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ds-ixd_614-r02 www.clare.com 1 rohs 2002/95/ec e 3 pb features ? 14a peak source/sink drive current ? wide operating voltage range: 4.5v to 35v ? -40c to +125c extended operating temperature range ? logic input withstands negative swing of up to 5v ? low propagation delay time ? low, 10 ? a supply current ? low output impedance applications ? efficient power mosfet and igbt switching ? switch mode power supplies ? motor controls ? dc to dc converters ? class-d switching amplifiers ? pulse transformer driver description the ixdd614 / ixdi614 / ixdn614 high-speed gate drivers are especially well suited for driving the latest ixys mosfets and igbts. each output can source and sink 14a of peak current while producing voltage rise and fall times of less than 30ns. internal circuitry eliminates cross-conduction and current "shoot-through," making the driver virtually immune to latch up. low propagation delay with fast rise and fall times make the ixd_614 family ideal for high-frequency and high-power applications. the ixdd614 is configured as a non-inverting driver with an enable. the ixdn614 is configured as a non-inverting driver, and the ixdi614 is configured as an inverting driver. the ixd_614 family is available in an 8-pin dip (pi), an 8-pin power soic with an exposed metal back (si), a 5-pin to-220 (ci), and a 5-pin to-263 (yi) package. ordering information part number logic configuration package type packing method quantity ixdd614pi 8-pin dip tube 50 ixdd614si 8-pin power soic with exposed metal back tube 100 ixdd614sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdd614ci 5-pin to-220 tube 50 ixdd614yi 5-pin to-263 tube 50 ixdi614pi 8-pin dip tube 50 IXDI614SI 8-pin power soic with exposed metal back tube 100 IXDI614SItr 8-pin power soic with exposed metal back tape & reel 2000 ixdi614ci 5-pin to-220 tube 50 ixdi614yi 5-pin to-263 tube 50 ixdn614pi 8-pin dip tube 50 ixdn614si 8-pin power soic with exposed metal back tube 100 ixdn614sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdn614ci 5-pin to-220 tube 50 ixdn614yi 5-pin to-263 tube 50 i n e n out i n out i n out ixd_614 14-ampere low-side ultrafast mosfet drivers
ixd_614 2 www.clare.com r02 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 electrical characteristics: t a = 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 electrical characteristics: t a = - 40c to +125c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.7 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 characteristics test diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. block diagrams & truth tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 ixdd614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 ixdi614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.3 ixdn614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4. typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.3 reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.4 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.4.1 si (8-pin power soic with exposed metal back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.4.2 si package tape & reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.4.3 yi (5-pin to-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4.4 ci (5-pin to-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4.5 pi (8-pin dip) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ixd_614 r02 www.clare.com 3 1 specifications 1.1 pin configurations 1.2 pin definitions note: clare recommends that the exposed metal pad on the back of the ?si? and the ?d2? packages be connected to gnd. the pad is not suitable for carrying current. 1.3 absolute maximum ratings unless stated otherwise, absolute maximum electrical ratings are at 25c absolute maximum ratings are stress rating s. stresses in excess of these ratings c an cause permanent damage to the device. functional operation of the device at condit ions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 recommended operating conditions 1 4 3 2 8 5 6 7 v cc i n e n g n d v cc out out g n d 1 4 3 2 5 v cc out g n d i n e n 1 4 3 2 8 5 6 7 v cc i n n c g n d v cc out out g n d 1 4 3 2 5 v cc out g n d i n n c 1 4 3 2 8 5 6 7 v cc i n n c g n d v cc out out g n d 1 4 3 2 5 v cc out g n d i n n c ixdd614 pi / si ixdi614 pi / si ixdn614 pi / si ixdd614 ci / yi ixdi614 ci / yi ixdn614 ci / yi pin name description in logic input en output enable - drive pin low to disable output, and force output to a high impedance state out output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt out inverted output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt v cc supply voltage - provides power to the device gnd ground - common ground reference for the device nc not connected parameter symbol minimum maximum units supply voltage v cc -0.3 40 v input voltage v in , v en -5 v cc +0.3 v output current i out -14a junction temperature t j -55 +150 c storage temperature t stg -65 +150 c parameter symbol minimum maximum units supply voltage v cc 4.5 35 v operating temperature range t a -40 +125 c
ixd_614 4 www.clare.com r02 1.5 electrical characteristics: t a = 25c test conditions: 4.5v < v cc < 35v (unless otherwise noted). parameter conditions symbol minimum typical maximum units input voltage, high 4.5v < v cc < 18v v ih 3.0 - - v input voltage, low 4.5v < v cc < 18v v il --0.8 input current 0v < v in < v cc i in --10 ? a en input voltage, high ixdd614 only v enh 2/3v cc -- v en input voltage, low ixdd614 only v enl -- 1/3v cc output voltage, high - v oh v cc -0.025 -- v output voltage, low - v ol - - 0.025 output resistance, high state v cc =18v, i out =-100ma r oh -0.40.8 ? output resistance, low state v cc =18v, i out =100ma r ol -0.30.6 output current, continuous limited by package power dissipation i dc --4a rise time c load =15nf, v cc =18v t r -2535 ns fall time c load =15nf, v cc =18v t f -1825 on-time propagation delay c load =15nf, v cc =18v t ondelay -5070 off-time propagation delay c load =15nf, v cc =18v t offdelay -5070 enable to output-high delay time ixdd614 only t enoh -3160 disable to high impedance state delay time ixdd614 only t dold -4470 enable pull-up resistor ixdd614 only r en -200-k ? power supply current v cc =18v, v in =3.5v i cc -12ma v cc =18v, v in =0v -<110 ? a v cc =18v, v in =v cc -<110
ixd_614 r02 www.clare.com 5 1.6 electrical characteristics: t a = - 40c to +125c test conditions: 4.5v < v cc < 35v. 1.7 thermal characteristics parameter conditions symbol minimum maximum units input voltage, high 4.5v < v cc < 18v v ih 3.3 - v input voltage, low 4.5v < v cc < 18v v il -0.65 input current 0v < v in < v cc i in -10 ? a output voltage, high - v oh v cc -0.025 - v output voltage, low - v ol - 0.025 output resistance, high state v cc =18v, i out =-100ma r oh -1.5 ? output resistance, low state v cc =18v, i out =100ma r ol -1.2 output current, continuous limited by package power dissipation i dc -1a rise time c load =15nf, v cc =18v t r -50 ns fall time c load =15nf, v cc =18v t f -40 on-time propagation delay c load =15nf, v cc =18v t ondelay -90 off-time propagation delay c load =15nf, v cc =18v t offdelay -90 enable to output-high delay time ixdd614 only t enoh -75 disable to high impedance state delay time ixdd614 only t dold -85 power supply current v cc =18v, v in =3.5v i cc -3ma v cc =18v, v in =0v -150 ? a v cc =18v, v in =v cc -150 package parameter symbol rating units ci (5-pin to-220) thermal resistance, junction-to-ambient ? ja 36 c/w pi (8-pin dip) 125 si (8-pin power soic) 85 yi (5-pin to-263) 46 ci (5-pin to-220) thermal resistance, junction-to-case ? jc 3 c/w si (8-pin power soic) 10 yi (5-pin to-263) 2
ixd_614 6 www.clare.com r02 2 performance 2.1 timing diagrams 2.2 characteristics test diagram 10% 90% t o n delay t offdelay t r t f v ih v il i n out 10% 90% t o n delay t offdelay t f t r v ih v il i n out e n i n out g n d v cc v cc + - v i n 0.1 f10 f tektronix c u rrent pro b e 6302 c load v cc
ixd_614 r02 www.clare.com 7 3 block diagrams & truth tables 3.1 ixdd614 3.2 ixdi614 3.3 ixdn614 in en out 0 1 or open 0 1 1 or open 1 x0 z in out 0 1 1 0 g n d i n e n v cc out i n v cc g n d out in out 0 0 1 1 i n v cc g n d out
ixd_614 8 www.clare.com r02 4 typical perform ance characteristics supply volta g e (v) 0 5 10 15 20 25 30 35 40 rise time (ns) 0 10 20 30 40 50 60 70 8 0 rise time vs. supply volta g e (v in =0-5v, f=10khz, t a =25oc) c l =15nf c l =7.5nf c l =3.6nf supply volta g e (v) 0 5 10 15 20 25 30 35 40 fall time (ns) 0 10 20 30 40 50 60 fall time vs. supply volta g e (v in =0v-5v, f=10khz, t a =25oc) c l =15nf c l =7.5nf c l =3.6nf temperature (oc) -40-200 204060 8 0 100 120 140 time (ns) 5 6 7 8 9 10 11 12 13 14 15 rise & fall time vs. temperature (v in =0-5v, f=10khz, c l =3.6nf, v cc =18v) t f t r load capacitance (nf) 246 8 10 12 14 16 rise time (ns) rise time vs. load capacitance 5 10 15 20 25 30 35 40 45 50 v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =25 v v cc =30 v v cc =35 v load capacitance (nf) 246 8 10 12 14 16 fall time (ns) 5 10 15 20 25 30 35 40 45 50 fall time vs. load capacitance v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =25 v v cc =30 v v cc =35 v supply volta g e (v) 0 5 10 15 20 25 30 35 40 propa g ation delay (ns) 0 50 100 150 200 250 propa g ation delay vs. supply volta g e (v in =0-5v, f=1khz, c l =15nf) t offdly t o n dly input volta g e (v) 246 8 10 12 14 propa g ation delay (ns) 40 60 8 0 100 120 140 160 propa g ation delay vs. input volta g e (v in =0-5v, f=1khz, c l =15nf, v cc =12v) t offdly t o n dly temperature (oc) -40-200 204060 8 0 100 120 140 propa g ation delay (ns) 40 45 50 55 60 65 70 propo g ation delay vs. junction temperature (v in =0-5v, f=1khz, c l =15nf, v cc =18v) t offdly t o n dly temperature (oc) -40-200 204060 8 0 100 120 140 input threshold (v) 1.5 2.0 2.5 3.0 3.5 input threshold vs. temperature (c l =3.6nf, v cc =18v) min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 40 input threshold (v) 1.5 2.0 2.5 3.0 3.5 input threshold vs. supply volta g e min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 40 enable threshold (v) 0 5 10 15 20 25 enable threshold vs. supply volta g e min v e n h max v e n l
ixd_614 r02 www.clare.com 9 load capacitance (pf) 246 8 10 12 14 16 1 8 supply current (ma) 1 10 100 1000 supply current vs. load capacitance (v cc =35v) f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz f=2mhz load capacitance (nf) 246 8 10 12 14 16 1 8 supply current (ma) 0.1 1 10 100 1000 supply current vs. load capacitance (v cc =18v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (nf) 246 8 10 12 14 16 1 8 supply current (ma) 0.1 1 10 100 1000 supply current vs. load capacitance (v cc =12v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =35v) c l =15nf c l =7.5nf c l =3.6nf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =18v) c l =15nf c l =7.5nf c l =3.6nf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =12v) c l =15nf c l =7.5nf c l =3.6nf load capacitance (nf) 246 8 10 12 14 16 1 8 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. load capacitance (v cc =8v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz temperature (oc) -40-20 0 204060 8 0 100 120 140 supply current (ma) -0.5 0.0 0.5 1.0 1.5 2.0 quiescent supply current vs. temperature 3.5 v 5 v 10 v 0 v & 1 8v temperature (oc) -40-200 204060 8 0 100 120 140 supply current (ma) 0.0 0.2 0.4 0.6 0. 8 1.0 1.2 1.4 dynamic supply current vs. temperature (v in =0-5v, f=1khz, c l =5.4nf, v cc =18v) frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency (v cc =8v) c l =15nf c l =7.5nf c l =3.6nf supply volta g e (v) 0 5 10 15 20 25 30 35 40 output source current (a) -35 -30 -25 -20 -15 -10 -5 0 output source current vs. supply volta g e (c l =330nf) supply volta g e (v) 0 5 10 15 20 25 30 35 40 output sink current (a) 0 5 10 15 20 25 30 35 40 45 output sink current vs. supply volta g e (c l =330nf)
ixd_614 10 www.clare.com r02 temperature (oc) -40-200 204060 8 0 100 120 140 output source current (a) -22 -20 -1 8 -16 -14 -12 -10 output source current vs. temperature (c l =330nf, v cc =18v) temperature (oc) -40-200 204060 8 0 100 120 140 output sink current (a) 16 17 1 8 19 20 21 22 23 24 output sink current vs. temperature (c l =330nf, v cc =18v) supply volta g e (v) 0 5 10 15 20 25 30 35 40 output resistance ( ) 0.3 0.4 0.5 0.6 0.7 0. 8 0.9 1.0 hi g h-state output resistance @ -10ma vs. supply volta g e supply volta g e (v) 0 5 10 15 20 25 30 35 40 output resistance ( ) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 low-state output resistance @ +10ma vs. supply volta g e
ixd_614 r02 www.clare.com 11 5 manufacturing information 5.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 5.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 5.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device moisture sensitivity level (msl) rating ixd_614si / ixd_614pi /ixd_614ci / ixd_614yi msl 1 device maximum temperature x time ixd_614ci / ixd_614yi 245c for 30 seconds ixd_614pi 250c for 30 seconds ixd_614si 260c for 30 seconds rohs 2002/95/ec e 3 pb
ixd_614 12 www.clare.com r02 5.4 mechanical dimensions 5.4.1 si (8-pin power soic with exposed metal back) 5.4.2 si package tape & reel information recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) n otes: 1. molded package conforms to jedec standard config u ration ms-012 v ariation ba. 2. the exposed metal pad on the b ack of the si package sho u ld b e connected to g n d. it is not s u ita b le for carrying c u rrent. 1.30 / 1.75 (0.051 / 0.069) 0.03 / 0.10 (0.001 / 0.004) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 2.29 / 2.79 (0.090 / 0.110) 3.30 / 3. 8 1 (0.130 / 0.150) 1.27 (0.050) 5.40 (0.209) 1.55 (0.061) 0.60 (0.024) 2.75 (0.10 8 ) 3. 8 0 (0.150) n otes: 1. a 0 & b 0 meas u red at 0.3mm a b o v e b ase of pocket. 2. 10 pitches c u m u lati v e tol. 0.2mm 3. ( ) reference dimensions only. 4. unless other w ise specified, all dimensions in millimeters. k 0 =2.30 0.10 b 0 =5.20 0.10 r0.50 typ 8 .00 0.10 2.00 0.10 4.00 0.10 see n ote #2 12.00 0.30 5.50 0.10 1.75 0.10 ? 1.50 (mi n ) ? 1.55 0.05 1. 8 0 0.10 (3.40) 0.30 0.05 (70o) a 0 =6.40 0.10 (4.70) (1.20) a a b b sectio n a-a sectio n b-b em b ossment em b ossed carrier top co v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.)
ixd_614 r02 www.clare.com 13 5.4.3 yi (5-pin to-263) 5.4.4 ci (5-pin to-220) dime n sio n s mm mi n / mm max (inches mi n / inches / max) n otes: 1. all metal s u rfaces are solder-plated except trimmed area. 2. short lead of n o. 3 is optional to ixys. 3. n o. 3 lead is connected to n o. 6 lead ( b ottom heat sink) internally. 8 . 8 0 / 9.50 (0.346 / 0.374) 14. 8 0 / 15. 8 0 (0.5 8 3 / 0.622) 9.65 / 10.30 (0.3 8 0 / 0.406) 1.70 bsc (0.067 bsc) 1 2 3 4 5 0.60 / 0.99 (0.024 / 0.039) 1.00 / 1.40 (0.039 / 0.055) 4.20 / 4. 8 0 (0.165 / 0.1 8 9) 1.20 / 1.40 (0.047 / 0.055) 0.40 / 0.70 (0.016 / 0.02 8 ) 2.24 / 2. 8 4 (0.0 88 / 0.112) 2.10 / 2.70 (0.0 8 3 / 0.106) 0o - 3o 6.60 / 7.20 (0.260 / 0.2 8 3) 7.50 / 8 .20 (0.295 / 0.323) 1.20 / 1.70 (0.047 / 0.067) 6 optional 3. 8 5 (0.152) 3.65 (0.144) 6.35 (0.250) 1.05 (0.041) 1.70 (0.067) 10.40 (0.409) 9.15 (0.360) recommended pcb pattern n otes: 1. this dra w ing w ill meet all dimensions req u irement of jedec o u tlines ts-001aa and 5-lead v ersion to-220ab. 2. mo u nting hole diameter: 3.53 / 3.96 (0.139 / 0.156) 3. the metal ta b is connected to pin 3 (g n d). finished hole diameter = 1.45mm (0.057 in.) recommended hole pattern 1.70mm (0.067 in.) 25.27 / 26.54 (0.995 / 1.045) 11.94 / 12.95 (0.470 / 0.510) 14.73 / 15.75 (0.5 8 0 / 0.620) 9.91 / 10.54 (0.390 / 0.415) 1.70 bsc (0.067 bsc) 0.64 / 1.02 (0.025 / 0.040) 8 .64 / 9.40 (0.340 / 0.370) 4.32 / 4. 8 3 (0.170 / 0.190) 1.14 / 1.40 (0.045 / 0.055) 0.3 8 / 0.64 (0.015 / 0.025) 2.29 / 2.92 (0.090 / 0.115) dime n sio n s mm mi n / mm max (inches mi n / inches / max) 12.3 8 7 (0.4 8 7) 6.299 (0.24 8 ) 7. 8 23 (0.30 8 ) 12.70 / 14.73 (0.50 / 0.5 8 ) 7.620 (0.300) 6.502 (0.256) 1 2 3 4 5 3
ixd_614 14 www.clare.com r02 5.4.5 pi (8-pin dip) dimensions mm mi n / mm max (inches mi n / inches max) n ote: molded package conforms to jedec standard config u ration ms-001 v ariation ba. pc board pattern 7.62 / 10.92 (0.300 / 0.430) 7.62 bsc (0.300 bsc) 0.20 / 0.3 8 (0.00 8 / 0.015) 7.37 / 8 .26 (0.290 / 0.325) 0.3 8 / 0.5 8 (0.015 / 0.023) 1.14 / 1.65 (0.045 / 0.065) 0.3 8 / 1.02 (0.015 / 0.040) 3.05 / 3. 8 1 (0.120 / 0.150) 3.43 / 4.70 (0.135 / 0.1 8 5) 3.1 8 / 3. 8 1 (0.125 / 0.150) 8 -0.900 dia. ( 8 -0.035 dia.) 7.50 (0.295) 2.540 (0.100) 9.02 / 10.16 (0.355 / 0.400) 6.10 / 6. 8 6 (0.240 / 0.270) 2.540 bsc (0.100 bsc) 1.40 (0.055) for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-ixd_614-r02 ?copyright 2011, clare, inc. all rights reserved. printed in usa. 8/16/2011

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