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| d a t a sh eet product speci?cation supersedes data of 1997 sep 02 file under integrated circuits, ic12 1999 jan 06 integrated circuits pcf8570 256 8-bit static low-voltage ram with i 2 c-bus interface
1999 jan 06 2 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 contents 1 features 2 applications 3 general description 4 quick reference data 5 ordering information 6 block diagram 7 pinning 8 characteristics of the i 2 c-bus 8.1 bit transfer 8.2 start and stop conditions 8.3 system configuration 8.4 acknowledge 8.5 i 2 c-bus protocol 9 limiting values 10 handling 11 dc characteristics 12 ac characteristics 13 application information 13.1 application example 13.2 slave address 13.3 power-saving mode 14 package outlines 15 soldering 15.1 introduction 15.2 through-hole mount packages 15.2.1 soldering by dipping or by solder wave 15.2.2 manual soldering 15.3 surface mount packages 15.3.1 reflow soldering 15.3.2 wave soldering 15.3.3 manual soldering 15.4 suitability of ic packages for wave, reflow and dipping soldering methods 16 definitions 17 life support applications 18 purchase of philips i 2 c components 1999 jan 06 3 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 1 features operating supply voltage 2.5 to 6.0 v low data retention voltage; minimum 1.0 v low standby current; maximum 15 m a power-saving mode; typical 50 na serial input/output bus (i 2 c-bus) address by 3 hardware address pins automatic word address incrementing available in dip8 and so8 packages. 2 applications telephony: C ram expansion for stored numbers in repertory dialling (e.g. pcd33xxa applications) general purpose ram for applications requiring extremely low current and low-voltage ram retention, such as battery or capacitor-backed. radio, television and video cassette recorder: C channel presets general purpose: C ram expansion for the microcontroller families pcd33xxa, pcf84cxxxa, p80clxxx and most other microcontrollers. 3 general description the pcf8570 is a low power static cmos ram, organized as 256 words by 8-bits. addresses and data are transferred serially via a two-line bidirectional bus (i 2 c-bus). the built-in word address register is incremented automatically after each written or read data byte. three address pins, a0, a1 and a2 are used to define the hardware address, allowing the use of up to 8 devices connected to the bus without additional hardware. 4 quick reference data 5 ordering information symbol parameter conditions min. max. unit v dd supply voltage 2.5 6.0 i dd supply current (standby) f scl =0hz - 15 m a i ddr supply current (power-saving mode) t amb =25 c - 400 na t amb operating ambient temperature - 40 +85 c t stg storage temperature - 65 +150 c type number package name description version pcf8570p dip8 plastic dual in-line package; 8 leads (300 mil) sot97-1 pcf8570t so8 plastic small outline package; 8 leads; body width 7.5 mm sot176-1 1999 jan 06 4 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 6 block diagram fig.1 block diagram. handbook, full pagewidth mlb928 word address register shift register power on reset input filter row select memory cell array column select multiplexer r/w control i c bus control 2 6 5 scl sda 3 a2 2 a1 1 a0 8 v dd 4 v ss 7 test pcf8570 7 8 7 pinning symbol pin description a0 1 hardware address input 0 a1 2 hardware address input 1 a2 3 hardware address input 2 v ss 4 negative supply sda 5 serial data input/output scl 6 serial clock input test 7 input for power-saving mode (see section power-saving mode). also used as a test output during manufacture. test should be tied to v ss during normal operation. v dd 8 positive supply fig.2 pin configuration. p age 1 2 3 4 8 7 6 5 mlb929 pcf8570 scl sda a2 a1 a0 v dd v ss test 1999 jan 06 5 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 8 characteristics of the i 2 c-bus the i 2 c-bus is for bidirectional, two-line communication between different ics or modules. the two lines are a serial data line (sda) and a serial clock line (scl). both lines must be connected to a positive supply via a pull-up resistor. data transfer may be initiated only when the bus is not busy. 8.1 bit transfer one data bit is transferred during each clock pulse. the data on the sda line must remain stable during the high period of the clock pulse as changes in the data line at this time will be interpreted as a control signal. fig.3 bit transfer. mba607 data line stable; data valid change of data allowed sda scl 8.2 start and stop conditions both data and clock lines remain high when the bus is not busy. a high-to-low transition of the data line, while the clock is high is defined as the start condition (s). a low-to-high transition of the data line while the clock is high is defined as the stop condition (p). fig.4 definition of start and stop conditions. mba608 sda scl p stop condition sda scl s start condition 1999 jan 06 6 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 8.3 system con?guration a device generating a message is a transmitter, a device receiving a message is the receiver. the device that controls the message is the master and the devices which are controlled by the master are the slaves. fig.5 system configuration. mba605 master transmitter / receiver slave receiver slave transmitter / receiver master transmitter master transmitter / receiver sda scl 8.4 acknowledge the number of data bytes transferred between the start and stop conditions from transmitter to receiver is unlimited. each byte of eight bits is followed by an acknowledge bit. the acknowledge bit is a high level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. a slave receiver which is addressed must generate an acknowledge after the reception of each byte. also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. the device that acknowledges must pull down the sda line during the acknowledge clock pulse, so that the sda line is stable low during the high period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). a master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. in this event the transmitter must leave the data line high to enable the master to generate a stop condition. fig.6 acknowledgement on the i 2 c-bus. handbook, full pagewidth mba606 - 1 start condition s scl from master data output by transmitter data output by receiver clock pulse for acknowledgement 1 2 8 9 1999 jan 06 7 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 8.5 i 2 c-bus protocol before any data is transmitted on the i 2 c-bus, the device which should respond is addressed first. the addressing is always carried out with the first byte transmitted after the start procedure. the i 2 c-bus configuration for the different pcf8570 write and read cycles is shown in figs 7, 8 and 9. fig.7 master transmits to slave receiver (write) mode. handbook, full pagewidth s 0a slave address word address a a data p acknowledgement from slave acknowledgement from slave acknowledgement from slave r/w auto increment memory word address mbd822 n bytes fig.8 master reads after setting word address (write word address; read data). handbook, full pagewidth s 0a slave address word address a a slave address acknowledgement from slave acknowledgement from slave acknowledgement from slave r/w acknowledgement from master a data auto increment memory word address mlb930 p no acknowledgement from master 1 data auto increment memory word address last byte r/w s1 n bytes at this moment master - transmitter becomes master - receiver and pcf8570 slave - receiver becomes slave - transmitter 1999 jan 06 8 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 9 limiting values in accordance with the absolute maximum rating system (iec 134). 10 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, to be totally safe, it is desirable to take precautions appropriate to handling mos devices. advice can be found in data handbook ic12 under handling mos devices . symbol parameter min. max. unit v dd supply voltage (pin 8) - 0.8 +8.0 v v i input voltage (any input) - 0.8 v dd + 0.8 v i i dc input current - 10 ma i o dc output current - 10 ma i dd positive supply current - 50 ma i ss negative supply current - 50 ma p tot total power dissipation per package - 300 mw p o power dissipation per output - 50 mw t amb operating ambient temperature - 40 +85 c t stg storage temperature - 65 +150 c fig.9 master reads slave immediately after first byte (read mode). a ndbook, full pagewidth s 1a slave address data a1 data acknowledgement from slave acknowledgement from slave acknowledgement from slave r/w auto increment word address mbd824 auto increment word address n bytes last bytes p 1999 jan 06 9 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 11 dc characteristics v dd = 2.5 to 6.0 v; v ss = 0 v; t amb = - 40 to +85 c; unless otherwise speci?ed. notes 1. the power-on reset circuit resets the i 2 c-bus logic when v dd 1999 jan 06 11 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 13 application information 13.1 application example fig.11 application diagram. it is recommended that a 4.7 m f/10 v solid aluminium capacitor (sal) be connected between v dd and v ss . handbook, full pagewidth mlb931 scl sda v ss a1 a0 a2 test pcf8570 '1010' sda scl master transmitter/ receiver v dd sda scl rr v dd (i c bus) 2 r: pull up resistor r = r t c bus v dd scl sda v ss a1 a0 a2 test pcf8570 '1010' v dd v dd scl sda v ss a1 a0 a2 test pcf8570 '1010' v dd 1 v dd 1 v dd 1 v dd 1 0 0 0 0 0 up to 8 pcf8570c 1999 jan 06 12 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 13.2 slave address the pcf8570 has a fixed combination 1 0 1 0 as group 1, while group 2 is fully programmable (see fig.12). 13.3 power-saving mode with the condition test = v dd or v ddr the pcf8570 goes into the power-saving mode and i 2 c-bus logic is reset. fig.12 slave address. handbook, halfpage mlb892 1 0 1 0 a2a1a0r/w group 1 group 2 fig.13 timing for power-saving mode. (1) power-saving mode without 5 v supply voltage. (2) power-saving mode with 5 v supply voltage. (3) t su and t hd1 3 4 m s and t hd2 3 50 m s. handbook, full pagewidth mlb932 power saving mode (1) test = v ddr power saving mode (2) test = v dd operating mode test scl sda v dd i dd v dd v ddr 0 v v dd v ddr 0 v v dd v ddr 0 v v dd v ddr 0 v i dd i dds t su t hd1 t su t hd2 (3) (3) (3) (3) 1999 jan 06 13 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 fig.14 application example for power-saving mode. it is recommended that a 4.7 m f/10 v solid aluminium capacitor (sal) be connected between v dd and v ss . (1) in the operating mode test = 0 v; in the power-saving mode test = v ddr . handbook, full pagewidth mlb933 test scl sda v ss pcf8570 microcontroller 4 v dd v ddr 8 7 6 5 a0 a1 a2 1 2 3 1.2 v (nicd) 5 v (1) 1999 jan 06 14 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 14 package outlines references outline version european projection issue date iec jedec eiaj sot97-1 92-11-17 95-02-04 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.045 0.17 0.020 0.13 b 2 050g01 mo-001an m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 8 1 5 4 b e 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index dip8: plastic dual in-line package; 8 leads (300 mil) sot97-1 1999 jan 06 15 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 unit a max. a 1 a 2 a 3 b p cd (1) e (1) z (1) eh e ll p qy w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 7.65 7.45 7.6 7.4 1.27 10.65 10.00 1.1 1.0 2.0 1.8 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.45 sot176-1 95-02-25 97-05-22 x 4 8 q a a 1 a 2 w m b p d h e l p q detail x e z e c l v m a 5 1 (a ) 3 a y 0.25 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.30 0.29 0.30 0.29 0.050 1.45 0.057 0.25 0.01 0.419 0.394 0.043 0.039 0.079 0.071 0.01 0.004 0.043 0.018 0.01 0 5 10 mm scale pin 1 index so8: plastic small outline package; 8 leads; body width 7.5 mm sot176-1 1999 jan 06 16 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 15 soldering 15.1 introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. 15.2 through-hole mount packages 15.2.1 s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 15.2.2 m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. 15.3 surface mount packages 15.3.1 r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. 15.3.2 w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 15.3.3 m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 1999 jan 06 17 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 15.4 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, sqfp not suitable suitable - hlqfp, hsqfp, hsop, htssop, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable - 1999 jan 06 18 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 16 definitions 17 life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. 18 purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011. 1999 jan 06 19 philips semiconductors product speci?cation 256 8-bit static low-voltage ram with i 2 c-bus interface pcf8570 notes internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1999 sca61 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2865, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 greece: no. 15, 25th march street, gr 17778 tavros/athens, tel. +30 1 489 4339/4239, fax. +30 1 481 4240 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 printed in the netherlands 415106/00/04/pp20 date of release: 1999 jan 06 document order number: 9397 750 04971 |
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