8-channel esd protection array in chip scale package cm1205 ?2010 scillc. all rights reserved. publication order number: april 2010 ? rev. 3 cm1205/d features ? functionally and pin compatible with cmd?s pacdn1408 esd protection device ? eight transient voltage suppressors in a single package ? optiguard tm coated for improved reliability at assembly ? in-system electrostatic discharge (esd) protection to + 25kv contact discharge per iec 61000-4-2 international standard ? compact chip scale package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages ? rohs compliant (lead-free) 10-bump csp applications ? esd protection for sensitive electronic equipment ? i/o port, keypad and button circuitry protection for portable devices ? wireless handsets ? handheld pcs / pdas ? mp3 players ? digital cameras and camcorders ? notebooks ? desktop pcs product description the cm1205 transient voltage suppressor array provides a very high level of protection for sensit ive electronic components that may be subjected to esd. the cm1205 will safely dissipate esd strikes at levels well beyond the maximum requirements set forth in the iec 61000-4-2 international standard (level 4, + 8kv contact discharge). all i/os are rated at + 25kv using the iec 61000-4-2 contact discharge method. using the mil-std-883d (method 3015) specification for human body model (hbm) esd, all pins are protected for contact discharges to greate r than + 30kv. the chip scale package format of this device enables extremely small footprints that are necessa ry in portable electronics such as cellular phones, pdas, internet appliances and pcs. the large solder bumps allow for standard attachment to laminate boards without the use of underfill. the cm1205 features optiguard tm coating for improved reliability at assembly and is available w ith rohs compliant lead-free finishing. block diagram
cm1205 rev. 3 | page 2 of 8 | www.onsemi.com ordering information part numbering information bumps package ordering part number 1 part marking 10 csp CM1205-08CP 120508 note 1: parts are shipped in tape & reel form unl ess otherwise specified. specifications absolute maximum ratings parameter rating units storage temperature range -65 to +150 c standard operating conditions parameter rating units operating temperature range -40 to +85 c
cm1205 rev. 3 | page 3 of 8 | www.onsemi.com electrical operating characteristics 1 symbol parameter conditions min typ max units v rev reverse standoff voltage i diode =10 a 6.0 v i leak leakage current v in =3.3v dc 100 na v sig signal clamp voltage positive clamp negative clamp i load = 10ma 5.6 -1.2 6.8 -0.8 8.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 note 2 + 30 + 25 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients note 2 +12 -8 v v c channel capacitance at 2.5v dc, f = 1mhz, 39 47 pf note 1: t a =25 c unless otherwise specified. gnd in this document refers to the lower supply voltage. note 2: esd applied to channel pins with respect to gnd, one at a time. all other channels are open. a ll gnd pins tied to ground.
cm1205 rev. 3 | page 4 of 8 | www.onsemi.com application information refer to application note ap-217, "the chip scale p ackage", for a detailed description of chip scale p ackages offered by california micro devices. printed circuit board recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tape red walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature 260?c figure 3. recommended non-solder mask defined pad illustration
cm1205 rev. 3 | page 5 of 8 | www.onsemi.com figure 4. lead-free (snagcu) solder ball reflow pr ofile
cm1205 rev. 3 | page 6 of 8 | www.onsemi.com mechanical details the cm1205 is offered in a custom chip scale package (csp). dimensions are presented below. package dimensions package custom csp bumps 10 millimeters inches dim min nom max min nom max a1 1.109 1.154 1.199 0.0437 0.0454 0.0472 a2 3.059 3.104 3.149 0.1204 0.1222 0.1240 b1 0.645 0.650 0.655 0.0254 0.0256 0.0258 b2 0.645 0.650 0.655 0.0254 0.0256 0.0258 c1 0.202 0.252 0.302 0.0080 0.0099 0.0119 c2 0.202 0.252 0.302 0.0080 0.0099 0.0119 d1 0.612 0.682 0.751 0.0241 0.0268 0.0296 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters package dimensions for cm1205 chip scale package
cm1205 rev. 3 | page 7 of 8 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1205-08CP 3.104 x 1.154 x 0.682 3.28 x 1.32 x 0.81 8mm 178mm (7") 3500 4mm 4mm figure 5. tape and reel mechanical data
cm1205 rev. 3 | page 8 of 8 | www.onsemi.com on semiconductor and are registered trademarks of semiconductor componen ts industries, llc (scillc). scillc reserves the ri ght to make changes without further notice to any products herein. scillc makes no warranty, represe ntation or guarantee regarding the suitability of i ts products for any particular purpose, nor does sc illc assume any liability arising out of the application or use of any product or cir cuit, and specifically disclaims any and all liabil ity, including without limitation special, conseque ntial or incidental damages. ?typical? parameters which may be provided in scillc data she ets and/or specifications can and do vary in differ ent applications and actual performance may vary ov er time. all operating parameters, including ?typicals? must be validated for each customer application by customer's technic al experts. scillc does not convey any license und er its patent rights nor the rights of others. scillc products are not designed , intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other applicati on in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unau thorized application, buyer shall indemnify and hol d scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and ex penses, and reasonable attorney fees arising out of , directly or indirectly, any claim of personal inj ury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the des ign or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applic able copyright laws and is not for resale in any ma nner. publication ordering information literature fulfillment: literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone: 303-675-2175 or 800-344-3860 toll free usa/canada fax: 303-675-2176 or 800-344-3867 toll free usa/canada email: orderlit@onsemi.com n. american technical support: 800-282-9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81-3-5773-3850 on semiconductor website: www.onsemi.com order literature: http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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