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| 1. product profile 1.1 general description 2-lines (one differential channel) common-mode filter with integrated esd protection up to 15 kv contact discharge, exceeding iec 61000- 4-2, level 4. the device can eliminate efficiently common-mode noise from usb 2.0 and other high-speed interfaces with differential lines. IP3319CX6 attenuates significantly common-mode noise above 800 mhz while differential-mode signal extends out to more than 1 ghz before reaching the ? 6db point. IP3319CX6 is designed to protect sensitive i/os, such as usb 2.0, ethernet, digital video interface (dvi) and low-voltage differential signaling (lvds) interfaces from destruction by electrostatic discharge (esd). IP3319CX6 is a combination of an integrat ed copper-coils common-mode filter and a monolithic silicon technology-b ased esd protection. it integrates two ultra-low capacitance rail-to-rail diodes plus a separated protection diode in a 0.4 mm pitch wafer-level chip-size package (wlcsp). due to the rail-to-rail concept, the protection is working independently from av ailability of a supply voltage 1.2 features and benefits 1.3 applications 1.4 quick reference data [1] this parameter is guaranteed by design. IP3319CX6 single-channel common-mode fi lter with integrated esd protection network rev. 1 ? 30 january 2013 product data sheet ? 2-lines (one differential mode) common-mode filter ? esd protection up to ? 15 kv on external contact pins ? esd protection for the usb id line ? ultra low esd diode capacitance ? extremely low clamping voltage ? wlcsp6 with 0.4 mm pitch ? usb 2.0 high-speed lines ? dvi ? lvds interfaces table 1. quick reference data symbol parameter conditions min typ max unit r s(ch) channel series resistance - 6 - ? c d diode capacitance v r = 0 v; f = 1 mhz; pins a1, b2 to gnd [1] -1.5-pf
IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 2 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 2. pinning information [1] d+ and d ? are interchangeable. 3. ordering information [1] size: 1.34 mm ? 0.95 mm ? 0.57 mm fig 1. pin configuration table 2. pinning pin symbol [1] description [1] a1 d+_out usb data d+ (host side) a2 d+_in usb data d+ (connector side) b1 d ? _out usb data d ? (host side) b2 d ? _in usb data d ? (connector side) c1 gnd ground c2 id usb identification table 3. ordering information type number package name description version IP3319CX6 wlcsp6 wafer level chip-size package; 6 bumps (2 ? 3) [1] IP3319CX6 IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 3 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 4. marking IP3319CX6 is laser-marked wit h the following information (see figure 2 ): ? a marker indicating the pin a1 position. ? two lines of characters or numbers: ? the first line (placeholder d+ and d- are interchangeable. fig 3. functional diagram IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 4 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 6. limiting values 7. characteristics 7.1 electrical characteristics [1] this parameter is guaranteed by design. [2] 100 ns transmission line pulse (tlp); 50 ? ; pulser at 80 ns. [3] according to iec 61000-4-5 (8/20 ? s). table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage 0 5.5 v v esd electrostatic discharge voltage iec 61000-4-2, level 4; pins a2, b2, c2 to gnd (c1) contact discharge - ? 15 kv air discharge - ? 15 kv iec 61000-4-2, level 4; pins a1, b1 to gnd (c1) contact discharge - ? 2kv air discharge - ? 2kv t stg storage temperature ? 55 +125 ?c t amb ambient temperature ? 40 +85 ?c table 6. electrical characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit r s(ch) channel series resistance -6- ? c d diode capacitance pins a1, b2 to gnd [1] -1.5-pf pin c2 to gnd [1] -1.7-pf i rm reverse leakage current pins a2, b2, c2 to gnd; v i =3v -0.011 ? a v br breakdown voltage pins a2, b2, c2; i r =10ma 6 - 10 v v f forward voltage i f =10ma - 0.7 - v r dyn dynamic resistance tlp [2] positive transient - 0.25 - ? negative transient - 0.20 - ? surge [3] positive transient - 0.20 - ? negative transient - 0.14 - ? v cl clamping voltage i cl =6a [3] -4-v i cl = ? 6a [3] - ? 2.5 - v IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 5 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network the device uses an advanced cl amping structure showing a negative dynamic resistance. this snap-back behavior strongly reduces the clamping voltage to the system behind the esd protection during an esd event. do not connect unlimited dc current sources to the data lines to avoid keeping the esd protection device in snap-back state after exceeding breakdown voltage (due to an esd pulse for instance). pin a2; t p = 100 ns; transmission line pulse (tlp) pin a2; t p = 100 ns; transmission line pulse (tlp) fig 4. dynamic resistance with positive clamping fig 5. dynamic resistance with negative clamping pin c2; t p = 100 ns; transmission line pulse (tlp) pin c2; t p = 100 ns; transmission line pulse (tlp) fig 6. dynamic resistance with positive clamping fig 7. dynamic resistance with negative clamping ! " # $ " $ % & '%( ) & & ) & '( '( '( * * * * * * * $ *" * $ % & '%( ) & & ) & '( '( '( ! " # $ " $ % & '%( ) & & ) & '( '( '( * * * * * * * $ *" * $ % & '%( ) & & ) & '( '( '( IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 6 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 7.2 frequency characteristics figure 8 shows the common mode and differential mode attenuation measured in a 50 ? network analyzer (nwa) system. the 3 db point for the differential-mode signal is above 1 ghz. the common-mode attenuation reaches a typical value of ? 25 db in the gsm band. table 7. frequency characteristics symbol parameter conditions min typ max unit common mode ? il insertion loss s21cc; r gen =50 ? ; r l =50 ? 700 mhz ? f ? 1.8 ghz - - ? 13 db f>1.8ghz - - ? 11 db differential mode ? il insertion loss s21dd f = 500 mhz; r gen =50 ?? 3- - db f = 1 ghz; r l =50 ?? 5- - db (1) s21dd: differential mode (2) s21cc: common mode fig 8. common-mode and differential-mode insertion loss ! " # + * * *# * *! ',-( . . '( '( '( '( '( '( '( '( '( IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 7 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network data rate: 480 mbit/s (usb 2.0 high-speed) vertical scale = 124 mv/div horizontal scale = 260 ps/div fig 9. usb 2.0 eye diagram printed-circuit board (pcb) with IP3319CX6 data rate: 480 mbit/s (usb 2.0 high-speed) vertical scale = 124 mv/div horizontal scale = 260 ps/div fig 10. usb 2.0 eye diagram pcb without IP3319CX6 (reference) IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 8 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 8. package outline fig 11. package outline wlcsp6 / 0 !" # $% ! &' ( )* 1 1 / 2 table 8. package outline dimensions of wlcsp6 symbol min typ max unit a 0.540.570.60mm a 1 0.36 0.37 0.38 mm b 0 . 2 10 . 2 60 . 3 1m m d 0 . 9 00 . 9 51 . 0 0m m e 1 . 2 91 . 3 41 . 3 9m m e 0 . 3 80 . 4 00 . 4 2m m e 1 0.76 0.80 0.84 mm IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 9 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 9. packing information [1] for further information and the avai lability of packing methods, see section 14 . 10. soldering table 9. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 4 500 IP3319CX6 wlcsp6 4 mm pitch, 8 mm tape and reel -135 fig 12. reflow soldering footprint wlcsp6 table 10. reflow soldering dimensions of wlcsp6 symbol min typ max unit c - 0.25 - mm d 0.91 0.96 1.01 mm e 1.31 1.36 1.41 mm e - 0.40 - mm f - 0.325 - mm !3 3 4 2 2 / IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 10 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 11. design and asse mbly recommendations 11.1 pcb design guidelines for optimum performance, use a non-solder mask defined (nsmd), also known as a copper-defined design, incorporating laser-dr illed micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. refer to table 11 for the recommended printed-circuit board (pcb) design parameters. 11.2 pcb assembly guidelines for pb-free soldering table 11. recommended pcb design parameters parameter value or specification pcb pad diameter 250 ? m micro-via diameter 100 ? m (0.004 inch) solder mask aperture diameter 325 ? m copper thickness 20 ? m to 40 ? m copper finish auni pcb material fr4 table 12. assembly recommendations parameter value or specification solder screen aperture diameter 290 ? m solder screen thickness 100 ? m (0.004 inch) solder paste: pb-free snag (3 % to 4 %) cu (0.5 % to 0.9 %) solder to flux ratio 50 : 50 solder reflow profile see figure 13 the device can withstand at least three reflows of this profile. fig 13. pb-free solder reflow profile 001aai943 t reflow(peak) 250 230 217 t (c) cooling rate preheat t 1 t 5 t 4 t 3 t 2 t (s) IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 11 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network table 13. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 ?c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t ? 250 ? c--30s t 3 time 3 time during t ? 230 ? c10 - 50 s t 4 time 4 time during t > 217 ? c 30 - 150 s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 ?c/s pre-heat 2.5 - 4.0 ?c/s IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 12 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 12. revision history table 14. revision history document id release date data sheet status change notice supersedes IP3319CX6 v.1 20130130 product data sheet - - IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 13 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. IP3319CX6 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 30 january 2013 14 of 15 nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors IP3319CX6 1-channel common-mode filter with integrated esd protection network ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 30 january 2013 document identifier: IP3319CX6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.1 electrical characteristics . . . . . . . . . . . . . . . . . . 4 7.2 frequency characteristics. . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 packing information . . . . . . . . . . . . . . . . . . . . . 9 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 design and assembly recommendations . . . 10 11.1 pcb design guidelines . . . . . . . . . . . . . . . . . . 10 11.2 pcb assembly guidelines for pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 contact information. . . . . . . . . . . . . . . . . . . . . 14 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 |
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