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| 1 motorola sensor device data # #$ $ $"$ "##%" # " " # %$ "##%" !! $ # ! $ !"$%" ! #$ "$ the motorola MPXAZ4100A series manifold absolute pressure (map) sensor for engine control is designed to sense absolute air pressure within the intake manifold. this measurement can be used to compute the amount of fuel required for each cylinder. the small form factor and high reliability of onchip integration makes the motorola map sensor a logical and economical choice for automotive system designers. the MPXAZ4100A series piezoresistive transducer is a stateoftheart, monolithic, signal conditioned, silicon pressure sensor. this sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. features ? resistant to high humidity and common automotive media ? 1.8% maximum error over 0 to 85 c ? specifically designed for intake manifold absolute pressure sensing in engine control systems ? ideally suited for microprocessor or microcontroller based systems ? temperature compensated over 40 c to +125 c ? durable thermoplastic (pps) surface mount package application examples ? manifold sensing for automotive systems ? also ideal for nonautomotive applications figure 1. fully integrated pressure sensor schematic ) & &"& " !"' ) 9>= " ' " ! '!$%'(% #!$"&' #" " " &' " &' " %#(" %%" & ' %( '%, $ "& " % "# #""'& #% &! #(' " $ ) order this document by MPXAZ4100A/d semiconductor technical data ? motorola, inc. 2001 5 6 7 8 gnd v out 4 1 2 3 integrated pressure sensor 20 to 105 kpa (2.9 to 15.2 psi) 0.3 to 4.9 v output pin number n/c v s n/c n/c n/c n/c note: pins 1, 5, 6, 7, and 8 are not device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. MPXAZ4100Ac6u case 482a small outline package MPXAZ4100A6u case 482 rev 0 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (note) parametric symbol value unit maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 5.1 vdc, t a = 25 c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range (1) p op 20 e 105 kpa supply voltage (2) v s 4.85 5.1 5.35 vdc supply current i o e 7.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.1 volts v off 0.225 0.306 0.388 vdc full scale output (4) (0 to 85 c) @ v s = 5.1 volts v fso 4.870 4.951 5.032 vdc full scale span (5) (0 to 85 c) @ v s = 5.1 volts v fss e 4.59 e vdc accuracy (6) (0 to 85 c) e e e 1.8 %v fss sensitivity v/p e 54 e mv/kpa response time (7) t r e 1.0 e ms output source current at full scale output i o+ e 0.1 e madc warmup time (8) e e 20 e ms offset stability (9) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 8. warmup time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 9. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data figure 2. cross sectional diagram sop (not to scale) * % #" &' " && &' $ ' %!#$ &' & #" & )((! %%" $ (#%# & #" #' %! &# (' !"' figure 2 illustrates an absolute sensing chip in the basic chip carrier (case 482). #('$(')96=< $;1<<>;1 ;12 =9 <1.610 ?./>>7 48 5$. ',$ !+ ! " '!$ =9 5$. '# 5$. !$+- '%"&% ("' #" ) 9>= ) < $ ;;9; ) & )0/ figure 3. recommended power supply decoupling and output filtering. for additional output filtering, please refer to application note an1646. figure 4. output versus absolute pressure $& : #('$(' )< ) " )9>= figure 4 shows the sensor output signal relative to pres- sure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 3. the output will saturate outside of the specified pressure range. a gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the gel die coat and durable polymer package provide a media resis- tant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments contain- ing common automotive media. contact the factory for more information regarding media compatibility in your specific application. figure 3 shows the recommended decoupling circuit for in- terfacing the output of the integrated sensor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data transfer function (MPXAZ4100A) nominal transfer value: v out = v s (p x 0.01059 0.1518) +/ (pressure error x temp. factor x 0.01059 x v s ) v s = 5.1 v 0.25 vdc temperature error band MPXAZ4100A series =9 '17:1;.=>;1 48 '17:1;.=>;1 ;;9; ./=9; note: the temperature multiplier is a linear response from 0 c to 40 c and from 85 c to 125 c. pressure error band ;;9; 474=< 29; $;1<<>;1 a a $;1<<>;1 48 5$. $;1<<>;1;;9;5$. $;1<<>;1 ;;9; !.@ =9 5$. a 5$. ordering information e small outline package device type options case no. mpx series order no. packing options marking basic element absolute, element only 482 MPXAZ4100A6u rails MPXAZ4100A absolute, element only 482 MPXAZ4100A6t1 tape and reel MPXAZ4100A ported element absolute, axial port 482a MPXAZ4100Ac6u rails MPXAZ4100A absolute, axial port 482a MPXAZ4100Ac6t1 tape and reel MPXAZ4100A f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data information for using the small outline package (case 482) minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct fottprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. ',$+ ',$+ ',$+ figure 5. sop footprint (case 482) 48/3 77 & f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data small outline package dimensions case 48201 issue o & & "#'& !"& #" " " '# %" " $% "& , ! #"'%# " !"& #" " !"& #" " # "#' " ( !# $%#'%(& #" !+ !(! !# $%#'%(& #" )%' &(%& ',$ %' s d g 8 pl n & ! & ' a b c m j k pin 1 identifier h t case 482a01 issue a & & "#'& !"& #" " " '# %" " $% "& , ! #"'%# " !"& #" " !"& #" " # "#' " ( !# $%#'%(& #" !+ !(! !# $%#'%(& #" )%' &(%& ',$ %' s d g 8 pl & ! & ' a b c m j k pin 1 identifier h t n v w f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motor ola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other ap plications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized app lication, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or dea th associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa/europe/locations not listed : motorola literature distribution; japan : motorola japan ltd.; sps, technical information center, 3201, p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 technical information center: 18005216274 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2, dai king street, tai po industrial estate, tai po, n.t., hong kong. 85226668334 home page : http://www.motorola.com/semiconductors/ MPXAZ4100A/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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