1 aug. 2009 applications igbt/mosfet driver features ? floating supply voltage ................................. 600v ? output current ...................... +130m a/?00ma (typ) ? undervoltage lockout ? sop-16 package description M81723FP is high voltage power mosfet and igbt mod- ule driver for half bridge applications. block diagram pin configuration (top view) outline:16p2n nc:no connection mitsubishi semiconductors M81723FP high voltage half bridge driver lo 1 8 2 7 3 6 4 5 16 9 15 10 14 11 13 12 v com v cc2 nc nc v s v b ho nc gnd lin nc hin v cc nc nc 12 7 v b 8 ho 6 v s v cc2 1 lo 2 v com pulse gen hin 11 v cc hv level shift v reg /v cc level shift uv detect v reg r q s inter lock 14 pulse gen lin 15 gnd hv level shift v reg /v cc level shift r q s inter lock 3 p onr uv detect p onr
2 aug. 2009 v v v v v v v v v v v/ns w mw/ c c/w c c c c absolute maximum ratings (ta = 25 c unless otherwise specified) ?.5 ~ 624 v b ?4 ~ v b +0.5 ?.5 ~ 24 v s ?.5 ~ v b +0.5 ?.5 ~ 624 v cc2 ?4 ~ v cc2 +0.5 ?.5 ~ 24 v com ?.5 ~ v cc2 +0.5 ?.5 ~ 24 ?.5 ~ v cc +0.5 50 0.11 ?.9 45 ?0 ~ 125* ?0 ~ 100 ?5 ~ 150 255:10s, max 260 v bs = v b ? s v cc2com = v cc2 ? com hin, lin ta = 25 c, on board ta > 25 c, on board pb free high side floating supply absolute voltage high side floating supply offset voltage high side floating supply voltage high side output voltage low side floating supply absolute voltage output standard voltage low side floating supply voltage low side output voltage low side fixed supply voltage logic input voltage allowable offset voltage transient package power dissipation linear derating factor junction-case thermal resistance junction temperature operation temperature storage temperature solder heat-proof (reflow) v b v s v bs v ho v cc2 v com v cc2com v lo v cc v in dv s /dt pd k q rth(j-c) tj t opr t stg tl symbol parameter test conditions ratings unit mitsubishi semiconductors M81723FP high voltage half bridge driver * please adjust the v s potential to 500v or less when the junction temperature (t j ) exceeds 125 c. v v v v v v v v v v v s +10 ? 10 v s v com +10 ? 10 v com 10 0 v s +20 500 20 v b v com +20 500 20 v cc2 20 v cc high side floating supply absolute voltage high side floating supply offset voltage high side floating supply voltage high side output voltage low side floating supply absolute voltage output standard voltage low side floating supply voltage low side output voltage low side fixed supply voltage logic input voltage symbol unit parameter t est conditions limits min. typ. max. v b > 10v v bs = v b ? s v cc2 > 10v v cc2com = v cc2 ? com hin, lin v b v s v bs v ho v cc2 v com v cc2com v lo v cc v in recommended operating conditions * for proper operation, the device should be used within the recommended conditions. thermal derating factor characteristic (maximum rating) pa c kage power dissipation pd (w) 0 0 2.0 1.5 1.0 0.5 25 50 100 75 125 150 t emperature ta ( c)
3 aug. 2009 mitsubishi semiconductors M81723FP high voltage half bridge driver electrical characteristics (ta = 25 c, v cc = v cc2com ( = v cc2 ? com ) = v bs ( = v b ? s ) = 15v, v s = v com = 0v, unless otherwise specified) a a ma ma ma ma ma ma ma ma ma v v v v v a a a v v s v v s v ns ma ma ? ? ns ns ns ns ns ns ns ns ns ns ns 14.9 4.0 1.0 7.2 0.1 7.2 0.1 300 80 60 75 85 15 10 70 85 15 10 200 0.20 0.30 0.20 0.25 0.37 0.20 0.20 0.37 0.25 1.5 25 75 8.4 0.4 7.5 8.4 0.4 7.5 130 100 55 45 95 115 35 30 95 115 35 30 220 1.0 1.0 0.4 0.6 0.4 0.5 0.75 0.4 0.4 0.75 0.5 0.1 0.6 2.0 75 150 1.0 9.7 0.7 9.7 0.7 6.0 180 140 100 70 120 145 70 80 120 145 70 80 15 15 240 floating supply leakage current v com floating supply leakage current v bs standby current v cc standby current v cc2 standby current v bs standby current h v cc standby current h v cc2 standby current h v bs standby current l v cc standby current l v cc2 standby current l high level output voltage low level output voltage high level input threshold voltage low level input threshold voltage input hysteresis voltage high level input bias current 5 high level input bias current 15 low level input bias current v bs supply uv reset voltage v bs supply uv hysteresis voltage v bs supply uv filter time v cc2 supply uv reset voltage v cc2 supply uv hysteresis voltage v cc2 supply uv filter time power-on reset voltage power-on reset filter time output high level short circuit pulsed current output low level short circuit pulsed current output high level on resistance output low level on resistance high side turn-on propagation delay high side turn-off propagation delay high side turn-on rise time high side turn-off fall time low side turn-on propagation delay low side turn-off propagation delay low side turn-on rise time low side turn-off fall time delay matching, high side and low side turn-on delay matching, high side and low side turn-off output pulse width symbol unit parameter t est conditions limits min. typ.* max. v b = v s = 600v v cc2 = v com = 600v hin = lin = 0v hin = lin = 0v hin = lin = 0v hin = 5v hin = 5v hin = 5v lin = 5v lin = 5v lin = 5v i o = 0a, lo, ho i o = 0a, lo, ho hin, lin hin, lin v inh = v ih ? il v in = 5v v in = 15v v in = 0v v o = 0v, v in = 5v, pw < 10 s v o = 15v, v in = 0v, pw < 10 s i o = ?0ma, r oh = (v oh ? o )/i o i o = 20ma, r ol = v o /i o cl = 200pf between ho-v s cl = 200pf between ho-v s cl = 200pf between ho-v s cl = 200pf between ho-v s cl = 200pf between lo-v com cl = 200pf between lo-v com cl = 200pf between lo-v com cl = 200pf between lo-v com |t dlh(ho) ? dlh(lo) | |t dhl(ho) ? dhl(lo) | v in : pw = 200ns * typ. is not specified. i fs i fcom i bs i cc i cc2 i bsh i cch i cc2h i bsl i ccl i cc2l v oh v ol v ih v il v inh i ih5 i ih15 i il v bsuvr v bsuvh t vbsuv v cc2uvr v cc2uvh t vcc2ur v ponr t ponr(fil) i oh i ol r oh r ol t dlh(ho) t dhl(ho) t rh t fh t dlh(lo) t dhl(lo) t rl t fl ? t dlh ? t dhl vopw
4 aug. 2009 mitsubishi semiconductors M81723FP high voltage half bridge driver function table lo = ho = low lo = high ho = high lo = ho = high ho = low, v bs uv tripped lo = high, v bs uv tripped lo = low, v cc2com uv tripped ho = high, v cc2com uv tripped h l h l l h l h x x h l l h hin behavioral state lin v bs uv v cc2com uv ho lo h l l h h l l h h l l h x x h h h h l l h h h h h h h h l l l l h h l l l h l h l h l h l l timing diagram 1. input/output timing diagram high active (when input signal (hin or lin) is ?? then output signal (ho or lo) is ??) in the case of both input signals (hin and lin) are ?? output signals (ho and lo) become ?? hin lin ho lo 2. v cc2com (v bs ) supply under voltage lockout timing diagram if supply voltage drops below uv trip voltage( ??? uvt = ??? uvr ??? uvh ) for supply uv filter time, output signal becomes ?? as soon as supply voltage is higher than uv reset voltage, output becomes normal. v cc2com (v bs ) lo (ho) lin (hin) t vcc2comuv (t vbsuv ) v cc2comuvr (v bsuvr ) v cc2comuvh (v bsuvh ) v cc2comuvt (v bsuvt ) note1 : ??state of v bs uv, v cc uv means that uv trip voltage. 2 : in the case of both input signals (hin and lin) are ?? output signals (ho and lo) become ?? 3 : x : l h or h l. 4 : output signal (ho, lo) is triggered by the edge of input signal. hin(lin) ho(lo)
5 aug. 2009 mitsubishi semiconductors M81723FP high voltage half bridge driver 3. allowable supply voltage transient it is recommended to supply v cc firstly and supply v cc2com secondly and supply v bs at last. in the case of shutting off supply voltage, please shut off v bs supply voltage firstly. secondly, shut off v cc2com supply voltage. and at last, shut- ting off v cc supply voltage. when applying v cc2com and v bs , power supply should be applied slowly. if it rises rapidly, output signal (ho or lo) may be malfunction. p ackage outline sop16-p-300-1.27 weigh t(g) p jedec code 0.2 eiaj package code lead material cu alloy 16p2n-a plastic 16pin 300mil sop symbol min nom max a a 2 b c d e l l 1 y dimension in millimeters h e a 1 i 2 p .35 0 0 .18 0 .0 10 .2 5 p .5 7 .4 0 p p p .27 1 .1 0 .8 1 .4 0 .2 0 .1 10 .3 5 .27 1 .8 7 .6 0 .25 1 p .62 7 p .2 0 .1 2 p .5 0 .25 0 .2 10 .4 5 p .1 8 .8 0 p .1 0 p b 2 p.76 0p p 0 p8 e e 1 16 9 8 1 h e e d e y f a a 2 a 1 l 1 l c e b 2 e 1 i 2 recommended mount pad detail f detail g z z 1 x p p z 1 p 0.605 p p p 0.755 0.25 z b x m g mmp
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