1 05156.r2 11/02 p0408fc3.3c* thru p0408fc36c* bidirectional flip chip applica tions ? cellular phones ? mcm boards ? wireless communication circuits ? ir leds ? smart cards & pcmcia cards iec compa tibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns fea tures ? esd protection > 25 kilovolts ? available in multiple voltage types ranging from 3.3v to 36v ? 250 watts peak pulse power dissipation per line (8/20s) ? monolithic structure mechanical characteristics ? standard eia chip size: 0408 ? weight 0.73 milligrams (approximate) ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? device marking on reel ? top contacts: solder bump 0.004? in height (nominal) circuit diagram 05156 0408 (single chip shown) . . . engineered solutions for the transient environment? * u.s. patent no. des. d456,367 s www.protekdevices.com
2 p0408fc3.3c* thru p0408fc36c* 05156.r2 11/02 * u.s. patent no. des. d456,367 s www.protekdevices.com device characteristics maximum ratings @ 25c unless otherwise specified operating temperature symbol value -55 c to 150 cc c -55 c to 150 c units t j t stg parameter storage temperature peak pulse power (t p = 8/20s) - see figure 1 p pp 250 watts electrical characteristics per line @ 25c unless otherwise specified pa r t number (see note 1) minimum breakdown voltage @ 1ma v (br) volts maximum clamping voltage (see fig. 2) @ i p = 1a v c volts maximum clamping voltage (see fig. 2) @8/20s v c @ i pp typical capacitance 0v @ 1 mhz c pf p0408fc3.3c p0408fc05c p0408fc08c p0408fc12c p0408fc15c p0408fc24c p0408fc36c 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 12.5v @ 20a 14.7v @ 17a 19.2v @ 13a 29.7v @ 9.0a 35.7v @ 7.0a 55.0v @ 5.0a 84.0v @ 3.0a 150 100 75 50 40 30 25 maximum leakage current @v wm i d a 75 10 10 1 1 1 1 rated stand-off voltage v wm volts note 1: all devices are bidirectional. electrical characteristics apply in both directions. 0.01 1 10 100 1,000 t d - pulse duration - s 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 figure 2 pulse wave form 10 100 1,000 10,000 p pp - peak pulse current - watts figure 1 peak pulse power vs pulse time 250w, 8/20s waveform
3 p0408fc3.3c* thru p0408fc36c* 05156.r2 11/02 * u.s. patent no. des. d456,367 s www.protekdevices.com graphs esd test pulse - 12 kilovolt, 1/30ns (waveshape) figure 5 overshoot & clamping voltage for p0408fc05c 5 volts per division 0 10 20 30 40 0 5 10 15 20 v c - clamping voltage - volts 0 4 8 12 14 figure 6 typical clamping voltage vs peak pulse current for p0408fc05c 10 6 2 i pp - peak pulse current - amps figure 4 reflow solder profile 225c 5-10 sec instantaneous to 200c soldering time cool down time 1-2 minutes to 150c 1-2 minutes to 25c pre-heat time 100c 200c note: this reflow profile does not take into account the printed circuit board (pcb) material heating time. additional time may be required for the preheat time and cool down time upon the pcb or board material. 0 25 50 75 100 125 150 t l - lead temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0
4 p0408fc3.3c* thru p0408fc36c* 05156.r2 11/02 * u.s. patent no. des. d456,367 s www.protekdevices.com package outline & dimensions t ape & reel ordering informa tion: surface mount product is taped and reeled in accordance with eia-481. plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-1 (i.e., p0408fc05c-t75-1). paper tape: 7 inch reels - 10,000 pieces per reel. ordering suffix: -t710-2 (i.e., p0408fc05c-t710-2). a b c e f g h i 0.56 nom 0.86 nom 0.99 0.0254 0.15 sq 2.0 0.0254 0.15 nom 0.127 max 0.076 min 0.406 nom 0.022 nom 0.034 nom 0.039 0.001 0.006 sq 0.079 0.001 0.006 nom 0.005 max 0.003 min 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002 ? ). package outline picture not available mounting pad - option 1 tape & reel orientation note: 1. top view of tape. solder bumps are face down in tape package. quad die - 0408 06021 rev 3 - 11/02 g h e f i side a b c top end 0.020 0.012 0.018 0.008 0.006 sq 0.028 0.039 0.02 a c d e f g h i 0.51 0.30 0.46 0.20 0.15 sq 0.71 0.99 0.5 dim millimeters inches pad dimensions note: preferred: using 0.1mm (0.004 ? ) stencil. 0408 c solder print 0.010? - 0.012? dia. a h d i solder pads f g e solder mask die solder bump
5 p0408fc3.3c* thru p0408fc36c* 05156.r2 11/02 * u.s. patent no. des. d456,367 s www.protekdevices.com copyright ? protek devices 2003 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the fi nal judgement concerning selection and specifications is the buyer ? s and that in furnishing engineering and technical assistance, protek assumes no responsibility with respect to the selection or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com package outline & dimensions 0.020 0.006 sq 0.028 0.039 0.020 a f g h i 0.51 0.15 sq 0.71 0.99 0.51 dim millimeters inches pad dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002 ? ). 3. preferred: using 0.1mm (0.004 ? ) stencil. mounting pad la yout - option 2 06021 rev 3 - 11/02 copper contact 0.009 ? [0.23] dia. solder print 0.014? [0.36] dia. a h i f g solder mask die solder bump
|
