? semiconductor components industries, llc, 2000 october, 2000 rev. 2 1 publication order number: mbrf2060ct/d mbrf2060ct preferred device switchmode ? schottky power rectifier the switchmode power rectifier employs the schottky barrier principle in a large area metaltosilicon power diode. stateoftheart geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for use as rectifiers in very lowvoltage, highfrequency switching power supplies, free wheeling diodes and polarity protection diodes. ? highly stable oxide passivated junction ? very low forward voltage drop ? matched dual die construction ? high junction temperature capability ? high dv/dt capability ? excellent ability to withstand reverse avalanche energy transients ? guardring for stress protection ? epoxy meets ul94, v o at 1/8 ? electrically isolated. no isolation hardware required. ? ul recognized file #e69369 (note 1.) mechanical characteristics ? case: epoxy, molded ? weight: 1.9 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds ? shipped 50 units per plastic tube ? marking: b2060 maximum ratings please see the table on the following page 1. ul recognized mounting method is per figure 4. device package shipping ordering information mbrf2060ct to220 http://onsemi.com isolated to220 case 221d style 3 50 units/rail 3 1 schottky barrier rectifier 20 amperes 60 volts 2 preferred devices are recommended choices for future use and best overall value. 2 1 3 marking diagram b2060 b2060 = device code
mbrf2060ct http://onsemi.com 2 maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 60 volts average rectified forward current (rated v r ), t c = 133 c total device i f(av) 10 20 amps peak repetitive forward current (rated v r , square wave, 20 khz), t c = 133 c i frm 20 amps nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 amps peak repetitive reverse surge current (2.0 m s, 1.0 khz) i rrm 0.5 amp operating junction and storage temperature range t j , t stg 65 to +150 c voltage rate of change (rated v r ) dv/dt 10000 v/ m s rms isolation voltage (t = 1.0 second, r.h. 30%, t a = 25 c) (note 2.) per figure 3. per figure 4. (note 1.) per figure 5. v iso1 v iso2 v iso3 4500 3500 1500 volts thermal characteristics (per leg) maximum thermal resistance, junction to case r q jc 4.0 c/w lead temperature for soldering purposes: 1/8 from case for 5 seconds t l 260 c electrical characteristics (per leg) characteristic symbol max unit maximum instantaneous forward voltage (note 3.) (i f = 10 amp, t c = 25 c) (i f = 10 amp, t c = 125 c) (i f = 20 amp, t c = 25 c) (i f = 20 amp, t c = 125 c) v f 0.85 0.75 0.95 0.85 volts maximum instantaneous reverse current (note 3.) (rated dc voltage, t c = 25 c) (rated dc voltage, t c = 125 c) i r 0.15 150 ma 1. ul recognized mounting method is per figure 4. 2. proper strike and creepage distance must be provided. 3. pulse test: pulse width = 300 m s, duty cycle 2.0% figure 1. typical forward voltage per diode figure 2. typical reverse current per diode 0.01 0.1 1.0 10 120 100 80 60 40 20 0 v r , reverse voltage (volts) i r , reverse current (ma) t j = 150 c t j = 125 c t j = 100 c t j = 25 c 0.5 0 v f , instantaneous voltage (volts) 1.0 3.0 5.0 10 20 50 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i f , instantaneous forward current (amps) t j = 25 c 100 c 150 c
mbrf2060ct http://onsemi.com 3 test conditions for isolation tests* mounted fully isolated package leads heatsink 0.110 min figure 3. clip mounting position for isolation test number 1 * measurement made between leads and heatsink with all leads shorted together. clip mounted fully isolated package leads heatsink clip 0.107 min mounted fully isolated package leads heatsink 0.107 min figure 4. clip mounting position for isolation test number 2 figure 5. screw mounting position for isolation test number 3 mounting information** 4-40 screw plain washer heatsink compression washer nut clip heatsink figure 6. typical mounting techniques 6a. screwmounted 6b. clipmounted laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. the compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. destructive laboratory tests show that using a hex head 440 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. additional tests on slotted 440 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. however, in order to positively ensure the package integrity of the fully isolated device, on semiconductor does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions. **for more information about mounting power semiconductors see application note an1040.
mbrf2060ct http://onsemi.com 4 package dimensions to220 fullpak case 221d02 issue d notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 3: pin 1. anode 2. cathode 3. anode dim a min max min max millimeters 0.621 0.629 15.78 15.97 inches b 0.394 0.402 10.01 10.21 c 0.181 0.189 4.60 4.80 d 0.026 0.034 0.67 0.86 f 0.121 0.129 3.08 3.27 g 0.100 bsc 2.54 bsc h 0.123 0.129 3.13 3.27 j 0.018 0.025 0.46 0.64 k 0.500 0.562 12.70 14.27 l 0.045 0.060 1.14 1.52 n 0.200 bsc 5.08 bsc q 0.126 0.134 3.21 3.40 r 0.107 0.111 2.72 2.81 s 0.096 0.104 2.44 2.64 u 0.259 0.267 6.58 6.78 b y g n d l k h a f q 3 pl 123 m b m 0.25 (0.010) y seating plane t u c s j r on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 3036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mbrf2060ct/d switchmode is a trademark of semiconductor components industries, llc. north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland
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