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1. product profile 1.1 general description the IP4309CX9 is a 8-channel low capacitanc e electrostatic discharge (esd) protection device, providing protection to downstream components from esd voltages up to ? 15 kv contact discharge and higher than ? 15 kv air discharge, far exceeding iec 61000-4-2, level 4. the device is optimized for the protection of high-speed interf aces such as high-definition multimedia interface (hdmi), digital video inte rface (dvi) and other interfaces requiring very low capacitance esd protection. in order to prevent any current backdrive into the adjacent channel, all eight esd protection ch annels are electrically separated and share only the same ground connections. the IP4309CX9 is fabricated using monolithic silicon techno logy in a single wafer level chip-size package (wlcsp). these features make IP4309CX9 ideal for use in applications requiring component miniatur ization, such as mobile phone handsets. 1.2 features and benefits ? pb-free, restriction of hazardous substanc es (rohs) compliant and free of halogen and antimony (dark green compliant) ? 8 ultra low input capacitance rail-to-rail esd protection diodes with c i/o =1.3pf ? r dyn =0.45 ? ? downstream esd protection up to ? 15 kv (contact), exceeding iec 61000-4-2, level 4 ? 3 ? 3 pin wlcsp with 0.4 mm pitch 1.3 applications ? high-speed interface esd protection such as hdmi, dvi and usb etc. ? interfaces with special requirements on low capacitive esd protection ? interfaces requiring separation of the positive clamping voltage / current path IP4309CX9 hdmi octal channel low capacitive high-performance esd protection rev. 1 ? 10 march 2011 product data sheet www..net
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 2 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 2. pinning information 2.1 pinning 2.2 pin description fig 1. pin configuration IP4309CX9 001aam186 transparent top view, solder balls facing down a 23 1 b c bump a1 index area table 1. pinning pin description a1 esd protection a2 esd protection a3 esd protection b1 esd protection b2 ground b3 esd protection c1 esd protection c2 esd protection c3 esd protection
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 3 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 3. ordering information 4. functional diagram table 2. ordering information type number package name description version IP4309CX9 wlcsp9 wafer level chip-size package; 9 bumps; 1.16 ? 1.16 ? 0.61 mm IP4309CX9 fig 2. schematic diagram IP4309CX9 a1 a2 a3 b3 b2 b1 c1 c2 c3 018aaa112
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 4 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 5. limiting values [1] all pins to ground. [2] IP4309CX9 is qualified to 1000 contact discharges of ? 15 kv using the iec 61000-4-2 model, far exceeding the specified iec 61000-4-2, le vel 4 (8 kv contact discharge). 6. characteristics [1] guaranteed by design. [2] pins a1, a2, a3, b1, b3, c1 and c2 to ground. [3] according to iec 61000-4-5 and iec 61000-4-9. table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage at i/o pins ? 0.5 +5.5 v v esd electrostatic discharge voltage [1] contact discharge [2] - ? 15 kv air discharge [2] - ? 15 kv iec 61000-4-2, level 4 contact discharge - ? 8kv air discharge - ? 15 kv t stg storage temperature ? 55 +150 ?c t reflow(peak) peak reflow temperature t p ? 10 s - 260 ?c t amb ambient temperature ? 30 +85 ?c table 4. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit c (i/o-gnd) input/output to ground capacitance v i =0.5v; f=1mhz [1] [2] 1.0 1.3 1.5 pf i lr reverse leakage current v i =3v [2] --50na v brzd zener diode breakdown voltage i test =1ma 6 - 11 v v f forward voltage - 0.7 - v r dyn dynamic resistance i = 1 a [3] positive transient - 0.45 - ? negative transient - 0.5 - ?
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 5 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 7. application information 7.1 insertion loss the IP4309CX9 is mainly designed as an esd protection device for high-speed interfaces such as hdmi, dvi and usb data lines etc. the insertion loss in a 50 ? network analyzer (nwa) of two channels of IP4309CX9 is depicted in figure 4 . the other channels behave similar as all channels contain an identical electrical circuitry. the insertion loss measurement configuration of a typical 50 ? nwa system for evaluation of the IP4309CX9 is shown in figure 3 . it was measured using a test printed-circuit board (pcb) utilizing laser-drille d micro-via holes that connect the pcb ground plane to the ground pins. fig 3. frequency response setup (1) pin a1 (2) pin a2 fig 4. typical IP4309CX9 frequency response curves 018aaa016 50 v gen 50 dut out in test board 018aaa113 ?15 ?5 5 s 21 (db) ?25 f (mhz) 10 ?1 10 4 10 3 11 0 2 10 (1) (2)
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 6 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 7.2 crosstalk the setup for crosstalk measurements in a 50 ? nwa system for several pin combinations reflecting the various possible physical distances is shown in figure 5 . the crosstalk measurement results are depicted in figure 6 . other combinations behave similar, depending on the distance between the pins. fig 5. crosstalk measurement configuration (1) pin a1 to a2 (2) pin a1 to b1 (3) pin a1 to c3 (4) pin a1 to a3 fig 6. typical IP4309CX9 crosstalk behavior 018aaa019 50 v gen 50 dut out2 in1 test board 50 out1 50 in2 018aaa114 ?80 ?40 0 s 21 (db) ?120 f (mhz) 110 4 10 3 10 10 2 (1) (4) (3) (2)
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 7 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 8. package outline fig 7. package outline wlcsp9 (IP4309CX9) wlcsp9_3x3_po european projection wlcsp9: wafer level chip-size package; 9 bumps (3 x 3) bump a1 index area d e detail x a a 2 a 1 e 1 e 1 e e b 1 c b a 23 x table 5. package outline dimensions symbol min typ max unit a 0.570.610.65mm a 1 0.18 0.20 0.22 mm a 2 0.59 0.61 0.63 mm b 0 . 2 10 . 2 60 . 3 1m m d 1.11 1.16 1.21 mm e 1.11 1.16 1.21 mm e - 0.40 - mm e 1 -0 . 8-m m
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 8 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 9. packing information fig 8. tape and reel information 001aai051 b - b k a - a b 0 t 1 g t k 0 a 0 p 2 p 0 d 0 w 1 p w f e d 1 a b b a 0.05 / 40 direction of feed position of pin a1 table 6. tape dimensions description item symbol specification (mm) dimension tolerance overall dimensions tape width w 8.00 ? 0.1 thickness k 1.20 max distance g 0.75 min sprocket holes [1] diameter d 0 1.50 +0.1 distance e 1.75 ? 0.1 pitch p 0 4.00 ? 0.1 distance between center lines length direction p 2 2.00 ? 0.05 width direction f 3.50 ? 0.05 compartments length a 0 1.32 ? 0.05 width b 0 1.28 ? 0.05 depth k 0 0.80 ? 0.05 hole diameter d 1 0.50 +0.1 pitch p 4.00 ? 0.1
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 9 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection [1] cumulated pitch error: ? 0.2 mm per 10 pitches. [2] carbon-loaded polystyrene 100 % recyclable. [3] the cover tape shall not overlap the sprocket holes. 10. design and asse mbly recommendations 10.1 pcb design guidelines it is recommended, for optimum performance, to use a non-solder mask defined (nsmd), also known as a copper-d efined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. refer to table 7 for the recommended pcb design parameters. 10.2 pcb assembly guidelines for pb-free soldering device rotation ? 20 ? max carrier tape antistatic [2] film thickness t 0.25 ? 0.07 cover tape [3] width w 1 5.75 max film thickness t 1 0.1 max bending radius in winding direction r 30 min table 6. tape dimensions ?continued description item symbol specification (mm) dimension tolerance table 7. recommended pcb design parameters parameter value or specification pcb pad diameter 250 ? m micro-via diameter 100 ? m (0.004 inch) solder mask aperture diameter 325 ? m copper thickness 20 ? m to 40 ? m copper finish auni pcb material fr4 table 8. assembly recommendations parameter value or specification solder screen aperture diameter 325 ? m solder screen thickness 100 ? m (0.004 inch) solder paste: pb-free snag (3 % to 4 %); cu (0.5 % to 0.9 %) solder to flux ratio 50 : 50 solder reflow profile see figure 9
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 10 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection the device is capable of withstanding at least three reflows of this profile. fig 9. pb-free solder reflow profile table 9. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 ?c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t ? 250 ? c--30s t 3 time 3 time during t ? 230 ? c10- 50s t 4 time 4 time during t > 217 ? c 30 - 150 s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 ?c/s preheat 2.5 - 4.0 ?c/s 001aai943 t reflow(peak) 250 230 217 t (c) cooling rate preheat t 1 t 5 t 4 t 3 t 2 t (s)
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 11 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 11. revision history table 10. revision history document id release date data sheet status change notice supersedes IP4309CX9 v.1 20110310 product data sheet - -
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 12 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
IP4309CX9 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 13 of 14 nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors IP4309CX9 hdmi octal channel low capacitive high-performance esd protection ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 10 march 2011 document identifier: IP4309CX9 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 5 7.1 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 packing information . . . . . . . . . . . . . . . . . . . . . 8 10 design and assembly recommendations . . . . 9 10.1 pcb design guidelines . . . . . . . . . . . . . . . . . . . 9 10.2 pcb assembly guidelines for pb-free soldering 9 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 12 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 contact information. . . . . . . . . . . . . . . . . . . . . 13 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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