pb rohs ec1300hs-18.432m ec13 00 hs -18.432m series rohs compliant (pb-free) 3.3v 8 pin dip metal thru-hole lvcmos/ttl oscillator frequency tolerance/stability 100ppm maximum package operating temperature range 0c to +70c nominal frequency 18.432mhz pin 1 connection no connect duty cycle 50 10(%) electrical specifications nominal frequency 18.432mhz frequency tolerance/stability 100ppm maximum (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range, supply voltage change, output load change, first year aging at 25c, shock, and vibration) aging at 25c 5ppm/year maximum operating temperature range 0c to +70c supply voltage 3.3vdc 0.3vdc input current 10ma maximum output voltage logic high (voh) 2.4vdc minimum with ttl load, 2.7vdc minimum with lvcmos load output voltage logic low (vol) 0.4vdc maximum with ttl load or 0.5vdc maximum with lvcmos load rise/fall time 10nsec maximum (0.4vdc to 2.4vdc with ttl load, or 10% to 90% of waveform with lvcmos load) duty cycle 50 10(%) (measured at 50% of waveform) load drive capability 2ttl load or 15pf lvcmos load maximum output logic type cmos pin 1 connection no connect tri-state input voltage (vih and vil) +2.2vdc minimum to enable output, +0.8vdc maximum to disable output (high impedance), no connect to enable output. absolute clock jitter 100psec maximum one sigma clock period jitter 25psec maximum start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c lead integrity mil-std-883, method 2004 mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 1 of 7
ec1300hs-18.432m mechanical dimensions (all dimensions in millimeters) pin connection 1 no connect 4 ground/case ground 5 output 8 supply voltage line marking 1 ecliptek 2 ec13 ec13=product series 3 18.432m 4 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 2 of 7 7.620 0.203 7.620 0.203 13.2 max 13.2 max 1 4 8 5 dia 0.457 0.1 (x4) 5.08 min 5.6 max 0.8 0.1 (x3) marking orient a tion output w a veform v oh v ol 90% or 2.4v dc 50% or 1.4v dc 10% or 0.4v dc f all time rise time t w t duty cycle (%) = t w /t x 100 clock output
ec1300hs-18.432m www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 3 of 7 supply v oltage (v dd ) t est cir cuit f or ttl output output no connect or t r i-state ground + + + + _ _ _ _ p o w er supply v oltage meter current meter 0.01 f (note 1) 0.1 f (note 1) c l (note 3) r l (note 4) p o w er supply oscilloscope f requency counter probe (note 2) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . note 4: resistance v alue r l is sho wn in t ab le 1. see applicab le specification sheet f or 'load dr iv e capability'. note 5: all diodes are mmbd7000, mmbd914, or equiv alent. t ab le 1: r l resistance v alue and c l capacitance v alue vs . output load dr iv e capability output load drive capability r l v alue (ohms) c l v alue (pf) 10ttl 5ttl 2ttl 10lsttl 1ttl 390 780 1100 2000 2200 15 15 6 15 3
ec1300hs-18.432m www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 4 of 7 supply v oltage (v dd ) t est cir cuit f or cmos output output no connect or t r i-state ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ec1300hs-18.432m high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 5 of 7
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ec1300hs-18.432m low temperature infrared/convection 185c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 185c maximum target peak temperature (tp target) 185c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 6 of 7
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ec1300hs-18.432m low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev p 8/12/2010 | page 7 of 7
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