description the pc8215tu is a silicon germanium (sige) monolithic int egrated circuit designed as low noise amplifier for gps and mobile communications. the package is 8-pin lead-less minimold suitable for surface mount. this ic is manufactured using our 50 ghz f max uhs2 (u ltra h igh s peed process) sige bipolar process. features ? low noise : nf = 1.3 db typ. @ v cc = 3.0 v high gain : g p = 27.0 db typ. @ v cc = 3.0 v low distortion : oip 3 = +12.5 dbm typ. @ v cc = 3.0 v high-density surface mounting : 8-pin lead-less minimold package (2.0 2.2 0.5 mm) high performance with minimum external components output matched to 50 ? application low noise amplifier for gps and mobile communications ordering information part number order number package marking supplying form pc8215tu-e2 pc8215tu-e2-a 8-pin lead-less minimold (pb-free) note 8215 ? 8 mm wide embossed taping ? pin 5, 6, 7, 8 indicates pull-out direction of tape ? qty 5 kpcs/reel note with regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. remark to order evaluation samples, contact your nearby sales office. part number for sample order: pc8215tu data sheet caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. bipolar analog integrated circuit pc8215tu sige low noise amplifier for gps/mobile communications document no. pu10546ej01v0ds (1st edition) date published june 2005 cp(k) printed in japan ? nec compound semiconductor devices, ltd. 2004, 2005
pin connections and internal block diagram 5 6 7 8 4 3 2 1 gnd input gnd gnd gnd output gnd v cc absolute maximum ratings parameter symbol test conditions ratings unit supply voltage v cc t a = +25 c 4.0 v power dissipation of package p d t a = +85c note 1.06 w operating ambient temperature t a ? 40 to +85 c storage temperature t stg ? 55 to +150 c input power p in +10 dbm note mounted on double-side copper-clad 50 50 1.6 mm epoxy glass pwb recommended operating range parameter symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v operating ambient temperature t a ? 25 +25 +85 c operating frequency range f in ? 1 575 ? mhz electrical ch aracteristics (t a = +25 c, v cc = 3.0 v, f in = 1 575 mhz, unless otherwise specified) parameter symbol test conditions min. typ. max. unit circuit current i cc no signal ? 10.0 13.0 ma power gain g p 24.0 27.0 30.0 db noise figure nf ? 1.3 1.5 db output 3rd order distortion intercept point oip 3 ? +12.5 ? dbm input return loss rl in 6.0 7.0 ? db output return loss rl out 10 14.0 ? db isolation isl 30 40.0 ? db gain 1 db compression output power p o (1 db) ? +5.0 ? dbm data sheet pu10546ej01v0ds 2 pc8215tu
test circuit 100 pf 0.1 f v cc 2.4 nh 12 nh 100 pf input 5 6 7 8 4 2 1 3 output 100 pf notes 1. high performance with minimum external components. 2. output matched to 50 ? . illustration of the test circui t assembled on evaluation board input output 2.4 nh 12 nh 100 pf 100 pf 100 pf 0.1 f notes 1. 30 30 0.51 mm double sided copper-clad hydrocarbon ceramic woven glass pwb (rogers : r04003, r = 3.38). 2. au plated on pattern 3. 12 nh/2.4 nh : murata lqp15m 4. 100 pf/0.1 f : murata grm15 5. represents cutout 6. : through holes 1 2 3 4 8 7 6 5 data sheet pu10546ej01v0ds 3 pc8215tu
typical characteristics (t a = +25 c, v cc = 3.0 v, unless otherwise specified) ? 10 0 ? 20 ? 40 ? 50 ? 60 ? 30 ? 70 0.1 1.0 10 45 50 40 30 25 20 15 35 10 0 0.1 1.0 10 1.575 ghz 5 1.575 ghz ? 5 0 ? 10 ? 15 ? 20 ? 25 ? 30 0.1 1.0 10 1.575 ghz ? 1 0 ? 2 ? 4 ? 5 ? 6 ? 7 ? 3 ? 8 ? 9 0.1 1.0 10 1.575 ghz input return loss rl in (db) frequency f (ghz) input return loss vs. frequency isolation isl (db) frequency f (ghz) isolation vs. frequency power gain g p (db) frequency f (ghz) power gain vs. frequency output return loss rl out (db) frequency f (ghz) output return loss vs. frequency output power p out (dbm) 3rd order intermodulation distortion im 3 (dbm) input power p in (dbm) output power, im 3 vs. input power + 10 +20 0 ?20 ?30 ?40 ?50 ?10 ?60 ?80 ?60 ?30 0 ?70 ?50 ?40 ?20 ?10 f in 1 = 1 575 mhz f in 2 = 1 576 mhz p out im 3 remark the graphs indicate nominal characteristics. data sheet pu10546ej01v0ds 4 pc8215tu
s-parameters (t a = +25 c, v cc = 3.0 v, monitored at connector on board) s 11 ? frequency 1 1 : 1 575 mhz 27.684 ? 29.132 ? 2.9438 nh start : 600.000 000 mhz stop : 2 000.000 000 mhz s 22 ? frequency 1 1 : 1 575 mhz 57.880 ? ? 12.447 ? 8.1185 pf start : 600.000 000 mhz stop : 2 000.000 000 mhz data sheet pu10546ej01v0ds 5 pc8215tu
package dimensions 8-pin lead-less minimold (unit: mm) 123 4 8 76 5 2.20.05 2.00.1 (top view) 0.50.03 4 3 2 1 56 7 8 0.40.1 0.40.1 (1.4) (0.75) (0.75) (0.25) (0.25) 0.160.05 (bottom view) 2.00.1 (0.35) (0.35) (0.35) (0.35) (0.5) (0.5) (0.6) (0.6) (0.65) (0.65) (0.6) (0.3) 0.125 +0.1 ?0.05 remark ( ) : reference value data sheet pu10546ej01v0ds 6 pc8215tu
notes on correct use (1) observe precautions for handling becaus e of electro-static sensitive devices. (2) form a ground pattern as widely as possible to mini mize ground impedance (to prevent undesired oscillation). all the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be attached to v cc line. recommended soldering conditions this product should be soldered and mounted under t he following recommended conditions. for soldering methods and conditions other than those recommend ed below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together ( except for partial heating). data sheet pu10546ej01v0ds 7 pc8215tu
when the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the au thority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license . m8e 00. 4 - 0110 the information in this document is current as of june, 2005. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product be fore using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ? data sheet pu10546ej01v0ds 8 pc8215tu
nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0504 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1573 fax: +81-44-435-1579 for further information, please contact pc8215tu
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