? semiconductor components industries, llc, 2000 october, 2000 rev. 2 1 publication order number: mbrb2535ctl/d mbrb2535ctl preferred device switchmode ? power rectifier d 2 pak surface mount power package the d 2 pak power rectifier employs the schottky barrier principle in a large metaltosilicon power diode. stateoftheart geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. these stateoftheart devices have the following features: ? centertap configuration ? guardring for stress protection ? low forward voltage ? 125 c operating junction temperature ? epoxy meets ul94, vo at 1/8 ? short heat sink tab manufactured e not sheared! ? similar in size to the industry standard to220 package mechanical characteristics ? case: epoxy, molded ? weight: 1.7 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? shipped 50 units per plastic tube ? available in 24 mm tape and reel, 800 units per 13 reel by adding a at4o suffix to the part number ? marking: b2535l maximum ratings please see the table on the following page device package shipping ordering information mbrb2535ctl d 2 pak http://onsemi.com d 2 pak case 418b style 3 50/rail 3 4 1 schottky barrier rectifier 25 amperes 35 volts 1 3 4 preferred devices are recommended choices for future use and best overall value. mbrb2535ctlt4 d 2 pak 800/tape & reel marking diagram b2535l b2535l = device code
mbrb2535ctl http://onsemi.com 2 maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 35 v average rectified forward current (rated v r , t c = 110 c) i f(av) 12.5 a peak repetitive forward current (rated v r , square wave, 20 khz, t c = 90 c) i frm 25 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 a peak repetitive reverse surge current (2.0 s, 1.0 khz) i rrm 1.0 a storage temperature range t stg 65 to +150 c operating junction temperature t j 65 to +125 c voltage rate of change (rated v r ) dv/dt 10,000 v/ s thermal characteristics (per leg) characteristic symbol value unit thermal resistance e junction to case e junction to ambient (note 1.) r q jc r q ja 2.0 50 c/w electrical characteristics (per leg) maximum instantaneous forward voltage (note 2.) (i f = 25 amps, t j = 25 c) (i f = 12.5 amps, t j = 125 c) (i f = 12.5 amps, t j = 25 c) v f 0.55 0.41 0.47 volts maximum instantaneous reverse current (note 2.) (rated dc voltage, t j = 125 c) (rated dc voltage, t j = 25 c) i r 500 10 ma 1. when mounted using minimum recommended pad size on fr4 board. 2. pulse test: pulse width = 300 m s, duty cycle 2.0%.
mbrb2535ctl http://onsemi.com 3 , reverse leakage current (ma) 50 20 10 5 2 1 0.5 0.2 0.1 0.9 10 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 v f , instantaneous voltage (volts) figure 1. typical forward voltage, per leg i f , instantaneous forward current (amp) 1000 100 10 1 i r 0.1 35 30 25 20 15 0 v r , reverse voltage (volts) figure 2. typical reverse current, per leg 510 t j = 125 c t j = 25 c t j = 100 c dc t j = 125 c square wave 40 35 30 25 20 15 10 5 0 p f(av) , average forward power dissipation (watts) 40 35 30 25 20 15 10 5 i f(av) , average forward current (amps) figure 3. typical forward power dissipation 0 sine wave (resistive load) (rated v r applied) r q jc = 2 c/w square dc 32 28 24 20 16 12 8 4 i f(av) , average forward current (amps) 0 125 115 105 95 85 t c , case temperature ( c) figure 4. current derating, case t j = 125 c t j = 25 c
mbrb2535ctl http://onsemi.com 4 information for using the d 2 pak surface mount package minimum recommended footprints for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 0.33 8.38 0.08 2.032 0.04 1.016 0.63 17.02 0.42 10.66 0.12 3.05 0.24 6.096 d 2 pak power dissipation the power dissipation of the d 2 pak is a function of the drain pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient; and the operating temperature, t a . using the values provided on the data sheet for the d 2 pak package, p d can be calculated as follows: p d = t j(max) t a r q ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 2.5 watts. p d = 150 c 25 c = 2.5 watts 50 c/w the 50 c/w for the d 2 pak package assumes the recommended drain pad area of 158k mil 2 on fr4 glass epoxy printed circuit board to achieve a power dissipation of 2.5 watts using the footprint shown. another alternative is to use a ceramic substrate or an aluminum core board such as thermal clad ? . by using an aluminum core board material such as thermal clad, the power dissipation can be doubled using the same footprint. general soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 5 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * due to shadowing and the inability to set the wave height to incorporate other surface mount components, the d 2 pak is not recommended for wave soldering.
mbrb2535ctl http://onsemi.com 5 recommended profile for reflow soldering for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must set temperatures for several heating zones, and a figure for belt speed. taken together, these control settings make up a heating aprofileo for that particular circuit board. on machines controlled by a computer, the computer remembers these profiles from one operating session to the next. figure 5 shows a typical heating profile for use when soldering the d 2 pak to a printed circuit board. this profile will vary among soldering systems but it is a good starting point. factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. the two profiles are based on a high density and a low density board. the vitronics smd310 convection/infrared reflow soldering system was used to generate this profile. the type of solder used was 62/36/2 tin lead silver with a melting point between 177189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 ramp" step 2 vent soak" step 3 heating zones 2 & 5 ramp" step 4 heating zones 3 & 6 soak" step 5 heating zones 4 & 7 spike" step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies desired curve for high mass assemblies 100 c 150 c 160 c 170 c 140 c figure 5. typical solder heating profile
mbrb2535ctl http://onsemi.com 6 package dimensions d 2 pak plastic case 418b03 issue d notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. base 2. collector 3. emitter 4. collector style 2: pin 1. gate 2. drain 3. source 4. drain style 3: pin 1. anode 2. cathode 3. anode 4. cathode seating plane s g d t m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.110 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.110 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 b m b
mbrb2535ctl http://onsemi.com 7 notes
mbrb2535ctl http://onsemi.com 8 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 3036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mbrb2535ctl/d switchmode is a trademark of semiconductor components industries, llc. thermal clad is a trademark of the bergquist company. north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland
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