doc. no : qw0905-la16b/yg-s25-pf rev. : a date : 29 - mar. - 2007 led array data sheet la16b/yg-s25-pf ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
y g 1 2 4.75 0.5 6.5 2.4 0.5 5.08 4.6 7.4 3.5 2 1 2.54typ 0.5 typ 3.5 0.5 ligitek electronics co.,ltd. property of ligitek only package dimensions 1/6 page 2 1 g lyg2362-pf 3.0 1.5max 5.0 0.5 typ 2.54typ 1 2 1.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25.0min y la16b/yg-s25-pf part no.
color note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) white diffused gaasp/gap la16b/yg-s25-pf yellow material part no emitted power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current typ. 4.0 luminous intensity @10ma(mcd) 585352.6 1.71.8 spectral halfwidth nm peak wave length pnm lensmax. forward voltage @ ma(v) min. 20 min. 100 viewing angle 2 1/2 (deg) 60 -40 ~ +100 -40 ~ +85 ir 10 ratings y 80 20 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/6 g 100 30 120 gap green56530 1.7 2.6100 1.84.0 part no. la16b/yg-s25-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip 3/6 page part no. la16b/yg-s25-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -40 60 ambient temperature( ) 40 20 0 -20100 80 0.0 ambient temperature( ) 02040 -20 60100 80 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 1.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 10 1.0 1000 g chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 0.5 4.0 forward voltage(v) 2.03.05.0 0.0 1.5 1.0 2.0 100 forward current(ma) 101000 fig.2 relative intensity vs. forward current 2.5 3.0 ligitek electronics co.,ltd. property of ligitek only 3.5 page4/6 part no. la16b/yg-s25-pf
ligitek electronics co.,ltd. property of ligitek only 2 /sec max preheat 60 seconds max 25 0 0 50 120 temp( c) 260 5 /sec max 100 time(sec) 150 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile page 5/6 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. la16b/yg-s25-pf
ligitek electronics co.,ltd. property of ligitek only this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description 1.t.sol=230 5 2.dwell time=5 1sec solderability test high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature high humidity test low temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test test itemtest condition reliability test: mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-883:1008 jis c 7021: b-10 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard page 6/6 part no. la16b/yg-s25-pf
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