hlmp-hl64, hlmp-hl65 precision optical performance amber alingap 5mm standard oval leds data sheet description this precision optical performance oval led is speci- cally designed for full color/video and passenger information signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide eld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains uv inhibitors to reduce the eects of long term exposure to direct sunlight. package dimensions a: non stand-o features well dened spatial radiation pattern high brightness material superior resistance to moisture stando package tinted and diused typical viewing angle 40 x100 applications mono color signs notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.20mm unless otherwise specied. b: stand-o 1.02 0.040 0.70 0.028 5.20 0.204 7.00 0.275 0.984 25.00 0.039 1.00 0.020 0.004 0.50 0.10 cathode lead 2.54 0.10 3.80 0.150 10.80 0.50 0.425 0.020 7.00 0.20 0.276 0.008 5.20 0.20 0.205 0.008 1.30 0.20 0.051 0.008 sq typ. 1.00 0.039 2.54 0.30 0.10 0.012 min. 1.02 0.040 0.70 0.028 max. 0.50 0.10 0.020 0.004 3.80 0.20 0.150 0.008 24.00 0.945 min. max. max. min. max. min. sq typ. cathode lead
2 device selection guide part number color and dominant wavelength d (nm) typ [3] luminous intensity iv (mcd) at 20 ma min [1,2,5] luminous intensity iv (mcd) at 20 ma max [1,2,5] stando hlmp-hl64-xykdd amber 590 1660 2400 no hlmp-hl64-xyldd no hlmp-hl65-xykdd yes hlmp-hl65-xyldd yes notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. the optical axis is closely aligned with the package mechanical axis. 3. dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 4. ? is the o-axis angle where the luminous intensity is half the on-axis intensity. 5. tolerance for each bin limit is 15% part numbering system note: please refer to ab 5337 for complete information about part numbering system. packaging option dd: ammo pack color bin selection k: color bin 2 & 4 l: color bin 4 & 6 maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide stando?/non stando? 4: non stando? 5: stando? package h: 5mm standard oval 40 x 100 hlmp C hl 6x C x x x xx
3 electrical / optical characteristics t j = 25c parameter symbol min. typ. max. units test conditions forward voltage v f 1.8 2.1 2.4 v i f = 20 ma reverse voltage v r 5v i r = 100 a dominant wavelength [1] d 587.0 590.0 594.5 nm i f = 20 ma peak wavelength peak 594 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-anode lead luminous ecacy [2] v 500 lm/w emitted luminous power/emitted radiant power thermal coecient of d 0.08 nm/c i f = 20 ma; + 25c t j + 100c notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp. 2. the radiant intensity, i e in watts per steradian, may be found from the equation i e = i v / v where i v is the luminous intensity in candelas and v is the luminous ecacy in lumens/watt. absolute maximum ratings t j = 25c parameter amber unit dc forward current [1] 50 ma peak forward current 100 [2] ma power dissipation 120 mw reverse voltage 5 v led junction temperature 130 c operating temperature range -40 to +100 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor 30%, frequency 1khz.
4 figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative intensity vs forward current figure 4 . maximum forward current vs ambient temperature figure 5. radiation pattern-major axis figure 6. radiation pattern-minor axis 0 10 20 30 40 50 60 0 20406080100 t a - ambient temperature - c - ambient temperature - c i f max - maximum forward current - ma 0.0 0.2 0.4 0.6 0.8 1.0 500 550 600 650 700 wavelength - nm relative intensity 0 20 40 60 80 100 0123 forward voltage-v forward current-ma 0.0 1.0 2.0 3.0 4.0 5.0 0 20406080100 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 angular dispalcement -degree normalized intensity 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 angular dispalcement - degree normalized intensity
5 intensity bin limit table (1.2: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max x 1660 1990 y 1990 2400 tolerance for each bin limit is 15% v f bin table (v at 20ma) bin id min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 tolerance for each bin limit is 0.05v amber color range bin min dom max dom xmin ymin xmax ymax 2 587 589.5 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 4 589.5 592 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 6 592 594.5 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 tolerance for each bin limit is 0.5nm. figure 7. relative light output vs junction temperature figur e 8. relative forward voltage vs junction temperature 0.1 1 10 -40 -20 0 20 40 60 80 100 120 140 t j - junction temperature - c relative light output (normalized at t j = 25c) -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 -40 -20 0 20 40 60 80 100 120 140 t j - junction temperature - c forward voltage shift - v avago color bin on cie 1931 chromaticity diagram 0.340 0.360 0.380 0.400 0.420 0.440 0.460 0.480 0.500 0.550 0.600 0.650 0.700 x y 2 4 6 amber
6 precautions: lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: care must be taken during pcb assembly and soldering process to prevent damage to the led component. led component may be eectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1.59 mm esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105c max. - preheat time 60 sec max - peak temperature 260c max. 260c max. dwell time 5 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering prole to ensure that it is always conforming to recommended soldering conditions. anode note: 1. pcb with dierent size and design (component density) will have dierent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering prole again before loading a new type of pcb. 2. avago technologies high brightness led are using high eciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260c and the solder contact time does not exceeding 5sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led conguration note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. any alignment xture that is being applied during wave soldering should be loosely tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. note: in order to further assist customer in designing jig accurately that t avago technologies product, 3d model of the product is available upon request. at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment xture or pallet. if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using reow soldering prior to insertion the th led. recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause diculty inserting the th led.
7 refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. example of wave soldering temperature prole for th led ammo packs drawing recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 255c 5c (maximum peak temperature = 260c) dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. 60 sec max time (sec) 260c max 105c max temperature (c) cathode view a - a a a 6.351.30 0.250.0512 12.701.00 0.500.0394 20.501.00 0.80710.0394 typ ? 4.000.20 0.15750.008 0.700.20 0.02760.0079 18.000.50 0.70870.0197 9.1250.625 0.35930.0246 12.700.30 0.500.0118
8 packaging box for ammo packs note: the dimension for ammo pack is applicable for the device with stando and without stando. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 260c label on this side of box from left side of box adhesive tape must be facing upwards. anode lead leaves the box first.
(1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code rohs compliant e3 max temp 260c lamps baby label acronyms and denition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only (ii) avago baby label (only available on bulk packaging) for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-2471en - june 11, 2010 disclaimer: avagos products and software are not specically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
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