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  transistors 1 2sb1678 silicon pnp epitaxial planer type for low-frequency amplification  features ? low collector to emitter saturation voltage v ce(sat) ? large peak collector current i cp ? mini power type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing  absolute maximum ratings t a = 25 c unit: mm parameter symbol rating unit collector to base voltage v cbo ? 30 v collector to emitter voltage v ceo ? 20 v emitter to base voltage v ebo ? 7v peak collector current i cp ? 5a collector current i c ? 3a collector power dissipation * p c 1w junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector cutoff current i cbo v cb = ? 10 v, i e = 0 ? 100 na emitter cutoff current i ebo v eb = ? 5 v, i c = 0 ? 100 na collector to emitter voltage v ceo i c = ? 1 ma, i b = 0 ? 20 v emitter to base voltage v ebo i e = ? 10 a, i c = 0 ? 7v forward current transfer ratio * 1, 2 h fe v ce = ? 2 v, i c = 200 ma 90 625 collector to emitter saturation voltage * 1 v ce(sat) i c = ? 3 a, i b = ? 0.1 a ? 1v collector output capacitance c ob v cb = ? 20 v, i e = 0, f = 1 mhz 85 pf transition frequency f t v cb = ? 6 v, i e = 50 ma, f = 200 mhz 120 mhz  electrical characteristics t a = 25 c 3 c marking symbol: 2k 1: emitter 2: collector 3: base minip3 type package note) * : printed circuit board copper foil for collector portion area: 1.0 cm 2 or more, thickness: 1.7 mm absolute maximum rating p c without heat sink shall be 0.5 w 4.5 ?.1 3.0 ?.15 45? 2.6 ?.1 0.4 max. 1.6 ?.2 1.5 ?.1 4.0 2.5 ?.1 3? +0.25 ?.20 1.0 +0.1 ?.2 0.5 ?.08 0.4 ?.04 0.4 ?.08 32 1 1.5 ?.1 3? note) * 1: pulse measurement * 2: rank classification rank p q r h fe 90 to 135 120 to 205 180 to 625
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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