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document no. PX10051EJ07V0TN (7th edition) date published december 2002 cp(k) ? nec compound semiconductor devices 2001, 2002 printed in japan technical note rf and microwave devices packages
technical note PX10051EJ07V0TN 2 m8e 00. 4 - 0110 the information in this document is current as of november, 2002. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
technical note PX10051EJ07V0TN 3 major revisions in this edition page description p.7 addition of 3-pin super lead-less minimold p.10 addition of flat-lead 4-pin thin-type super minimold (m05) p.24 addition of t-91m p.26 addition of 3-pin super lead-less minimold p.27 addition of flat-lead 4-pin thin-type super minimold (m05) the mark shows major revised points.
technical note PX10051EJ07V0TN 4 contents 3l2mm [3-pin lead-less minimold] 7 3mm [3-pin minimold] 7 3pmm [3-pin power minimold] 7 3sl2mm [3-pin super lead-less minimold] 7 3smm [3-pin super minimold] 8 3usmm [3-pin ultra super minimold] 8 f3tusmm [flat-lead 3-pin thin-type ultra super minimold] 8 4 ceramic [4-pin ceramic] 8 4mm (39) [4-pin minimold (39)] 9 4pmm [4-pin power minimold] 9 4smm (18) [4-pin super minimold (18)] 9 f4tsmm (m04) [flat-lead 4-pin thin-type super minimold (m04)] 9 f4tsmm (m05) [flat-lead 4-pin thin-type super minimold (m05)] 10 6l2mm (1208 pkg) [6-pin lead-less minimold (1208 pkg)] 10 6l2mm (1511 pkg) [6-pin lead-less minimold (1511 pkg) for silicon mmic] 10 6l2mm (1511 pkg) [6-pin lead-less minimold (1511 pkg) for gaas mmic] 10 6mm [6-pin minimold] 11 6smm (m01) [6-pin super minimold (m01)] 11 6tsmm [6-pin thin-type super minimold] 11 f6tusmm [flat-lead 6-pin thin-type ultra super minimold] 11 8 ceramic (t-31) [8-pin ceramic (t-31)] 12 8sop [8-pin plastic sop (5.72 mm (225))] 13 8ssop [8-pin plastic ssop (4.45 mm (175))] 13 10tson [10-pin plastic tson] 14 10tssop [10-pin plastic tssop] 14 14sop [14-pin plastic sop (5.72 mm (225))] 15 14ssop [14-pin plastic ssop (5.72 mm (225))] 15 16htssop [16-pin plastic htssop] 16 16ssop [16-pin plastic ssop (5.72 mm (225))] 16 20qfn [20-pin plastic qfn] 17 20sop [20-pin plastic sop (7.62 mm (300))] 17 20ssop [20-pin plastic ssop (5.72 mm (225))] 18 24qfn [24-pin plastic qfn] 18
technical note PX10051EJ07V0TN 5 28qfn [28-pin plastic qfn] 19 30ssop [30-pin plastic ssop (7.62 mm (300))] 19 36qfn [36-pin plastic qfn] 20 -x [-x] 20 40 [40 (ceramic)] 20 41 [41 (ceramic)] 21 75 [75] 21 77 [77] 21 79a [79a] 22 83a, 83b [83a, 83b] 22 84, 84a, 84c [84, 84a, 84c] 22 95 [95] 23 96/99 [96/99] 2 3 s01 [s01] 23 t-61 [t-61] 23 t-65 [t-65] 24 t-78 [t-78] 24 t-86 [t-86] 24 t-91m [t-91m] 24 t-92 [t-92] 25 t-92m [t-92m] 25 to-92 [to-92] 25
technical note PX10051EJ07V0TN 6 3l2mm [3-pin lead-less minimold] 26 3mm [3-pin minimold] 26 3pmm [3-pin power minimold] 26 3sl2mm [3-pin super lead-less minimold] 26 3smm [3-pin super minimold] 26 3usmm [3-pin ultra super minimold] 26 f3tusmm [flat-lead 3-pin thin-type ultra super minimold] 26 4mm (39) [4-pin minimold (39)] 26 4pmm [4-pin power minimold] 26 4smm (18) [4-pin super minimold (18)] 27 f4tsmm (m04) [flat-lead 4-pin thin-type super minimold (m04)] 27 f4tsmm (m05) [flat-lead 4-pin thin-type super minimold (m05)] 27 6l2mm (1208 pkg) [6-pin lead-less minimold (1208 pkg)] 27 6l2mm (1511 pkg) [6-pin lead-less minimold (1511 pkg) for silicon mmic/ gaas mmic] 27 6mm [6-pin minimold] 27 6smm (m01) [6-pin super minimold (m01)] 27 f6tusmm [flat-lead 6-pin thin-type ultra super minimold] 27 8ssop [8-pin plastic ssop (4.45 mm (175))] 27 10tson [10-pin plastic tson] 28 14ssop [14-pin plastic ssop (5.72 mm (225))] 28 16ssop [16-pin plastic ssop (5.72 mm (225))] 28 20ssop [20-pin plastic ssop (5.72 mm (225))] 28 24qfn [24-pin plastic qfn] 28 28qfn [28-pin plastic qfn] 28 79a [79a] 28
technical note PX10051EJ07V0TN 7 package dimensions (1/19) (unit : mm) 3-pin lead-less minimold 3-pin minimold 3-pin power minimold 3-pin super lead-less minimold 2.80.2 1.5 2 1 3 2.90.2 0.95 0.95 0.4 +0.1 ?0.05 0.4 +0.1 ?0.05 0.65 +0.1 ?0.15 0.16 +0.1 ?0.05 0.3 0 to 0.1 1.1 to 1.4 marking 1.50.1 0.41 +0.03 ?0.06 4.50.1 0.420.06 0.420.06 1.60.2 3.0 1.5 c eb 2.50.1 4.00.25 0.8 min. 0.470.06 0.125 +0.1 ?0.05 0.50.05 0.1 0.1 0.2 +0.1 ?0.05 0.35 0.7 0.35 0.15 +0.1 ?0.05 0.15 +0.1 ?0.05 1.0 +0.1 ?0.05 0.5 +0.1 ?0.05 0.70.05 1 2 3 0.3 0.2 0.2 (bottom view) 0.15 0.57 0.285 0.125 0.440.05 1 2 3 (bottom view) 0.15 0.840.05 0.125 0.15 0.640.05 0.11 0.4
technical note PX10051EJ07V0TN 8 package dimensions (2/19) (unit : mm) 3-pin ultra super minimold flat-lead 3-pin thin-type ultra super minimold 4-pin ceramic 1.48 max. 0.1?.06 0.7 +0.2 ? 0.1 4.1 min. 1 2 4 3 0.6?.06 4.5 max. 0.4?.06 4.6 max. 4.1 min. 0.75?.05 0.6 0 to 0.1 0.15 +0.1 ? 0.05 1.6?.1 1.0 0.5 0.5 0.3 +0.1 ? 0 1.6?.1 0.8?.1 0.2 +0.1 ? 0 1 2 3 0.59 ?0.05 0.15 +0.1 ? 0.05 1.2 ?0.05 0.8 ?0.1 1.4 ?0.1 (0.9) 0.45 0.45 0.3 +0.1 ? 0 1 3 2 0.2 +0.1 ? 0 3-pin super minimold 0.9?.1 0.3 0.15 +0.1 ? 0.05 0 to 0.1 marking 2.0?.2 0.65 0.65 0.3 +0.1 ? 0 0.3 +0.1 ? 0 1 2 3 2.1?.1 1.25?.1
technical note PX10051EJ07V0TN 9 package dimensions (3/19) (unit : mm) 4-pin power minimold 4-pin super minimold (18) flat-lead 4-pin thin-type super minimold (m04) 0.59 ?0.05 0.11 +0.1 ? 0.05 0.60 0.65 0.65 0.65 1.30 1.25 2.0 ?0.1 12 43 1.25 ?0.1 2.05 ?0.1 0.30 +0.1 ? 0.05 0.40 +0.1 ? 0.05 0.30 +0.1 ? 0.05 0.30 +0.1 ? 0.05 1.5?.1 0.25?.02 4.5?.1 2.1 1.6 0.8 0.42?.06 0.42?.06 0.3 2.45?.1 0.1 0.8 min. 3.95?.25 0.46 ?.06 3.0 1.5 0.85 1.55 eb c e 0.9?.1 0.15 +0.1 ? 0.05 0.3 0 to 0.1 3 1.30 2.0?.2 1.25 0.65 0.60 4 2 1 2.1?.2 1.25?.1 0.65 0.65 0.4 +0.1 ? 0.05 0.3 +0.1 ? 0.05 0.3 +0.1 ? 0.05 0.3 +0.1 ? 0.05 4-pin minimold (39) 2.9?.2 (1.8) (1.9) 0.95 2 1 3 4 0.85 0.6 +0.1 ? 0.06 0.4 +0.1 ? 0.05 0.4 +0.1 ? 0.05 0.4 +0.1 ? 0.05 2.8 +0.2 ? 0.3 1.5 +0.2 ? 0.1 5? 5? 0.8 0.16 +0.1 ?.06 0 to 0.1 1.1 +0.2 ?.1 5? 5?
technical note PX10051EJ07V0TN 10 package dimensions (4/19) (unit : mm) 6-pin lead-less minimold (1511 pkg) for silicon mmic 6-pin lead-less minimold (1511 pkg) for gaas mmic (0.9) 0.2?.1 (bottom view) (0.48) (0.48) (0.96) 1.5?.1 1.3?.05 1.1?.1 0.16?.05 0.55?.03 0.11 +0.1 0.05 (0.48) (0.48) (0.96) 1.5?.1 1.3?.1 1.1?.1 0.55?.05 0.11 +0.1 0.05 0.16 +0.1 0.05 6-pin lead-less minimold (1208 pkg) 0.5?.05 0.125 +0.1 0.05 0.4 0.4 0.8 0.15?.05 1.2 +0.07 0.05 0.8 +0.07 0.05 1.0?.05 1 2 3 6 5 4 flat-lead 4-pin thin-type super minimold (m05) 0.59?.05 0.11 +0.1 0.05 0.65 0.65 1.30 2.0?.1 43 12 1.25?.1 2.05?.1 0.30 +0.1 0.05
technical note PX10051EJ07V0TN 11 package dimensions (5/19) (unit : mm) flat-lead 6-pin thin-type ultra super minimold 0.550.05 0.11 +0.1 0.05 0.48 0.48 0.96 0.20 +0.1 0.05 1.50?.1 321 456 1.10?.1 1.50?.1 0.60?.1 0.13?.05 0.45 0 to 0.1 2.10?.1 1.25?.1 2.00?.2 1.30 0.22 +0.1 0.05 0.65 0.65 1 2 3 6 5 4 6-pin thin-type super minimold 6-pin super minimold (m01) 0.9?.1 0.7 0 to 0.1 0.15 +0.1 0.05 0.2 +0.1 0.05 2.0?.2 1.3 0.65 0.65 1.25?.1 2.1?.1 0.1 min. 6-pin minimold 2.9?.2 0.95 0.95 1.9 4 3 5 2 6 1 0.3 +0.1 0.05 2.8 +0.2 0.3 1.5 +0.2 0.1 0.8 0.13?.1 1.1 +0.2 0.1 0 to 0.1 0.2 min.
technical note PX10051EJ07V0TN 12 package dimensions (6/19) (unit : mm) 1.7 max. 0.2 +0.05 0.02 3.8?.2 1.27?.1 1.27?.1 10.6 max. 10.6 max. 5 678 4 0.6 432 1 4 0.4 8-pin ceramic (t-31)
technical note PX10051EJ07V0TN 13 package dimensions (7/19) (unit : mm) 8-pin plastic ssop (4.45 mm (175)) 1.50.1 0.575 max. 0.10 m 1.8 max. 0.10.1 0.3 +0.10 0.05 detail of lead end 3 ? +7 ? 3 ? 0.65 8 5 1 4 2.9?.1 4.94?.2 0.5?.2 0.87?.2 3.2?.1 0.15 +0.10 0.05 0.15 1.49 0.85 max. 0.12 m 1.57?.2 0.1?.1 0.42 +0.08 0.07 detail of lead end 3 ? +7 ? 3 ? 1.27 8 5 1 4 5.2?.2 6.5?.3 0.6?.2 1.1?.2 4.4?.15 0.17 +0.08 0.07 0.10 8-pin plastic sop (5.72 mm (225))
technical note PX10051EJ07V0TN 14 package dimensions (8/19) (unit : mm) 10-pin plastic tson 10-pin plastic tssop detail of lead end 10 ? to 20 ? (10 - 0.2) (0.5) 2.75?.15 (2.2) 3.2?.2 1.05?.15 (0.9) 0.35?.15 0.15?.1 (0.1) 2.40?.15 2.20?.1 2.25?.1 (1.95) (0.95) (0.3) 2.55?.15 0.40?.05 0.18?.05 (1.70) (0.35) (bottom view) (0.6 max.) (0.125)
technical note PX10051EJ07V0TN 15 package dimensions (9/19) (unit : mm) 14-pin plastic sop (5.72 mm (225)) 14-pin plastic ssop (5.72 mm (225)) detail of lead end 3 ? +7 ? 3 ? 6.55?.2 4.38?.1 0.6?.2 1.1?.16 0.15 +0.10 0.05 0.10 1.49 1.42 max. 0.1?.1 1.59 +0.21 0.20 0.4 +0.10 0.05 0.10 m 1.27 10.2?.26 1 7 14 8 detail of lead end 5 ? ?5 ? 14 8 17 5.40 max. 0.10 6.2?.3 4.4 0.5?.2 0.9 0.15 +0.10 0.05 0.30 +0.10 0.05 1.8 max. 1.44 0.75 max. 0.125?.075 0.10 m 0.65
technical note PX10051EJ07V0TN 16 package dimensions (10/19) (unit : mm) 16-pin plastic htssop 16-pin plastic ssop (5.72 mm (225)) (1.5) 0.90.2 0.200.10 (0.4) (2.7) (0.5) (1.8) (0.1) (2.5) 5.20.2 5.50.3 6.40.3 0.650.1 0.200.10 16 9 1 8 detail of lead end 5 ? ?5 ? 16 9 18 5.2?.3 6.4?.2 4.4?.2 0.5?.2 1.0?.2 0.17 +0.08 0.07 0.10 s 1.8 max. 1.5?.1 0.475 max. s 0.22 +0.10 0.05 0.125?.075 0.10 m 0.65
technical note PX10051EJ07V0TN 17 package dimensions (11/19) (unit : mm) 20-pin plastic qfn 20-pin plastic sop (7.62 mm (300)) detail of lead end 3 ? +7 ? 3 ? 7.7?.3 5.6?.2 0.6?.2 1.1 0.20 +0.10 0.05 1.55?.1 0.78 max. 0.1?.1 1.8 max. 0.4?.1 0.12 m 1.27 0.10 12.7?.3 110 20 11 3.2?.2 3.0?.2 3.2?.2 4.2?.2 4.0?.2 3.0?.2 pin 1 pin 20 0.18?.05 0.4 0.30?.15 (bottom view) caution the island pins located on the corners are needed to fabricate products in our plant, but do not serve any other function. consequently the island pins should not be soldered and should remain non-connection pins. 4.2?.2 4.0?.2 0.9 max. 0.14 +0.10 0.05
technical note PX10051EJ07V0TN 18 package dimensions (12/19) (unit : mm) 20-pin plastic ssop (5.72 mm (225)) 24-pin plastic qfn detail of lead end 3 ? +7 ? 3 ? 0.5?.2 0.15 +0.10 0.05 6.4?.2 4.4?.1 1.0?.2 1.8 max. 1.5?.1 0.1?.1 0.22 +0.10 0.05 0.575 max. 0.10 m 0.65 0.15 20 11 110 6.7?.3 caution the island pins located on the corners are needed to fabricate products in our plant, but do not serve any other function. consequently the island pins should not be soldered and should remain non-connection pins. 4.2?.2 4.0?.2 5.2?.2 pin 24 5.0?.2 0.22?.05 0.45?.15 0.5 (bottom view) 1.0 max. pin 1 0.14 +0.10 0.05 5.2?.2 5.0?.2 4.0?.2 4.2?.2
technical note PX10051EJ07V0TN 19 package dimensions (13/19) (unit : mm) 28-pin plastic qfn 30-pin plastic ssop (7.62 mm (300)) 30 16 9.850.26 115 6.10.2 8.10.2 0.50.2 1.00.2 0.15 +0.10 0.05 0.51 max. 2.0 max. 1.7?.1 0.125?.075 0.3?.1 0.65 0.10 m 0.10 detail of lead end 3 ? +7 ? 3 ? 5.1?.2 pin 28 pin 1 5.1?.2 4.7?.2 5.5?.2 5.1?.2 4.7?.2 1.0 max. 5.5?.2 5.1?.2 0.14 +0.10 0.05 0.55?.20 0.24?.05 (bottom view) 0.5 0.6 0.5 0.5 0.6 caution the extra-wide pins (shaded portion) located between pins 11 and 12 and pins 25 and 26 in this package are needed to fabricate products in our plant, but do not serve any other function. consequently the pins should not be soldered and should remain non-connection pins.
technical note PX10051EJ07V0TN 20 package dimensions (14/19) (unit : mm) 36-pin plastic qfn 40 (ceramic) -x 0.03 1.8 max. 0.55 2.1 ? e b c e 0.5?.05 3.8 min. 3.8min. 3.8 min. 3.8 min. 2.0 max. 0.1 +0.06 0.03 1.25?.1 1.25?.1 5.0 min. 5.0 min. 3 2 1 0.6?.05 4 5 6 3.5 +0.3 0.2 6.2?.2 6.0?.2 0.22?.05 0.55?.2 0.5 (bottom view) 6.2?.2 6.0?.2 1.0max. 0.14 +0.10 0.05 6.2?.2 6.0?.2 6.2?.2 6.0?.2 36 pin 1 pin caution the island pins located on the corners are needed to fabricate products in our plant, but do not serve any other function. consequently the island pins should not be soldered and should remain non-connection pins.
technical note PX10051EJ07V0TN 21 package dimensions (15/19) (unit : mm) 41 (ceramic) 75 77 17.50.5 14.3 source gate 1.00.1 6.350.4 4.0 min. both leads drain r1.25, 2 places 2.5 8.90.4 3.8 max. 1.0 0.2 max. 2.260.4 0.1 +0.06 0.02 5.0 min. 3 4 2 1 5 5.0 min. 0.6?.1 0.6?.1 1.25?.1 5.0 min. 3.5 +0.3 0.2 (#492c) 2.0 max. 0.1 +0.06 0.03 2.3 1.13 0.9 max. gate drain 0.5 source 2.7 3.0 min. 2.3 9.8 max. 2.7 7.0 1.8
technical note PX10051EJ07V0TN 22 package dimensions (16/19) (unit : mm) 79a 83a, 83b 84, 84a, 84c ( ? ? 0.03
technical note PX10051EJ07V0TN 23 package dimensions (17/19) (unit : mm) 95 96/99 s01 t-61 5.0 max. 0.2 max. 12.0 10.7 0.1 +0.05 0.01 2.6?.15 1.6 0.5?.1 gate side indicator 12.9 3.2 2.5 min. 21.0?.3 17.0 drain source 6.45?.05 1.6r?.1 2 places 1.5 chamfer 4 places gate 0.5 typ. 2.0?.2 4 0.65 typ. 3 2 1 2.0?.2 2.0?.2 1.9?.2 1.6 4.0?.2 0.125?.05 1.5 max. 7.2?.2 4.5 max. 0.1 0.2 max. 2.1?.15 1.0 14.0?.3 5.9?.2 4.0 min. 0.7?.1 gate 2.5?.3 dia source 18.5 max. drain 6.0?.2 0.1 1.2 0.2 max. 1.7?.15 5.0 max. 4.0 min. both leads source gate drain 0.6?.1 5.2?.3 11.0?.3 15.0?.3 1.0?.1 4.3?.2 4.0 2.2?.3 2 places
technical note PX10051EJ07V0TN 24 package dimensions (18/19) (unit : mm) t-65 t-78 t-91m t-86 2.40.2 1.80.2 4.7 max. 19.40.4 11.40.3 5.70.3 2.40.3 0.1 d2 d1 g2 g1 ss 45 ? r1.2?.3 14.5?.3 1.4?.2 7.8?.2 20.9?.3 24.5?.3 1.8?.1 0.2 max. 3.0?.2 9?.3 8.25?.15 gate 9.7?.13 drain 13?.1 16.5?.13 r 0.65 2.74?.1 source c1.0 4places r1.2 4places source 0.5?.1 17.4?.2 2.5 min. 2.5 min. 2.4 5.6 20.4?.2 24.0?.3 drain gate 8.0?.1 16.0 16.0 5.0 max. 2.4?.2 0.1 +0.1 0.05 0.2 max. 1.6 source gate drain 3.3?.3
technical note PX10051EJ07V0TN 25 package dimensions (19/19) (unit : mm) to-92 t-92m t-92 4.00.3 1.40.3 30.40.25 s 8.00.2 0.60.3 17.40.15 9.70.2 35.20.25 23.90.3 2.60.3 s 4 r1.3 4 c1.5 d1 d2 g1 g2 45 ? 2.4?.2 6.0 max. 2.1?.3 5.2 max. 1.27 1 2 3 5.5 max. 4.2 max. 1.77 max. 12.7 min. 0.5 2.54 2.4?.2 4.75 max. 1.8?.2 4.0?.3 31.6?.3 s 8.0 17.4?.3 9.7?.3 35.2?.3 2.4?.3 s r1.2?.3 d1 d2 g1 g2 45 ?
technical note PX10051EJ07V0TN 26 mounting pad layout (1/3) 1 2 3 0.95 0.4 0.5 0.4 0.9 0.45 flat-lead 3-pin thin-type ultra super minimold 3-pin lead-less minimold 1.9 0.8 1.0 2.4 0.95 1 2 3 3-pin minimold 0.6 1.0 0.6 1.3 0.5 1 2 3 3-pin ultra super minimold 1.5 0.8 2.2 1.0 1.5 1.5 1.0 1.0 2.7 4-pin power minimold 1.0 1.9 2.4 1 4 2 3 1.0 4-pin minimold (39) 2.2 1.0 2.0 2.0 1.0 1.0 1.5 0.9 0.9 2.2 45
technical note PX10051EJ07V0TN 27 mounting pad layout (2/3) 0.95 0.95 2.4 0.6 1.0 6-pin minimold 0.65 0.65 1.9 0.8 0.4 6-pin super minimold (m01) 0.48 0.48 0.30 1.20 0.40 flat-lead 6-pin thin-type ultra super minimold 0.35 0.65 4.45 1.27 8-pin plastic ssop (4.45 mm (175)) 6-pin lead-less minimold (1208 pkg) 0.4 0.4 0.8 0.45 0.25 (unit : mm) 6-pin lead-less minimold (1511 pkg) for silicon mmic/gaas mmic 0.48 0.48 1.10 0.45 0.26 1 2 4 3 1.15 1.3 1.55 0.8 0.5 0.6 flat-lead 4-pin thin-type super minimold (m04) flat-lead 4-pin thin-type super minimold (m05) 1.3 1.55 0.5 0.6 0.6 1.25 1.7 4 3 1 2 0.8 4-pin super minimold (18)
technical note PX10051EJ07V0TN 28 mounting pad layout (3/3) 0.3 0.5 0.3 1.2 0.5 0.5 0.5 0.5 0.4 3.90 0.70 4.30 0.70 r0.15 r0.2 r0.15 28-pin plastic qfn 79a 1.7 4.0 1.0 1.0 5.9 1.2 gate drain 0.5 0.5 6.1 through hole: 0.2 33 0.3 0.3
nec compound semiconductor devices hong kong limited hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-528-0301 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-528-0302 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-01 fax: +49-211-6503-487 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0209 nec compound semiconductor devices, ltd. 5th sales group, sales division tel: +81-3-3798-6372 fax: +81-3-3798-6783 e-mail: salesinfo@csd-nec.com business issue nec compound semiconductor devices, ltd. http://www.csd-nec.com/ sales engineering group, sales division e-mail: techinfo@csd-nec.com fax: +81-44-435-1918 technical issue

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