hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 1/7 H277 hsmc product specification H277 complementary output hall effect sensor ic general description H277 is designed to integrate hall sens or with output driver together on the same chip. it is suitable for dual coils brush-less dc motors, dual coils brush-less dc fan, speed measurement, and revolution counting. it includes a band-gap reference voltage source, a hall devic e, an amplifier, a hysteretic controller and an open- collector output drive capable of sinking up to 300ma current load. an on-chip protection diode is implemented to prevent reverse power fault. H277 has a control circuit to prevent ?dead angle? from logic race condition in dc fan. it has excellent characteristic of temperature compensation. the internal temperature compensated voltage source can let sensor to get uniform sensitivity in a wide temperature range. it is rated for operation over temperature rage from -20 o c to +85 o c and voltage ranges from 3.0v to 20v. features ? on-chip hall sensor ? 3.0v to 20v operating voltage ? internal temperature compensation ? special design providing logic race condition immuni ty, shorter switching time, and good switch reliability ? 300ma output sink current ? internal on-chip protection diode ? sip-4l package applications ? dual-coil brush-less dc motor ? dual-coil brush-less dc fan ? revolution counting ? speed measurement typical application circuit (brush-less dc fan) fig.2 H277 application circuit
hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 2/7 H277 hsmc product specification pin configuration name p/i/o pin no. description vcc p 1 p ower supply input do o 2 output pin dob o 3 output pin gnd p 4 ground block diagram temperature compensation voltage regulator logic control vcc hall effect sensor differential amplifier hysteresis control output driver vout2 gnd vout1 gnd fig.3 functional block diagram of H277 absolute maximum ratings (ta=25 o c) characteristics symbol values unit supply voltage v cc 20 v output breakdown voltage v out(breakdown) 35 v magnetic flux density b unlimited gauss output zener breakdown v z 28 v output on current (continuous) i c 300 ma maximum output current i cmax 1 a operating temperature range t a -20 to +85 storage temperature range t stg -65 to +150 package power dissipation p d 500 mw maximum junction temperature t j 150
hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 3/7 H277 hsmc product specification electrical characteristics (t=+25 , v cc =3v~20v) characteristic symbol test c onditions min. typ. max. unit supply voltage v cc 3 - 20 v v cc =3v, i l =100ma - 200 - output saturation voltage v ce(sat) v cc =14v, i l =300ma - 300 600 mv output leakage current icex vce=14v, v cc =14v - - 2 ua supply current iccq v cc =20v, output open - 14 20 ma output rise time tr v cc =14v, r l =400 , c l =20pf - 1 5 us output falling time tf v cc =14v, r l =400 , c l =20pf - 0.2 1.2 us magnetic characteristics characteristic symbol min. max. unit grade operate point b op - 50 gauss H277a release point b rp -50 - gauss a operate point b op - 70 gauss H277b release point b rp -70 - gauss b operate point b op - 90 gauss H277c release point b rp -90 - gauss c operate point b op - 130 gauss H277d release point b rp -130 - gauss d fig.4 v do vs. magnetic flux density fig.5 v dob vs. magnetic flux density
hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 4/7 H277 hsmc product specification characteristics curve fig.6 i cc vs. v cc fig.7 i cc vs. t a supply current & temperature 12.4 12.5 12.6 12.7 12.8 12.9 13 13.1 13.2 13.3 13.4 0 20 40 60 80 100 120 temperature ( o c) supply current (ma) ... test conditions: v cc =20v output open, r l = (refer to test circuit) output saturation voltage & loading current 0 200 400 600 800 1000 1200 1400 1600 300 400 500 600 700 800 900 1000 loading current (ma) output saturation voltage (mv) ... test conditions: v cc =14v, t a =25 o c i l =300ma~1200ma hysteresis & temperature 0 10 20 30 40 50 60 70 80 0 20 40 60 80 100 120 temperature ( o c) hysteresis (g) test conditions: v cc =14v, r l =400 ? c l =20pf (refer to test circuit) fig.8 v sat vs. i c fig.9 bhys vs. t a sip-4l power dissipation & temperature 200 250 300 350 400 450 500 550 600 0 20406080100120 temperature ( o c) power dissipation (mw) fig.10 p d vs. t a
hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 5/7 H277 hsmc product specification brush-less dc fan output current curve 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 time (us) current (ma) 180 90 0 ic oil 1 ic oil 2 12v, 0.24a brush-less dc fan (refer to typical application circuit) test conditions: v cc =12v, c 1 =c 2 =2.2uf r coil1 =r coil2 =40ohm fig.11 dc fan output curve fig.12 dc fan output curve brush-less dc fan output voltage curve 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20 time (ms) output voltage (v) vout 1 vout 2 12v, 0.24a brush-less dc fan (refer to typical application circuit) test conditions: v cc =12v, c 1 =c 2 =2.2uf r coil1 =r coil2 =40ohm test circuit fig.13 test circuit
hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 6/7 H277 hsmc product specification sip-4l dimension dim min. max. a 5.12 5.32 b 4.10 4.30 c 3.55 3.75 d 0.43 0.49 e 0.35 0.41 f 1.24 1.30 g 3.78 3.84 h 1.32 1.52 i 1.45 1.65 j 0.93 1.13 k 13.00 15.50 l a1 3 o 5 o a2 5 o 7 o *: typical, unit: mm a b c a1 a2 d e f g h marking site a1 j i k a2 e 12 34 l marking: note: green label is used for pb-free packing pin style: 1.vcc 2.vout1 3.vout2 4.gnd hall sensor location: 2.00m m 1.25mm to p view material: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammability solid bu rning class: ul94v-0 4-lead sip-4l plastic package hsmc package code: ad important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of avantic. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer prod uct design, infringement of paten ts, or application assistance. head office: ? head office (hi-sincerity microelectronics corp.): 5/f., golden ha rvest building 15 wang chiu road, kowloon bay, hong kong tel: +852-2755-7162 fax: +852-2755- 7795 avantics : shanghai address: no.399, cai lum rd. zhang jiang technology industrial park pudong, shanghai 201210, china tel: +86(21) 61637118 fax: +86(21)61637006
hi-sincerity microelectronics corp. spec. no. : ic200907 issued date : 2009.04.03 revised date :2009.10.29 page no. : 7/7 H277 hsmc product specification soldering methods for hsmc products 1. storage environment: temperature=10 o c~35 o c humidity=65%15% 2. reflow soldering of surface-mount devices figure 1: temperature profile t p t l ramp-down ramp-up ts max ts min critical zone t l to t p t s preheat t l t p 25 t 25 o c to peak time temperature profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (t l to t p ) <3 o c/sec <3 o c/sec preheat - temperature min (ts min ) - temperature max (ts max ) - time (min to max) (ts) 100 o c 150 o c 60~120 sec 150 o c 200 o c 60~180 sec tsmax to t l - ramp-up rate <3 o c/sec <3 o c/sec time maintained above: - temperature (t l ) - time (t l ) 183 o c 60~150 sec 217 o c 60~150 sec peak temperature (t p ) 240 o c +0/-5 o c 260 o c +0/-5 o c time within 5 o c of actual peak temperature (t p ) 10~30 sec 20~40 sec ramp-down rate <6 o c/sec <6 o c/sec time 25 o c to peak temperature <6 minutes <8 minutes 3. flow (wave) soldering (solder dipping) products peak temperature dipping time pb devices. 245 o c 5 o c 5sec 1sec pb-free devices. 260 o c +0/-5 o c 5sec 1sec
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