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zaxm- 201-1 apex series transceiver modules description apex modules provide a cost-effective rf transceiver solution for 2.4ghz zigbee and ieee 802.15.4 data links and wireless networks. the zaxm-201-1 apex module is based on the ember? em250 plat - form. it combines embers transceiver ic and 16-bit microprocessor with an onboard 100mw power amplifer. its designed to support point to point, point to multi-point, and emberznet applications. the apex module provides over 4000 feet of range and is designed to deliver constant rf output power across the 2.1 to 3.6v voltage input, ensuring consistent performance over the entire life of the battery. integrated transceiver modules for zigbe e / ieee 802.15. 4 evaluation kit available: zaxm-201-kit-1 the information in this document is subject to change without notice, please confrm data is current. document no: 0002-00-07-00-000 (issue c) date published: april 29, 2010 data sheet ? ember? em250 platform ? 128kb flash memory ? 5kb sram ? 16-bit xap2b microprocessor ? 16 general purpose i/o ports ? dma C spi, i 2 c and uart interfaces ? integrated adc with 12-bit resolution apex module zaxm-201-1 applications ? 1 - 100mw output power, software controlled ? designed for emberznet networks ? miniature footprint: 1.00 x 1.275 ? integrated pcb trace antenna ? optional mmcx connector for external antenna ? 16 rf channels (channel 16 operates at reduced power levels) ? over 4000 feet of range ? i ntegrated hardware support for ember insight development environment ? non-intrusive debug interface (sif) ? aes 128 bit encryption ? low power consumption ? constant rf output power over 2.1C 3.6 v voltage range ? fcc, ic, and ce certifed ? rohs compliant ordering information part number order number supplying form zaxm-200 series apex module zaxm-201-1 100 mw output power, pcb trace antenna zaxm-201-1c 100 mw output power, with mmcx connector for use with off board antenna zaxm-201-kit-1 engineering evaluation kit features home & building automation ? security ? hvac control ? lighting control ? thermostats industrial controls ? food processing controls ? traffc management ? sensor networks ? asset management ? barcode reader ? patient monitoring ? glucose monitor automated meter reading ? in meter applications ? thermostats ? in-home display units
zaxm-200 series apex module block diagram 24 mhz 32.768 khz xt al xt al radio micro processo r ember em250 zigbee tm soc rf front end (nec pa and nec switch ) ant castellation edge connecto r pwr reg apex evaluation kit cel provides apex evaluation kits to assist users in evaluating apex and apex lt modules. the key components of the apex evaluation kit are the interface board and the cels apex radio module. apex module combines an ember em250 transceiver ic with an nec high gain power amplifer and a high performance nec rfic switch. the interface board features a serial communication interface, a power management module, peripherals such as potentiometer and accelerometer, and gpio headers. the evaluation kit also contains four aa batteries and two usb cables. for more detail information regarding apex evaluation kit, refer to the apex module evaluation kit user guide document . ( http:// www.cel.com/pdf/misc/apexseries_ug.pdf ) kit contents: ? evaluation boards (2) ? zigbee modules (2) ? usb cables (2) ? aa batteries (4) ? technical information cd (1) order number description zaxm-201-kit-1 engineering evaluation kit
zaxm-200 series introduction and overview description .............................................................................................................................................................................................. 1 features .................................................................................................................................................................................................. 1 applications ............................................................................................................................................................................................ 1 ordering information ............................................................................................................................................................................. 1 apex module block diagram ................................................................................................................................................................. 2 evaluation kit ......................................................................................................................................................................................... 2 system level function apex module microprocessor ................................................................................................................................................................ 4 antenna ................................................................................................................................................................................................... 4 modes of operation (tx, rx, sleep) ...................................................................................................................................................... 6 processor active .................................................................................................................................................................................. 6 processor idle ....................................................................................................................................................................................... 6 power amplifer regulator control line ................................................................................................................................................ 7 sif interface ............................................................................................................................................................................................ 7 host protocol interface commands ...................................................................................................................................................... 7 electrical specifcation absolute maximum ratings ................................................................................................................................................................... 8 recommended (operating condition) .................................................................................................................................................. 8 dc characteristics .................................................................................................................................................................................. 8 rf characteristics .................................................................................................................................................................................. 9 pin signal & interfaces pin signals i/o confguration ................................................................................................................................................................ 9 apex i/o pin assignment ....................................................................................................................................................................... 10 apex module dimensions ...................................................................................................................................................................... 11 pcb copper pattern layout ................................................................................................................................................................... 12 pcb stencil pattern ................................................................................................................................................................................ 12 pcb keep-out areas .............................................................................................................................................................................. 13 processing 14 agency certifcations 16 shipment, storage & handling 17 references & revision history 18 table of contents
zaxm-200 series apex module microprocessor apex modules provide 16 gpio ports that are shared with other peripheral or alternate functions. the alternate functions can be utilized on a variety of different gpios as detailed on the following page in the table of pin assignments. all the gpio pads are selectable as input, output, or bi-directional and have an internal pull-up or pull-down. the integrated serial controller sc1 can be confgured for spi (master-only), i 2 c (master-only), or uart functionality. the serial controller sc2 can be confgured for spi (master or slave) or i 2 c (master-only) operation. the integrated adc can sample analog signals from three gpio pins single-ended or differentially. the integrated voltage reference vref for the adc can be made available to a gpio port. please consult the ember em250 datasheet for details on confguring and controlling the information fow of the apex module interface ports to setup the following: ? gpio data registers ? alternate function routing ? external interrupts ? serial controller sc1 module (uart mode, spi master mode, i 2 c master mode) ? serial controller sc2 module (spi modes, i 2 c master mode) ? general purpose timers ? adc module ? event manager antenna the apex module includes an integrated pcb trace antenna. an optional mmcx connector can be specifed, enabling connection to a 50-ohm external antenna of the users choice. see ordering information. the pcb antenna employs an f-antenna topology that is compact and supports an omni-directional radiation pattern.to maximize antenna effciency, an adequate ground plane must be provided on the host pcb. if positioned correctly, the ground plane on the host board under the module can contribute signifcantly to antenna performance. the position of the module on the host board and overall design of the product enclosure contribute to antenna perfor- mance. poor design effects radiation patterns and can result in refection, diffraction, and/or scattering of the transmitted signal. measured radiation patterns of these modules are available from california eastern labs and can be used to benchmark design performance. here are some design guidelines to help ensure antenna performance: ? never place the ground plane or route copper traces directly underneath the antenna portion of the module. ? never place the antenna close to metallic objects. ? in the overall design, ensure that wiring and other components are not placed near the antenna. ? do not place the antenna in a metallic or metallized plastic enclosure. ? keep plastic enclosures 1 cm or more from the antenna in any direction. t op vie w t op vie w t op vie w
zaxm-200 series orientation of eut peak gain was in the horizontal position. the receiver antenna was in the horizontal position. -3 0 -2 5 -2 0 -1 5 -1 0 -5 0 5 30 21 0 60 24 0 90 27 0 12 0 30 0 15 0 33 0 18 0 0 ho ri zo nt al po la ri za ti on ga in (d bi ) mi n: -8 .9 ma x: +1 .8 av g: -2 .7 ve rt ic al po la ri za ti on ga in (d bi ) mi n: -2 6. 1 ma x: -7 .3 av g: -14. 7 fr equenc y = 2405 mh z ho ri zo nt al po la ri za ti on ga in (d bi ) m in: -15.2 max: +1.4 avg: -3.1 ve rt ic al po la ri za ti on ga in (d bi ) min: -22.1 max: -8.7 avg: -13. 9 fr equenc y = 2480 mh z fr equenc y = 2440 mh z ve rt ic al po la ri za ti on ga in (d bi ) mi n: -2 4. 7 ma x: -9 .6 av g: -14. 8 ho ri zo nt al po la ri za ti on ga in (d bi ) mi n: -8 .1 ma x: +0 .4 av g: -3 .4 -3 0 -2 5 -2 0 -1 5 -1 0 -5 0 5 30 21 0 60 24 0 90 27 0 12 0 30 0 15 0 33 0 18 0 0 -3 0 -2 5 -2 0 -1 5 -1 0 -5 0 5 30 21 0 60 24 0 90 27 0 12 0 30 0 15 0 33 0 18 0 0 antenna (continued)
zaxm-200 series modes of operation the apex supports three power modes: processor active, processor idle, and deep sleep. processor active in this mode all operations are running normally. processor idle in this mode the processor stops code execution of the xap2b microprocessor until any interrupt occurs or external sif wake up command is seen. the radio is operating normally in this mode. deep sleep to achieve the lowest power consumption, the module can be set in deep sleep mode. in this mode most of the function - alities of the modules are turned off with the exception of the critical functions such as gpio pads and ram that is powered by the high voltage supply (dcc_pads). the module can be taken out of deep sleep in 3 ways: ? confguring the sleep timer to generate an interrupt after some periods of time. ? issuing external interrupt signal. ? issuing commands through the sif interface. in deep sleep the current consumption of the module will drop to 5.0a (5.5a with optional 32.768khz oscillator enabled). for more detail information on modes of operation refer to ember em250 datasheet available at embers website ( www.ember.com )
zaxm-200 series power amplifier regulator control line the apex modules include a separate 1.8v regulator for a power amplifer bias that enables consistent module output per - formance over the wide 2.1 C 3. 6 v voltage range. to prevent excessive sleep currents, this regulator should be disabled when the module is in sleep mode. an external pull up resistor option is provided on each module (r6) that allows the regulator to be constantly enabled. this option increases the sleep current of the module to a point well above the speci - fed values. specifications gpio7 (apex) parameter min typ max unit regulator enable voltage 0.95 v regulator disable voltage 0.4 v enable line current (ven = 0) 0.1 a enable line current (ven = v dd ) 10 a turn on time 250 sec on the apex module, the regulator control line is connected to the module via the gpio7 port. the host can drive this port as it does on the apex lt module, but it can also use the default serial digital function of this port as an external voltage regulator enable. please consult the em250 datasheet for details on the operation of this function. note that both these approaches preclude the use of the gpio7 port for any other functions, including use as the adc3 input. if the application does not put the module to sleep or if sleep current is not an issue, the power amplifer regulator may be permanently enabled by tying the control line high. in this setup, the sleep current will increase by 8 0 a over the 5a standby current fgure provided in electrical specifcations. sif interface the apex module provide access to the sif module programming and debug interface. consult the em250 datasheet for further details on the following sif features: ? production testing ? firmware download ? product control and characterization ? xap2b code development (apex only) host protocol interface commands for information on host protocol interface commands and for other software-related documents refer to embers website: http://www.ember.com/products_documentation.html
zaxm-200 series absolute maximum ratings rating value unit power supply voltage 3.6 vdc voltage on any digital pin v dd + 0.3, max 3.6 vdc rf input power +10 dbm storage temperature range -45 to 125 c note: exceeding the maximum ratings may cause permanent damage to the module or devices. recommended (operating conditions) characteristic min typ max unit power supply voltage (v dd ) 2.1 3.6 v input frequency 2405 2480 mhz ambient temperature range -40 25 85 c logic input low voltage 0 20% v dd v logic input high voltage 80% v dd v dd v dc characteristics (@ 25c, v dd = 3.3v unless otherwise noted) parameter min typ max unit logic input low 0 0.2 x v dd v logic input high 0.8 x v dd v dd v logic output low 0 0.18 x v dd v logic output high 0.82 x v dd v dd v output source current (standard pad C apex) 4 ma output sink current (standard pad C apex) 4 ma output source current (high current pad C apex) 8 ma output sink current (high current pad C apex) 8 ma i/o pin pull-up and pull-down resistor (apex) 30 k power consumption transmit mode (100mw output): apex 170 ma receive mode: apex 37 ma standby mode: 10mw 5 a 100mw 5 a
zaxm-200 series rf characteristics (@ 25c, v dd = 3.3v unless otherwise noted) parameter min typ max unit general charcteristics rf frequency range 2400 2483.5 mhz rf data rate 250 kbps microcontroller operating frequency 12 mhz flash memory 128 kb ram 5 kb transmitter nominal output power 20 dbm programmable output power range 32 db error vector magnitude 15 35 % receiver receiver sensitivity (1% per) C normal mode -92 -96 dbm receiver sensitivity (1% per) C boost mode * -93 -97 dbm saturation (maximum input level) (1% per) 0 dbm 802.15.4 adjacent channel rejection: apex 35 db 802.15.4 alternate channel rejection 40 db 802.11 g rejection (10 mhz): apex 40 db * boost mode is an optional software-selectable high performance mode designed to increase receiver sensitivity . note: refer to ember em250 datasheet for additional details. pin signals i/o port configuration the apex module has a 28 edge i/o interface for connection to the users host board. figure 1 shows the layout of the 28 edge castellations. pin 1 pin 10 pin 28 pin 19 figure 1 (top view)
zaxm-200 series unused i/o pins should be left unconnected and the pin state set via the host protocol. di = digital input pi = power input do = digital output gnd = ground ai = analog input ao = analog output apex i/o pin assignments pin # name type description 1 ground gnd ground 2 ground gnd ground 3 ground gnd ground 4 v dd pi power supply input 5 rstb di reset, active low 6 gpio11 di/do general purpose digital i/o, sc1 uart cts, sc1 spi master clock, or capture input a of timer 2 7 gpio12 di/do general purpose digital i/o, sc1 uart rts, or capture input b of timer 2 8 gpio0 di/do general purpose digital i/o, sc2 spi mosi, or capture input a of timer 1 9 gpio1 di/do general purpose digital i/o, sc2 spi miso, sc2 i 2 c sda, or capture input a of timer 2 10 gpio2 di/do general purpose digital i/o, sc2 spi master clock, sc2 i 2 c scl, or capture input b of timer 2 11 gpio3 di/do general purpose digital i/o, sc2 spi slave select, or capture input b of timer 1 12 gpio4 di/do/ai general purpose digital i/o, adc input 0, or pti frame signal 13 gpio5 di/do/ai general purpose digital i/o, adc input 1, or pti data signal 14 gpio6 di/do/ai general purpose digital i/o, adc input 2, timer 2 clock input, or timer 1 enable 15 gpio7 do regulator enable, active high (see section of power amplifer regulator control line ) 16 gpio8 di/do/ao general purpose digital i/o, adc reference output, timer 1 clock input, timer 2 enable, or source a interrupt 17 gpio9 di/do general purpose digital i/o, sc1 txd, sc1 mo, sc1 i 2 c data, or capture input a of timer 1 18 gpio10 di/do general purpose digital i/o, sc1 rxd, sc1 mi, sc1 i 2 c clock, or capture input b of timer 1 19 clk di sif interface clock 20 miso do sif interface master in/slave out 21 mosi di sif interface master out/slave in 22 loadb di/do sif interface load strobe 23 gpio16 di/do general purpose digital i/o, output b of timer 1, capture input b of timer 2, or source d interrupt 24 gpio15 di/do general purpose digital i/o, output a of timer 1, capture input a of timer 2, or source c interrupt 25 gpio14 di/do general purpose digital i/o, output b of timer 2, capture input b of timer 1, or source b interrupt 26 gpio13 di/do general purpose digital i/o, output a of timer 2, or capture input a of timer 1 27 ground gnd ground 28 ground gnd ground
zaxm-200 series dimensions: zaxm-201-1 apex dimensions in inches. tolerances = +/-0.005 unless otherwise noted. pin 19: sif_clk miso mosi load b gpio 16 gpio 15 gpio 14 gpio 13 ground pin 28: ground pin 10: gpio 2 gpio ?1 gpio 0 gpio 12 gpio 11 rstb vdd ground ground pin 1: ground pin 18: gpio 10 gpio 9 gpio 8 gpio 7 gpio 6 gpio 5 gpio 4 pin 11: gpio 3 0.062 1.275 1.000 0.895 rf shield 0.195 pcb trace antenna top view dimensions: zaxm-201-1c apex with optional mmcx connector dimensions in inches. tolerances = +/-0.005 unless otherwise noted. top view pin 19: sif_clk miso mosi load b gpio 16 gpio 15 gpio 14 gpio 13 ground pin 28: ground pin 10: gpio 2 gpio ?1 gpio 0 gpio 12 gpio 11 rstb vdd ground ground pin 1: ground pin 18: gpio 10 gpio 9 gpio 8 gpio 7 gpio 6 gpio 5 gpio 4 pin 11: gpio 3 0.062 0.205 1.275 1.000 0.895 rf shield 0.195 optional mmcx connector for external antenna overall height w/mmcx connector j 2 j 2 0.410
zaxm-200 series pcb copper pattern layout: apex dimensions in inches. tolerances = +/-0.005 unless otherwise noted. 0.850 0.090 0.050 0.240 0.025 0.025 0.970 0.100 pitch typ 0.040 0.125 typ 28 pads 0.070 typ 28 pads recommended host pcb board edge 0.040 pin 1 28 pcb paste stencil pattern: apex dimensions in inches. tolerances = +/-0.005 unless otherwise noted. 0.900 0.100 pitch typ 0.065 0.100 typ 28 pads 0.070 typ 28 pads 0.065 pin 1 28
zaxm-200 series pcb keep-out areas: apex dimensions in inches. tolerances = +/-0.005 unless otherwise noted. for optimum antenna performance, the apex module should be mounted with the pcb trace antenna overhanging the edge of the host board. to further improve performance, a ground plane may be placed on the host board under the module, up to the pcb edge. the installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. cel can provide assistance with your pcb layout. 1.275 1.000 1.200 0.190 0.315 0.050 if optional mmcx connector is specified, edge of host board must be notched as shown edge of host pcb recommended overhang for pcb antenna = 0.230 if module does not overhang edge of host pcb, no components, copper or traces are allowed in this area component keep out area: no components within 0.100 inches of module
zaxm-200 series processing recommended refow profle parameters values ramp up rate (from tsoakmax to tpeak) 3o/sec max minimum soak temperature 150oc maximum soak temperature 200oc soak time 60-120 sec tliquidus 217oc time above tl 60-150 sec tpeak 260 + 0oc time within 5o of tpeak 20-30 sec time from 25o to tpeak 8 min max ramp down rate 6oc/sec max achieve the brightest possible solder fllets with a good shape and low contact angle. pb-free soldering paste use of no clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. note: the quality of the solder joints on the castellations (half vias) where they contact the host board should meet the appropriate ipc specifcation. see ipc-a-610-d acceptability of electronic assemblies, section 8.2.4 castellated terminations. cleaning in general, cleaning the populated modules is strongly discouraged. residuals under the module cannot be easily removed with any cleaning process. ? cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. the combination of soldering fux residuals and encapsulated water could lead to short circuits between neighboring pads. water could also damage any stickers or labels. ? cleaning with alcohol or a similar organic solvent will likely food soldering fux residuals into the two housings, which is not accessible for post-washing inspection. the solvent could also damage any stickers or labels. ? ultrasonic cleaning could damage the module permanently. the best approach is to consider using a no clean soldering paste and eliminate the post-soldering cleaning step. optical inspection after soldering the module to the host board, consider optical inspection to check the following: ? proper alignment and centering of the module over the pads. ? proper solder joints on all pads. ? excessive solder or contacts to neighboring pads, or vias.
zaxm-200 series repeating refow soldering only a single refow soldering process is encouraged for host boards. wave soldering if a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. hand soldering hand soldering is possible. use a soldering iron temperature setting equivalent to 350c, follow ipc recommendations/ reference document ipc-7711. rework the apex lt module can be unsoldered from the host board. use of a hot air re-work tool and hot plate for pre-heating from underneath is recommended. avoid overheating. !warning never attempt a rework on the module itself, e.g. replacing individual components. such actions will terminate warranty coverage. additional grounding attempts to improve module or system grounding by soldering braids, wires, or cables onto the module rf shield cover is done at the customers own risk. the numerous ground pins at the module perimeter should be suffcient for optimum immunity to external rf interference. processing (continued)
zaxm-200 series agency certifications fcc part 15.247 module certifed (mobile) the apex modules comply with part 15 of the federal communications commission rules and regulations. to meet the fcc certifcation requirements, the user must meet these regulations: ? the text on the fcc id label provided with the module must be placed on the outside of the fnal product. ? the modules may only use the antennas that have been tested and approved with these modules: the on-board pcb trace antenna nearson s131cl-5-rmm-2450s antenna. to meet the section 15.209 emission requirements in the restricted frequency bands of section 15.205, the transceiver transmitter power for the apex (em250) module needs to be reduced from the typical maximum setting on the upper two channels (2475 mhz and 2480 mhz). maximum values are tbd. per section 2.109, the apex module have been certifed by the fcc for use with other products without additional certifcation. any modifcations to this product may violate the rules of the federal communications commission and make operation of the product unlawful. per sections 15.107 and 15.109, the users end product must be tested for unintentional radiators compliance. per section 47 c.f.r. sec.15.105(b), the apex module is certifed as mobile devices for the fcc radiation exposure limits set forth for an uncontrolled environment. the antennas used with this module must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. if the module is to be used in a handheld application, the user is responsible for passing additional fcc part 2.1091 rules (sar) and fcc guidelines for human exposure to radio frequency electromagnetic fields, oet bulletin and supplement c. ic certifcation canada the apex module is ic certifed. the labeling requirements for industry canada are similar to those of the fcc. a visible label on the outside of the fnal product must display the ic labeling. the user is responsible for the end product to comply with ic ices-003 (unintentional radiators). ce certifcation europe the apex module is ce certifed. the ce marking must be affxed legibly and indelibly to a visible location on the users product. fcc approved antennas ? integrated pcb trace antenna ? nearson s131cl-5-rmm-2450s C a 2.4ghz dipole antenna with a 5 inch cable and a right angle mmcx connector.
zaxm-200 series shipment, handling, and storage shipment the apex module is deliveredin trays of 32. each package consist of 5 trays and therefore the total module quantity per package is 160. handling the apex module is designed and packaged to be processed in an automated assembly line. ! warning the apex module contains a highly sensitive electronic circuitry. handling without proper esd protection may destroy or damage the module permanently. ! warning according to jedec isp, the apex module is moisture sensitive devices. appropriate handling instructions and precautions are summarized in section 2.1. read carefully to prevent permanent damage due to moisture intake. moisture sensitivity level (msl) msl 3, per j-std-033
zaxm-200 series references & revision history references reference documents apex module evaluation kit user guide ember em250 datasheet (june 29, 2007) revision history previous versions changes to current version page 0002/3-00-07-00-000 (issue a) may 7, 2008 initial preliminary datasheet. n/a 0002-00-07-00-000 (issue b) january 22, 2009 datasheet unifcation for zigbee product line n/a 0002-00-07-00-000 (issue c) april 29, 2010 the following corrections/changes were made: on page 11, pin 10 was changed from gnd to gpio2 and the module height was changed from 0.162 to 0.195. on page 6, the deep sleep mode current consumption was changed to 5.0a. 6, 11 disclaimer ? the information in this document is current as of the published date. the information is subject to change without notice. for actual design-in, refer to the latest publications of cel data sheets or data books, etc., for the most up-to-date specifcations of cel products. not all products and/or types are available in every country. please check with an cel sales representative for availability and additional information. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of cel. cel assumes no responsibility for any errors that may appear in this document. ? cel does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of cel products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of cel or others. ? descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customers ?equipment shall be done under the full responsibility of the customer. cel assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. ? while cel endeavors to enhance the quality, reliability and safety of cel products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely . to minimize risks of damage to property or injury (including death) to persons arising from defects in cel products, customers must incorporate suffcient safety measures in their design, such as redundancy, fre-containment and anti-failure features.

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