a r r a y s t est & burn-in t est & burn-in specifica tions are subject to al tera tion without prior notice ? dimensions in millimeter specifica tions are subject to al tera tion without prior notice ? dimensions in millimeter t est & burn-in t est & burn-in n p 3 9 6 s e r ie s (o p e n t o p ) shrink ball grid array (1.27 mm pitch) o u t l i n e d i m e n s i o n s 100v ac for 1 minute w 30m max. at 10ma/20mv max. ?55c to +150c?40c to +170c f e a t u r e s insulation resistance: dielectric withstanding v oltage: contact resistance:operating t emperature range: w 1 ,0 0 0 m m in . a t 1 0 0 v d c h o u s i n g : c o n t a c t s : p l a t i n g : polyetherimide (pei), glass-filled beryllium copper (becu) gold over nickel s e ri e s n o . n o . o f c o n ta c t p in s d e s ig n n u m b e r n p 3 9 6 5 0 0 * - materials and finish open top type sockets for bga packages coverless shrink version 2-point t weezer contact system contact force: operationg force:mating cycles: 13g per pin approx. 3.2 kg10,000 insetions s p e c i f i c a t i o n s p a r t n u m b e r ( d e t a i l s ) t o p v i e w f r o m s o c k e t recommended pc board layout recommended pc board layout
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