 0 2.5 mm scale a 1 b 0.30 0.23 0.15 d e e e 1 e 2 1.16 e 3 l l 1 0.15 0.08 0.00 v w 0.05 y 0.1 y 1 0.05 c y c y 1 x terminal 1 index area b a d e detail x a a 1 l 08-04-22 10-02-05 terminal 1 index area e 2 e 1 e 3 e 1/2 e 1 ac b v m c w m l 1 b 1 2 3 4 5 6 7 8 9 10 metal area must not be soldered xqfn10u: plastic extremely thin quad flat package; no leads; 10 terminals; utlp based; body 2 x 1.55 x 0.5 mm sot1049-2
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 12 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch fig 14. package outline sot1160-1 (xqfn10) references outline version european projection issue date iec jedec jeita sot1160-1 - - - - - - - - - sot1160-1_po 09-12-28 09-12-29 unit (1) mm max nom min 0.5 0.05 0.00 0.25 0.20 0.15 1.5 1.4 1.3 1.9 1.8 1.7 0.4 0.45 0.40 0.35 0.55 0.50 0.45 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. xqfn10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.40 x 1.80 x 0.50 mm sot1160-1 a 1 a 3 0.127 bdeee 1 0.8 e 2 0.4 ll 1 v 0.1 wy 0.05 y 1 0.05 0 1 2 mm scale b a terminal 1 index area d e c y c y 1 x detail x a a 1 a 3 b e 1 e 2 e ac b v c w terminal 1 index area l 1 l 5 10 8 6 7 2 1 3
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 13 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 14. abbreviations 15. revision history table 13. abbreviations acronym description cdm charged device model cmos complementary metal-oxide semiconductor esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 14. revision history document id release date data sheet status change notice supersedes nx3dv42 v.1 20120103 product data sheet - -
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 14 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
nx3dv42 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 3 january 2012 15 of 16 nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors nx3dv42 dual high-speed usb 2.0 double-pole double-throw analog switch ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 january 2012 document identifier: nx3dv42 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 functional description . . . . . . . . . . . . . . . . . . . 3 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 recommended operating conditions. . . . . . . . 4 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 11.1 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11.2 on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11.3 on resistance test circuit and graphs. . . . . . . . 6 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12.1 waveform and test circuits . . . . . . . . . . . . . . . . 7 12.2 additional dynamic characteristics . . . . . . . . . . 9 12.3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 contact information. . . . . . . . . . . . . . . . . . . . . 15 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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