metal film thermosensitive chip resistors design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. e 1 r 2 a 3 s 4 1 5 5 6 j 7 1 8 0 9 3 10 v 11 metal film chip resistors product code size, power rating type: inches w: 0402 v: 0603 s: 0805 0.031 w 0.063 w 0.1 w power rating resistance tolerance code j tol. 5% resistance value temperature coefficient of resistance (tcr) code type 15 27 33 39 erav, eras eraw, erav, eras eraw, erav, eras erav, eras 1500 2700 3300 3900 ( 10 ? / c ) packaging methods code x v packaging type punched carrier taping 2m mp itch eraw erav eras punched carrier taping 4m mp itch the first two digits are significant figures of resistance and the third one denotes number of zeros following. decimal point is expressed by ? ? (ex.) 103 : 10 k 6r8 : 6.8 a b t w l (1) dimensions in mm (not to scale) type (inches) dimensions (mm) mass (weight) [g/1000 pcs.] lwa b t eraw (0402) 1.00 ?.07 0.50 ?.05 0.15 ?.10 0.25 ?.07 0.35 ?.05 0.6 erav (0603) 1.60 ?.20 0.80 ?.20 0.30 ?.20 0.30 ?.20 0.45 ?.10 2 eras (0805) 2.00 ?.20 1.25 ?.10 0.40 ?.25 0.40 ?.25 0.50 ?.10 4 metal film thermosensitive chip resistors 0402, 06 03, 0805 type: eraw, v, s features suitable for temperature correction circuits temperature coef? cient value 1500 10 ? / c(ppm/ c) to 3900 10 ? / c(ppm/ c) high performance quick response to tem per a ture change linearity excellent linear resistance val ue change in wide temperature range (?0 c to +125 c) high reliability, high density placing small size and lightweight for pcb size reduction and lightweight products suitable for both re? ow and ? ow soldering explanation of part numbers construction protective coating alumina substrate electrode (inner) electrode (between) thermosensitive element electrode (outer) 1) marking temperture coef cient value : 2 signi cant gure 100 10 ? / c (ppm/ c) eraw type is no marking. jan. 2008
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. metal film thermosensitive chip resistors 0 40 20 0 20 40 60 80 100 120 140 20 40 60 80 100 120 rated load (%) ambient temperature( c) 70 c 125 c 30 40 25 0 25 50 75 100 125 20 10 0 10 20 30 40 50 60 resistance change (%) ambient temperature ( c) 3900 10 ? / c (ppm/ c) 2700 10 ? / c (ppm/ c) 1500 10 ? / c (ppm/ c) type (inched) power rating at 70 c (w) standard speci? cation (1) t.c.r. tolerance re sis tance tolerance (%) standard resistance values t.c.r. [ 10 ? / c(ppm/ c)] (2) resistance rang e ( ) eraw (0402) 0.031 2700 3300 43 to 1 k 22 to 390 ?0 % 5 e12 erav (0603) 0.063 1500 10 to 10 k ?00[ 10 -6 / c(ppm/ c)] ? e12 2700 3300 3900 43 to 3.3 k 22 to 1.2 k 7. 5 to 3 9 0 ?0 % eras (0805) 0.1 1500 10 to 10 k ?00[ 10 -6 / c(ppm/ c)] ? e12 2700 3300 3900 43 to 5.1 k 22 to 1.8 k 6.2 to 470 ?0 % r 75 -r 25 r 25 1 75 25 (2) t. c.r.= { 10 6 } 10 ? / c (ppm/ c) r 25 : re sis tance valu e at refe rence temper ature 25 c r 75 : re sis tance valu e at temperature 75 c power derati ng curve for resistor s operated in ambient tem per a tures above 70 c, power rating shall be derated in accordance with the ? gure on the right. typical linearity of resistance change category temperature range (operating tem per a ture range) ?0 c to +125 c ratings (1) please as k us when resistors other than standard spec i ? ca tion shown in the abov e table are needed. feb. 2006
metal film thermosensitive chip resistors design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. t a p 0 p 2 p 1 p 1 d 0 b f w e (2 mm pitch) c a b w t c a b chip resistor punched carrier attention this product has high temperature coef cient. wh en mea sur ing resistance, the resistance value can change due to joule heating. therefore, the mea sur ing current shall be very small in order to prevent the resistance value from changing. (for example, when the resistor is used at rcwv, temperature of the re sis tor rise ab out 15 c and the resistance value rise a few percents.) resistance value ma y also change due to the ambient tem per a ture. resistance value is me asured at 25 c. recommended land pattern in case of ow soldering, the land width must be smaller than the chip resistor width to control the sol der amount properly. generally, the la nd width should be 0.7 to 0.8 times of the width of chip re sis tor. in case of re ow soldering, solder amount can be ad just ed, therefore the land width should be set to 1.0 to 1.3 times of chip resistor width (w). example packaging methods (taping) standard quantity taping reel carrier tape (unit : mm) (unit : mm) type (inches) dimensions (mm) abc eraw (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erav (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 eras (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 type kind of taping pitch (p 1 )quantity eraw punched carr ier taping 2 mm 1 0000 pcs./reel erav 4 mm 5 000 pcs./reel eras type a b w f e p 1 p 2 p 0 d 0 t eraw 0.70 ?.05 1.20 ?.05 8.00 ?.20 3.50 ?.05 1.75 ?.10 2.00 ?.10 2.00 ?.05 4.00 ?.10 1.50 +0.10 0.52 ?.05 erav 1.10 ?.10 1.90 ?.10 4.00 ?.10 0.70 ?.05 eras 1.65 ?.15 2.50 ?.20 0.52 ?.05 ? type a b c wt eraw 18 0.0 +0 60 min. 13.0 ?.0 9.0 ?.0 11.4 ?.0 erav eras ?.0 feb. 2006
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. metal film thermosensitive chip resistors preheating peak heating temperature time temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 ? max. 10 s for soldering f or lead-fre e soldering temp erature tim etemperaturetime preheating 140 c to 180 c 60 s to 120 s 150 c to 180 c 60 s to 120 s soldering 245 ?5 c 20 s to 30 s max. 260 c max. 10 s recommended soldering conditions recommendations and precau tions are described below. recommended so ldering conditions for re ow for solderin g (example : sn/pb) for lead-fre e soldering (example : sn/ag/cu) recommended solderin g conditions for ow safety precautions the following ar e precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er3 of this catalog. 1. keep th e rated power and ambient temperature within the speci ed derating curve. * when positioning and mounting metal film thermosensitive chip re sistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neigh bor ing components and for the temperature rise of adjacent heat-generating components. 2. if a transien t load (heavy load in a short time) like a pulse is expe cted to be applied, check and evaluate the operations of the resistors when installed in your products before use. when app lying pulses to the resistors, keep the pulse peak within the rated voltage. 3. do not us e halogen-based or other high-activity ux. otherwise, the residue may impair the resistors' per for mance and/or re liability. 4. when soldering with a soldering iron, never touch the resist ors' bodies with the tip of th e soldering iron. when using a soldering iron with a high temperature tip, nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amount of solder. 6. when the resistor s' protective coat ings are chipped, awed, or removed, th e characteristics of the resistors may be impaired. take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. d o not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. avoid excessive bend ing of printed circuit boards in order to protect the resistors from abnormal stress. 9. do no t immerse the resistors in solvent for a long time. befo re using solvent, carefull y check the effects of im mer sion. ?re ow soldering shall be performed a maximum of two times. ?please contact us for additional information when used in conditions other than those speci ed. ?please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. feb. 2006
? er3 ? safety precautions (common precautions for fixed resistors) when using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this cata log explains the quality and performance of the products as individual components. be fore use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signi? cant damage, such as damage to vehicles (au to mo bile, train, vessel), traf? c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ? systems equipped with a protection circuit and a protection device ? systems equip ped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precautions for use these products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. av equipm ent, home el ectric ap pli anc es, of? ce equipment, information and com mu ni ca tion equipment) these products are not intended fo r use in the following special conditions. be fore using the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid an y environment where strong electromagnetic waves exist. 6. in an environment where these pr oducts cause dew condensation 7. s e a li n g o r c o ating of these products or a printed circuit board on which thes e products are mounted, with resin or othe r materials these products generate joule heat when energized. carefu lly position th ese products so that their he at will not affect th e other components. carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. do not mount or place heat-generating com po nents or in? ammables, such as vinyl-coated wires, near these products . note that non- cleaning solder, halogen-based highly active ? ux, or wate r-soluble ? ux may dete riorate the performance or reliab ility of the products. carefully select a ? ux cleaning agent fo r use after soldering. an unsuit able agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performanc e of these products, including the solderability, is guar anteed for a year from the date of arrival at your company, provided that they remain packed as they were wh en delivered and stored at a temperature of 5 c to 35 c and a relative humidity of 45 % to 85 %. even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or dete riorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package ma rkings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. oct. 2007
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