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number GS-12-006 type product specification title page revision 1 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 1.0 objective this specification defines the performance, tes t, quality, and reliability requirements of the conan ? micro miniature connector system as well as lead free product that meets the requirem ent of the european union directives of restriction for hazar dous substances (dir ective 2002/95/ec). 2.0 scope this specification is applicable to the termination characteristics of the conan ? connector system, which provides for parallel interconnection of printed wi ring boards in low power applications. 3.0 general paragraph title 1.0 objective 2.0 scope 3.0 general 4.0 applicable documents 5.0 requirements 5.1 qualification 5.2 material 5.3 finish 5.4 design and construction 6.0 electrical characteristics 7.0 mechanical characteristics 8.0 environmental conditions 9.0 quality assurance provisions 9.1 equipment calibration 9.2 inspection conditions 9.3 sample quantities and description 9.4 qualification testing 9.5 requalification testing 4.0 applicable documents in the event of a conflict between t he requirements outlined in this specif ication and the product drawing, the product drawing shall take precedence. in the event of a conflict betw een the requirements outlined in this specification and the referenced documents, th is specification sha ll take precedence. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 2 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 4.1 specifications 4.1.1 engineering drawings 91900, 10084781 & 10086244 4.2 military standards 4.2.1 mil-std-202f: test methods for electronic component parts 4.2.2 eia-364: test methods for electrical connectors 4.2.3 mil-c-45662: equipment calibration 4.3 federal specifications 4.3.1 qq-n-290: nickel pl ating (electrodeposited) 4.3.2 qq-n-533: beryllium copper alloy strip 4.3.3 qq-b-750: phosphor bronze alloy strip 4.3.4 qq-b-613: cartridge brass alloy strip 4.3.5 qq-s-571: solder 4.4 other standards and specifications 4.4.1 ul-94: flammability 4.4.2 astm b-19: brass 4.4.3 astm b-36: brass 4.4.3 astmb-194: beryllium copper 4.4.4 astm b-103: phosphor bronze 4.4.5 iso 9000 4.5 fci specifications 4.5.1 bus-03-114: capacitance measurement 4.5.2 bus-03-404: normal force measurement 4.5.3 gs-19-037: solderability 4.5.4 gs-19-036: porosity 4.5.5 gs-19-039: plating adhesion 4.6 fci lab reports - supporting data 4.6.1 el-93-03-062: qualification testing 4.6.2 el-93-03-062b: qualification testing 4.6.3 el-92-08-051: qualification testing 4.6.4 el-94-01-031: qualification testing 4.6.5 el-2004-09-024: qualification testing 4.6.6 za5-2625 lead-free plating in vestigation (doe pure tin) pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 3 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 5.0 requirements 5.1 qualification connectors furnished under this s pecification shall be products t hat are capable of meeting the qualification test require ments specified herein. 5.2 material the material for each part shall be as specified herein, or equivalent. substitute material shall meet the performance requirements of this specification. 5.2.1 receptacle terminal. the base material shall be bery llium copper strip c17200, shm (tmo5). 5.2.2 header terminal. the base material shall be 3/4 hard phosphor bronze strip c51000. 5.2.3 header and receptacle insulator housing. the insulators shall be molded of 30% glass filled liquid crystal polymer that is rated 94v-0 or better in accordance with ul-94. 5.2.4 hold-down. the base material shall be full hard, brass strip c26000. see section 5.3.2 for plating requirements. 5.3 finish 5.3.1 the header and receptacle terminals s hall be plated in the contact area with 15 microinches min. gxt?, 30 microinches mi n. gxt? or 50 microinches min. gold (dependent on finish specified by part number) over 50 microinches nickel or copper. the terminal soldertail shall be plated with 200 microinhces min. tin lead, 100 microinches min. tin lead or pure tin over 50 microinches min. nickel or copper . the terminal areas outside of the contact area and soldertail areas shall be plated with 50 microinches min. nickel or copper. 5.3.2 the hold-down shall be plated with 100 micr oinches min. tin lead or pure tin over 50 microinches min. nickel or copper. 5.4 design and construction the connector shall be a multi-piece assembly havi ng two rows of contacts with surface mount soldertail terminations and solderable surface mount retention devices for installation on surface mount printed wiring boards or flexible circuits. 5.4.1 mating. the connector shall be capable of ma ting and unmating manually without the use of special tools. 5.4.2 workmanship. connectors shall be uniform in quality and shall be free from burrs, scratches, cracks, voids, chips, blisters, pin holes, sharp edges, and other defects that will adversely affect life or serviceability. open knit lines, which may appear as a crack, may be present in the housing but do not adv ersely affect the performance of the connector as per the requirements outlined in this specification. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 4 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 6.0 electrical characteristics 6.1 current rating the maximum current rating based upon a 30 degree c te mperature rise over ambient is 1.0 amp dc per contact for a 69 position connector with all contacts carrying current. the maximum current carrying capacity for an individual contact is 2.0 amps d.c. 6.2 low level contact resistance the low level contact resistance of the 4.15mm, 4.5mm, 5mm and 5.5mm mated height connectors shall not exceed 20 milliohms initially and 30 milliohms after environmental exposure when measured in accordance with eia-364 tp45. the low level contact resistance of the 6mm, 7mm and 7.5mm mated height connectors shall not ex ceed 25 milliohms initially and 35 milliohms after environmental exposure when measured in accordanc e with eia-364 tp45. the following details shall apply: a. method of connection: attach current and voltage leads as shown in figure 1.0. the resistance shall be measured from the solder tail of the header to the solder tail of the receptacle. b. test voltage: 20 millivolts dc max open circuit. c. test current: not to exceed 100 milliamperes. 6.3 insulation resistance the insulation resistance of the mated connec tors shall not be less than 1 gigaohm after environmental exposure when measured in acco rdance with mil-std-202f, method 302. the following details shall apply: a. test voltage: 500 volts dc b. preparation: the connectors shall be mated but not soldered to a p.c. board. c. measurement points: the insulation re sistance shall be measured between a minimum of 10 adjacent and 10 opposing contacts per connector. 6.4 dielectric withstanding voltage there shall be no evidence of arc-over, insulati on breakdown or leakage current in excess of 1 milliampere when the unmated connector is tested in accordance with mil-std-202f, method 301. the following details shall apply: a. test voltage: 500 volts rms at 60 hz. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 5 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 b. test duration: 60 seconds c. preparation: the connectors shall be mounted but not soldered to a p.c. board. d. measurement points: the dielectric withstanding voltage shall be applied across a minimum of 10 adjacent and 10 opposing contacts. 6.5 capacitance the capacitance between adjacent and opposing contac ts in a mated connector shall not exceed 2.0 picofarads when tested in accordance with du pont specification bus-03-114. the following details shall apply: a. test frequency: 100 khz b. preparation: the connectors shall be mated but not soldered to a p.c. board. c. measurement points: the capacitance shall be measured across a minimum of 10 adjacent and 10 opposing contacts. 7.0 mechanical characteristics 7.1 contact retention individual contacts in the unterminated header and receptacle portions of the connector shall withstand a load normal to the soldertail of 0. 25 min. pounds. the force shall be measured on a minimum of 10 contacts per unmated header and rec eptacle connector. the crosshead speed shall be no greater than 0.2 inches per minute. 7.2 mating force the force to mate header and receptacle connecto rs that are mounted on a p.c. board shall not exceed 125 grams per contact. the crosshead s peed shall be no greater than 1.0 inches per minute. 7.3 unmating force the force to unmate header and receptacle connecto rs that are mounted on a p.c. board shall be no less than 45 grams per contact. the cross head speed shall be no greater than 1.0 inch per minute. 7.4 normal force pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 6 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 the contact normal force shall not be less than 75 grams when tested in accordance with bus-03- 404 section 3.2 (probe method). refer to figur e 2.0. the following process shall be used: 7.4.1 solder the receptacle and header c onnectors to a printed circuit board. 7.4.2 select the receptacle term inal positions to be measured. 7.4.3 measure the maximum terminal gap betw een the selected positions and the opposite row of terminals in the receptacle connector. 7.4.4 measure the minimum width across t he selected positions and the opposite row of terminals of the header connector. 7.4.5 using an "l" shaped probe, lab fixture num ber mf149, figure 2, deflect the contact positions on the instron tester. 7.4.6 the minimum beam deflection occurs on t he long row of terminals. calculate the minimum beam deflection as follows: v = minimum width across the header terminals. w = maximum gap between receptacle terminals. z = deflection of terminals in the long row. a = number of terminals in the short row. b = number of terminals in the long row. a*(v-w) minimum deflection (z) = ------------ (a+b) 7.4.7 starting at the bottom of the force-deflect ion curve where the terminal begins to deflect, move up the curve a distance equal to the mi nimum deflection, z, to find the minimum normal force. measure a minimu m of 5 contacts per connector. 7.5 board retention the force to remove the header and receptacle c onnectors from a p.c. board shall be no less than 10 lbs. when both the hold-downs and the terminal leads are soldered in place. the crosshead speed shall be no greater than 0.2 inches per minute. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 7 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 8.0 environmental conditions after exposure to the following environmental conditions in accordance with the specified test procedures and/or details, the product shall show no physical damage and shall meet the electrical and mechanical requirements per paragraphs 6.0 and 7.0 as specified in the table 1.0 test sequences. unless specified otherwise, the assemblies shall be mated during exposure. 8.1 humidity, steady state - mil-std-202f, method 103b a. relative humidity: 90% +/- 5% b. temperature: 40 +/- 3 deg. c c. test duration: 96 hours d. samples: groups 1 and 2 - unmated during exposure. 8.2 thermal shock - mil-std-202f, method 107g a. test condition: a - (25, 1 hour cycles). b. temperature range: -55 +/- 5 to +130 +5/-0 deg. c. c. time at each temperature: 30 minutes d. transfer time: 5 minutes max. e. samples: groups 1 and 2 - unmated during exposure. 8.3 environmental sequence phase 1 - thermal shock, mil-std-202f, method 107g. a. test duration - 36, 1-hour cycles b. temperature range - between -20 and +80 deg. c. c. time at temperature - 30 minutes d. transfer time - 5 minutes, maximum phase 2 - humidity, mil-std-202f, method 103b. a. test duration - 10 days b. relative humidity - 95% c. temperature - 40 +/- 3 deg. c. 8.3.1 - high tem life mil-std-202f, method 108a a. test duration - 21 days b. temperature - 105 deg. c. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 8 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 8.4 shock - mil-std-202f, method 213b a. condition - a, (50g, 11 ms half-sine) contac ts shall show no evidence of discontinuity greater than one microsecond. the following details shall apply: b. shocks: 3 shocks in both directions along each of 3 orthogonal axes (18 total). c. mounting: see figure 3.0. d. no discontinuities greater than 1.0 microseconds. 8.5 vibration - mil-std-202f, method 204d a. condition: b b. vibration amplitude: +/-15g or .06" da. c. frequency range: 10 to 2000 hz. d. sweep time and duration: 20 minutes per sweep, 4 hours along each of 3 orthogonal axes (12 hours total). e. mounting: see figure 3.0. 8.6 industrial mixed flowin g gas - battelle procedure a. class: iia b. duration: 20 days, mated 8.7 solderability - mil-std-202f method 208f a. contact tails shall be solderable ov er a minimum of .035 from the tip. b. steam aging: suspended 2 inches abov e boiling, distilled water for 4 hours. c. acceptable coverage: 95% minimum. d. solder: 60/40 tin-lead in accordance with qq-s-571, type s. e. flux: type rma. f. flux immersion time: 10 seconds. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 9 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 g. solder dwell time: terminal held immediately above solder for 10 seconds and then immersed for 5 +/- 0.5 seconds. the solder tails shall be bent normal to the base of the connector to prevent the insulator from touching the solder bath. h. solder temperature: 245 +/- 5 deg. c. i. samples: group 7 - unsoldered and unmated. 8.8 resistance to ir soldering heat a. temperature: 260 o c + 5 o c (peak temperature) b. duration: 30 seconds. 8.9 durability - standard laboratory procedures a. number of cycles: 30 cycl es for 15u" gxt contact finish 200 cycles for 30u" gxt contact finish b. crosshead speed: 1 inch/minute max. 9.0 quality assurance provisions 9.1 equipment calibration all test equipment and inspection facilities used in t he performance of any test shall be maintained in a calibration system in accordance with mil-c-45662 and iso 9000. 9.2 inspection conditions unless otherwise specified herein, all inspecti ons shall be performed under the following ambient conditions: a. temperature: 25 +/- 5 deg. c. b. relative humidity: 30 to 60% c. barometric pressure: local ambient. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 10 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 9.3 sample quantities sample quantities for the respecti ve test groups are as follows: test group size (number of positions) connector height quantity 1 69 4.15 3 2 69 4.15 3 3 21 & 69 4.15 & 7.0 3 ea. 3a 21 & 69 4.15 & 7.0 3 ea. 4 21 7.0 3 5 69 7.0 3 5a 69 7.0 3 6 69 4.15 & 7.0 3 ea. 7 69 7.0 3 8 9 & 21 & 69 7.0 3 ea. 9 69 n/a 3 10 21 & 69 4.15 & 7.0 3 ea. 11 69 7.0 1 11a 69 7.0 1 11b 69 7.0 1 12 69 4.15 & 7.0 1 ea. 13 69 4.15 3 13a 69 4.15 3 pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 11 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 9.4 qualification testing qualification testing shall be performed on samp le units produced with equipment and procedures normally used in production. the test sequence shall be as shown in table 1. 9.5 requalification testing if either of the following conditions occurs, the responsible product engineer shall initiate requalification testing consisting of all applicable par ts of the qualification test matrix, table 1. a. a significant design change is made to t he existing product. a significant change shall include, but is not limited to, changes in t he contact material composition, contact material thickness, contact force, c ontact surface geometry, underlying material composition, underlying material thickness, insulator design, contact base material, or contact lubrication requirements. b. a significant change is made to the manuf acturing process which impacts the product form, fit, or function. c. a significant event occurs during producti on or end use requiring corrective action to be taken relative to the product des ign or manufacturing process. pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 12 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 table 1 - qualification testing test/operation test group 1 2 3 3 a 4 5 5 a 6 7 8 9 10 11 11 a 11 b 12 13 13 a product examination 1 10 1 8 1 14 1 14 1 10 1 11 1 11 1 5 1 4 1 4 1 4 1 7 1 5 1 5 1 4 1 - 1 12 1 12 sample preparation - 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 plating thkns. and/or metal exam. - - - - - - - - - - - - - - - 3 - - porosity - - - - - - - - - - - - 4 4 3 - - - contact resistance - - 5 5 5 5 5 - - - - 3 - - - - 5 5 - - 7 7 8 7 7 - - - - 5 - - - - 9 9 - - 9 9 - 9 9 - - - - - - - - - 11 11 - - 13 13 - - - - - - - - - - - - - - current rating - - - - - - - - - 3 - - - - - - - - insulation resistance 2 - - - - - - - - - - - - - - - - - 6 - - - - - - - - - - - - - - - - - 8 - - - - - - - - - - - - - - - - - dielectric withstanding 3 - - - - - - - - - - - - - - - - - voltage 9 - - - - - - - - - - - - - - - - - capacitance 4 - - - - - - - - - - - - - - - - - mating force - - 3 3 3 3 3 - - - - - - - - - 3 3 - - 11 11 - - - - - - - - - - - - 7 7 unmating force - - 4 4 4 4 4 - - - - - - - - - 4 4 - - 12 12 - - - - - - - - - - - - 8 8 - - - - - - - - - - - - - - - - - - contact retention - 3 - - - - - 4 - - - - - - - - - - - 5 - - - - - - - - - - - - - - - - - 7 - - - - - - - - - - - - - - - - normal force - - - - - - - - - - 3 6 - - - - - - board retention - - - - 9 10 10 - - - - - - - - - - - humidity 5 4 - - - - - - - - - - - - - - - - thermal shock 7 6 - - - - - - - - - - - - - - - - thermal shock phase 1 - - 6 6 - - - - - - - - - - - - - - temp. & hum. phase 2 - - 8 8 - - - - - - - - - - - - - - hi temp. life - - - - - - - - - - - 4 - - - - 10 10 mechanical shock - - - - 6 - - - - - - - - - - - - - vibration - - - - 7 - - - - - - - - - - - - - durability (30 cycles) - - 10 - - 6 - - - - - - 3 - - - 6 - durability (200 cycles) - - - 10 - - 6 - - - - - - 3 - - - 6 battelle imfg - - - - - 8 8 - - - - - - - - - - - resistance to ir heat - - - - - - - 3 - - - - - - - - - - solderability - - - - - - - - 3 - - - - - - - - - pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 13 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 figure 1.0 pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 14 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 figure 2.0 pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 15 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 figure 3.0 pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 16 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 pdm: rev:t released . status: printed: nov 28, 2010
number GS-12-006 type product specification title page revision 17 of 17 t authorized by date conan? micro miniature connector system c. martinez 29 july 08 classification unrestricted copyright fci form e-3334 rev f gs-01-001 revision record rev page description ec # date 1 all created new product spec. 10/14/91 a all various changes released v22342 04/16/92 b 15 change dim. on drawing .236 to .230 .082 to .064 .098 to .095 v33470 07/09/92 c all rewrite the following sections: change title 1.0, 4.1, 4.6, 5.2, 5.4, 6.1, 7. 2, 7.3, 8.6, 8.8, 9.3, table 1 v31757 09/29/93 d all correct spelling in header 2.0 - change "family of products" to "system" 9.3 - add test group 13 v31770 10/07/93 e 2,3,4 5,6,7 8,9 12 15 update 4.6, 5.3.2, 6.2, 7.2, 7.3 7.4.5, 8.3 remove 8.9 section and renumber add test group 7 and delete 13 update chart change connector to receptacle on dwg. v40605 01/26/94 f 2 10,12 add 4.6.4 add test group #13 v40450 03/21/94 g 3 9 10,12 update 5.3.1 and 6.1 update 8.0 add 3a, 5a and 13a v51216 10/16/95 h 7 sect. 8.3 - change phase ii to read ?phase 2?; change phase iii to read ?8.3.1?. v60740 03/18/97 j 4 para. 6.2 - add 5.5mm and 7.5mm. v70778 05/08/97 k all revised format to be cons istent with gs-01-001, and change berg, dupont, etc. referenc es to fci. change document number prefix from ges to gs. v01949 08/15/00 l 1,3 4.0 add statement for document control precedence. 5.4.2 add statement concerning allowance for open knit lines. v03-1033 09/12/03 m n p all 1,2,3,9 2 3 change logo add lead-free information mil-std-1344 was replaced by eia-364 remove ?tin lead? information m06-0295 m06-0326 m07-0357 08/01/06 08/25/06 08/09/07 r 3 add ?trade mark? at gxt . m08-0012 01/11/08 s 2 & 3 add ?tin lead? information and new series m08-0042 02/13/08 t 2 & 3 change solderability, porosi ty & adhesion specifications; remove obsolete specifications. add new plating option m08-0204 07/29/08 pdm: rev:t released . status: printed: nov 28, 2010

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