autoinsertable 3 mm led lamps reliability data description the following cumulative test results have been obtained from testing performed at agilent technologies in accordance with the latest revisions of mil- std- 883 and jis c 7021. agilent tests parts at the absolute maximum rated conditions recommended for the device. the actual performance you obtain from agilent parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in table 1. stress test total units total failure rate colors conditions device hrs. tested failed mtbf (% /1k hours) her, orange, t a = 85 c 672,000 672 0 672,000 0.149 emerald green, i f = 13 ma green and yellow dh as algaas t a = 85 c 112,000 112 0 112,000 0.893 (red) i f = 15 ma as alingap t a = 85 c 336,000 336 0 336,000 0.298 (amber, r/o & red) i f = 15 ma table 1. life tests demonstrated performance point typical performance failure rate prediction the failure rate of semiconductor devices is determined by the junction temperature of the device. the relationship between ambient temperature and actual junction temperature is given by the following: t j ( c) = t a ( c) + q ja p avg where t a = ambient temperature in c q ja = thermal resistance of junc- tion-to-ambient in c/watt p avg = average power dissipated in watts the estimated mtbf and failure rate at temperatures lower than the actual stress temperature can be determined by using an arrhenius model for temperature accelera- tion. results of such calculations are shown in the table on the fol- lowing page using an activation energy of 0.43 ev (reference mil- hdbk-217). hlmp-n10x hlmp-n60x hlmp-n20x hlmp-nl05 hlmp-n30x hlmp-nh01 hlmp-n40x hlmp-ng05 hlmp-n50x
2 table 2a. her, orange, emerald green and green, 85 c @ 13 ma notes: 1. the point typical mtbf (which repre- sents 60% confidence level) is the total device hours divided by the number of failures. in the case of zero failures, one failure is assumed for this calculation. 2. the 90% confidence mtbf represents the minimum level of reliability perfor- mance which is expected from 90% of all samples. this confidence interval is based on the statistics of the distribu- tion of failures. the assumed distribution of failures is exponential. this particular distribution is com- monly used in describing useful life failures. refer to mil-std-690b for de- tails on this methodology. 3. a failure is any led which is open, shorted, or fails to emit light. point typical performance in time [2] performance [1] in time (90% confidence) ambient junction failure rate failure rate temperature ( c) temperature ( c) mtbf [1] (%/1k hours) mtbf [2] (%/1k hours) +85 +94 672,000 0.149 292,000 0.343 +75 +84 983,000 0.102 427,000 0.234 +65 +74 1,471,000 0.068 639,000 0.156 +55 +64 2,254,000 0.044 979,000 0.102 +45 +54 3,545,000 0.028 1,540,000 0.065 +35 +44 5,737,000 0.017 2,492,000 0.040 +25 +34 9,580,000 0.010 4,161,000 0.024 table 2b. dh algaas, 85 c @ 15 ma ambient junction failure rate failure rate temperature ( c) temperature ( c) mtbf [1] (%/1k hours) mtbf [2] (%/1k hours) +85 +94 112,000 0.893 49,000 2.065 +75 +84 164,000 0.610 71,000 1.405 +65 +74 245,000 0.408 106,000 0.939 +55 +64 376,000 0.266 163,000 0.613 +45 +54 591,000 0.169 257,000 0.390 +35 +44 956,000 0.105 415,000 0.241 +25 +34 1,597,000 0.063 693,000 0.144 ambient junction failure rate failure rate temperature ( c) temperature ( c) mtbf [1] (%/1k hours) mtbf [2] (%/1k hours) +85 +93 336,000 0.298 146,000 0.685 +75 +83 493,000 0.203 214,000 0.467 +65 +73 739,000 0.135 321,000 0.312 +55 +63 1,135,000 0.088 493,000 0.203 +45 +53 1,790,000 0.056 777,000 0.129 +35 +43 2,905,000 0.034 1,262,000 0.079 +25 +33 4,867,000 0.021 2,114,000 0.047 table 2c. as alingap, 55 c @ 15 ma
3 table 3. environmental tests mil-std-883c jis c 7021 units units test name reference ref. test conditions tested failed autoinsertion, 1010 method a-4 a/i, ir exposure (130 c to 150 c for 90 55,309 7 wave solder and to 120 sec.), wave solder (250 c 10 c temperature cycle for 5 sec.) and tmcl (-40 c to 85 c; 30 min. dwell, 5 min. transfer) for 5 cycles temperature cycle 1010 method a-4 tmcl (-40 c to 85 c; 30 min. dwell, 500 0 5 minute transfer) for 1500 cycles resistance to 2003 method a-1 250 c for 5 seconds/2x dip 55,309 0 soldering heat cond. a solderability 2003 method a-2 230 c for 5 sec. 1 to 1.5 mm from body, 120 0 95% solder coverage of immersed area humidity agilent req. agilent req. 85 c, 85% rh, @ 13 ma, 1000 hours 448 0 operational life humidity storage agilent req. agilent req. 85 c, 85% rh, 1000 hours 560 0 life resistance to 2015 n/a 1. z propanol/mineral spirit solution 60 0 solvents (1:3 by volume). 2. propylene glycol monomethylether/monoethanolamine/di water solution (1:1:42 by volume). 3. semiaquous solvent with a minimum of 60% limonene and skysol 600. esd eiaj ed- method c-111, condition a 60 0 4701 example of failure rate calculation assume a device operating 8 hours/day, 5 days/week. the utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.25 for her, orange, emerald green, green and yellow, 85 c @ 13 ma: the point failure rate per year (8760 hours) at 85 c ambient temperature is: (0.149% / 1k hours) x 0.25 x (8760 hours/year) = 0.33% per year similarly, 90% confidence level failure rate per year at 85 c: (0.343% / 1k hours) x 0.25 x (8760 hours/year) = 0.75% per year mil-std-883c jis c 7021 units units test name reference ref. test conditions tested failed mechanical 2002 method a-7 max. acceleration: 14700 m/s 2 with 60 0 shock condition f 0.5 m/s pulse width, 3x each direction vibration variable 2007 method a-10 100-2000-100 hz frequency range in 60 0 frequency condition d 4 min., 196 m/s 2 peak-to-peak acceleration, 48 min. total free drop test n/a method a-8 drop from 75 cm 3x 60 0 termination 2004 method a-11 1 kg. load for 30 sec. 5 n. load on lead 60 0 strength tests i and iii with 90 bend constant 2001 method a-9 1 min. each 6 directions, 196,000 m/s 2 60 0 acceleration condition d table 4. mechanical tests
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. 5965-9641e (11/99)
|
