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480 1 pc122f 2 5 7 8 6 34 k2m ag s k 15 goy ordering code ;my applications ??y features y ~ ?p
q %?;mz?
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qu?m y ???vu??o ?^m y
i?0?u??o ?^m ??a?? spark gaps operating temp. k 30 vj 85 c ag ??a?? ? ? y6 6 l??y?0) [ v ] 4 8 f g m 500 m 800 ??? y [ mm ] h3d l3n k2m k2u k4m k4u y h ????? ??? k ????? k ????? k ????? k ????? 6.4 6.4 5.0 5.0 6.4 6.4 ?^ 5.0 m 0.8 24 ? 20 ? 5.0 m 1 20 ? 5.0 m 1 0.65 0.65 0.60 0.60 0.60 0.60 2 ? y 15 ?
go?w?? 20 yy p ???? % 3 %p? 5 ? ?l????y [ vdc ] 7 a
y crt *%w? ?yu ) q = ?? q e 20 ??o ? f >g? g s e 15 ??o ? f >g? g b e 15 ??a?e?? ? q = ?? q %???s` c %??? ? 122 1200 492 4900 y very safe due to self-extinguishing resin y leakage current is very small. y electrostatic capacitance is very small. y used to absorb abnormal voltages in the periphery of a crt ag spark gaps type coating conditions 6 4 8 lead configuration [ mm ] h3d l3n k2m k2u k4m k4u lead type h-formed straight k-formed k-formed k-formed k-formed lead space 6.4 6.4 5.0 5.0 6.4 6.4 length 5.0 m 0.8 24min. 20min. 5.0 m 1 20min. 5.0 m 1 diameter 0.65 0.65 0.60 0.60 0.60 0.60 2 external dimension 15 20 p alkyd resin 3 resin material 76 packaging q e type 20, bulk s e type 15, bulk b e type 15, taped q =blank space q without resin cap c with resin cap 1 type by external dimension 122 1200 492 4900 nominal discharge starting voltage [ vdc ] discharge voltage tolerance [ v ] f g m 500 m 800 q =blank space 5 1
surge absorbers 8 481 p.481 ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions p.482 p.483 p.484 p.486 ?3???? selection guide p.14 etc ?
goy external dimensions h ????? formed h3d ag20 ag15 k ????? formed k2m,k2u,k4m,k4u ??? straight l3n type ???
lead type ??aay part numbers y w g tx ? ? y6ztxl????yz r tx?0)z?txa
ztx??? yg?u???b{ g please specify the coating condition code and z the discharge starting voltage code and r the tolerance code and g the packaging code and the lead configuration code. f ? g ?;`om?p?x~ ?p
q %pz ul94v-0 z ul1410 f phase ll f
m g ?- ab??wpb{ note d the material used is a self-extinguishing resin conforming to ul94v-0 and ul1410 f phase ll regulation g yyy i 1 ag15 z ag20 x dc500v20 ?ow?pb{ ?.w^ thickness of body d 4 m 0.5 ?.w^ thickness of body d 4 m 0.5 unit d mm f inch g e ? t y capless ? t y ? v capped ?.w^ thickness of body d 3.5max f 0.138max gf 0.157 m 0.020 gf 0.157 m 0.020 g ?.w^ thickness of body d 4 m 0.5 f 0.157 m 0.020 g ?.w^ thickness of body d 4.7 m 0.5 f 0.184 m 0.020 g ?.w^ thickness of body d 4.7 m 0.5 f 0.184 m 0.020 g i 1 values of ag15,ag20 are set at dc500v within 20 seconds. y type l????y discharge starting voltage f dc g ? ?? nominal value [ v ] 1200 y 1500 y 2000 2500 1200 y 1500 y 2000 2500 ?0) tolerance [ v ] m 500 m 800 m 500 m 800
? ? insulation resistance [ m e ] i 1 10000min 10000min ??? y lead configuration k ????? k formed ???z h ????? straight ,h formed ag15p g r g e ag20p g r e ehs (environmental hazardous substances) rohs rohs
482 ?
q
$y electrical characteristics
surge absorbers 8 483 ay packaging 7 ? !?o?
: minimum quantity type ag15 ag20 >g? bulk 1000 500 a?e?? taped 1300 f ------ 7 ? !?o?
: minimum quantity [ pcs ] t k2m ??w? g? symbol a b t p p 0 p 1 p 2 f w w 0 w 1 w 2 h h 0 b d 0 l b t q h1 q h2 d 6.8 m 0.5 f 0.268 m 0.020 g 7.0 m 0.5 f 0.276 m 0.020 g 4.0 m 0.5 f 0.157 m 0.020 g 12.7 m 1.0 f 0.500 m 0.039 g 12.7 m 0.3 f 0.500 m 0.012 g 3.85 m 0.5 f 0.152 m 0.020 g 6.35 m 1.3 f 0.250 m 0.051 g 5.0 m 0.5 f 0.197 m 0.020 g 18.0 f 0.709 g y 12.0min f 0.472min g 9.0 f 0.354 g 3.0max f 0.118max g 19.6 m 0.5 f 0.772 m 0.020 g 16.0 m 0.5 f 0.630 m 0.020 g 4.0 m 0.3 f 0.157 m 0.012 g 11.0max f 0.433max g 2.0max f 0.079max g 0.75 m 0.2 f 0.030 m 0.008 g 2.0max f 0.079max g 0.6 m 0.05 f 0.024 m 0.002 g
go dimensions j 0.039 k 0.020 j 0.75 k 0.5 j 1.0 k 0.5 j 0.030 k 0.020 a?e??
goy f k2m ?? g y taping dimensions f k2m type g t available for k2m type only unit d mm f inch g
surge absorbers 8 485 reliability data spark gaps specified value item test methods and remarks 1.operating temperature y range 2.operating humidity range 3.storage temperature y range 4.discharge voltage 5.insulation resistance 6.capacitance 7.discharge y life 8. damp heat 9.terminal y strength tensile torsional no damage no damage k 30 cvj 85 c 95%rh max. f no dew condensation g k 40 cvj 85 c within the specified tolerance 10,000 m e min. 1pfmax. with the circuit 1 shown below, conduct measure- ment with voltage application. applied voltage d 500vdc duration d within 20 sec. measuring frequency d 1 m 0.1mhz measuring voltage d 0.5 v 5.0vrms bias application d none with the circuit 2 shown below, repeat discharge with specified voltage, followed by the measurement within 2 to 5 hrs. number of discharge d 10,000 times temperature d 40 m 2 c humidity d 90 v 95 l rh duration d 250 hrs recovery d 2 to 5 hrs of recovery under the standard condition after the removal from test chamber. apply the tensile force in the direction to draw terminal. applied force d 9.8n apply the bending force to incline the body to right and left through angle of 90 applied force d 4.9n circuit 2 circuit 1 note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 c of temperature, 45 to 85% relative humidity and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20 m 2 c of temperature, 60 to 70% relative humidity and 86 to 106kpa of air pressure. unless otherwise specified, all the tests are conducted under the "standard condition." discharge voltage change insulation resistance discharge voltage change insulation resistance l 5000m e 5000m e l k 35 j 20 k 30 j 50 ag15 z ag20 r d 20m e c d 10000pf e d refer to individual specification ag15 z ag20 r d 20m e c d 2000pf
precautions surge absorbers 8 487 1/2 technical considerations stages precautions precautions on the use of spark gaps 1. circuit design s verification of operating environment, electrical rating and per- formance 1. a malfunction in medical equipment, spacecraft, nuclear re- actors, etc. may cause serious harm to human life or have severe social ramifications. as such, any spark gaps to be used in such equipment may require higher safety and/or reli- ability considerations and should be clearly differentiated from components used in general purpose applications. s verification of rated voltage (dc rated voltage) 1. spark gaps has determined electric discharge voltage be- tween metaled electrode using the insulation resistance of air. therefore, since a life changes with the energies of input serge, please give me examination enough in the case of use. 2. since between the electrode will be in a short state at the time of electric discharge, when using it for a low impedance cir- cuit, the follow current occurs and reduce the life of spark gaps remarkably. in such a case, please connect low resis- tance or a capacitive varistor in series. 3. since the voltage which starts electric discharge when the early serge of a standup is actually impressed, since electric discharge delay generates spark gaps may become higher than the specified electric discharge start voltage, cautions are required. 4. since spark gaps was developed for serge with small en- ergy, when using it as an object for guidance thunder absorp- tion with the big energy generated on a commercial power supply line, telephone / communication line, etc., it requires cautions enough. s operating environment precautions 1. spark gaps should not be used in the following environments: (1)environmental conditions to avoid a. exposure to water or salt water. b. exposure to moisture or condensation. c. exposure to corrosive gases (such as hydrogen sulfide, sulfu- rous acid, chlorine, and ammonia) 2. pcb design 1. when spark gaps are mounted onto a pc board, hole dimen- sions on the board should match the lead pitch of the compo- nent, if not it will cause breakage of the terminals or cracking of terminal roots covered with resin as excess stress travels through the terminal legs. as a result, humidity resistance performance would be lost and may lead to a reduction in insulation resistance and cause a withstand voltage failure. 3. considerations for automatic insertion s adjustment automatic insertion machines (leaded components) 1. when inserting spark gaps in a pc board by auto-insertion machines the impact load imposed on the capacitors should be minimized to prevent the leads from chucking or clinching.
precautions surge absorbers 8 489 4. soldering s selection of flux 1. when soldering spark gaps on the board, flux should be ap- plied thinly and evenly. 2. flux used should be with less than or equal to 0.1 wt% (equiva- lent to chroline) of halogenated content. flux having a strong acidity content should not be applied. 3. when using water-soluble flux, special care should be taken to properly clean the boards. s wave soldering 1.temperature, time, amount of solder, etc. are specified in y accordance with the following recommended conditions. 2. do not immerse the entire spark gaps in the flux during the soldering operation. only solder the lead wires on the bottom of the board. 1. flux is used to increase solderability in wave soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. to mini- mize the amount of flux applied, it is recommended to use a flux-bubbling system. 2. with too much halogenated substance (chlorine, etc.) content is used to activate the flux, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 3. since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degrada- tion of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. 1. if spark gaps are used beyond the range of the recommended conditions, heat stresses may cause cracks inside the spark gaps, and consequently degrade the reliability of the spark gaps. 5. cleaning s board cleaning 1. when cleaning the mounted pc boards, make sure that cleaning conditions are consistent with prescribed usage conditions. 1. the resin material used for the outer coating of capacitors is occasionally a wax sub- stance for moisture resistance which can easily be dissolved by some solutions. so before cleaning, special care should be taken to test the component? vulnerability to the solutions used. when using water-soluble flux please clean the pcb with purified water sufficiently and dry thoroughly at the end of the process. insufficient washing or drying could lower the reliability of the capacitors. 6. post-cleaning-process s application of resin molding, etc. to the pcb and components. 1. please contact your local taiyo yuden sales office before per- forming resin coating or molding on mounted capacitors. please verify on the actual application that the coating pro- cess will not adversely affect the component quality. 2/2 1-1. the thermal expansion and coefficient of contraction of the molded resin are not neces- sarily matched with those of the spark gaps. the spark gaps may be exposed to stresses due to thermal expansion and contraction during and after hardening. this may lower the specified characteristics and insulation resistance or cause reduced with- stand voltage by cracking the ceramic or separating the coated resin from the ceramics. 1-2. with some types of mold resins, the resin's decomposition gas or reaction gas may remain inside the resin during the hardening period or while left under normal condi- tions, causing a deterioration of the capacitor's performance. 1-3. some mold resins may have poor moisture proofing properties. please verify the contents of the resins before they are applied. 1-4. please contact taiyo yuden before using if the hardening process temperature of the mold resins is higher than the operating temperature of the spark gaps. technical considerations stages precautions precautions on the use of spark gaps s mechanical considerations 1. be careful not to subject the spark gaps to excessive me- chanical shocks. withstanding voltage failure may result. 2. if spark gaps are dropped onto the floor or a hard surface they should not be used. 1. because the spark gaps is made of ceramic, mechanical shocks applied to the board may damage or crack the spark gaps. 2.spark gaps which are dropped onto the floor or a hard surface may develop defects and have a higher risk of failure over time. 7. handling 1. under high temperature/high humidity conditions, the decrease in solderability due to the oxidation of terminal electrodes and deterioration of taping and packaging character- istics may be accelerated. s storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. hu- midity should especially be kept as low as possible. recom- mended conditions: ambient temperature below 40 c humid- ity below 70% rh. products should be used within 12 months after delivery. after the above period, the solderability should be checked before using the spark gaps. 2. spark gaps should not be kept in an environment filled with decomposition gases such as (sulfurous hydrogen, sulfurous acid, chlorine, ammonia, etc.) 3. spark gaps should not be kept in a location where they may be exposed to moisture, condensation or direct sunlight. 8. storage conditions

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