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oct. 17. 2008 / rev. 0.0 1/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 the ADT7310 is system specific power supply ic that is suitable for color ccd camera. other features include over-current protection, thermal shutdown. it reduces design complexity and external component count. general description features typical application circuit applications ? input voltage range : 4.75v to 18v ? multiple output voltage channel available - 2 channel 3.3v outputs , 200ma / 60ma max. - 1.8v output , 40ma max. - 5v boost converter output , 100ma max. - 15v output , 10ma max. - externally adjustable negative voltage output (-7v typical) ? power-on-reset output & power sequence ? protection : thermal shutdown , over-current protection ? small size(5x5 mm 2 body) and thermally enha nced 28 pin mlf package ? color ccd camera ?cctv camera ? distributed power system (3.3v / 1.8v / 5v / 15v / -7v) package outline of the ADT7310 ADT7310 yyww u0 (ADT7310) 3.3vd 15v 3.3va rbo -7v vin2 l1 c1 c10 c20 l2 c2 cf1 u1 u2 u3 cf2 cf3 cl3 cl2 cl6 cl4 ct rs2 vin c100 c200 rs1 5v c30 d1 d2 rn1 rn2 qp1 qn1 cl1 cl5 cl7 c40 1.8v
oct. 17. 2008 / rev. 0.0 2/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 part list component type value ( model ) manufacturer u0 ic ADT7310 adtech u1, 2, 3 ic bat54swt1 on semiconductor qp1 chip transistor 2sb1424 rohm qn1 chip transistor mmbt4401lt1 on semiconductor d1, d2 chip sbd rsx101m-30 rohm l1 chip inductor 47uh / 590ma (slf6028t-470mr59) tdk l2 chip inductor 47uh / 590ma (slf6028t-470mr59) tdk c1 , 2 mlcc 10uf / 10v / x5r murata c100 tantalum capacitor 10uf / 25v (t91c106k025at) kemet c200 mlcc 0.1uf / 25v - cf1 , 2 , 3 mlcc 1uf / 25v / x5r murata cl1 , 2 , 3 mlcc 2.2uf / 25v / x5r murata c10 mlcc 1nf - c20 mlcc 22nf - c30 mlcc 22nf - ct mlcc 18pf - cl4, 5, 7 mlcc 2.2uf / 25v / x5r murata cl6 mlcc 4.7uf / 25v / x5r murata c40 mlcc 10nf - rs1 , 2 chip resistor 0.1 ? / 1% - rn1 chip resistor 45.3 ? / 1% - rn2 chip resistor 12.1 ? / 1% - sbd (schottky barrier diode)
oct. 17. 2008 / rev. 0.0 3/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 pin configuration ADT7310 1 2 3 4 5 6 7 21 20 19 18 17 16 15 28 27 26 25 24 23 22 8 9 10 11 12 13 14 pin description pin no. name i/o type description 1 rs2 i a current sensing and voltage feed-forward for boost converter 2 vin1 - p main power input 3 rs1 i a current sensing and voltage feed-forward for buck converter 4 pwm o d pwm output for buck converter 5 cc1 o a capacitor terminal for phase compensation of buck converter 6 gnd2 - g ground 7 vin2 - p second power input 8 vo1 o a 3.3v output for digital part 9 gnd3 - g ground 10 dly o a delay time control for rbo signal 11 rbo o d power on reset output 12 ct o a capacitor terminal for tuning oscillation frequency 13 vo2 o a 3.3v output for analog part 14 gnd4 - g ground 15 vho o a 15v output for ccd positive voltage 16 vreg o a internal reference voltage output 17 vno1 i a feedback voltage input for vno (-7v typical) 18 drv3 o d driving signal output of charge pump inverter 19 gnd5 - g ground 20 vin5 - p power input for 15v output 21 drv2 o d driving signal output of charge pump doubler 22 vin4 - p power input for charge pump block 23 gnd6 - g ground 24 vlo o a 1.8v output 25 vin3 - p feedback voltage input for boost converter 26 drv1 o d pwm output for boost converter 27 cc2 o a capacitor terminal for phase compensation of boost converter 28 gnd1 - g ground i : input , o : output , io : input/output , p : power , g : ground , a : analog , d : digital
oct. 17. 2008 / rev. 0.0 4/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 functional block diagram internal reg vin1 bias thermal shutdown pwm controller ldo 15v 3.3vd por rbo ldo 3.3va vin2 c/p doubler pwm controller osc power sequencer ldo c/p inverter ldo vin4 feedback vin5 1.8v drv2 vno1 drv3 cc1 pwm rs1 rs2 cc2 drv1 5v
oct. 17. 2008 / rev. 0.0 5/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 note2 ? 500 400 300 continuous mode , ct=18 ? note1 ? 600 500 400 continuous mode , ct=13 ? switching frequency - 58 - v in =12v , max. load current efficiency parameter condition min typ max unit note basic function operating supply voltage - 4.75 12 18 v icc with no load v in =12v, w/o loading 5.0 8.0 11.0 ? power on reset tdelay v in =12v , c30 =22 ? -8.5- ? voh - 3.0 3.3 3.6 v over-temperature protection on junction temperature at ot enable - 140 - off junction temperature at ot release - 110 - buck converter (+3.7v output) output voltage (vin2) v in =12v 3.5 3.7 3.9 v absolute maximum ratings operating ratings electrical characteristics (ta = 25 , v in = 12v , unless otherwise noted.) *1 derate 35 /w above +70 . stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. parameter symbol min. typ. max. unit power supply voltage v in --20v power dissipation (ta=70 ) *1 p dmax --2.2w storage temperature t stg -65 - +150 junction temperature t jmax --+150 thermal resistance ja -35- /w parameter symbol min. typ. max. unit power supply voltage v in 4.75 12 18 v operating temperature t opr -20 - +85 junction temperature t j --+125 max. power dissipation (ta=70 ) *1 p d --1.5w *1 this spec. indicates that junction temperature of the device is under 125 . in specific applications, this is recommended under this power dissipation specification.
oct. 17. 2008 / rev. 0.0 6/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 ? 100 50 - v in =12v maximum output current v 5.25 5.00 4.75 v in =12v , i o =80 ? output voltage (vin3) boost converter (+5v output) parameter condition min. typ. max. unit note +3.3vd output output voltage v in =12v , i o =180 ? 3.0 3.3 3.6 v output drive current v in =12v - 180 200 ? current limit v in =12v - 480 - ? load regulation i o =0 to 200 ? - 90 200 ? ripple rejection i o =200 ? , freq=10 ? -40- ? +3.3va output output voltage v in =12v , i o =50 ? 3.0 3.3 3.6 v output drive current v in =12v - 50 60 ? current limit v in =12v - 180 - ? load regulation i o =0 to 60 ? - 60 100 ? ripple rejection i o =60 ? , freq=10 ? -40- ? +1.8v output output voltage v in =12v , i o =25 ? 1.7 1.8 1.9 v output drive current v in =12v - 25 40 ? current limit v in =12v - 200 - ? load regulation i o =0 to 40 ? -2040 ? ripple rejection i o =40 ? , freq=10 ? -40- ? +15v output output voltage v in =12v , i o =5 ? 14.55 15.00 15.45 v output drive current v in =12v - 5 10 ? current limit v in =12v - 20 - ? load regulation i o =0 to 10 ? -3050 ? -7v output (rn1=45.3 ? , rn2=12.1 ? , unless otherwise noted.) output voltage v in =12v , io=-2 ? -7.5 -7.0 -6.5 v output drive current inflow current - 2 5 ? load regulation io=0 to -5 ? - 30 100 ? electrical characteristics (continued) note 1. this switching frequency is suitable to 5v vin operating condition. note 2. this switching frequency is suitable to 12v vin operating condition.
oct. 17. 2008 / rev. 0.0 7/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 typical performance characteristics 15v change vs temperature -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -20 0 20 40 60 80 100 120 temperature ( ) 15v change (% ) -7v change vs temperature -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -20 0 20 40 60 80 100 120 temperature ( ) -7v change (% ) 1.8v change vs temperature -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -20 0 20 40 60 80 100 120 temperature ( ) 1.8v change (% ) 5v change vs temperature -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -20 0 20 40 60 80 100 120 temperature ( ) 5v change (% ) 3.3vd change vs. temperature -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -20 0 20 40 60 80 100 120 temperature ( ) 3.3vd change (% ) 3.3va change vs temperature -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -20 0 20 40 60 80 100 120 temperature ( ) 3.3va change (% )
oct. 17. 2008 / rev. 0.0 8/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 typical performance characteristics efficiency vs load current (buck) 20 40 60 80 100 0 200 400 600 800 1000 load current (ma) efficiency (%) vin=5v vin=12v vin=18v switching frequency vs temperature 300 325 350 375 400 425 450 475 500 -20 0 20 40 60 80 100 120 temperature ( ) frequency (khz)
oct. 17. 2008 / rev. 0.0 9/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 note that external resistors for tuning negative voltage output required as accurate as possible. it is recommended 1% accur- acy. because -7v output is generated by two cascaded charge pump converter, this channel ha s operating voltage limitation. with the operation above -7.5v, it is saturated and its regulati- on performance degraded. +15v channel is generated with two cascaded charge pump co- nverters and one ldo. this channel output supplied current to ccd device. so, its channel outpu t noise affects image to noi- se directly. this is why one ldo is added and therefore the ADT7310 provides clear +15v output to the system. ldo this device has four ldos inte grated (+3.3v 2 channel, +15v and +1.8v channel). because the ADT7310 provided for using ccd camera application, the noise of each channel output mu- st be minimized. integration of ldos trade off noiseless output and heat dissipation performance of the device. from these aspect, each channel load cap ability and input-output dropout conditions are designed. by thes e considerations this device provides optimum application function. note that the heavy load current and high line volta ge application will produce the- mal constraint. power on sequence ccd camera application made by various devices requires ma- ny different supply voltages. also with different operating rati- ng between devices, it is seriously considered to power up se- quence. fortunately ccd camera application has only two cri- tical power supplies, +15v and -7v for powering the ccd. power on sequence that the system needs is as follows : i) the -7v must be supplied lastly. ii) the +15v must be supplied before the -7v. iii) other power supplies have no order. followed by the upper sequence, the ADT7310 operate succe- ssfully when it is powered up. further the ADT7310 will mon- itor +3.3v channel voltage and ge nerate rbo signal to reset the dsp device. this rbo signal also follows after the -7v channel settling. operation description device information the ADT7310 includes one step down dc-dc switching buck converter, one step up dc-dc switching boost converter, cha- rge pump boost converter, charge pump inverting converter, and several ldos. especially produced for power ing ccd camera applications, this device provides various pow er channels for composing the ccd applied camera system. these channel are 3.3v, 5v, 15v , -7v and 1.8v. from these chan nel, it is possible to supply all the powers required for the ap plication in one power supply device, ADT7310. the ADT7310 is assembled with sm all size and thermally enh- anced mlf (micro lead frame) package. with wide input operating vol tage range and one stop power supply configuration, it is very easy to design new specific set. buck converter buck converter generates inte rnal supply voltage (approxima- tely 3.7v). as required wide i nput supply range from 4.75v to 18v, intermediate power is n eeded. from this intermediate power all the channel outputs re-generated. using a current mode architecture with asynch ronous rectification, the buck converter have the ability to de liver sufficient current to the following power supply channels. boost converter 5v output channel is generated by the boost converter. operat- ing with current mode step-up dc-dc converter, its input volt- age is buck converter output vol tage (3.7v typical). with this boost converter output, supplied the power at the following charge pump converters for ge nerating +15v and -7v output. also it is provided +5v output with 100ma load current inde- pendently. in case of upper 100ma load, must be considered the device?s heat dissipation constraint. charge pump converter by these converters the ADT7310 provides +15v and -7v cha- nnel outputs. for these two channel generation, it is used three charge pump converters, one with externally composed and others with integrated. in case of generating charge pump inve- rter the part of the inverter are placed at the outside of the devi- ce for its inherent limitation of negative voltage operation. -7v inverter is possible to change its output voltage by tuning the external resistors. -7v +15v rbo vin
oct. 17. 2008 / rev. 0.0 10/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 re range of -55 to +125 , will only vary the capacitance to within 15%. the capacitor type x5r has a similar tolerance over a reduced temperature range of -55 to +85 . many large value ceramic capacitors, larger than 1uf are manufactu- red with z5u or y5v temperature characteristics. their capa- citance can drop by more than 50% as the temperature varies from 25 to +85 . therefore x7r is recommended over z5u and y5v in applications where the ambient temperature will change significantly above or below 25 . tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when com- paring equivalent capacitance and voltage ratings in the 0.47uf to 4.7uf range. another important consideration is that tantalum capacitors ha- ve higher esr values than equiva lent size ceramics. this mea- ns that while it may be possible to find a tantalum capacitor with an esr value within the stable range, it would have to be larger in capacitance than a ceramic capacitor with the same esr value. it should also be noted that the esr of a typical tantalum will increase about 2: 1 as the temperature goes from 25 down to -40 , so some guard band must be allowed. buck considerations inductor selection there are two main consideratio ns when choosing an inductor; the inductor should not saturate, and the inductor current ripple is small enough to achieve the desired output voltage ripple. different saturation current rating specs are followed by differ- ent manufacturers so attention must be given to details. satura- tion current ratings are typically specified at 25 so rating at max ambient temperature of ap plication should be requested from manufacturer. the saturation current is greater than the sum of the maximum load current and the worst case average to peak inductor curr- ent. a 47uh inductor with a satu ration current rating of at least 590ma is recommended in this a pplication. the inductor?s res- istance should be as low as possi ble for better efficiency. for cctv camera application, radiat ed rf noise from inductor is critical for high definitive vide o image. in this application, a toroidal or shielded bobbin inductor should be used. application hints external capacitors the ADT7310?s regulators requires external capacitors for regulator stability. these are specifically designed for cctv camera applications requiring minimum board space and smallest components. these capac itors must be correctly sel- ected for good performance. output capacitor the ldo?s are designed specifically to work with small cera- mic output capacitors. and each ldo?s has its own output capacitor ranges. be sure to be connected proper output capa- citor between the output pin and ground. for using mlcc, output capacitor value is good to use more than that of the specified to ?typical application circuit?. and its required esr range are between 10m ? to 1 ? . the output capacitor must meet the requirement for the min- imum value of capacitance and also have an esr value that is within the optimum range for stability. the ldo?s will remain stable and in regulation with no ext- ernal load. capacitor characteristics the ldo?s are designed to work with ceramic capacitors on the output to take advantage of the benefits they offer. for capacitance values in the range of 0.47uf to 4.7uf, ceramic capacitors are the smallest, least expensive and have the low- est esr values, thus making them best for eliminating high frequency noise. the esr of a typical 1.0uf ceramic capacitor is in the range of 20m ? to 40m ? . the capacitor value can change greatly, depending on the oper- ation conditions and capacitor t ype. so, the output capacitor selection should take account of all the capacitor parameters, to ensure that the specification is met within the application. the capacitance can vary with dc bias conditions as well as temperature and frequency of ope ration. normally increasing the dc bias condition can result in the capacitance value fall- ing below the minimum specified limit. it is therefore recom- mended that the capacitor manufacturer?s specifications for the nominal value capacitor are consulted for all conditions. the ceramic capacitor?s capacitance can vary with temperatu- re. the capacitor type x7r, wh ich operates over a temperatu- ldo considerations
oct. 17. 2008 / rev. 0.0 11/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 where i outmax : maximum load current l : min. inductor value incl uding worst case tolerance charge pump considerations doubler / inverter capacitor selection the flying capacitor (cf*) transfers charge from the its input power supply to the output. a polarized capacitor (tantalum, aluminum electrolytic, etc.) mu st not be used here, as the capacitor will be reve rse biased upon start-up of the ADT7310. the size of the flying capacito r and its esr a ffect output cur- rent capability and ripple characte ristic. in this applications, a 1uf, x7r or x5r type ceramic capacitor is recommended for the flying capacitor. the load capacitor (cl1,2,3) of the charge pump plays an imp- ortant part in determining the characteristics of the doubler output. the esr of the output load capacitor affects charge pump output resistance, which pl ays a role in determining output current capability. both output capacitance and esr affect output voltage ripple. for these reasons, a low value esr capacitor is recommended. boost considerations inductor selection as previously mentioned from th e inductor selection at the buck converter, inductor at the boost converter also needs to be considered two factors when choosing an inductor; the inductor should not saturate, and the inductor current ripple is small enough to achieve the desired output voltage ripple. by the property of cascading boost converter from buck conv- erter, its inductor saturation current is lower than the that of the buck converter. in this application, the same 47uh adopted and is sufficient. boost converter dr ives both its load current and the following charge pump converters for generating +15v and -7v. for proper operation at the power up time this inductor needs more saturation current than its total load current requir- ed. output capacitor selection use a 10uf, 10v ceramic capacitor. use x7r or x5r types, do not use y5v. (the same component as buck converter) application hints (continued) output capacitor selection use a 10uf, 10v ceramic capacitor. use x7r or x5r types, do not use y5v. the output filter capacitor smoot hes out current flow from the inductor to the load, helps maintain a steady output voltage du- ring transient load changes and reduces output voltage ripple. these capacitors must be selected with sufficient capacitance and sufficiently low esr to perform these functions. the output voltage ripple is cau sed by the charging and disch- arging of the output capacitor and also due to its esr and can be calculated as : voltage peak-to-peak ripple due to capacitance can be express- ed as follows v pp-c = i ripple / (4 * f * c) where i ripple : average to peak inductor current f : minimum switching frequency voltage peak-to-peak ripple due to esr can be expressed as follows v pp-esr = (2 * i ripple ) * r esr because these two components are out of phase the rms value can be used to get an approximate value of peak-to-peak ripple. voltage peak-to-peak ripple, r oot mean squared can be expre- ssed as follows v pp-rms = (v pp-c 2 + v pp-esr 2 ) note that the output voltage ri pple is dependent on the inductor current ripple and the esr of the output capacitor. the esr is frequency dependent (as well as temperature dependent), make sure the value used for calculations is at the switching frequency of the part. input capacitor selection the ADT7310 uses 10uf, 25v tant alum capacitor for input capacitor. use a mix of input by pass capacitors to control the voltage overshoot. use ceramic capacitor for the high frequen- cy decoupling and tantalum ca pacitor to supply the required rms input current. place the input capacitor as close as possible to the vin pin of the device. th e input filter capacitor supplies current to the pnp switching transistor of the converter in the first half of each cycle and reduces voltage ripple imposed on the input power source. the input current ripple can be calcul- ated as : in outmax out out in 2 in out in out outmax rms v i f l v ) v (v r 12 r v v v v 1 i i ? ? ? ? ? = ? ? ? ? ? ? ? ? + ? ? ? =
oct. 17. 2008 / rev. 0.0 12/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 application hints (continued) the output filter capacitor smoot hes out current flow from the inductor to the load, helps main tain a steady output voltage during transient load changes and reduces output voltage ripple . these capacitors must be selected with sufficient capacitance and sufficiently low esr to perform these functions. though the output ripple at the boost conv erter is not critical at the ccd camera application, care must be needed because its out- put ripple attacks other power s upplies composed in the board to add ripple voltage noise and induce noise at the image. so, if produced output ripple don?t aff ect to the image than it is recommended to choose one by considering component cost.
oct. 17. 2008 / rev. 0.0 13/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 pcb to the bottom layers, thermal vias need to be incorporated into the thermal pad design. the number of thermal vias improve the package thermal performance. generally, web-constructed via is often used in through-hole applications to facilitate the soldering of a pin to a large plane. it has a large thermal resistance to the surrounding layer. for this reason, do not use web-constructed via to the thermal pad. it is recommended use completely connected via to the surrounding layer (figure 2). if the diameter of the vias is too large, solder will be pulled away from the exposed paddle (solder wicking) during the reflow process. this will decrease thermal characteristic of the via 3. recommended pcb patterns figure 3 and 4 show adoptive pcb pattern of the ADT7310. top and bottom of the thermal pad patterns are the same and connected through the thermal vias. also the bottom thermal pad must be connected to adjacent ground plane. it is recom- mended that an array of thermal vias should be incorporated at 1.0 to 1.2mm pitch with via diameter of 0.3 to 0.33mm. pcb design for optimize d thermal performance 1. overview temperature characteristic of the ADT7310 is dependant to power dissipation and heat away of the pcb pattern. therefore, in design of the pcb pattern, consideration of the heat away characteristic is important. ADT7310 package is designed to provide enhanced thermal characteristics through the exposed pad on the bottom surface of the package. exposed pad effectively decrease the thermal resistance, which in turn provi des excellent heat dissipation from the die. in order to take full advantage of exposed pad, the pcb must have features to effectively conduct heat away from the package. this can be achieved by incorporating thermal pad and thermal vias. 2. pcb layout considerations 2.1 heat transfer for enhanced thermal performance, the exposed pad on the package needs to be soldered to thermal pad on the pcb. furthermore, for proper heat conduction through the pcb, thermal vias need to be incorporated in the pcb in the thermal pad region. the exposed pad should be attached to the ground plane for proper thermal and electrical performance. figure 1 illustrates primary heat away through gnd layer of the pcb. the presence of large metal planes in the pcb can heat away 90% of the generated heat in the ADT7310 (reference 1) 2.2 thermal pad to maximize thermal performance, the size of the thermal pad should at least match the e xposed pad size. the size of the thermal pad on the bottom pcb layer should be at least as large as the thermal pad on the top pcb layer. it is recommended that the bottom thermal pad be thermally connected to a gnd layer (reference 2) 2.3 thermal vias in order to effectively transfer heat from the top layer of the

oct. 17. 2008 / rev. 0.0 14/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 pcb design for optimize d thermal performance 4. stencil mask in order to effectively remove the heat from the package and to enhance electrical performance the exposed pad needs to be soldered to the thermal pad, preferably with minimum voids. if the solder paste coverage is too big, out gassing occurs during reflow process which ma y cause defects (splatter, solder balling). therefore, it is recommended that smaller multiple openings in stencil should be used instead of one big opening for printing solder pa ste on the thermal pad region (figure 5). this will typically result in 50 to 80% solder paste coverage 5. reflow condition reflow profile and peak temperature has a strong influence on void formation. voids in the thermal pad region reduce as the peak reflow temperature is 250~270 . solder extrusion from the bottom side of the pcb reduces as the reflow temperature is reduced.

1.0mm dia. circles @1.2mm pitch reference : 1. b.guenin, ?packaging: designing for thermal performance.? electronics cooling, may1997. 2. application note: ?application notes for surface mount assembly of amkor?s micro lead frame ( mlf) packages.? amkor technology, march2001
oct. 17. 2008 / rev. 0.0 15/15 * this specifications are subject to be changed without notice http://www.ad-tech.co.kr ADT7310 package ; 28mlf, 5mm x 5mm body (units : mm) top view side view bottom view

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