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1. general description the pca9515 is a bicmos integrated circuit intended for application in i 2 c-bus and smbus systems. while retaining all the operating modes and features of the i 2 c-bus system, it permits extension of the i 2 c-bus by buffering both the data (sdan) and the clock (scln) lines, thus enabling two buses of 400 pf. the i 2 c-bus capacitance limit of 400 pf restricts the number of devices and bus length. using the pca9515 enables the system designer to isolate two halves of a bus, thus more devices or longer length can be accommodated. it can also be used to run two buses, one at 5 v and the other at 3.3 v or a 400 khz and 100 khz bus, where the 100 khz bus is isolated when 400 khz operation of the other is required. two or more pca9515 s cannot be put in series. the pca9515 design does not allow this con?guration. since there is no direction pin, slightly different legal low voltage levels are used to avoid lock-up conditions between the input and the output. a regular low applied at the input of a pca9515 will be propagated as a buffered low with a slightly higher value. when this buffered low is applied to another pca9515, pca9516a, or pca9518a in series, the second pca9515, pca9516a, or pca9518a will not recognize it as a regular low and will not propagate it as a buffered low again. the pca9510a/9511a/9513a/9514a and pca9512a cannot be used in series with the pca9515, pca9516a, or pca9518a but can be used in series with themselves since they use shifting instead of static offsets to avoid lock-up conditions. the pca9515 scln/sdan c i is about 200 pf versus the normal < 10 pf when v cc =0v. the newer pca9515a should be used in applications where power is secured to the repeater but an active bus remains on either set of scln/sdan pins to prevent this increase in bus loading. additionally, the pca9515a has a wider voltage range of 2.3 v to 3.6 v and can be used in applications with lower voltage supply constraints. 2. features n 2 channel, bidirectional buffer n i 2 c-bus and smbus compatible n active high repeater enable input n open-drain input/outputs n lock-up free operation n supports arbitration and clock stretching across the repeater n accommodates standard-mode and fast-mode i 2 c-bus devices and multiple masters n powered-off high-impedance i 2 c-bus pins n operating supply voltage range of 3.0 v to 3.6 v pca9515 i 2 c-bus repeater rev. 09 23 april 2009 product data sheet
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 2 of 16 nxp semiconductors pca9515 i 2 c-bus repeater n 5.5 v tolerant i 2 c-bus (scln, sdan) and enable (en) pins n 0 hz to 400 khz clock frequency 1 n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115, and 1000 v cdm per jesd22-c101 n latch-up testing is done to jedec standard jesd78 which exceeds 100 ma n packages offered: so8 and tssop8 (msop8) 3. ordering information [1] also known as msop8. 3.1 ordering options 4. block diagram the output pull-down of each internal buffer is set for approximately 0.5 v, while the input threshold of each internal buffer is set about 0.07 v lower, when the output is internally driven low. this prevents a lock-up condition from occurring. 1. the maximum system operating frequency may be less than 400 khz because of the delays added by the repeater. table 1. ordering information type number package name description version pca9515d so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 pca9515dp tssop8 [1] plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 table 2. ordering options type number topside mark temperature range pca9515d pca9515 t amb = - 40 c to +85 c pca9515dp 9515 t amb = - 40 c to +85 c fig 1. block diagram of pca9515 002aae620 pca9515 sda0 scl0 en sda1 scl1 v cc gnd pull-up resistor
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 3 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 5. pinning information 5.1 pinning 5.2 pin description fig 2. pin con?guration for so8 fig 3. pin con?guration for tssop8 pca9515d n.c. v cc scl0 scl1 sda0 sda1 gnd en 002aac743 1 2 3 4 6 5 8 7 pca9515dp n.c. v cc scl0 scl1 sda0 sda1 gnd en 002aac744 1 2 3 4 6 5 8 7 table 3. pin description symbol pin description n.c. 1 not connected scl0 2 serial clock bus 0 sda0 3 serial data bus 0 gnd 4 supply ground en 5 active high repeater enable input sda1 6 serial data bus 1 scl1 7 serial clock bus 1 v cc 8 supply power
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 4 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 6. functional description the pca9515 bicmos integrated circuit contains two identical buffer circuits which enable i 2 c-bus and similar bus systems to be extended without degradation of system performance. (refer to figure 1 bloc k diag r am of pca9515 .) the pca9515 bicmos integrated circuit contains two bidirectional open-drain buffers speci?cally designed to support the standard low-level-contention arbitration of the i 2 c-bus. except during arbitration or clock stretching, the pca9515 acts like a pair of non-inverting, open-drain buffers, one for sda and one for scl. 6.1 enable the en pin is active high with an internal pull-up and allows the user to select when the repeater is active. this can be used to isolate a badly behaved slave on power-up until after the system power-up reset. it should never change state during an i 2 c-bus operation because disabling during a bus operation will hang the bus and enabling part way through a bus cycle could confuse the i 2 c-bus parts being enabled. the enable pin (en) should only change state when the global bus and the repeater port are in an idle state to prevent system failures. 6.2 i 2 c-bus systems as with the standard i 2 c-bus system, pull-up resistors are required to provide the logic high levels on the buffered bus. (standard open-collector con?guration of the i 2 c-bus.) the size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. this part is designed to work with standard-mode and fast-mode i 2 c-bus devices in addition to smbus devices. standard-mode i 2 c-bus devices only specify 3 ma output drive; this limits the termination current to 3 ma in a generic i 2 c-bus system where standard-mode devices and multiple masters are possible. under certain conditions, higher termination currents can be used. please see application note an255, i 2 c/smbus repeaters, hubs and expanders for additional information on sizing resistors and precautions when using more than one pca9515 in a system or using the pca9515 in conjunction with the p82b96.
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 5 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 7. application design-in information a typical application is shown in figure 4 . in this example, the system master is running on a 3.3 v i 2 c-bus while the slave is connected to a 5 v bus. both buses run at 100 khz unless the slave bus is isolated and then the master bus can run at 400 khz. master devices can be placed on either bus. the pca9515 is 5 v tolerant so it does not require any additional circuitry to translate between the different bus voltages. when one side of the pca9515 is pulled low by a device on the i 2 c-bus, a cmos hysteresis type input detects the falling edge and causes an internal driver on the other side to turn on, thus causing the other side to also go low. the side driven low by the pca9515 will typically be at v ol = 0.5 v. in order to illustrate what would be seen in a typical application, refer to figure 5 and figure 6 . if the bus master in figure 4 were to write to the slave through the pca9515, we would see the waveform shown in figure 5 on bus 0. this looks like a normal i 2 c-bus transmission until the falling edge of the 8 th clock pulse. at that point, the master releases the data line (sda) while the slave pulls it low through the pca9515. because the v ol of the pca9515 is typically around 0.5 v, a step in the sda will be seen. after the master has transmitted the 9 th clock pulse, the slave releases the data line. on the bus 1 side of the pca9515, the clock and data lines would have a positive offset from ground equal to the v ol of the pca9515. after the 8 th clock pulse, the data line will be pulled to the v ol of the slave device that is very close to ground in our example. it is important to note that any arbitration or clock stretching events on bus 1 require that the v ol of the devices on bus 1 be 70 mv below the v ol of the pca9515 (see v ol - v ilc in section 9 static char acter istics ) to be recognized by the pca9515 and then transmitted to bus 0. fig 4. typical application 002aae621 v cc pca9515 sda0 sda1 scl0 scl1 en sda scl bus master 400 khz slave 100 khz sda scl bus 0 bus 1 5 v 3.3 v
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 6 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 8. limiting values fig 5. bus 0 waveform 9 th clock pulse v ol of master v ol of pca9515 002aae622 scl sda fig 6. bus 1 waveform 9 th clock pulse v ol of slave v ol of pca9515 002aae623 scl sda table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages with respect to gnd. symbol parameter conditions min max unit v cc supply voltage - 0.5 +7 v v bus voltage range i 2 c-bus scl or sda - 0.5 +7 v i dc current any pin - 50 ma p tot total power dissipation - 100 mw t stg storage temperature - 55 +125 c t amb ambient temperature operating - 40 +85 c
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 7 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 9. static characteristics [1] v il speci?cation is for the ?rst low level seen by the sdan/scln lines. v ilc is for the second and subsequent low levels seen by the sdan/scln lines. [2] the scln/sdan c i is about 200 pf when v cc = 0 v. the pca9515a should be used in applications where power is secured to the repeater but an active bus remains on either set of scln/sdan pins. table 5. static characteristics v cc =3.0v to 3.6v; gnd=0v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit supplies v cc supply voltage 3.0 3.3 3.6 v i cch high-level supply current both channels high; v cc = 3.6 v; sdan = scln = v cc - 2.3 5 ma i ccl low-level supply current both channels low; v cc = 3.6 v; one sda and one scl = gnd, other sda and scl open - 2.3 5 ma i cclc contention low-level supply current v cc = 3.6 v; sdan = scln = gnd - 2.1 5 ma input scln; input/output sdan v ih high-level input voltage 0.7v cc - 5.5 v v il low-level input voltage [1] - 0.5 - +0.3v cc v v ilc contention low-level input voltage [1] - 0.5 - +0.4 v v ik input clamping voltage i i = - 18 ma - - - 1.2 v i li input leakage current v i = 3.6 v - 1- +1 m a i il low-level input current sda, scl; v i = 0.2 v - - 10 m a v ol low-level output voltage i ol = 0 ma or 6 ma 0.47 0.52 0.6 v v ol - v ilc difference between low-level output and low-level input voltage contention guaranteed by design - - 70 mv i loh high-level output leakage current v o = 3.6 v - - 10 m a c i input capacitance v i = 3 v or 0 v - 6 7 [2] pf enable input en v il low-level input voltage - 0.5 - +0.8 v v ih high-level input voltage 2.0 - 5.5 v i il low-level input current en; v i = 0.2 v - 10 30 m a i li input leakage current - 1- +1 m a c i input capacitance v i = 3.0 v or 0 v - 6 7 pf
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 8 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 10. dynamic characteristics [1] the t tlh transition time is speci?ed with loads of 1.35 k w pull-up resistance and 7 pf load capacitance, plus an additional 50 pf load capacitance. different load resistance and capacitance will alter the rc time constant, thereby changing the propagation delay and transition times. 11. test information table 6. dynamic characteristics v cc =3.0v to 3.6v; gnd=0v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit t phl high to low propagation delay figure 7 57 98 170 ns t plh low to high propagation delay figure 7 33 55 78 ns t thl high to low output transition time figure 7 -67-ns t tlh low to high output transition time figure 7 [1] - 135 - ns t su set-up time en to start condition 100 - - ns t h hold time en after stop condition 100 - - ns fig 7. propagation delay and transition times 002aad478 3.3 v 3.3 v t plh t thl 1.5 v 1.5 v input output 20 % 1.5 v 1.5 v 80 % 20 % 80 % t phl t tlh v ol 0.1 v r l = load resistor; 1.35 k w . c l = load capacitance includes jig and probe capacitance; 7 pf. r t = termination resistance should be equal to z o of pulse generators. fig 8. test circuit for open-drain outputs pulse generator v o c l r l 002aad479 r t v i v cc v cc dut
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 9 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 12. package outline fig 9. package outline sot96-1 (so8) unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 99-12-27 03-02-18
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 10 of 16 nxp semiconductors pca9515 i 2 c-bus repeater fig 10. package outline sot505-1 (tssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (2) z (1) q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.70 0.35 6 0 0.1 0.1 0.1 0.94 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.4 sot505-1 99-04-09 03-02-18 w m b p d z e 0.25 14 8 5 q a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 2.5 5 mm 0 scale tssop8: plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 1.1 pin 1 index
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 11 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 13. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 13.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 13.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 12 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 13.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 11 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 7 and 8 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 11 . table 7. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 8. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 13 of 16 nxp semiconductors pca9515 i 2 c-bus repeater for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 14. abbreviations msl: moisture sensitivity level fig 11. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 9. abbreviations acronym description bicmos bipolar complementary metal-oxide semiconductor cdm charged-device model dut device under test esd electrostatic discharge hbm human body model i 2 c-bus inter-integrated circuit bus mm machine model rc resistor-capacitor network smbus system management bus
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 14 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 15. revision history table 10. revision history document id release date data sheet status change notice supersedes pca9515_9 20090423 product data sheet - pca9519_8 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? section 1 gener al descr iption : C 4 th paragraph: referenced part type numbers changed from pca951x to pca951xa (excludes pca9515) C added new 5 th paragraph ? t ab le 5 static char acter istics , sub-section input scln; input/output sdan: C symbol for parameter input leakage current changed from i i to i li C symbol/parameter changed from i oh , output high level leakage current to i loh , high-level output leakage current ? added soldering information ? added section 14 ab bre viations pca9515_8 (9397 750 14097) 20040929 product data sheet - pca9515_7 pca9515_7 (9397 750 12875) 20040624 product data sheet - pca9515_6 pca9515_6 (9397 750 12294) 20031110 product data 853-2223 30410 dated 2003 oct 03 pca9515_5 pca9515_5 (9397 750 09814) 20020513 product data 853-2223 28185 dated 2002 may 13 pca9515_4 pca9515_4 (9397 750 09512) 20020301 product data 853-2223 27802 pca9515_3 pca9515_3 (9397 750 08127) 20010307 product speci?cation 853-2223 25782 pca9515_2 pca9515_2 (9397 750 07852) 20001201 product speci?cation 853-2223 25138 pca9515_1 pca9515_1 (9397 750 07757) 20001113 product speci?cation 853-2223 25005 -
pca9515_9 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 09 23 april 2009 15 of 16 nxp semiconductors pca9515 i 2 c-bus repeater 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 16.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. i 2 c-bus logo is a trademark of nxp b.v. 17. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors pca9515 i 2 c-bus repeater ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 23 april 2009 document identifier: pca9515_9 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 3.1 ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 6.1 enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 i 2 c-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application design-in information . . . . . . . . . . 5 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 7 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 soldering of smd packages . . . . . . . . . . . . . . 11 13.1 introduction to soldering . . . . . . . . . . . . . . . . . 11 13.2 wave and re?ow soldering . . . . . . . . . . . . . . . 11 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 16.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 contact information. . . . . . . . . . . . . . . . . . . . . 15 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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