View TLYE1102BT10_3751465.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 1 toshiba led lamps tlre1102b (t10), tlse1102b (t10), tloe1102b (t10), tlye1102b (t10), tlge1102b (t10), tlpge1102b (t10) panel circuit indicator ? surface-mount devices ? 3.2 (l) 2.8 (w) 3.4 (h) mm ? 2.8mm diameter lens-top type ? ingaa ? p leds ? high luminous intensity ? low drive current, high-i ntensity light emission ? colors: red, orange, yellow, green, pure green ? reflow soldering is possible ? applications: automotive use, message signboards, backlighting, etc. ? standard embossed tape packing: t10 (500/reel) 12-mm tape reel color and material unit: mm jedec D jeita D toshiba 4-3q1 weight: 0.042 g (typ.) product name color material tlre1102b red tlse1102b red tloe1102b orange tlye1102b yellow tlge1102b green tlpge1102b pure green ingaa ? p
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 2 maximum ratings (ta = 25c) product name forward current i f (ma) please see note 1 reverse voltage v r (v) power dissipation p d (mw) operating temperature t opr (c) storage temperature t stg (c) tlre1102b tlse1102b tloe1102b tlye1102b tlge1102b tlpge1102b 50 4 120 ? 40~100 ? 40~100 note 1: forward current derating electrical characteristics (ta = 25c) forward voltage v f reverse current i r product name min typ max i f max v r tlre1102b 1.6 1.9 2.4 tlse1102b 1.6 1.9 2.4 tloe1102b 1.6 2.0 2.4 tlye1102b 1.6 2.0 2.4 tlge1102b 1.6 2.0 2.4 tlpge1102b 1.6 2.1 2.4 20 10 4 unit v ma a v 0 80 60 0 100 80 120 40 20 40 20 60 allowable forward current i f (ma) ambient temperature ta (c) i f ? ta
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 3 optical characteristics?1 (ta = 25c) luminous intensity i v product name min typ max i f available iv rank please see note 2 tlre1102b 100 320 800 ra / sa / ta / ua tlse1102b 250 600 2000 ta / ua / va / wa tloe1102b 250 650 2000 ta / ua / va / wa tlye1102b 160 480 1250 sa / ta / ua / va tlge1102b 100 300 800 ra / sa / ta / ua tlpge1102b 25 75 200 20 na / pa / qa / ra unit mcd ma note 2: the specification on the above table is us ed for iv classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of eac h rank be unquestioned. luminous intensity i v rank min max na 25 50 pa 40 80 qa 63 125 ra 100 200 sa 160 320 ta 250 500 ua 400 800 va 630 1250 wa 1000 2000 unit mcd mcd optical characteristics?2 (ta = 25c) emission spectrum peak emission wavelength p ? dominant wavelength d product name min typ max typ min typ max i f tlre1102b ? 644 ? 18 624 630 638 tlse1102b ? 623 ? 15 607 613 621 tloe1102b ? 612 ? 15 599 605 613 tlye1102b ? 590 ? 13 581 587 595 tlge1102b ? 574 ? 11 565 571 576 tlpge1102b ? 562 ? 11 555 558 564 20 unit nm nm nm ma the cautions ? this visible led lamp also emits some ir light. if a photodetector is located near the led lamp, please ensure that it will not be affected by the ir light. ? this product is designed as a general display light sou rce usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. ther efore, it is not intended for usage of functional application (ex. light source for sensor, optical communi cation and etc) except general display light source.
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 4 tlre1102b i f ? v f i v ? i f i v ? tc ta = 25c radiation pattern i f = 20 ma ta = 25c 0 640 0.4 1.0 0.8 580 680 660 620 600 700 0.6 0.2 0.1 ? 25 50 0.3 0.5 10 0 100 5 25 75 3 1 ta = 25c 10 1000 1 50 500 300 100 30 50 3 5 10 30 100 1 1.6 2.0 3 5 50 10 1.7 2.2 30 1.8 2.1 1.9 ta = 25c 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 ( t yp . ) ( t yp . ) forward voltage v f (v) forward current i f (ma) forward current i f (ma) luminous intensity i v (mcd) relative luminous intensity i v ( t yp . ) case temperature tc (c) wavelength characteristic ( t yp . ) wavelength (nm) ( t yp . ) relative luminous intensity
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 5 tlse1102b i f ? v f i v ? i f i v ? tc ta = 25c radiation pattern i f = 20 ma ta = 25c 0 640 0.4 1.0 0.8 580 680 660 620 600 700 0.6 0.2 0.1 10 ? 25 75 5 3 1 0.3 0.5 0 100 25 50 50 2000 1 50 1000 300 100 3 5 10 30 100 500 ta = 25c ta = 25c 1 100 1.6 2.1 50 30 10 3 5 1.7 1.8 1.9 2.0 2.2 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 ( t yp . ) forward current i f (ma) forward voltage v f (v) ( t yp . ) luminous intensity i v (mcd) forward current i f (ma) ( t yp . ) relative luminous intensity i v case temperature tc (c) wavelength characteristic ( t yp . ) relative luminous intensity wavelength (nm) ( t yp . )
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 6 tloe1102b i f ? v f i v ? i f i v ? tc ta = 25c radiation pattern i f = 20 ma ta = 25c 0 600 0.4 1.0 0.8 540 640 620 580 560 660 0.6 0.2 1 10 3 75 100 1 0.3 25 5 0.5 ? 25 0 50 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 1 30 3 100 5 10 ta = 25c 50 2000 1000 300 500 100 50 ( t yp . ) forward current i f (ma) forward voltage v f (v) ( t yp . ) luminous intensity i v (mcd) forward current i f (ma) ( t yp . ) relative luminous intensity i v case temperature tc (c) wavelength characteristic ( t yp . ) relative luminous intensity wavelength (nm) ( t yp . )
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 7 tlye1102b i f ? v f i v ? i f i v ? tc ta = 25c radiation pattern 0.1 10 ? 25 75 5 3 1 0.3 0.5 0 100 25 50 ta = 25c 20 1000 1 50 500 300 100 50 3 5 10 30 100 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 i f = 20 ma ta = 25c 600 540 640 620 580 560 1.0 0.8 0.6 0.4 0.2 0 660 ( t yp . ) forward current i f (ma) forward voltage v f (v) ( t yp . ) luminous intensity i v (mcd) forward current i f (ma) ( t yp . ) relative luminous intensity i v case temperature tc (c) wavelength characteristic ( t yp . ) relative luminous intensity wavelength (nm) ( t yp . )
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 8 tlge1102b i f ? v f i v ? i f i v ? tc ta = 25c radiation pattern i f = 20 ma ta = 25c 0 0.4 1.0 0.8 540 0.6 0.2 620 600 580 560 0.1 10 3 ? 25 75 50 0 100 1 0.3 25 5 0.5 ta = 25c 10 1000 1 50 500 300 100 30 50 3 5 10 30 100 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 ( t yp . ) forward current i f (ma) forward voltage v f (v) ( t yp . ) forward current i f (ma) luminous intensity i v (mcd) ( t yp . ) relative luminous intensity i v case temperature tc (c) wavelength characteristic ( t yp . ) relative luminous intensity wavelength (nm) ( t yp . )
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 9 tlpge1102b i f ? v f i v ? i f i v ? tc ta = 25c radiation pattern i f = 20 ma ta = 25c 0 0.4 1.0 0.8 520 0.6 0.2 600 580 560 540 0.1 10 3 75 100 1 0.3 25 5 0.5 ? 25 0 50 ta = 25c 5 200 1 50 100 30 50 3 5 10 30 100 10 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 ( t yp . ) forward current i f (ma) forward voltage v f (v) ( t yp . ) luminous intensity i v (mcd) forward current i f (ma) ( t yp . ) relative luminous intensity i v case temperature tc (c) wavelength characteristic ( t yp . ) wavelength (nm) relative luminous intensity ( t yp . )
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 10 packaging these led devices are packed in an aluminum envelope with silica gel an d a moisture indicator to prevent moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture-proof bag may be stored unopened for up to 12 months under the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if, upon opening, the moisture indicator card show s humidity of 30% or above (when the indication color changes to pink) or the expiration da te has passed, the devices should be baked while packed in the tape reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from the sealing date, which is imprinted on the same side as this label. 4. repeated baking can cause the peelin g strength of the tape to change, lead ing to trouble in mounting. also, be sure to prevent damage to the device from st atic electricity during the baking process. 5. any breakage in the laminate pack ing material will cause th e hermeticity of the product to deteriorate. do not toss or drop the packed devices. mounting method soldering ? reflow soldering ? the products are evaluated using above reflow soldering conditions. no additi onal test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s ? do not perform wave soldering. recommended soldering pattern 1.65 1.15 2.41 unit: mm 1.65 (*) 60~120 s max 10 s max 240 c max 4 c/s max 140~160 c max 4 c/s max time (s) package surface temperature ( c) temperature profile (example) (*) (*) (*) (*) (*)
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 11 cleaning when cleaning is required after soldering, tosh iba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean trough 750h : (made by kao) pine alpha st-100s : (made by arakawa chemical) toshiba technocare : (made by ge toshiba silicones) (frw-17, frw-1, frv-100) precautions when mounting do not apply force to plastic parts of th e led under high-temperature conditions. the led plastic is easily s cratched. avoid friction between plastic parts and hard objects or materials. when installing the pcb in a product, ensure that the device does not come into contact with other components. tape specifications 1. product number format the type of package used for shipment is denoted by a symbol suffix after the product number. the method of classification is as below. (this method, howe ver does not apply to pr oducts whose electrical characteristics differ from standard toshiba specifications.) (1) tape type: t10 (8-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 + 0.1/ ? 0 p 2 2.0 0.05 e 1.75 0.1 w 12.0 0.3 p 0 4.0 0.1 p 8.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 5.5 0.05 b 0 3.7 0.1 d 1 1.5 +0.1/ ? 0 k 0 3.6 0.1 tlye1102b (t10) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 12 3. reel dimensions unit: mm 4. leader and trailer sections of tape (note 1) leading part: 190 mm (min) 40 mm or more (note 2) 40 mm or more 13.0 0.3 180 + 0 ? 4 60 13 15.4 1.0 2 0.5 44 note 1: empty trailer section note 2: empty leader section
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 13 5. packing display (1) packing quantity reel 500 pcs carton 2,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example: tlye1102b (t10) p/n: toshiba type tlye1102b addc (t10) q?ty 500 pcs lot number key code for tsb 32c 500 (rank symbol) use under 5-30degc/60%rh within 168h seal date: [[g]]/rohs compatible diffused in ***** *y3804xxxxxxxxxxxxxxxxx* assembled in ***** (2) label location tape reel direction label position label position ? reel ? ? the aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side.
tl(re,se,oe,ye,ge,pge)1102b(t10) 2006-06-06 14 ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality an d reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inhe rent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba produc ts, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within s pecified operating ranges as set forth in the most recent toshiba products specific ations. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semicon ductor devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are inte nded for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control in struments, airplane or spaceship instruments, transportation instruments, traffic signa l instruments, combusti on control instruments, medical instruments, all types of safety devices, et c. unintended usage of toshiba products listed in this document shall be made at th e customer?s own risk. ? the products described in this document shall not be used or embedded to any down stream products of which manufacture, use and/or sale are prohibited und er any applicable laws and regulations. ? gaas(gallium arsenide) is used in this product. the dust or vapor is harmful to the human body. do not break, cut, crush or dissolve chemically. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of toshiba or others. restrictions on product use

▲Up To Search▲

Price & Availability of TLYE1102BT10

	To Download TLYE1102BT10 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .