405 a t a d l a c i n a h c e m s e r u t a e f s c i t s i r e t c a r a h c l a c i r t c e l e d n a s g n i t a r m u m i x a m (t a =25 o c unless otherwise noted) plastic package has underwriters laboratory flammability classification 94v-0 glass passivated chip junctions high surge overload rating: 35a peak saves space on printed circuit boards high temperature soldering guaranteed: 260 o c/10 seconds. case: molded plastic body over passivated junctions terminals: plated leads solderable per mil-std-750, method 2026 mounting position: any weight: 0.078 oz., 0.22 g s 0 1 b m u r h t s 2 b m s r e i f i t c e r e g d i r b t n u o m e c a f r u s e s a h p - e l g n i s d e t a v i s s a p s s a l g e r u t a i n i m e r e p m a 5 . 0 t n e r r u c d r a w r o f s t l o v 0 0 0 1 o t 0 0 2 e g a t l o v e s r e v e r r e t e m a r a ps l o b m y ss 2 b ms 4 b ms 6 b ms 8 b ms 0 1 b ms t i n u e g a t l o v e s r e v e r k a e p e v i t i t e p e r m u m i x a mv m r r 0 0 20 0 40 0 60 0 80 0 0 1s t l o v e g a t l o v s m r m u m i x a mv s m r 0 4 10 8 20 2 40 6 50 0 7s t l o v e g a t l o v g n i k c o l b c d m u m i x a mv c d 0 0 20 0 40 0 60 0 80 0 0 1s t l o v t n e r r u c d e i f i t c e r t u p t u o d r a w r o f e g a r e v a m u m i x a m . b . c . p y x o p e - s s a l g n o ) 1 . g i f e e s ( e t a r t s b u s m u n i m u l a n o i ) v a ( f 5 . 0 ) 1 ( 8 . 0 ) 2 ( p m a e v a w - e n i s f l a h e l g n i s s m 3 . 8 t n e r r u c e g r u s d r a w r o f k a e p ) d o h t e m c e d e j ( d a o l d e t a r n o d e s o p m i r e p u s i m s f 0 . 5 3s p m a ) s m 3 . 8 < t ( g n i s u f r o f g n i t a ri 2 t0 . 5a 2 c e s a 4 . 0 t a g e l r e p p o r d e g a t l o v d r a w r o f s u o e n a t n a t s n i m u m i x a mv f 0 . 1t l o v t t a t n e r r u c e s r e v e r c d m u m i x a m a 5 2 = o c t g e l r e p e g a t l o v g n i k c o l b c d d e t a r a 5 2 1 = o c i r 0 . 5 0 0 1 u a g e l r e p e c n a t s i s e r l a m r e h t l a c i p y t r a j r a j r l j 5 8 ) 1 ( 0 7 ) 2 ( 0 2 ) 1 ( o w / c z h m 0 . 1 , v 0 . 4 t a g e l r e p e c n a t i c a p a c n o i t c n u j l a c i p y tc j 3 1 p f e g n a r e r u t a r e p m e t e g a r o t s d n a n o i t c n u j g n i t a r e p ot j t , g t s 0 5 1 + o t 5 5 - o c notes: 1. on glass epoxy p.c.b. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. on aluminum substrate p.c.b. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad package outline dimensions in inches (millimeters)
406 s e v r u c c i t s i r e t c a r a h c d n a s g n i t a r (t a = 25 o c unless otherwise noted)
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