integrated circuits mf2 icd8x dual interface smart card ic short form speci?cation revision 1.0 july 2000 short form specification
2 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x contents 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 different configurations of the mf2 icd8x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1.1 configuration a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1.2 configuration b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 pinning information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.1 smart card contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 note: specification may be changed without further notice.
3 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x 1 description the mifare ? pro card ic is a microprocessor based chip combining contactless smart card technology based on the mifare ? contactless system and standard contact smart card technology on a single chip (dual interface). this chip is compatible with the mifare ? architecture platform. compatibility with existing mifare ? reader modules and the optional emulation modes of mifare ? s and mifare ? plus enable fast system integration of mifare ? pro based cards. physical construction and dimensions of the mifare ? pro ic allows the production of iso cards (iso 7816-1). compared to a contact only card an antenna has to be added in the peripheral zone of the card (see figure 1). the antenna consists of a few turns of a printed, etched or wired coil which is directly connected to the two contactless interface pins of the mifare ? pro module. the 80c51 micro-controller operates both in contact and in contactless mode. thus, in both interface modes users define the final function of the card with their operating system. this allows the same level of security and flexibility for both the contact (iso 7816) interface as well as the contactless (mifare ? ; iso 14443/type a) interface. for the development of the card operating systems all necessary tools are available based on the ashling tool platform. the triple-des co-processor together with the fast mifare ? interface offer high security and speed in contactless and contact smart card applications. the field proven mifare ? modulation and communication technique provides reliable communication and secure processing, even in electro-magnetically harsh environments like in buses or train stations. fig.1 mifare ? pro card. dual interface module with mifare ? pro antenna
4 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x 1.1 different con?gurations of the mf2 icd8x depending on the application requirements the mifare ? pro can be configured in two different ways. the configuration has impact on the memory organization of the rom and on the access conditions for the eeprom and influences the user os development. the selected configuration is part of the user rom mask, that contains also the user os code. three different configurations (a, b1, b4) are possible and shown in table 1. fig.2 rom mapping in different configurations of mf2 icd8x. mifare 1 os os16 (user os) os20 (user os) configuration a configuration b
5 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x 1.1.1 c onfiguration a in configuration a the full 20 kbytes rom memory is available for a dual interface user operating system (os20). the eeprom management and configuration is fully up to the user os (os20). the mifare ? pro type number mf2 icd8 0...... defines configuration a. 1.1.2 c onfiguration b in configuration b the lower 4 kbytes of the user rom memory are used for the contactless mifare ? 1 operating system provided by philips. with this mifare ? 1 os the mifare ? s and mifare ? plus functionality may be emulated on the mifare ? pro. here different hardware secured configurations of the eeprom memory are supported. this flexibility allows to combine the new features of mifare ? pro with the requirements of existing applications and infrastructure. the remaining 16 kbytes rom are available for a dual interface user operating system (os16). for secure separation of both operating systems the dedicated built in hardware protection controls access to the eeprom and 4 kbytes mifare ? rom. for detailed explanation of mifare ? s and mifare ? plus functionality please refer also to the following documents: mifare ? mf cm500 product specification mifare ? standard ic mf1 ics50 functional specification mifare ? plus, mf1 p60 general description, smart card ic for contact and contactless operation. the mifare ? pro type number mf2 icd8 1...... defines configuration b1 with emulation of mifare ? s and 1 kbyte eeprom with mifare ? mapping. the mifare ? pro type number mf2 icd8 4...... defines configuration b4 with emulation of mifare ? plus and 4 kbytes eeprom with mifare ? mapping. table 1 configuration part number rom eeprom ram a mf2 icd8 0 ... 20 kbytes for user os 8 kbytes for access with user os 256 bytes b1 mf2 icd8 1 ... 16 kbytes for user os 4 kbytes for mifare1 os 7 kbytes for access with user os 1 kbyte for access with mifare1 os and user os, con?gurable b4 mf2 icd8 4 ... 16 kbytes for user os 4 kbytes for mifare1 os 4 kbytes for access with user os 4 kbytes for access with user os and mifare os, con?gurable
6 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x 2 block diagram fig.3 block diagram of mf2 icd8x. iso contacts contact interface (iso7816) contactless interface unit eeprom 8 kbytes 80c51 cpu ram 256 bytes data memory data & program memory triple-des co-processor mifare ? coil (iso 14443) rf interface (mifare ? , iso 14443) security logic and sensors interface management test rom 4 kbytes rom1 16 kbytes rom2 rom
7 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x 3 features 80c51 8-bit micro-controller core operating in contact and contactless mode on a single chip low power, high speed triple-des co-processor for contactless and contact operation C triple-des calculation speed (with keys loaded): 175 m s in contactless mode C single des calculation speed (with keys loaded): 125 m s in contactless mode low power / low voltage design 20 (16) kbytes user rom 256 bytes ram 8 kbytes eeprom C stores data or program code C 32 byte pages C 8 bytes security area (write once memory) C minimum of 100.000 write/erase cycles C data retention for minimum of 10 years C eeprom programming voltage generated on chip power saving modes C power-down and idle mode 2 vectorised interrupt sources from C eeprom C io transition clock frequency range 1 to 5 mhz contact configuration and serial interface according to iso 7816 mifare ? rf contactless interface as suggested by iso/iec 14443 type a C 13.56 mhz operating frequency C reliable communication C high speed (106 kbaud, efficient frame support) C true anticollision C high speed crc co-processor according to ccitt mifare ? reader module compatibility mifare ? s and mifare ? plus emulation modes advanced security features C rom code not visible due to implantation C low supply voltage sensor (lvs) C high supply voltage sensor (hvs) C low clock frequency sensor (lfs) C high clock frequency sensor (hfs) C high temperature sensor (hts) C unique serial number (hardware protected) C fabkey per individual die custom specific eeprom initialisation supply voltage: 2.7 v - 5.5 v operating temperature: -25 to + 70 c 3.5 kv esd protection on iso pads according to mil standard 883-c, method 3015
8 philips semiconductors short form speci?cation revision 1.0 july 2000 dual interface smart card ic mf2 icd8x 4 ordering information 5 pinning information 5.1 smart card contacts table 2 pin description type number (1) package temperature range ( c) name description version mf2 moc1 d8 0 /d0xxyy module dual interface modules on super 35 mm ?lm (8-contact) sot507aa1 -25 to +70 mf2 moc1 d8 1 /dmxxyy mf2 moc1 d8 4 /dmxxyy mf2icd8000w/p5dxxyy ffc sawn wafer on ?lm frame carrier - mf2icd8101w/p5dxxyy mf2icd8401w/p5dxxyy iso 7816 mf2 icd8x contacts symbol symbol description c1 vcc vdd power supply voltage input c2 rst rst reset input, active low c3 clk clk clock input c4 reserved n.c. not connected c5 gnd vss ground (reference voltage) input c6 reserved n.c. not connected c7 i/o i/o input/output for serial data c8 reserved n.c. not connected -- la antenna coil connection -- lb antenna coil connection n.c. i/o n.c. gnd n.c. clk rst vcc c5 c2 c3 c4 c1 c6 c7 c8 la lb * * * antenna contacts are placed on module backside fig.4 iso contact assignments for sot507aa1
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