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  ls l896, la l896, lo l896, ly l896 smartled tm hyper-bright led vorl?ufige daten / preliminary data 2001-11-30 1 besondere merkmale ? geh ? usetyp: smt geh ? use scd 80  besonderheit des bauteils: kleinste bauform 1,7 mm x 0,8 mm x 0,65 mm (lxbxh)  wellenl ? nge: 633 nm (super-rot), 617 nm (amber), 606 nm (orange), 587 nm (gelb)  abstrahlwinkel: extrem breite abstrahlcharakteristik (160 )  technologie: ingaalp  optischer wirkungsgrad: 7 lm/w (super-rot), 11 lm/w (gelb, orange, amber)  gruppierungsparameter: lichtst ? rke, wellenl ? nge  verarbeitungsmethode: f r alle smt-best cktechniken geeignet  l ? tmethode: ir reflow l ? ten und wellenl ? ten (ttw)  vorbehandlung: nach jedec level 2  gurtung: 8 mm gurt mit 10000/rolle, ? 180 mm oder 40000/rolle, ? 330 mm anwendungen  informationsanzeigen im au ? enbereich  flache hinterleuchtung (lcd, mobile phone, schalter, display)  signal- und symbolleuchten  markierungsbeleuchtung (z.b. stufen, fluchtwege, u. ? .) features  package: smt package scd 80  feature of the device: smallest package 1.7 mm x 0.8 mm x 0.65 mm (lxwxh)  wavelength: 633 nm (super-red), 617 nm (amber), 606 nm (orange), 587 nm (yellow)  viewing angle: extremely wide (160 )  technology: ingaalp  optical efficiency: 7 lm/w (super-red), 11 lm/w (yellow, orange, amber)  grouping parameter: luminous intensity, wavelength  assembly methods: suitable for all smt assembly methods  soldering methods: ir reflow soldering and ttw soldering  preconditioning: acc. to jedec level 2  taping: 8 mm tape with 10000/reel, ? 180 mm or 40000/reel, ? 330 mm applications  outdoor displays  flat backlighting (lcd, cellular phones, switches, displays)  signal and symbol luminaire  marker lights (e.g. steps, exit ways, etc.)
2001-11-30 2 ls l896, la l896, lo l896, ly l896 anm.: -1 gesamter farbbereich, lieferung in einzelgruppen (siehe seite 5 ) die standardlieferform von serientypen beinhaltet eine untere bzw. eine obere familiengruppe, die aus nur 3 bzw. 4 halbgruppen besteht. einzelne halbgruppen sind nicht erh?ltlich. in einer verpackungseinheit / gurt ist immer nur eine halbgruppe enthalten. note: -1 total color tolerance range, delivery in single groups (please see page 5 ) the standard shipping format for serial types includes a lower or upper family group of 3 or 4 individual groups. individual half groups are not available. no packing unit / tape ever contains more than one luminous intensity half group. typ type emissions- farbe color of emission geh ? usefarbe color of package lichtst ? rke luminous intensity i f = 20 ma i v (mcd) lichtstrom luminous flux i f = 20 ma v (mlm) bestellnummer ordering code ls l896-m1n1-1 ls l896-n1p2-1 super-red colorless diffused 18.0 ? 35.5 28.0 ? 71.0 105 (typ.) 200 (typ.) q62703-q6020 q62703-q6160 la l896-p1q1-1 la l896-q1r2-1 amber colorless diffused 45.0 ? 90.0 71.0 ? 180.0 270 (typ.) 500 (typ.) q62703-q6204 q62703-q6205 lo l896-p1q1-1 lo l896-q1r2-1 orange colorless diffused 45.0 ? 90.0 71.0 ? 180.0 270 (typ.) 500 (typ.) q62703-q6207 q62703-q6208 ly l896-p1q1-1 ly l896-q1r2-1 yellow colorless diffused 45.0 ? 90.0 71.0 ? 180.0 270 (typ.) 500 (typ.) q62703-q6021 q62703-q6164
ls l896, la l896, lo l896, ly l896 2001-11-30 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol werte values einheit unit ls, la lo, ly betriebstemperatur operating temperature range t op ? 40 ? + 100 c lagertemperatur storage temperature range t stg ? 40 ? + 100 c sperrschichttemperatur junction temperature t j + 110 c durchlassstrom forward current i f 60 30 ma sto ? strom surge current t 10 s, d = 0.1 i fm ?? a sperrspannung reverse voltage v r 3v leistungsaufnahme power consumption p tot 170 80 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung junction/ambient sperrschicht/l ? tpad junction/solder point montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) r th ja r th js 500 290 k/w k/w
2001-11-30 4 ls l896, la l896, lo l896, ly l896 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol werte values einheit unit ls la lo ly wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 20 ma peak 645 622 610 591 nm dominantwellenl ? nge 1) (typ.) dominant wavelength i f = 20 ma dom 633 ?6 617 ?6 606 ?6 587 +8/ ? 7 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 20 ma ? 16 16 16 15 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 160 160 160 160 grad deg. durchlassspannung 2) (typ.) forward voltage (max.) i f = 20 ma v f v f 2.0 2.4 2.0 2.4 2.0 2.4 2.0 2.4 v v sperrstrom (typ.) reverse current (max.) v r = 5 v i r i r 0.01 10 0.01 10 0.01 10 0.01 10 a a temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 20 ma; ? 10 c t 100 c tc peak 0.14 0.13 0.13 0.13 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 20 ma; ? 10 c t 100 c tc dom 0.01 0.06 0.07 0.10 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 20 ma; ? 10 c t 100 c tc v ? 2.0 ? 1.8 ? 1.7 ? 2.5 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 20 ma opt 7 111111lm/w 1) wellenl ? ngengruppen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von ? nm ermittelt. wavelength groups are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) spannungswerte werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von 0,1 v ermittelt. voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
ls l896, la l896, lo l896, ly l896 2001-11-30 5 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11% ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11%. 1) wellenl ? ngengruppen f r ly l896 wavelength groups for ly l896 gruppe group wellenl ? nge wavelength einheit unit min. max. 2 580 583 nm 3 583 586 nm 4 586 589 nm 5 589 592 nm 6 592 595 nm helligkeits-gruppierungsschema luminous intensity groups lichtgruppe luminous intensity group lichtst ? rke luminous intensity i v (mcd) lichtstrom luminous flux v (mlm) m1 m2 n1 n2 p1 p2 q1 q2 r1 r2 18.0 ? 22.4 22.4 ? 28.0 28.0 ? 35.5 35.5 ? 45.0 45.0 ? 56.0 56.0 ? 71.0 71.0 ? 90.0 90.0 ? 112.0 112.0 ? 140.0 140.0 ? 180.0 80 (typ.) 100 (typ.) 125 (typ.) 160 (typ.) 200 (typ.) 250 (typ.) 320 (typ.) 400 (typ.) 500 (typ.) 640 (typ.) gruppenbezeichnung auf etikett group name on label beispiel: r2-3 example: r2-3 lichtgruppe luminous intensity group halbgruppe half group wellenl ? nge wavelength r23
2001-11-30 6 ls l896, la l896, lo l896, ly l896 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 20 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic ohl00235 400 0 20 40 60 80 100 450 500 550 600 650 700 nm % i rel v yellow orange amber super-red ohl01440 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ?
ls l896, la l896, lo l896, ly l896 2001-11-30 7 durchlassstrom i f = f ( v f ) forward current t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current t s : temp. solder point relative lichtst ? rke i v / i v(20 ma) = f ( i f ) relative luminous intensity t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current t a : temp. ambient ohl00232 10 -1 1.4 1.8 2.2 2.6 3 v 3.4 0 10 1 10 10 2 5 5 ma 5 1 f v f i ohl01457 0 i f t 0 s 10 20 30 40 50 60 70 80 ? c 100 thjs r = 290 k/w 10 20 30 40 50 60 70 ma super-red/amber yellow/orange i ohl00233 f -1 10 v i 10 -3 -2 -1 0 1 10 10 10 10 10 0 10 1 10 2 5 5 5 55ma (20 ma) i v super-red yellow orange/amber ohl01454 0 i f t 0 a 10 20 30 40 50 60 70 80 ? c 100 thja r = 500 k/w 10 20 30 40 50 60 70 ma super-red/amber yellow/orange
ls l896, la l896, lo l896, ly l896 2001-11-30 8 relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 20 ma t ohl00238 0 v i -20 0 20 40 60 ? c 100 orange a 0.4 0.8 1.2 1.6 2.0 i v (25 ? c) yellow amber super-red super-red amber yellow orange
ls l896, la l896, lo l896, ly l896 2001-11-30 9 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gewicht / approx. weight: 1,4 mg gply6057 0.8 (0.031) 0.1 (0.004) cathode 0.3 (0.012) +0.05 (0.002) -0.03 (0.001) 0.125 (0.005) 1.7 (0.067) 0.1 (0.004) 7 ? max +0.02 (0.001) -0.05 (0.002) 0.65 (0.026) 5 ? 1.3 (0.051) 0.1 (0.004)
2001-11-30 10 ls l896, la l896, lo l896, ly l896 l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohly0597 0 0 50 100 150 200 250 50 100 150 200 250 300 t t ? c s 240-245 ? c 10-40 s 183 ? c 120 to 180 s defined for preconditioning: up to 6 k/s ramp-down rate up to 6 k/s ramp-up rate up to 6 k/s defined for preconditioning: 2-3 k/s
ls l896, la l896, lo l896, ly l896 2001-11-30 11 wellenl ? ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangsk ? hlung forced cooling normalkurve standard curve grenzkurven limit curves
2001-11-30 12 ls l896, la l896, lo l896, ly l896 empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). geh ? use f ? r wellenl ? ten (ttw) geeignet / package suitable for ttw-soldering empfohlenes l ? tpaddesign verwendbar f r smartled tm und chipled - bauform 0603 ir reflow l ? ten recommended solder pad useable for smartled tm and chipled - package 0603 ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). empfohlene l ? tpastendicke: 120 m/ recommended thickness of solder paste: 120 m geh ? use f ? r wellenl ? ten (ttw) geeignet / package suitable for ttw-soldering ohpy1301 1.45 (0.057) 0.35 (0.014) 0.35 (0.014) ohpy0203 2.25 (0.089) 0.65 (0.026) 0.3 (0.012) 0.5 (0.020) 0.8 (0.031) 0.35 (0.014) 0.225 (0.009)
ls l896, la l896, lo l896, ly l896 2001-11-30 13 gurtung / polarit ? t und lage verpackungseinheit 8 mm gurt mit 10000/rolle, 180 mm oder 40000/rolle, 330 mm method of taping / polarity and orientation packing unit 8 mm tape with 10000/reel, 180 mm or 40000/reel, 330 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohay1350 1.5 (0.059) 4 (0.157) 2 (0.079) 0.4 (0.016) 0.93 (0.037) 3.5 (0.138) 1.75 (0.069) 8 (0.315) 1.4 (0.055) 2.04 (0.080) a c
2001-11-30 14 ls l896, la l896, lo l896, ly l896 published by osram opto semiconductors gmbh & co. ohg wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2001-11-30 previous version: 2001-03-09 page subjects (major changes since last revision) 2 changed resin from colorless clear to colorless diffused 1 taping changed from 5000 to 10000/reel, 180 mm and from 20000 to 40000/reel, 330 mm 4 value (wavelength amber) 12 recommended solder pad


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