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d a t a sh eet product data sheet supersedes data of 2003 apr 01 2003 oct 20 discrete semiconductors bza800avl series quadruple low capacitance esd suppressor db ook, halfpage mbd127
2003 oct 20 2 nxp semiconductors product data sheet quadruple low capacitance esd suppressor bza800avl series features ? low diode capacitance ? low leakage current ? sot353 (sc-88a) surface mount package ? common anode configuration. applications ? communication systems ? computers and peripherals ? audio and video equipment. description monolithic transient voltage suppressor diode in a five lead sot353 (sc-88a) package for 4-bit wide esd transient suppression. marking pinning type number marking code BZA856AVL r3 bza862avl r2 bza868avl r1 pin description 1 cathode 1 2 common anode 3 cathode 2 4 cathode 3 5 cathode 4 handbook, halfpage mgt580 1 5 4 3 2 3 1 4 5 2 fig.1 simplified outline (sot353; sc-88a) and symbol. ordering information type number package name description version BZA856AVL ? plastic surface mounted package; 5 leads sot353 bza862avl ? plastic surface mounted package; 5 leads sot353 bza868avl ? plastic surface mounted package; 5 leads sot353
2003 oct 20 3 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. dc working current limited by p tot(max) . 2. device mounted on standard printed-circuit board. esd standards compliance thermal characteristics note 1. solder point of common anode (pin 2). symbol parameter conditions min. max. unit per diode i z working current t amb = 25 c ? note 1 ma i f continuous forward current t amb = 25 c ? 200 ma i fsm non-repetitive peak forward current t p = 1 ms; square pulse ? 3.5 a p tot total power dissipation t amb = 25 c; note 2; see fig.5 ? 300 mw p zsm non repetitive peak reverse power dissipation square pulse; t p = 1 ms ? 6 w t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c esd electrostatic discharge iec 61000-4-2 (contact discharge) 15 ? kv hbm mil-std 883 10 ? kv standard conditions iec 61000-4-2, level 4 (esd) >15 kv (air); >8 kv (contact discharge) hbm mil-std 883, class 3 >4 kv symbol parameter conditions value unit r th j-a thermal resistance from junction to ambient all diodes loaded 410 k/w r th j-s thermal resistance from junction to solder point; note 1 one diode loaded 200 k/w all diodes loaded 185 k/w
2003 oct 20 4 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series electrical characteristics t j = 25 c unless otherwise specified. symbol parameter conditions min. typ. max. unit v f forward voltage i f = 200 ma ? ? 1.2 v i r reverse current BZA856AVL v r = 3 v ? ? 200 na bza862avl v r = 4 v ? ? 100 na bza868avl v r = 4.3 v ? ? 20 na v z working voltage i z = 1 ma BZA856AVL 5.32 5.6 5.88 v bza862avl 5.89 6.2 6.51 v bza868avl 6.46 6.8 7.14 v r dif differential resistance i z = 1 ma BZA856AVL ? ? 200 ? bza862avl ? ? 150 ? bza868avl ? ? 100 ? s z temperature coefficient i z = 1 ma BZA856AVL ? 1.3 ? mv/k bza862avl ? 2.4 ? mv/k bza868avl ? 2.9 ? mv/k c d diode capacitance f = 1 mhz; v r = 0 BZA856AVL ? 22 28 pf bza862avl ? 18 22 pf bza868avl ? 16 19 pf diode capacitance f = 1 mhz; v r = 5 v BZA856AVL ? 12 17 pf bza862avl ? 9 12 pf bza868avl ? 8 11 pf i zsm non-repetitive peak reverse current t p = 1 ms; t amb = 25 c BZA856AVL ? ? 0.90 a bza862avl ? ? 0.85 a bza868avl ? ? 0.80 a
2003 oct 20 5 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series handbook, halfpage 10 1 10 ? 1 mld997 10 ? 2 10 ? 1 1 t p (ms) i zsm (a) 10 BZA856AVL bza862avl/bza868avl fig.2 maximum non-repetitive peak reverse current as a function of pulse time. handbook, halfpage 10 1 10 2 mld999 10 ? 2 10 ? 1 1 t p (ms) p zsm (w) 10 bza862avl BZA856AVL bza868avl fig.3 maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). handbook, halfpage 05 26 6 10 14 18 22 1234 v r (v) c d (pf) mld998 bza862avl bza868avl BZA856AVL fig.4 diode capacitance as a function of reverse voltage; typical values. t j = 25 c; f = 1 mhz. handbook, halfpage 050 t amb ( c) p tot (mw) 100 150 400 300 100 0 200 mld793 fig.5 power derating curve.
2003 oct 20 6 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series handbook, full pagewidth mle004 450 ? 50 ? note 1: attenuator is only used for open socket high voltage measurements iec 1000-4-2 network c z = 150 pf; r z = 330 ? 1/4 bza800avl rg 223/u 50 ? coax r z c z esd tester digitizing oscilloscope 10 attenuator note 1 gnd gnd1 gnd2 gnd3 gnd gnd unclamped + 1 kv esd voltage waveform (iec 1000-4-2 network) clamped + 1 kv esd voltage waveform (iec 1000-4-2 network) unclamped ? 1 kv esd voltage waveform (iec 1000-4-2 network) clamped ? 1 kv esd voltage waveform (iec 1000-4-2 network) vertical scale = 5 v/div horizontal scale = 50 ns/div bza868avl bza862avl BZA856AVL vertical scale = 200 v/div horizontal scale = 50 ns/div vertical scale = 200 v/div horizontal scale = 50 ns/div vertical scale = 5 v/div horizontal scale = 50 ns/div fig.6 esd clamping test set-up and waveforms.
2003 oct 20 7 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series application information typical common anode application a quadruple transient suppressor in a sot353 package makes it possible to protect four separate lines using only one package. two simplified examples are shown in figs. 7 and 8 . handbook, full pagewidth gnd keyboard, terminal, printer, etc. i/o bza800avl a b c d functional decoder mle006 fig.7 computer interface protection. handbook, full pagewidth mle007 i/o rom ram cpu clock gnd v dd v gg data bus control bus address bus bza800avl fig.8 microprocessor protection.
2003 oct 20 8 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series device placement and prin ted-circuit board layout circuit board layout is of extreme importance in the suppression of transients. the clamping voltage of the bza800avl is determined by the peak transient current and the rate of rise of that current (di/dt). since parasitic inductances can further add to the clamping voltage (v = l di/dt) the series cond uctor lengths on the printed-circuit board should be kept to a minimum. this includes the lead length of the suppression element. in addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. place the suppression element close to the input terminals or connectors 2. keep parallel signal paths to a minimum 3. avoid running protection conductors in parallel with unprotected conductors 4. minimize all printed-circuit board loop areas including power and ground loops 5. minimize the length of th e transient return path to ground 6. avoid using shared transient return paths to a common ground point.
2003 oct 20 9 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series package outline references outline version european projection issue date iec jedec eiaj sot353 wb m b p d e 1 e a a 1 l p q detail x h e e v m a a b y 0 1 2 mm scale c x 13 2 4 5 plastic surface mounted package; 5 leads sot353 unit a 1 max b p cd e (2) e 1 h e l p qy w v mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 0.25 0.15 a 1.1 0.8 97-02-28 sc-88a
2003 oct 20 10 nxp semico nductors product data sheet quadruple low capacitance esd suppressor bza800avl series data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors. no changes were made to the content, except for the legal definitions and disclaimers. printed in the netherlands r76/02/pp11 date of release: 2003 oct 20 document order number: 9397 750 11934

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