z 0 k 1 2 1 - r b - 1 0 (a) (c) (b) (f) (e) 1. part no. expression : (b) dimension code (c) material code (a) series code 2. configuration & dimensions : 4. materials : superworld electronics (s) pte ltd (a) body : ferrite (b) termination : ag/ni/sn a 3. schematic : (e) r : reel (f) current : c = 300ma 5. general specification : b) rated current : base on temp. rise a) temp. rise : 30c max. pg. 1 0.300.03 bd unit:m/m 0.600.03 a c 0.300.03 c a d b 0.150.05 b ag(100%) ni(100%)-1.5um(min.) sn(100%)-3.0um(min.) c) storage temp. : -55c to +125c d) operating temp. : -55c to +125c ( include self-temp. rise ) e) resistance to solder heat : 260c.10secs (d) (g) (g) : 10 : rohs compliant (d) impedance code : 470 = 47
ferrite chip beads 11.08.2010 Z0 series note : specifications subject to change without notice. please check our website for latest information. 11 ~ 99 : internal controlled number
superworld electronics (s) pte ltd pg. 2 6. electrical characteristics : part number impedance (
) dc resistance ( hz ) frequency test max. (
) ( ma ) rated current 7. impedance vs. frequency curves : 11.08.2010 max. Z0k121-rb- 120 25% 100m 0.50 200 Z0k181-ra- 180 25% 100m 0.70 100 Z0m100-re- 10 25% 100m 0.15 500 Z0m220-rc- 22 25% 100m 0.20 300 Z0m300-rc- 30 25% 100m 0.25 300 Z0m470-rb- 47 25% 100m 0.30 200 Z0m600-ra- 60 25% 100m 0.30 100 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information. 1101001000 freq uency(mhz) 0 10 0 20 0 30 0 40 0 impedance(ohm) fcm0603 kf-121t02 z r x Z0k121-rb-10 Z0k121-rb- ? ? 1 10 100 1000 frequency(mhz) 0 100 200 300 400 500 impedance(ohm ) fcm0603kf-181t01 z r x Z0k181-ra-10 Z0k181-ra- ? ? 1 10 100 1000 frequen cy(mhz) 0 10 20 30 40 50 impedance (o hm) fcm0603mf-100t05 z r x Z0m 100-re-10 Z0m100-re- ? ? 1101001000 frequency(mhz) 0 40 80 120 impedance(ohm) fcm0603mf-220t03 z r x Z0m220-rc-10 Z0m220-r c- ? ?
superworld electronics (s) pte ltd pg. 3 7. impedance vs. frequency curves : 11.08.2010 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information. 1 10 100 1000 freque ncy(mhz) 0 60 120 180 impedance(ohm) fcm0603mf-300t03 z r x Z0m300-rc-10 Z0m300-rc- ? ? 1101001000 freq uency( mhz) 0 10 0 20 0 30 0 impedance (ohm) fcm0603mf-470t02 z r x Z0 m 4 70 -rb -1 0 Z0m470-rb- ? ? 1101001000 frequency(mhz) 0 100 200 300 impedance(ohm) fcm0603mf-600t01 z r x Z0m600-ra-10 Z0m600-ra- ? ?
superworld electronics (s) pte ltd pg. 4 8. reliability & test condition : 40(1.575) 100(3.937) 100.5 seconds 60 seconds not be damaged by the forces applied on the the terminal electrode & the dielectric must bending not be damaged by the forces applied on the the terminal electrode & the dielectric must w flexture strength right conditions. 45(1.772) 20(.787) 45(1.772) w terminal strength solderability 150c 41.0 seconds right conditions. 60 seconds more than 90% of the terminal electrode should be covered with solder. preheating 245c dipping natural cooling 3 0.6 solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 7 8 1.5 2.0 4 5 6 1.0 1.0 1.0 > 25 force (kfg) size 1 2 0.2 0.5 for z series : time (sec) solder : sn-ag3.0-cu0.5 flux for lead free : rosin dip time : 41sec. preheat : 150c, 60sec. solder temper ature : 2455c refer to standard electrical characteristics list temperature rise test solder heat resistance electrical characteristics test rated current impedance dc resistance impedance change : within 30% appearance : no significant abnormality preheating 260c 150c natural dipping cooling 30c max. ( ? t) item performance 2. temperature measured by digital surface thermometer. dip time : 100.5sec. solder temper ature : 2605c solder : sn-ag3.0-cu0.5 preheat : 150c, 60sec. flux for lead free : rosin hp4291a, hp 4287a+ 16092a 1. applied the allowed dc current. hp4338b test condition 11.08.2010 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 5 derating curve for the ferrite chip bead which withstanding current over 1.5a, as the operating temperature over 85c, t he derating current information is necessary to consider with. for the detail derating of current, please refer to the derated current vs. operating temperature curve. 8. reliability & test condition : low temperature storage test thermal shock temperature loading at high random vibration test bending st rength item drop humidity directions (total 6 hours). measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. step1 : -552c 303 min. temperature (c) phase times (min.) measured : 5 times 1 2 -552c +1255c duration : 100812hrs temperature : -552c step2 : +1255c 303 min. number of cycles : 5 303 303 impedance : within 30% of initial value. impedance : within 30% of initial value. appearance : no damage. appearance : no damage. duration : 100812hrs condition for 1 cycle for z series : temperature : 402c humidity : 90~95% rh. duration : 100812hrs temperature : 1255c applied current : rated current p-kgf a period of 2 hours in each of 3 mutually perpendicular directions & times : x, y, z directions for 2 hours. defects harmful to the characteristics should appearance : cracking, shipping & any other the ferrite should not be damaged by forces 1.0(0.039) a impedance : within 30% not be allowed. applied on the right condition. r0.5(0.02) chip 2.5 2.70 (0.106) z7 frequency : 10-55-10hz for 1 min. amplitude : 1.52mm z8 series name z3 z4 z5 z6 z2 1.40 (0.055) 1.0 2.00 (0.079) 2.5 0.80 (0.033) mm (inches) 0.3 performance test condition height of 75cm. drop 10 times on a concrete floor from a b. impedance change : 30% a. no mechanical damage 11.08.2010 1a 1.5a 3a 2a 6a 5a 4a 4 5 6 2 3 1 0 derating derated current(a) operating temperature( c) 125 85 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 6 9. soldering and mounting : soldering of large size products is discouraged. recommended temperature profile for wave soldering is shown seen by the circuit when immersed in the molten solder wave . due to the risk of thermal damage to products, wave 9-2.2 solder wave : wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature 9-1. recommended pc board pattern air soldering tools. 9-2.3 soldering iron (figure 3) : 9-2.1 lead free solder re-flow : wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred techni que is the utilization of hot by the difference in coefficients of expansion between solder, ch ip and substrate. the terminations are suitable for all mildly activated rosin fluxes are preferred. the minimu m amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a) preheat circuit and products to 150c. b) 350c tip temperature (max) c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. note : 9-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 3 secs. d) 1.0mm tip diameter (max) under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient 0.30 0.80 0.30 in fig. 2 temperature c 480s max. temperature c figure 2. wave soldering over 2min. figure 1. re-flow soldering time(sec.) 60~180s 25 217 200 150 60~150s temperature c figure 3. hand soldering over 1min. 150 gradual cooling soldering 330 350 preheating natural (max.) (max.) 10s 3s cooling 245 150 gradual cooling within 10s natural cooling preheating tp(260c/10s max.) 20~40s soldering 260 preheating natural cooling soldering 11.08.2010 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 7 may cause the failure of mechanical or electrical perform ance. solder shall be used not to be exceed as shown in fig. 4. accordingly increasing the solder volume, the mechanical st ress to product is also increased. exceeding solder volume figure 4 recommendable upper limit t 9-3. solder volume 11.08.2010 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 8 w:8.00.1 p2:20.05 e:1.750.1 po:40.1 p f:3.50.05 d1:10.1 ao a ko section a-a 4 5 bo 2 z / l 3(12) 3(09) material : plastic po:40.1 p e:1.750.1 p2:20.1 f:3.50.1 ko ao d:1.5+0.1 a t series size w:8.00.1 bo d:1.56 +0.1 -0.05 3(09) t 2 z / l 1 1.880.10 2.770.10 3.500.10 3.420.10 1.270.10 1.550.10 1.050.10 1.500.10 1.420.10 1.950.10 2.350.10 2.250.10 1.050.10 1.450.10 1.040.10 0.220.05 0.220.05 4.00.1 4.00.1 1.00.1 1.00.1 0.230.05 0.220.05 0.220.05 4.00.1 4.00.1 4.00.1 none 1.00.1 1.00.1 ao(mm) bo(mm) ko(mm) t(mm) p(mm) d1(mm) 0.950.05 2.300.05 1.500.05 1.050.05 0.620.03 1.850.05 1.120.03 0.950.05 0.600.03 none 4.00.1 0.950.05 0.950.05 0.600.03 4.00.1 2.00.1 none none 13.50.5 r1.9 p po:40.1 material : paper 10-2 tape dimension / 8mm p2:20.1 f:3.50.05 e:1.750.1 w:8.00.03 bo ao d:1.5 +0.1 -0.0 series ko size 0 t 1 2 0 10-1. reel dimension 10. packaging information : d c b a 7" x 8mm 7" x 12mm 20.5 r0.5 ao(mm) 0.380.05 bo(mm) 0.680.05 ko(mm) 0.50 max. t(mm) 0.50 max. p(mm) 2.00.05 d1(mm) none 60.02.0 60.02.0 r10.5 13.50.5 9.00.5 7" x 12mm 7" x 8mm 178.02.0 178.02.0 13.50.5 13.50.5 a(mm) type b(mm) d(mm) c(mm) 11.08.2010 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information.
superworld electronics (s) pte ltd pg. 9 the force for tearing off cover tape is 15 to 60 grams a) products should be handled with care to avoid dam age or contamination from perspiration and skin oils. c) bulk handling should ensure that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) recommended products should be used within 6 months from the time of delivery. a) temperature and humidity conditions : -10 ~ 40c and 30 ~ 70% rh. to maintain the solderabililty of terminal electrodes : 165 to 180 2. transportation : application notice 1. storage conditions : top cover tape f in the arrow direction under the following conditions. base tape (c) (%) 5~35 45~85 room humidity room temp. (mm/min) (hpa) 860~1060 300 tearing speed room atm 40000 20000 80000 w:12.00.1 10-3. packaging quantity bulk (bags) carton 10-4. tearing off force 7000 40000 12000 40000 chip / reel inner box chip size middle box 4000 20000 20000 4000 1000 8 1000 7 f:5.50.05 d1:1.50.1 a p ao 10-2.1 tape dimension / 12mm d:1.5+0.1 e:1.750.1 p2:20.05 po:40.1 a 100000 100000 30000 125000 50000 150000 150000 200000 200000 200000 62500 12500 8000 75000 15000 2000 65 2500 3000 4 100000 20000 50000 10000 100000 20000 4000 3 (09) 2000 3 (12) 4000 2 750000 - 300000 500000 375000 75000 250000 50000 15000 10000 10 1.850.1 4.950.1 3.660.1 z / l 7 bo section a-a ko 85.400.1 6.100.1 2.000.1 t 6 series size 1.930.1 ao(mm) 4.950.1 bo(mm) 1.930.1 ko(mm) 1.50.1 8.00.1 0.240.05 0.300.05 8.00.1 1.50.1 0.240.05 t(mm) 4.00.1 p(mm) 1.50.1 d1(mm) 11.08.2010 ferrite chip beads Z0 series note : specifications subject to change without notice. please check our website for latest information.
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