d a t a sh eet preliminary speci?cation file under discrete semiconductors, sc01 1996 jun 05 discrete semiconductors byg70 series fast soft-recovery controlled avalanche rectifiers handbook, halfpage m3d168
1996 jun 05 2 philips semiconductors preliminary speci?cation fast soft-recovery controlled avalanche recti?ers byg70 series features glass passivated high maximum operating temperature low leakage current excellent stability guaranteed avalanche energy absorption capability ul 94v-o classified plastic package shipped in 12 mm embossed tape. description do-214ac surface mountable package with glass passivated chip. the well-defined void-free case is of a transfer-moulded thermo-setting plastic. fig.1 simplified outline (do-214ac; sod106) and symbol. handbook, 4 columns msa474 cathode
band top view side view k a limiting values in accordance with the absolute maximum rating system (iec 134). symbol parameter conditions min. max. unit v rrm repetitive peak reverse voltage byg70d - 200 v byg70g - 400 v byg70j - 600 v v r continuous reverse voltage byg70d - 200 v byg70g - 400 v byg70j - 600 v i f(av) average forward current averaged over any 20 ms period; t tp = 100 c; see fig.2 - 1.00 a averaged over any 20 ms period; al 2 o 3 pcb mounting (see fig.7); t amb = 60 c; see fig.3 - 0.53 a averaged over any 20 ms period; epoxy pcb mounting (see fig.7); t amb = 60 c; see fig.3 - 0.39 a i fsm non-repetitive peak forward current t = 10 ms half sine wave; t j = t j max prior to surge; v r = v rrmmax - 20 a e rsm non-repetitive peak reverse avalanche energy l = 120 mh; t j = t j max prior to surge; inductive load switched off - 10 mj t stg storage temperature - 65 +175 c t j junction temperature see fig.4 - 65 +175 c
1996 jun 05 3 philips semiconductors preliminary speci?cation fast soft-recovery controlled avalanche recti?ers byg70 series electrical characteristics t j = 25 c unless otherwise speci?ed. thermal characteristics notes 1. device mounted on al 2 o 3 printed-circuit board, 0.7 mm thick; thickness of copper 3 35 m m, see fig.7. 2. device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 3 40 m m, see fig.7. for more information please refer to the general part of handbook sc01 . symbol parameter conditions min. typ. max. unit v f forward voltage i f = 1 a; t j = t j max; see fig.5 - - 2.1 v i f = 1 a; see fig.5 - - 3.6 v v (br)r reverse avalanche breakdown voltage i r = 0.1 ma byg70d 300 - - v byg70g 500 - - v byg70j 700 - - v i r reverse current v r = v rrmmax ; see fig.6 - - 5 m a v r = v rrmmax ; t j = 165 c; see fig.6 - - 100 m a t rr reverse recovery time when switched from i f = 0.5 a to i r = 1 a; measured at i r = 0.25 a; see fig.8 - - 30 ns c d diode capacitance v r = 0 v; f = 1 mhz - 30 - pf symbol parameter conditions value unit r th j-tp thermal resistance from junction to tie-point 25 k/w r th j-a thermal resistance from junction to ambient note 1 100 k/w note 2 150 k/w
1996 jun 05 4 philips semiconductors preliminary speci?cation fast soft-recovery controlled avalanche recti?ers byg70 series graphical data fig.2 maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). v r = v rrmmax ; d = 0.5; a = 1.57. handbook, halfpage 0 200 2.0 i f(av)
(a) 1.5 0.5 0 1.0 mgd485 100 t tp ( c) fig.3 maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). v r = v rrmmax ; d = 0.5; a = 1.57. device mounted as shown in fig.7; solid line: al 2 o 3 pcb; dotted line: epoxy pcb. handbook, halfpage 0 200 0.8 i f(av)
(a) 0.6 0.2 0 0.4 mgd486 100 t amb ( c) device mounted as shown in fig.7. solid line: al 2 o 3 pcb. dotted line: epoxy pcb. fig.4 maximum permissible junction temperature as a function of reverse voltage. handbook, halfpage 200 t j
( c) 0 400 0 mgd487 800 v r (v) 40 d g j 80 120 160 solid line: t j = 25 c. dotted line: t j = 175 c. fig.5 forward current as a function of forward voltage; maximum values. handbook, halfpage 0 2 4 6 v f (v) 8 5 i f
(a) 0 4 mgd488 3 2 1
1996 jun 05 5 philips semiconductors preliminary speci?cation fast soft-recovery controlled avalanche recti?ers byg70 series fig.6 reverse current as a function of junction temperature; maximum values. handbook, halfpage 200 0 10 3 mgc532 10 2 10 1 100 t j ( c) o i r ( m a) v r = v rmmmax . fig.7 printed-circuit board for surface mounting. dimensions in mm. material: al 2 o 3 or epoxy-glass. handbook, full pagewidth msb213 4.5 2.5 1.25 50 50 fig.8 test circuit and reverse recovery time waveform and definition. input impedance oscilloscope: 1 m w , 22 pf; t r 7 ns. source impedance: 50 w ; t r 15 ns. handbook, full pagewidth 10 w 1 w 50 w 25 v dut mam057 + t rr 0.5 0 0.5 1 i f (a) i r (a) t 0.25
1996 jun 05 6 philips semiconductors preliminary speci?cation fast soft-recovery controlled avalanche recti?ers byg70 series package outline definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. handbook, full pagewidth msa414 4.5
4.3 5.5
5.1 3.3
2.7 2.3
2.0 2.8
2.4 1.6
1.4 0.05 0.2 marking band indicates the cathode. dimensions in mm. fig.9 do-214ac; sod106.
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