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ht75xx-2 100ma low power ldo selection table part no. output voltage package marking ht7521-2 2.1v to92 sot89 sot23-5 75xx-2# (for to92) 75xx-2# (for sot89) 5xx2+ (for sot23-5-a) ht7523-2 2.3v ht7525-2 2.5v ht7527-2 2.7v ht7530-2 3.0v ht7533-2 3.3v ht7536-2 3.6v ht7540-2 4.0v ht7544-2 4.4v ht7550-2 5.0v ht7560-2 6.0v ht7570-2 7.0v ht7580-2 8.0v ht7590-2 9.0v ht75a0-2 10.0v HT75C0-2 12.0v ht7541-2 4.15v sot23-5 541b+ (for sot23-5-b) note: xx stands for output voltages. # stands for lead-free devices. + stands for green compound devices, which are lead-free and halogen-free. rev. 1.20 1 june 1, 2011 features low power consumption low voltage drop low temperature coefficient high input voltage (up to 24v) high output current : 100ma output voltage accuracy: tolerance 1% to92, sot89 and sot23-5 packages applications battery-powered equipment communication equipment audio/video equipment general description the ht75xx-2 series is a set of three-terminal low power high voltage implemented in cmos technology. they can deliver 100ma output current and allow an in - put voltage as high as 24v. they are available with sev - eral fixed output voltages ranging from 2.1v to 12.0v. cmos technology ensures low voltage drop and low quiescent current. although designed primarily as fixed voltage regulators, these devices can be used with external components to obtain variable voltages and currents.
block diagram pin assignment absolute maximum ratings supply voltage ......................................... 0.3v to 26v storage temperature ........................... 50 cto125 c operating temperature .......................... 40 cto85 c note: these are stress ratings only. stresses exceeding the range specified under absolute maximum ratings may cause substantial damage to the device. functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. thermal information symbol parameter package max. unit ja thermal resistance (junction to ambient) (assume no ambient airflow, no heat sink) sot23-5 500 c/w sot89 200 c/w to92 200 c/w p d power dissipation sot23-5 0.20 w sot89 0.50 w to92 0.50 w note: p d is measured at ta= 25 c ht75xx-2 rev. 1.20 2 june 1, 2011

pin descriptions pin no. pin name pin description 1 gnd ground pin 2 vin input pin 3 vout output pin electrical characteristics v in =v out +2v, c in =c o =10f ta=25 c symbol parameter test conditions min. typ. max. unit conditions v in input voltage 24 v v out output voltage tolerance i out =10ma -1% +1% v i out output current 2.1v
v out
4.4v 70 100 ma v out 5.0v 100 150 ma 6.0v
v out
12.0v 150 ma v out load regulation 2.1v
v out
3.6v 1ma
i out
50ma 10 45 mv 4.0v
v out
4.4v 1ma
i out
50ma 13 65 mv 5.0v
v out
12.0v 1ma
i out
70ma 17 80 mv v dif voltage drop (note) i out =10ma, v out =2% 2.1v
v out
2.4v 0.46 0.95 v 2.5v
v out
2.7v 0.32 0.68 v 3.0v
v out
3.3v 0.23 0.41 v v out 3.6v 0.19 0.35 v 4.0v
v out
4.4v 0.16 0.30 v v out =5.0v 0.12 0.25 v 6.0v
v out
12.0v 0.11 0.23 v i ss quiescent current no load 2.5 5.0 a v line line regulation v in =v out +1v
v in
24v, i out =1ma 0.1 0.2 %/v temperature coefficient i out =10ma -40cv out
12.0v 100 ppm/c note: dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at v in =v out + 2v with a fixed load. ht75xx-2 rev. 1.20 3 june 1, 2011
application circuits basic circuit high output current positive voltage regulator short-circuit protection for tr1 ht75xx-2 rev. 1.20 4 june 1, 2011

circuit for increasing output voltage v=v(1+ r2 r1 )+i r2 out xx ss circuit for increasing output voltage v=v+v out xx d1 constant current regulator i= v r +i out xx a ss dual supply ht75xx-2 rev. 1.20 5 june 1, 2011

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package information 3-pin to92 outline dimensions symbol dimensions in inch min. nom. max. a 0.170 0.200 b 0.170 0.200 c 0.500 d 0.011 0.020 e 0.090 0.110 f 0.045 0.055 g 0.045 0.065 h 0.130 0.160 0 10 symbol dimensions in mm min. nom. max. a 4.32 5.08 b 4.32 5.08 c 12.70 d 0.28 0.51 e 2.29 2.79 f 1.14 1.40 g 1.14 1.65 h 3.30 4.06 0 10 ht75xx-2 rev. 1.20 6 june 1, 2011 # %
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3-pin sot89 outline dimensions symbol dimensions in inch min. nom. max. a 0.173 0.181 b 0.059 0.072 c 0.090 0.102 d 0.035 0.047 e 0.155 0.167 f 0.014 0.019 g 0.017 0.022 h 0.059 i5 5 63 j1 4 17 symbol dimensions in mm min. nom. max. a 4.39 4.60 b 1.50 1.83 c 2.29 2.59 d 0.89 1.19 e 3.94 4.24 f 0.36 0.48 g 0.43 0.56 h 1.50 i 1.40 1.60 j 0.36 0.43 ht75xx-2 rev. 1.20 7 june 1, 2011 # % &
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5-pin sot23-5 outline dimensions symbol dimensions in inch min. nom. max. a 0.039 0.051 a1 0.004 a2 0.028 0.035 b 0.014 0.020 c 0.004 0.010 d 0.106 0.122 e 0.055 0.071 e 0.075 h 0.102 0.118 l 0.015 0 9 symbol dimensions in mm min. nom. max. a 1.00 1.30 a1 0.10 a2 0.70 0.90 b 0.35 0.50 c 0.10 0.25 d 2.70 3.10 e 1.40 1.80 e 1.90 h 2.60 3.0 l 0.37 0 9 ht75xx-2 rev. 1.20 8 june 1, 2011 & % # ( # # $
product tape and reel specifications to92 reel dimensions (unit: mm) ht75xx-2 rev. 1.20 9 june 1, 2011 ) * + , - .
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reel dimensions sot89-3 symbol description dimensions in mm a reel outer diameter 180.01.0 b reel inner diameter 62.01.5 c spindle hole diameter 12.75 +0.15/-0.00 d key slit width 1.900.15 t1 space between flange 12.4 +0.2/-0.0 t2 reel thickness 17.0 +0.0/-0.4 sot23-5 symbol description dimensions in mm a reel outer diameter 178.01.0 b reel inner diameter 62.01.0 c spindle hole diameter 13.00.2 d key slit width 2.500.25 t1 space between flange 8.4 +1.5/-0.0 t2 reel thickness 11.4 +1.5/-0.0 ht75xx-2 rev. 1.20 10 june 1, 2011 #
carrier tape dimensions to92 symbol description dimensions in mm i1 taped lead length (2.5) p component pitch 12.71.0 p 0 perforation pitch 12.70.3 p 2 component to perforation (length direction) 6.350.40 f 1 lead spread 2.5 +0.4/-0.1 f 2 lead spread 2.5 +0.4/-0.1 h component alignment 0.00.1 w carrier tape width 18.0 +1.0/-0.5 w 0 hold-down tape width 6.00.5 w 1 perforation position 9.00.5 w 2 hold-down tape position (0.5) h 0 lead clinch height 16.00.5 h 1 component height less than 24.7 d 0 perforation diameter 4.00.2 t taped lead thickness 0.70.2 h component base height 19.00.5 note: thickness less than 0.38 0.05mm~0.5mm p0 accumulated pitch tolerance: 1mm/20pitches. ( ) bracketed figures are for consultation only ht75xx-2 rev. 1.20 11 june 1, 2011

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carrier tape dimensions sot89-3 symbol description dimensions in mm w carrier tape width 12.0 +0.3/-0.1 p cavity pitch 8.00.1 e perforation position 1.750.10 f cavity to perforation (width direction) 5.500.05 d perforation diameter 1.5 +0.1/-0.0 d1 cavity hole diameter 1.5 +0.1/-0.0 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.00.1 a0 cavity length 4.80.1 b0 cavity width 4.50.1 k0 cavity depth 1.80.1 t carrier tape thickness 0.3000.013 c cover tape width 9.30.1 sot23-5 symbol description dimensions in mm w carrier tape width 8.00.3 p cavity pitch 4.00.1 e perforation position 1.750.10 f cavity to perforation (width direction) 3.500.05 d perforation diameter 1.5 +0.1/-0.0 d1 cavity hole diameter 1.5 +0.1/-0.0 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.000.05 a0 cavity length 3.150.10 b0 cavity width 3.20.1 k0 cavity depth 1.40.1 t carrier tape thickness 0.200.03 c cover tape width 5.30.1 ht75xx-2 rev. 1.20 12 june 1, 2011 + 2 + + %
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ht75xx-2 rev. 1.20 13 june 1, 2011 copyright 2011 by holtek semiconductor inc. the information appearing in this data sheet is believed to be accurate at the time of publication. however, holtek as - sumes no responsibility arising from the use of the specifications described. the applications mentioned herein are used solely for the purpose of illustration and holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. holtek s products are not authorized for use as critical components in life support devices or systems. holtek reserves the right to alter its products without prior notification. for the most up-to-date information, please visit our web site at http://www.holtek.com.tw. holtek semiconductor inc. (headquarters) no.3, creation rd. ii, science park, hsinchu, taiwan tel: 886-3-563-1999 fax: 886-3-563-1189 http://www.holtek.com.tw holtek semiconductor inc. (taipei sales office) 4f-2, no. 3-2, yuanqu st., nankang software park, taipei 115, taiwan tel: 886-2-2655-7070 fax: 886-2-2655-7373 fax: 886-2-2655-7383 (international sales hotline) holtek semiconductor inc. (shenzhen sales office) 5f, unit a, productivity building, no.5 gaoxin m 2nd road, nanshan district, shenzhen, china 518057 tel: 86-755-8616-9908, 86-755-8616-9308 fax: 86-755-8616-9722 holtek semiconductor (usa), inc. (north america sales office) 46729 fremont blvd., fremont, ca 94538, usa tel: 1-510-252-9880 fax: 1-510-252-9885 http://www.holtek.com

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