1 asmc-qxb2-txxxx envisium tm 0.5w power plcc-4 surface mount led indicator data sheet envisium tm envisium tm is the premier class of mid-power leds using ts alingap chip technology. envisium tm leds o?er unpar- alleled performance, engineering and design ?exibility. description the envisium tm 0.5w power plcc-4 smt led is an extension of envisium tm power plcc-4 smt leds. the package can be driven at high current due to its superior package design. the product is able to dissipate the heat more e?ciently compared to the envisium tm power plcc- 4 smt leds. these leds produce higher light output with better ?ux performance compared to the envisium tm power plcc-4 smt led. the envisium tm 0.5w power plcc-4 smt leds are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. the performance characteristics of these new mid-power leds make them uniquely suitable for use in harsh condi- tions such as in automotive applications, and in electron- ics signs and signals. to facilitate easy pick and place assembly, the leds are packed in eia-compliant tape and reel. every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. these leds are compatible with the ir solder re?ow process. envisium tm 0.5w power plcc-4 smt led is available in red orange & amber colors. features industry standard plcc 4 platform (3.2 x 2.8 x 1.9mm) high reliability led package mid-power intensity brightness with optimum ?ux performance using ts allngap chip technologies available in red orange and amber colors high optical e?ciency available in 8mm carrier tape and 7 inch reel low thermal resistance super wide viewing angle at 120 longer life time with minimum degradation due to enhanced silicone resin material jedec msl 2a applications 1. exterior automotive - turn signals - side repeaters - chsml - rear combination lamp - side markers - truck clearance lamp 2. electronic signs and signals - channel lettering - contour lighting - indoor variable message sign 3. o?ce automation, home appliances, industrial equipment - front panel backlighting - push button backlighting - display backlighting
2 note: 1. all dimensions in millimeters. 2. lead polarity as shown in figure 12. 3. terminal finish: ag plating 4. encapsulation material: silicone resin figure 1. package drawing table 1. device selection guide (t j = 25 c) color part number luminous flux, v [1] (lm) dice technology min. flux (lm) typ. flux (lm) max. flux (lm) test current (ma) amber asmc-qab2-tac0e 4.30 6.60 9.00 150 alingap red orange asmc-qhb2-tcd0e 7.00 9.30 11.50 150 alingap notes: 1. v is the total luminous ?ux output as measured with an integrating sphere at mono pulse conditions. 2. tolerance = 12% part numbering system component dimensions a s m c - q x 1 b 2 - t x 2 x 3 x 4 x 5 packaging o p t ion co l or bin se l ec t ion max. fl ux bin min. fl ux bin co l or a - amber h - red orange 3 .6 0.2 0.7 3 .2 0.2 2.8 0.2 2.2 0.2 1.9 0.2 0.6 0. 3 c c aa 0.79 0. 3 cath o de marking 2. 4 1.1 5 0.2 0. 4 1 (typ.) 0. 5 6 (typ.) 0.97
3 table 2. absolute maximum ratings (t a = 25 c) parameters asmc-qxb2-txxxx dc forward current [1] 150 ma peak forward current [2] 300 ma power dissipation 470 mw reverse voltage 5 v junction temperature 125 c operating temperature -40 c to +100 c storage temperature -40 c to +100 c notes: 1. derate linearly as shown in figure 6. 2. duty factor = 10%, frequency = 1khz table 3. optical characteristics (t j = 25 c) color part number dice technology dominant wavelength d [1] (nm) viewing angle 2 ? [2] (degrees) luminous e?ciency e (lm/w) total flux / luminous intensity f v (lm) / i v (cd) typ. typ. typ. typ. amber asmc-qab2-txxxx alingap 593.5 120 17 6.5 red orange asmc-qhb2-txxxx alingap 619.3 120 24 5.0 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. ? is the o?-axis angle where the luminous intensity is ? the peak intensity. table 4. electrical characteristics (t j = 25 c) part number forward voltage v f (volts) @ i f = 1 5 0 ma reverse voltage v r @ 100 a thermal resistance r j-p (c/w) typ. max. min. asmc-qxb2-txxxx 2.64 3.10 5 60
4 figure 3 . forward current vs. forward voltage figure 4 . relative intensity vs. forward current figure 5 . relative intensity vs. temperature figure 2. relative intensity vs. wavelength 0 5 0 1 00 15 0 200 2 5 0 3 00 35 0 0 1 2 345 fo rward v o l t age - v fo rward c u rren t - ma a li ngap amber a li ngap red o range 0 0.2 0. 4 0.6 0.8 1 .0 1 .2 020 4 06080 1 00 1 20 14 0 1 60 dc fo rward c u rren t - ma rela ti ve l u m i n ou s i n t ens it y (n o rmal iz a tio n a t 15 0 ma) 0 0.2 0. 4 0.6 0.8 1 1 .2 1 . 4 1 .6 -5 0 - 2 5 02 55 07 51 00 1 2 5 j u nc tio n t empera tu re - c rela ti ve l u m i n ou s i n t ens it y (n o rmal iz a tio n a t 2 5 c) 0.0 0. 1 0.2 0. 3 0. 4 0. 5 0.6 0.7 0.8 0.9 1 .0 3 80 43 0 4 80 53 0 5 80 6 3 0 680 7 3 0 780 waveleng th - nm rela ti ve i n t ens it y a li ngap amber a li ngap red o range figure 6a. maximum forward current vs. ambient temperature. derated based on t jma x = 12 5 c, r j-a =1 3 0 c/w, 110c/w and 100c/w figure 6b. maximum forward current vs. solder point temperature. derated based on t jma x = 12 5 c, r jp = 60c/w ma xi m u m fo rward c u rren t - ma 0 20 4 0 60 80 1 00 1 20 14 0 1 60 020 4 06080 1 00 1 20 amb i en t t empera tu re (c) r ja = 1 00c/w r ja = 11 0c/w r ja = 13 0c/w ma xi m u m fo rward c u rren t - ma 0 20 4 0 60 80 1 00 1 20 14 0 1 60 020 4 06080 1 00 1 20 s o lder p oi n t t empera tu re (c) r jp = 60c/w
5 figure 8. forward voltage shift vs. temperature figure 9. radiation pattern figure 7. dominant wavelength vs. forward current - alingap devices - 0. 15 - 0. 1 - 0.0 5 0 0.0 5 0. 1 0. 15 -5 0 - 2 5 02 55 07 51 00 t j - j u nc tio n t empera tu re - c fo rward v o l t age s hift - v 0 0. 1 0.2 0. 3 0. 4 0. 5 0.6 0.7 0.8 0.9 1 - 90 - 60 -3 00 3 06090 ang u lar d i splacemen t - degrees n o rmal iz ed i n t ens it y 5 70 5 80 5 90 600 6 1 0 620 6 3 0 1 2 51 020 5 0 1 00 15 0 c u rren t - ma d o m i nan t waveleng th - nm red o range amber
6 figure 12. recommended soldering pad pattern figure 10. recommended pick and place nozzle size figure 11. recommended pb-free re?ow soldering pro?le note: for detail information on re?ow soldering of avago surface mount leds, do refer to avago application note an 1060 surface mounting smt led indicator components note: diameter "d" should be smaller than 2.2mm d 217c 200c 60 - 120 sec. 6c/sec. ma x . 3 c/sec. ma x . 1 5 0c 2 55 - 260c 100 sec. ma x . 10 to 3 0 sec. time temperat u re (acc. to j-std-020c) 3 c/sec. ma x . ca tho de mark i ng ca tho de mark i ng a c a a c c c c s o lder mask an o de ca tho de 0. 4 0. 3 m i n i m u m 55 mm 2 of ca tho de pad fo r i mpr o ved h ea t d i ss i pa tio n 2. 4 0.6 0.9 x 6 4 .6 1 . 1 1 . 3 x 6 aa cc
7 figure 1 4 . tape dimensions figure 1 5 . reeling o rientation figure 1 3 . tape leader and trailer dimensions 200 mm m i n. fo r ? 1 80 reel. 200 mm m i n. fo r ? 33 0 reel. t ra i ler c o mp o nen t leader 4 80 mm m i n. fo r ? 1 80 reel. 960 mm m i n. fo r ? 33 0 reel. c a u ser f eed d i rec tio n 3 .8 0. 1 2.29 0. 1 0.229 0.0 1 all d i mens io ns i n mm. 2 0.0 5 4 0. 1 4 0. 1 3 .0 5 0. 1 3 . 5 0.0 5 8 + 0. 3 C 0. 1 1 .7 5 0. 1 ? 1 . 5 + 0. 1 C 0 8 ? 1 + 0. 1 C 0 aa cc cath o de side printed label u ser feed directi o n
8 color bin select (x 4 ) individual reel will contain parts from one full bin only. x 4 0 full distribution a 1 and 2 only b 2 and 3 only c 3 and 4 only d 4 and 5 only e 5 and 6 only g 1, 2 and 3 only h 2, 3 and 4 only j 3, 4 and 5 only k 4, 5 and 6 only m 1, 2, 3 and 4 only n 2, 3, 4 and 5 only p 3, 4, 5 and 6 only r 1, 2, 3, 4 and 5 only s 2, 3, 4, 5 and 6 only z special color bin color bin limits amber/yellow min. (nm) max. (nm) 2 583.0 586.0 3 586.0 589.0 4 589.0 592.0 5 592.0 595.0 6 595.0 598.0 red o range min. (nm) max. (nm) 1 611.0 616.0 2 616.0 620.0 3 620.0 625.0 tolerance of each bin limit = 1nm device color (x 1 ) a amber h red orange flux bin select (x 2 x 3 ) individual reel will contain parts from one bin only x 2 min flux bin x 3 max flux bin flux bin limits bin id min. (lm) max. (lm) a 4.30 5.50 b 5.50 7.00 c 7.00 9.00 d 9.00 11.50 e 11.50 15.00 f 15.00 19.50 g 19.50 25.50 h 25.50 33.00 j 33.00 43.00 k 43.00 56.00 l 56.00 73.00 tolerance of each bin limit = 12%
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-0397en - september 29, 2009 moisture sensitivity this product is quali?ed as moisture sensitive level 2a per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reli- ability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use - unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to re?ow the leds per the original msl rating. - it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb - the humidity indicator card (hic) shall be read immediately upon opening of mbb. - the leds must be kept at <30c / 60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. c. control for un?nished reel - for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their ?oor life of 672 hours. e. baking is required if: - 10% is not blue and 5% hic indicator turns pink. - the leds are exposed to condition of >30c / 60% rh at any time. - the leds ?oor life exceeded 672 hours. recommended baking condition: 605c for 20 hours. handling precaution the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly of handling, the unit should b e held on the body only. please refer to avago application note an 5288 for detail information. packaging option (x 5 ) o ption test current package type reel size e 150ma top mount 7 inch vf binning bin min. max. 2d 2.35 2.50 2e 2.50 2.65 2f 2.65 2.80 2g 2.80 2.95 2h 2.95 3.10 2j 3.10 3.25 tolerance of each bin = 0.1v
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