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prepared by: date: a- t spec.no: dg-996011 approved by: date: electronic components group representative division: jd b /?yy sharp corporation ( specification 1 opto-electronic devices division / y device specification for . light emitting diode model no. ltlze4oa 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp5 consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting corn use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; i * oa equipment * audio visual equipment * home appliance * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers 1 if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; l * transportation control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers l rescue and security equipment * other safety equipment 1 (3) please do not use this product for equipment which require extremely high reliability and safety in fimction and precision, such as ; c * space equipment * telecommunication equipment (for trunk lines) l nuclear power control equipment * medical equipment 1 . (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. -i customer?s approval date: by: date: presented by: m.katoh, i department general manager of engineering dept.,111 opto-electronic devices division electronic components group sharp corporation
j .i l. i __, .dg-g96011.-. . feb/22/9! model nd. ?- _. - page - ltl ze40a l/14 ltlze40a smdkation 1. application this specification applies to the light emitting diode device model no. ltl ze4oa. [alingap (dicing or scribe/brake type/yellow green) chip led device] 2. outline dimensions and temkal connections ...*.*..**...~.......,~f~ to the attached sheet page2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 3-5. 3- 1. absolute maximum ratings 3-2. electra-optical characteristics 3-3. derating curve 3-4. characteristics diagram 4. reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 6. 4-1. test items and test conditions 4-2. failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 7. 5- 1. inspection method 5-2. description of inspection and criteria 6. taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 8- 11. 6-1. taping 6-2. label 6-3. luminous intensity rank 6-4. dominant wavelength raak 7. packing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* refer to the attached sheet page 12. 7- 1. dampproof package 7-2. storage conditions 7-3. treatment after opening 8. soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 13. 8- 1. reflow soldering 8-2. manual soldering 9. precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 14. 9- 1. precautions matters for designing circuit 9-2. cleaning method 10. ekironment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 14. lo- 1. ozonosphere destructive chemicals. 10-2. bromic non-burning materials
febl2219? 2. outliue dimensions and terminal connections unit mm material finish drawiug no. pwb: glass-epoxy resin: epoxy au plated j--- i 1. plabzd area m resist area m 0. 4 . i i- h-l= . --- e-w 2. pin conection 0 cathode @ anode 43-o 3. unspecified tol. to be ktl. 1
l 3. ratings and characteristics (notel) duty ratio=l/lo,puise width=o.lms (note2) manual soldering max.3second (note 3)measured by sharp eg&g modelsso(radiometer/photometersystem) (tolerance: f 15%) / _.. _ / i dg-99.6011 ifddel, no. ? ,,-, _ febl22/99- -?. page ?-\u \.?yi t * :.-- \ . . . 3/14 -. .._
forward current derating curve 60 -25 b 25 50 75 100 125 anbient temperature ta("c) peak fotward current vs. duty ratio cta=25"c) l/100 l/10 1 10 duty raito dr
(/ ? ~ dg-996011 1 jud8/9! moplyo.., .. \\ ? -.lt l,$edo a~, page ?, ._ 5114 3-4. characteristics diagram(typ) (note 1) forward current vs.fotward voltage fla=2573 s e a y t 2 l.l 0. 1 1.2 1.4 1.6 1.8 2 2.2 2.4 fotward voltage vfw relative lminoua lntenaitv vi. fromrd voltare ua=25%) t i i iiitttt i i iii/iii i i iiiiltl 1000 8 relative luminous intensity vs. ambient tamerature (if=5mai b -60 -40 -20 0 20 40 60 80 100 120 ambient tetwature ta("c) 0. 1 1 10 100 forward current ifw (note 1) above characteristic data are typical data and not a guarantteed data.
4. reliability the reliability of products shall be satisfied with items listed below. ,-i. test items and test conditions confidence level: 907 4-2. failure judgement criteria * 1 parameter symbol forward voltage vf reverse current ir luminous intensity iv failure judgement criteria l 2 v, > u.s.l. x 1.2 ir > u.s.l. x 2.0 iv > the first stage value x 2.0 or the first stage value x 0.5 > iv l 1: measuring condition is in accordance with specification. $2: u.s.l. is shown by upper specification limit.
i i. , i,. ., ?k. / jig<-9960?1 1 *-yodel no.,,. ) ?i. ., y ~hzk40~-.. febl22/9! page 7114 5. incoming inspection s- 1. inspection method a single sampling plan, normal inspection level s-4 based on is0 2859-l shall be adopted. product inserted in reverse direction 7 outline dimensions not conforming to the specification 8 dust and flaw effect to the specification minor defect 9 resin flash over the unspecified tolerance 10 resin crack 0.3mm or greater corn the product side face 11 solderbility could solder 50% or greater and less than 90% out of judgement area * 1 aql 0.1% 0.4% * 1 judgement area : the plated area of the product bottom
6.taping specification 6-l.tapiug 6-1-l.shape and dimension of tape(typ.) w tp cathode 1 cover tape width wi 5.5 thickness t 3 0.1 carrier tape width wa 8.0 thickness t 1 0.2 thickness of the entire unit t2 1.2 % material : carrier tape...ps, cover tape.. . polyester with cover tape and carrier tape combined
. . dg-996011 febl22/9 page 9114 -._ 6-i-2.shape and dimension of reel(typ.) frange parameter 1 symbol 1 dimension 1 remarks external diameter 460 hub spindle hole diameter c 413 key slit width e 2.0 depth u 4.5 dotation for part name etc. labeling on one side of flange.(part name,quantity,lot no.) % material : reel...polystyrene
? i; dg-996011 mo&l go. ..- --y ly &&a? y.., febl22/99 page 10114 6-1-3.taping specification (1) lead tape: end 40-50 pitch (2) cover tape strength against peeling:f=o. l-o.sn( 6 =lo?or less) cover tape 1 ? - ?%pe speed : sum/s <- forward carrier tape (3) tape strength against bending: the radius of bending circle should be 30mm or more. if it is less than 3omm, the cover may peel. (4) jointing of tape: there should not be joint of cover tape or carrier tape. (5) quantity per reel: average 4,ooopcs. per reel (6) others: 0 there should not be missing above continuous three products. @ products should be easily taken out. @ products should not be attached to the cover tape at peeling.
,? ,: dg-996011 jud8/9! m,odei, no. <4 ?~ page .a. u ..ltl~ei~a 1 l/14 6-2. label cl+ model number - quaiikr i i- c quantity of products + eiaj c-3 bar code 0 production plant code(to be indicated alphabetically) @ production lot(single or double figures) q) year of production(tbe last two figures of the year) @ month of production (to be indicated alphabetically with january corresponding to a) @ date of production(0 1 - 3 1) 6-3.lurninous intensity rank(note 1) luminous intensity a 10 - 19 unit (ta=25?c) condition b c d e (note 1) 14 - 28 21 - 40 mcd j?=2oma 30 - 30 43 - 84 also i sbail not ask tbe delivery ratio of each rank. 6-4.dominant wavelength rank (note 2) (ta=25?c) dominant wavelength unit condition d 562 - 566.0 e f (r 565.0 - 569 568 - 572.0 571n - 575 (note 2) this rank value is the setting value of when that cla.ssiiies it the rank and be not a guarantee value. also i shall not ask the delivery ratio of each rank.
,.? , . . / \ _ .-. y dgr996011 model for 1 ..v , a; -- . febl22199 page label e - silicagel q ree1 label 7. paclang specification 7- 1. dampproof package in other to avoid the absorption of humidity iu transport and storage, the device s are packed in aluminum sleeve. 7-2.strage conditions temperature : 5 to 30c humidity : less than 6o%rh 7-3.treatment after opening (1) please make a soldering within 15 days after opening under following condition; temperature : 5 to 30c humidity : less than 6o%rh (2) in case the devices are not used for a long time after opening ,the storage in dry box is recommendable. or it is better to repack the devices with a desiccative by the sealer and put them in the some storage conditions as 7-2. then they should be used withiu 2 weeks. (3) please make a soldering after a follewing bakiug treatment if unused term should be over the conditions ofw *recommendable conditions: 0 in taping temprature:6o?c to 65?c,time:36 to 48 hours 0 in individual (on pwb or metallic tray) temprature:loo?cto120?c ,time:2 to 3 hours
8. soldering 8- 1 .reflow soldering (1) it is not recommended to exceed the soldering temperature and time shown below. caused by substrate bend or the other mechanical stress during reflow soldering may happen gold wire disconnection etc. therefore please check and study your solder reflow machine?s best condition. (2) in case of 2 times reflow process.2nd reflow process should be done within 8 hours after 1st reflow process.(strage condition ; at 3o?c,rh less than 6o%rh) ? (3) reflow soldering temperature profile to be done under the following condition. max 250 140-160 h febl22/99 page 13114 time(s) recommendable thermal model (4) recommendable metal mask pattern for screen print recommend 0.2mm to 0.3mm thickness metal mask for screen print. caused by solder reflow condition, ---mm -.-_-.-_ .-. solder paste, substrate and the other material etc., r 2 , center of the produc r may change solderbility. please check and study actual solderbility before i i il ? l usage. / 4 ?- - - -. - - -. - . - _ -. - a if 1.25 recommended soldar pattern (u&mm) 8-2.manual soldering (1) it is recommended to keep the soldering iron temperature at 350% (soldering iron power consumption 2ow) and not to solder more than once or for over 3 seconds. (2) when using a soldering iron, care must be taken not to damage the package. (pay attention not to allow any under stress or heat on package.) l
9-l. precautions matters for designing circuit this product is not designed as electromagnetic and ionized-particle radiation resistant. 9-2. cleaning method (1) solvent cleaning recommend conditions: 0 solvent temperature is not more than 45 degree. 0 immersion up to 3 minutes. (2) ultrasonic cleaning the affect on the device from ultrasonic bath, ultrasonic output, duration, board size and device mounting method. test the cleaning method under actual conditions and check for abnormalities before actual use. (3) solvents use only the following types of solvent. water, methyl alcohol, ethyl alcohol, isopropyl alcohol recommend conditions: rt. 4okhz, 3ow/l, 3 to 5 minutes 10. environment 10-l. ozonosphere destructive chemicals. (1) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires following substance. restricted part: cfcs,halones,cch,trichloroethane(methychlorofotm) 1 o-2. bromic non-burning materials the device doesn?t contain bromic non-burning materials(pbbos,pbbs)

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