may 2011 doc id 10913 rev 4 1/8 8 emif02-mic02f2 2-line ipad?, emi filter and esd protection features emi symmetrical (i/o) low-pass filter high efficiency in emi filtering lead-free package very low pcb space occupation: 1.42 mm x 0.92 mm very thin package: 0.65 mm high efficiency in esd suppression high reliability offered by monolithic integration high reducing of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 on input pins ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1 on input pins ? 2 kv (air discharge) ? 2 kv (contact discharge) applications where emi filtering in es d sensitive equipment is required: mobile phones and communication systems computers, printers and mcu boards description the emif02-mic02 is a highly integrated device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. the emif02 flip-chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry which prevents damage to the application when subjected to esd surges up 15 kv. figure 1. pin configuration (bump side) figure 2. basic cell configuration tm : ipad is a trademark of stmicroelectronics. flip chip (6 bumps) b 1 2 3 a i1 o1 gnd gnd i2 o2 input output gnd gnd gnd low-pass filter ri/o = 470 cline = 16 pf www.st.com
electrical characteristics emif02-mic02f2 2/8 doc id 10913 rev 4 1 electrical characteristics table 1. absolute ratings (t amb = 25 c) symbol parameter value unit t j junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current r i/o series resistance between input and output c line input capacitance per line symbol test conditions min. typ. max. unit v br i r = 1 ma 14 16 v i rm v rm = 12 v per line 500 na r i/o 423 470 517 c line @ 0 v 16 20 pf i v i pp v cl v br v rm i r i rm i rm i r i pp v rm v br v cl
emif02-mic02f2 electrical characteristics doc id 10913 rev 4 3/8 figure 3. attenuation measurement and aplac simulation figure 4. analog crosstalk measurements 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g - 50.00 - 45.00 - 40.00 - 35.00 - 30.00 - 25.00 - 20.00 - 15.00 - 10.00 s21 (db) measurement simulation f (hz) 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 db - - - - - - i2/o1 f (hz) figure 5. digital crosstalk measurement figure 6. esd response to iec61000-4-2 (-15 kv air discharge) on one input v(in) and on one output v(out) figure 7. esd response to iec61000-4-2 (+15 kv air discharge) on one input v(in) and on one output v(out) figure 8. line capacitance versus applied voltage 0 2 4 6 8 10 12 14 16 18 20 0123456789101112 v (v) r f=1mhz v osc =30mv rms t j =25c c(pf)
application information emif02-mic02f2 4/8 doc id 10913 rev 4 2 application information figure 9. aplac model figure 10. aplac parameters model = d01-gnd rsubump rsubump cox cox rsubump cox rsubump cox gnd model = d01-ext model = d01-int model = d01-ext model = d01-int r_470r r_470r i2 i1 o1 o2 gnd 50ph 50m lgnd rgnd cgnd 50ph 50m lgnd rgnd cgnd model d01-ext bv = 7 cjo = cz_ext ibv = 1u ikf = 1000 is = 10f isr = 100p n = 1 m = 0.3333 rs = rs_ext vj = 0.6 tt = 50n ls 400ph rs 100m r_470r 482.6 cz_ext 8.73pf rs_ext 850m cz_int 2.9pf rs_int 850m cz_gnd 215.61pf rs_gnd 470m rgnd 10m lgnd 48ph cgnd 0.15pf cox 3.05pf rsubump 200m model d01-int bv = 7 cjo = cz_int ibv = 1u ikf = 1000 is = 10f isr = 100p n = 1 m = 0.3333 rs = rs_int vj = 0.6 tt = 50n model d01-gnd bv = 7 cjo = cz_gnd ibv = 1u ikf = 1000 is = 10f isr = 100p n = 1 m = 0.3333 rs = rs_gnd vj = 0.6 tt = 50n
emif02-mic02f2 ordering information scheme doc id 10913 rev 4 5/8 3 ordering information scheme figure 11. ordering information scheme 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. package dimensions emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10 pf or 3 letters = application 2 digits = version f = flip chip x = 2: lead-free, pitch = 500 m, bump = 315 m 0.92 mm 50m 1.42 mm 50 m 500 m 50 315 m 50 500 m 50 650m 65 210 m 210 m
ordering information emif02-mic02f2 6/8 doc id 10913 rev 4 figure 15. flip chip tape and reel specification 5 ordering information table 3. ordering information note: more information is availa ble in the application notes: an1235:"flip chip: package description and recommendations for use" an1751: ?emi filters: recommendations and measurements? figure 13. footprint figure 14. marking copper pad diameter: 250 m recommended, 300 m max solder stencil opening: 330 m solder mask opening recommendation: 340 m min for 300 m copper pad diameter x y x w z w e dot, st logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.73 0.05 1.02 0.05 0.20 0.02 1.47 0.05 st xxz yww e st xxz yww e st xxz yww e st xxz yww e st xxz yww e st xxz yww e order code marking package weight base qty delivery mode emif02-mic02f2 fj flip chip 2.3 mg 5000 tape and reel 7?
emif02-mic02f2 revision history doc id 10913 rev 4 7/8 6 revision history table 4. document revision history date revision changes 12-oct-2004 1 initial release. 11-jan-2006 2 ecopack statement added. die dimensions modified in figure 12. and first page. typographical errors corrected. 17-apr-2008 3 updated ecopack statement. updated figure 11 , figure 12 and figure 15. reformatted to current standards. 26-may-2011 4 updated c line values in ta bl e 2 .
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