1 features mechanical data ps l22 th ru ps l24 silicon epit axial planer type silicon epit axial planer type low vf chip schottky diodes o maximum ratings (at t a =25 c unless otherwise noted) u n i t s symbol i o i r i fsm c j r ja t stg min. typ. max. parameter conditions forward rectified current forward surge current reverse current -55 70 160 2.0 50 1.0 10 +150 m a m a a a 0 c / w p f 0 c symbols marking code operating temperature 0 (c ) -55 to + 125 *1 repetitive peak reverse peak reverse *2 rms voltage *3 continuous reverse voltage *4 maximum forward voltage 20 30 40 14 21 28 20 0.38 30 0.40 40 0.40 plastic package has underwriters laboratory flammability classification 94v-0 ufizing flame retardant epoxy molding compound. for surface mounted applications. exceeds environmental standards of ml-s-19500/228 low leakage current case jedec d0-214ac/sma molded plastic t erminals solder plated, solderable per mil-std-750, method 2026 polarity indicated by cathode band mounting position any weight 0.05gram 8.3ms single half sine-wave superimposed on rated load (jedec method) 0 v r =v rrm t a =25 c 0 v r =v rrm t a =100 c junction to ambient f=1mhz and applied 4vdc reverse voltage see fig.1 PSL22 psl23 psl24 sl22 sl23 sl24 *1 v rrm (v) *2 v rms (v) *3 v r (v) *4 v f (v) thermal resistance diode junction capacitance storage temperature s m a / d o - 2 1 4 a c 0.18 9(4.8 ) 0.16 5(4.2 ) 0.01 2(0.3 ) typ . 0.10 6(2.7 ) 0.09 1(2.3 ) 0.16 5(4.2 ) 0.15 0(3.8 ) 0.07 1(1.8 ) 0.05 5(1.4 ) 0.04 0 (1.0 ) typ . 0.04 0(1.0 ) typ . dim ens ions in i nch es a nd (mi llim ete rs) www.paceleader.tw
2 crownpo technology ps l22 th ru ps l24 silicon epit axial planer type silicon epit axial planer type www.paceleader.tw
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