133 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: june 27, 2011 SP4060 series SP4060 lightning surge protection - SP4060 series description applications the SP4060 integrates low capacitance diodes with an additional zener diode to protect each i/o pin against esd and high surge events. this robust device can safely absorb up to 20a per iec61000-4-5 (t p =8/20s) without performance degradation and a minimum 30kv esd per iec61000-4-2 international standard. their low loading capacitance also makes them ideal for protecting high speed signal pins. features ? esd, iec61000-4-2, 30kv contact, 30kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec61000-4-5, 20a (8/20s) ? low capacitance of 4.4pf (typ) per i/o ? low leakage current of 1a (max) at 2.5v ? lcd/pd tvs ? desktops ? game consoles ? set to p boxes ? notebooks functional block diagram i/o 8 i/o 7 i/o 6 i/o 5 i/o 1 i/o 2 gnd i/o 3 i/o 4 pinout i/o 1 i/o 2 gnd i/o 3 i/o 4 nc i/o 8 i/o 7 i/o 6 i/o 5 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example lvds controller outside world clk+ shield gnd clk- a0+ a0- a1+ a1- a2+ a2- signal shield gnd SP4060-08atg lvds interface SP4060 series 2.5v 20a rail clamp array
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 134 tvs diode arrays (spa ? family of products) revision: june 27, 2011 SP4060 series lightning surge protection - SP4060 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 20.0 a p pk peak pulse power (t p =8/20s) 300 w t op operating temperature -40 to 85 oc t stor storage temperature -50 to 150 c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm 2.5 v snap back voltage v sb i sb =50ma 2.0 v reverse leakage current i leak v r =2.5v, i/o to gnd 0.5 1. 0 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 4.5 5.5 v i pp =5a, t p =8/20s, fwd 6.0 7. 2 v i pp =10a, t p =8/20s, fwd 8.0 9.6 v i pp =20a, t p =8/20s, fwd 12.5 15.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) 30 kv iec61000-4-2 (air) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v 4.4 5.0 pf diode capacitance 1 c i/o-i/o reverse bias=0v 2.2 pf note: 1. parameter is guaranteed by design and/or device characterization. thermal information parameter rating units storage temperature r ange -65 to 150 c maximum j unction temperature 150 c maximum l ead temperature (soldering 20-40s) 260 c clamping voltage vs. i pp pulse waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 peak pulse current-i pp (a) clamp voltage (v c ) 1.0 3.0 5.0 7.0 9.0 11 .0 13.0 15.0 17 .0 19.0 21.0
135 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: june 27, 2011 SP4060 series SP4060 lightning surge protection - SP4060 series capacitance vs. bias insertion loss (s21) i/o to gnd 0.0 1.0 2.0 3.0 4.0 5.0 0.0 0.5 1.0 1.5 2.0 2.5 dc bias (v) capacitance (pf) -30 -25 -20 -15 -10 -5 0 5 00001 0001 001 01 frequency (mhz) attenuation (db) ti me temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters package dimensions msop10 package msop10 pins 10 millimeters inches dim min max min max a - 1. 10 - 0.043 a1 0.00 0.15 0.000 0.006 b 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 d 2.90 3.10 0.114 0.122 e 4.67 5.10 0.184 0.200 e1 2.90 3.10 0.114 0.122 e 0.50 bsc 0.020 bsc l 0.40 0.80 0.016 0.032 b e a1 a 21 e1 e 10 d l c 0.32 [0.0126] 4.24 [0.1669] 1. 04 [0.0409] 5.28 [0.2079] 3.20 [0.1260] 0.50 [0.0 19 7] 2.00 [0.0787] solder pad layout
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 136 tvs diode arrays (spa ? family of products) revision: june 27, 2011 SP4060 series lightning surge protection - SP4060 series ordering information part number package marking min. order qty. SP4060-08atg msop10 ph8 4000 part numbering system part marking system sp 4060 08 a t g series number of channels package a = msop10 t= tape & reel g= green - silicon protection array (spa tm ) family of tvs diode arrays yyww = date code f l yywwd ph8 product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. all specifcations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte fnish vdi 11-13. embossed carrier tape & reel specif cation msop-10 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 5.40 5.60 0.213 0.220 d 1.50 1.60 0.059 0.063 d1 1.50 min 0.059 min p0 3.90 4.10 0.154 0.161 10p0 40.0+/- 0.20 1.574+/-0.008 w 11.90 12.10 0.469 0.476 p 7.90 8.10 0.311 0.319 a0 5.20 5.40 0.205 0.213 b0 3.20 3.40 0.126 0.134 k0 1.20 1.40 0.047 0.055 t 0.30 +/- 0.05 0.012+/- 0.002
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