smd fyls- 1206pgc radiation pattern. features: z compatible with automatic placement equipment. z compatible with reflow solder process. applications: z automotive-telecommunication. z indicators. z water clear z illuminations. descriptions: z dice material: ingan z emitting color: super bright pure green z lens color: water clear. absolute maximum ratings(ta=25 b ) parameter max. unit power dissipation 70 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 100 ma continuous forward current 20 ma derating linear from 25 0.4 ma/ operating temperature range -30 to +80 storage temperature range -40 to +85 electrical and optical characteristics(ta=25 b ) parameter symbol min. typ. max. unit test condition luminous intensity iv -- 200 -- mcd if=20ma viewing angle 2 1/2 -- 140 -- deg peak emission p 515 520 525 nm dominant wavelength d520 -- 525nm spectral line half-width 25 30 35 nm forward voltage vf 3.2 3.6 v reverse current ir 10 a vr=5v relative lumionous intensity(lop @max=1)
smd typical electrical characteristics curves (25 b ambient temperature unless otherwise noted) forward current vs.forward voltage forward voltage vf( v) forward current if(ma) luminous intensity vs.ambient temperature c ambient temperature c luminous intensity (iv) -20 0 20 40 60 80 normalized response wave length(nm) (1)peak@520nm/pure green (1) ambient temperature ta ( forward current derating curve forward current(ma) 0 10 20 30 40 50 60 10 20 30 40 50 60 70 80 90 ) forward current if(ma) relative intensity (lop@20ma=1) relative luminous intensity vs forward current
smd ? precautions for use 1.suggest the leds should be kept between 5 and 30 and 60%rh or less before opening the package, the max. storage period before opening the package is 1 year. 2. after opening the package, the leds should be kept at 30 /35%rh or less, and it should be used within3 hours. in the event o f incomplete usage, it is advised that user preheat the remaining devices at 605 for 8 hours prior to use. 3. reflow soldering should not be done more t han twice. when soldering, don?t tress on leds during heating. after soldering, don?t warp the circuit board. 4. repair should not be done after the leds have been soldered. when repair is unavoidable, double-head soldering iro n should be used. it should be confirmed beforehand whether the characteristics of the leds will be damaged by repair or not. ? soldering iron: z temperature at tip of iron:300 b max.(25w max) z soldering time: 31sec. please refer to the following figure
smd 1.6 1.6 3.2 0.8 cathode mark led die 2.0 0.5 1.1 pcb resin 0.6 0.6 2.0 6 r o g h u l q j 7 h u p l q d o 1.5 1.5 1.5 2.0 f w cathode d0 p2 p0 d 1 p1 a0 a' a' k0 t sec:a-a' 5 e 60+0.5/-0 13.50.2 90.1 120.15 1781.0 ? package dimensions of device ? tape specification: 3000pcs per reel. packing size item wp1 e f d0d1p0 unit spec. 8.00 4.00 1.75 3.50 1.50 1.00 4.00 mm tolerance 0.20 0.10 0.10 0.05 +0.1/-0 0.05 0.05 mm item 10p0p2a0b0k0 t unit spec. 40.00 2.00 1.85 3.45 1.27 0.22 mm tolerance 0.20 0.05 0.10 0.10 0.10 0.05 mm ? package dimensions of reel: ? packing and shipping spec. unit:mm unit:mm
smd unit:mm sb sb l1 w1 desiccant antistatic bag zip-lock desiccant spec. spec. spec. 203.0. 198.0 3 $ 5 7 1 2 4
7 < s f v box dimension(cm):30 * 19* 11.5 10 reels per box c/no * : 1 : 0 ( $ 6
& 0 . * 6 . * 6 carton dimension(cm):39*32*38 6boxs/carton 0603b/0603/0805: 4000pcs*10reels*6boxs 0805b/1206b/ 1206 1210 /1204: 3000pcs*10reels*6boxs* 3528:2000pcs*10reels*6boxs 5050:1000pcs*8reels*6boxs
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