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| semipack ? 3 thyristor / diode modules skkh 330 skkt 330 features ! " # $ # % typical applications & ' ) * ) + * ) * 1) , 2) skkt skkh - . , / - . . / - & . / 0 . / , 1 $ 2 3 4 ) 5 + * - - 0 4 - 1 # # 3 4 ) 2 6 3 7 1 6 3 8 ' * 9 3 3 6 3 3 , : : # # 3 ; 3 6 ! , : : # # 3 ; 3 6 ! 2 # 3 3 2 % 3 3 , : : # # 3 ; 2 % ! , : : # # 3 ; 2 % ! 2 < 3 3 2 " 3 3 , : : # # 3 ; 2 " ! , : : # # 3 ; 2 " ! 2 9 3 3 2 6 3 3 , : : # # 3 ; 2 6 ! , : : # # 3 ; 2 6 ! symbol conditions values units 0 4 - 2 6 3 7 1 6 $ ) 2 3 3 * 8 ' 7 # 3 $ ) % % $ * 4 0 & 2 " ; % 3 3 = 7 1 # $ 8 ' 7 > % ; > " $ % 3 ; " $ 3 4 0 . / , 2 " ; % 3 3 = 7 1 # $ 8 ' 7 ? 2 ; ? # $ 6 $ ; # @ a 6 $ 4 0 , / + b 1 % $ 8 ' 7 2 3 9 $ 3 3 4 + b 1 2 # 3 8 ' 7 2 3 6 3 3 3 4 c + b 1 % $ 8 ' 7 6 # 2 3 a $ 2 3 3 3 4 c + b 1 2 # 3 8 ' 7 6 # 2 3 # % 3 3 3 3 4 c - + b 1 % $ 8 ' 7 0 1 < $ 3 4 5 2 a - - ) d * + b 1 2 # 3 8 ' 5 3 6 - + b 1 2 # 3 8 ' 5 3 " e 0 & & 7 0 . & + b 1 2 # 3 8 ' 7 - . & 1 - . . / 7 - & & 1 - & . / 5 6 $ 4 + b 1 % $ 8 ' 7 0 f 1 2 4 7 f ; 1 2 4 ; g 2 g - & 1 3 " < @ - & . / % g ) ; * + b 1 2 # 3 8 ' 5 % $ 3 4 ; g ) + ; * + b 1 2 # 3 8 ' 5 2 3 3 3 - ; g h + b 1 2 # 3 8 ' $ 3 2 $ 3 g 0 + b 1 % $ 8 ' 7 ; 5 2 $ 3 ; $ 3 3 4 0 + b 1 % $ 8 ' 7 . f 1 # # e 7 ; 5 # 3 3 ; % 3 3 3 4 - f + b 1 % $ 8 ' 7 # - 0 f + b 1 % $ 8 ' 7 % 3 3 4 - f & + b 1 2 # 3 8 ' 7 5 3 % $ - 0 f & + b 1 2 # 3 8 ' 7 5 2 3 4 . ) b i * 7 ; 3 2 2 ; 3 3 $ $ : ; ? . ) b i * 2 6 3 7 ; 3 2 2 " ; 3 3 $ 6 : ; ? . ) b i * 2 % 3 7 ; 3 2 # ; 3 3 " $ : ; ? . ) i * ; 3 3 a ; 3 3 % : ; ? + b i a 3 j 2 # 3 8 ' i a 3 j 2 # 3 8 ' - $ 3 7 7 2 ; 2 # " 3 3 ; # 3 3 3 - k / l $ m 2 $ n 2 * o / 9 m 2 $ n % * o $ @ 9 6 2 ; c 5 " 3 3 ' , : : 4 < # , : : 4 < " skkt 330, skkh 330 thyristor bridge,scr,bridge 1 16-02-2009 may ? by semikron fig. 1l power dissipation per thyristor vs. on-state current fig. 1r power dissipation per thyristor vs. ambient temp. fig. 2l power dissipation per module vs. rms current fig. 2r power dissipation per module vs. case temp. fig. 3l power dissipation of two modules vs. direct current fig. 3r power dissipation of two modules vs. case temp. rectifier,diode,thyristor,module 2 16-02-2009 may ? by semikron fig. 4l power dissipation of three modules vs. direct and rms current fig. 4r power dissipation of three modules vs. case temp. fig. 5 recovered charge vs. current decrease fig. 6 transient thermal impedance vs. time fig. 7 on-state characteristics fig. 8 surge overload current vs. time skkt 330, skkh 330 thyristor bridge,scr,bridge 3 16-02-2009 may ? by semikron fig. 9 gate trigger characteristics dimensions in mm ' 4 < # ) , : : * ' 4 < " , : : this technical information specifies semiconductor devices but promises no characteristics. no warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. rectifier,diode,thyristor,module 4 16-02-2009 may ? by semikron |
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