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73S1209F
Self-Contained PINpad, Smart Card Reader IC UART to ISO7816 / EMV Bridge IC
Simplifying System IntegrationTM
DATA SHEET
December 2008
GENERAL DESCRIPTION
The Teridian Semiconductor Corporation 73S1209F is a versatile and economical CMOS System-on-Chip device intended for smart card reader applications. More generally, it is suitable anywhere a UART to ISO-7816 / EMV bridge function is needed. The circuit is built around an 80515 high-performance core; it features primarily an ISO-7816 / EMV interface and a generic asynchronous serial interface. Delivered with turnkey Teridian embedded firmware, it forms a ready-to-use smart card reader solution that can be seamlessly incorporated into any microprocessor-based system where a serial line is available. The solution is scalable, thanks to a built-in I2C interface that allows to drive external electrical smart card interfaces such as Teridian 73S8010R/C ICs. This makes the solution immediately able to support multi-card slots or multi-SAM architectures. In addition, the 73S1209F features a 5x6 PINpad interface, 9 user I/Os, 2 LED outputs (programmable current), multiple interrupt options and an analog voltage input (for DC voltage monitoring such as battery level detection) that make it suitable for low-cost PINpad reader devices. The 80515 CPU core instruction set is compatible with the industry standard 8051, while offering one clock-cycle per instruction processing power (most instructions). With a CPU clock running up to 24MHz, it results in up to 24MIPS available that meets the requirements of various encryption needs such as AES, DES / 3-DES and even RSA (for PIN encryption for instance). The circuit requires a single 6MHz to 12MHz crystal. The respective 73S1209F embedded memories are 32KB Flash program memory, 2KB user XRAM memory, and 256B IRAM memory. Dedicated FIFOs for the ISO7816 UART are independent from the user XRAM and IRAM. Alternatively to the turnkey firmware offered by Teridian, customers can develop their own embedded firmware directly within their application or using Teridian 73S1209F Evaluation Board through a JTAG-like interface. Overall, the Teridian 73S1209F IC requires 2 distinct power supply voltages to operate normally with full support of all smart card voltages, 1.8V, 3V and 5V. The digital power supply VDD requires a 2.7V to 3.6V voltage, and the analog power supply VPC requires typically a 4.75V to 6.0V. While the VDD is used to power up the CPU core and the digital functions of the IC, the VPC voltage is used to supply the proper VCC voltage to the smart card interface: The chip incorporates an low drop-out linear voltage regulator that generates the smart card power-supply VCC from the power supply source VPC.
Embedded Flash memory is in-system programmable and lockable by means of on-silicon fuses. This makes the 73S1209F suitable for both development and production phases. Teridian Semiconductor Corporation offers with its 73S1209F a very comprehensive set of software libraries for EMV. Refer to the 73S12xxF Software User's Guide for a complete description of the Application Programming Interface (API Libraries) and related Software modules. A complete array of development and programming tools, libraries and demonstration boards enable rapid development and certification of readers that meet most demanding smart card standards.
APPLICATIONS * UART to ISO-7816 / EMV Bridges * PINpad smart card readers: o With serial connectivity o Ideal for low-cost POS Terminals) & Digital Identification (Secure Login, Gov't ID...) * SIM Readers in Telecom & Personal Wireless devices * Payphones and vending machines * General purpose smart card readers ADVANTAGES * Reduced BOM * Low-Cost * Dual power supply required 3.3V and 5V typical * Higher performance CPU core (up to 24MIPS) * Built-in EMV/ISO slot, expandable to multislots * Powerful In-Circuit Emulation and Programming * A complete set of EMV4.1 / ISO-7816 libraries * Turnkey PC/SC and CCID firmware and host drivers o Supported OS: Windows XP, WindowsTM Mobile; Windows CE; Linux o Other OS: Contact Teridian Semiconductor
Rev. 1.2
(c) 2008 Teridian Semiconductor Corporation
1
73S1209F Data Sheet FEATURES 80515 Core: * * * * * * 1 clock cycle per instruction (most instructions) CPU clocked up to 24MHz 32kB Flash memory with security 2kB XRAM (User Data Memory) 256 byte IRAM Hardware watchdog timer Communication Interfaces:
DS_1209F_004
* Full-duplex serial interface (1200bps to 115kbps UART) * I2C Master Interface (400kbps) Man-Machine Interface and I/Os: * 5x6 Keyboard (hardware scanning, debouncing and scrambling) * (9) User I/Os * Up to 2 programmable current outputs (LED) Voltage Detection: * * * * Analog Input (detection range: 1.0V to 2.5V) Operating Voltage: 2.7V to 3.6V Digital power supply 4.75 to 5.5V Analog, smart card power supply
Oscillators: * Single low-cost 6MHz to 12MHz crystal * An Internal PLL provides all the necessary clocks to each block of the system Interrupts: * Standard 80C515 4-priority level structure * 9 different sources of interrupt to the core Power Down Modes: * 2 standard 80C515 Power Down and IDLE modes * Extensive device power down mode Timers: * (2) Standard 80C52 timers T0 and T1 * (1) 16-bit timer Built-in ISO-7816 Card Interface: * Linear regulator produces VCC for the card (1.8V, 3V or 5V) * Full compliance with EMV 4.1 * Activation/Deactivation sequencers * Auxiliary I/O lines (C4 and C8 signals) * 7kV ESD protection on all interface pins Communication with Smart Cards: * ISO-7816 UART for protocols T=0, T=1 * (2) 2-Byte FIFOs for transmit and receive * Configured to drive multiple external Teridian 73S8010x interfaces (for multi-SAM architectures)
Operating Temperature: * -40C to 85C Package: * 68-pin QFN, 44-pin QFN Software: * Turnkey firmware: o Compliant with PC/SC, CCID, ISO7816 and EMV4.1 specifications o Features a Power Down mode accessible form the host o Supports Plug & Play over serial interface o Windows(R) XP driver available (*) o Windows CE / Mobile driver available (*) o Linux and other OS: Upon request * Or for custom developments: o A complete set of ISO-7816, EMV4.1 and low-level libraries are available for T=0 / T=1 o Two-level Application Programming Interface (ANSI C-language libraries)
(*) Contact Teridian Semiconductor for conditions and availability
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
Table of Contents
1 Hardware Description ......................................................................................................................... 8 1.1 Pin Description .............................................................................................................................. 8 1.2 Hardware Overview .................................................................................................................... 11 1.3 80515 MPU Core ........................................................................................................................ 11 1.3.1 80515 Overview ............................................................................................................. 11 1.3.2 Memory Organization .................................................................................................... 11 1.4 Program Security ........................................................................................................................ 16 1.5 Special Function Registers (SFRs) ............................................................................................ 18 1.5.1 Internal Data Special Function Registers (SFRs).......................................................... 18 1.5.2 IRAM Special Function Registers (Generic 80515 SFRs) ............................................ 19 1.5.3 External Data Special Function Registers (SFRs) ........................................................ 21 1.6 Instruction Set ............................................................................................................................. 23 1.7 Peripheral Descriptions............................................................................................................... 23 1.7.1 Oscillator and Clock Generation .................................................................................... 23 1.7.2 Power Control Modes .................................................................................................... 27 1.7.3 Interrupts ........................................................................................................................ 32 1.7.4 UART ............................................................................................................................. 39 1.7.5 Timers and Counters ..................................................................................................... 44 1.7.6 WD Timer (Software Watchdog Timer) ......................................................................... 46 1.7.7 User (USR) Ports ........................................................................................................... 49 1.7.8 Analog Voltage Comparator .......................................................................................... 51 1.7.9 LED Drivers ................................................................................................................... 53 1.7.10 I2C Master Interface ....................................................................................................... 54 1.7.11 Keypad Interface ............................................................................................................ 61 1.7.12 Emulator Port ................................................................................................................. 67 1.7.13 Smart Card Interface Function ...................................................................................... 68 1.7.14 VDD Fault Detect Function .......................................................................................... 102 Typical Application Schematics .................................................................................................... 103 Electrical Specification................................................................................................................... 105 3.1 Absolute Maximum Ratings ...................................................................................................... 105 3.2 Recommended Operating Conditions ...................................................................................... 105 3.3 Digital IO Characteristics .......................................................................................................... 106 3.4 Oscillator Interface Requirements ............................................................................................ 106 3.5 DC Characteristics: Analog Input ............................................................................................. 106 3.6 Smart Card Interface Requirements ......................................................................................... 107 3.7 DC Characteristics .................................................................................................................... 109 3.8 Voltage / Temperature Fault Detection Circuits ....................................................................... 109 Equivalent Circuits ......................................................................................................................... 110 4.1 Package Pin Designation (68-pin QFN) ................................................................................... 117 4.2 Package Pin Designation (44-pin QFN) ................................................................................... 118 4.3 Packaging Information .............................................................................................................. 119 Ordering Information ...................................................................................................................... 121 Related Documentation .................................................................................................................. 121 Contact Information ........................................................................................................................ 121
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5 6 7
Revision History ...................................................................................................................................... 122
Rev. 1.2
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73S1209F Data Sheet
DS_1209F_004
Figures
Figure 1: IC Functional Block Diagram ......................................................................................................... 7 Figure 2: Memory Map ................................................................................................................................ 15 Figure 3: Clock Generation and Control Circuits ........................................................................................ 24 Figure 4: Oscillator Circuit ........................................................................................................................... 26 Figure 5: Power-Down Control .................................................................................................................... 27 Figure 6: Detail of Power-Down Interrupt Logic .......................................................................................... 28 Figure 7: Power-Down Sequencing ............................................................................................................ 28 Figure 8: External Interrupt Configuration ................................................................................................... 32 Figure 9: I2C Write Mode Operation ........................................................................................................... 55 Figure 10: I2C Read Operation .................................................................................................................... 56 Figure 11: Simplified Keypad Block Diagram.............................................................................................. 61 Figure 12: Keypad Interface Flow Chart ..................................................................................................... 63 Figure 13: Smart Card Interface Block Diagram ......................................................................................... 68 Figure 14: External Smart Card Interface Block Diagram........................................................................... 69 Figure 15: Asynchronous Activation Sequence Timing .............................................................................. 72 Figure 16: Deactivation Sequence .............................................................................................................. 72 Figure 17: Smart Card CLK and ETU Generation ...................................................................................... 73 Figure 18: Guard, Block, Wait and ATR Time Definitions ........................................................................... 74 Figure 19: Synchronous Activation ............................................................................................................. 76 Figure 20: Example of Sync Mode Operation: Generating/Reading ATR Signals ..................................... 76 Figure 21: Creation of Synchronous Clock Start/Stop Mode Start Bit in Sync Mode ................................. 77 Figure 22: Creation of Synchronous Clock Start/Stop Mode Stop Bit in Sync Mode ................................. 77 Figure 23: Operation of 9-bit Mode in Sync Mode ...................................................................................... 78 Figure 24: 73S1209F Typical PINpad, Smart Card Reader Application Schematic ................................. 103 Figure 25: 73S1209F Typical SIM / Smart Card Reader Application Schematic ..................................... 104 Figure 26: 12 MHz Oscillator Circuit ......................................................................................................... 110 Figure 27: Digital I/O Circuit ...................................................................................................................... 110 Figure 28: Digital Output Circuit ................................................................................................................ 111 Figure 29: Digital I/O with Pull Up Circuit .................................................................................................. 111 Figure 30: Digital I/O with Pull Down Circuit ............................................................................................. 112 Figure 31: Digital Input Circuit ................................................................................................................... 112 Figure 32: Keypad Row Circuit ................................................................................................................. 113 Figure 33: Keypad Column Circuit ............................................................................................................ 113 Figure 34: LED Circuit ............................................................................................................................... 114 Figure 35: Test and Security Pin Circuit ................................................................................................... 114 Figure 36: Analog Input Circuit.................................................................................................................. 115 Figure 37: Smart Card Output Circuit ....................................................................................................... 115 Figure 38: Smart Card I/O Circuit.............................................................................................................. 116 Figure 39: PRES Input Circuit ................................................................................................................... 116 Figure 40: PRES Input Circuit ................................................................................................................... 116 Figure 41: 73S1209F Pinout ..................................................................................................................... 117 Figure 42: 73S1209F Pinout ..................................................................................................................... 118 Figure 43: 73S1209F 68 QFN Pinout ....................................................................................................... 119 Figure 44: 73S1209F 44 QFN Pinout ....................................................................................................... 120
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
Tables
Table 1: 73S1209F Pinout Description ......................................................................................................... 8 Table 2: MPU Data Memory Map................................................................................................................ 11 Table 3: Flash Special Function Registers ................................................................................................. 13 Table 4: Internal Data Memory Map ........................................................................................................... 14 Table 5: Security Control Registers ............................................................................................................ 17 Table 6: IRAM Special Function Registers Locations ................................................................................. 18 Table 7: IRAM Special Function Registers Reset Values........................................................................... 19 Table 8: XRAM Special Function Registers Reset Values ......................................................................... 21 Table 9: PSW Register Flags ...................................................................................................................... 22 Table 10: Port Registers ............................................................................................................................. 23 Table 11: Frequencies and Mcount Values for MCLK = 96MHz ................................................................ 25 Table 12: The MCLKCtl Register ................................................................................................................ 25 Table 13: The MPUCKCtl Register ............................................................................................................. 26 Table 14: The INT5Ctl Register .................................................................................................................. 29 Table 15: The MISCtl0 Register .................................................................................................................. 29 Table 16: The MISCtl1 Register .................................................................................................................. 30 Table 17: The MCLKCtl Register ................................................................................................................ 30 Table 18: The PCON Register .................................................................................................................... 31 Table 19: The IEN0 Register....................................................................................................................... 33 Table 20: The IEN1 Register....................................................................................................................... 34 Table 21: The IEN2 Register....................................................................................................................... 34 Table 22: The TCON Register .................................................................................................................... 35 Table 23: The T2CON Register .................................................................................................................. 35 Table 24: The IRCON Register ................................................................................................................... 36 Table 25: External MPU Interrupts .............................................................................................................. 36 Table 26: Control Bits for External Interrupts .............................................................................................. 37 Table 27: Priority Level Groups................................................................................................................... 37 Table 28: The IP0 Register ......................................................................................................................... 37 Table 29: The IP1 Register ......................................................................................................................... 38 Table 30: Priority Levels .............................................................................................................................. 38 Table 31: Interrupt Polling Sequence .......................................................................................................... 38 Table 32: Interrupt Vectors.......................................................................................................................... 38 Table 33: UART Modes ............................................................................................................................... 39 Table 34: Baud Rate Generation ................................................................................................................ 39 Table 35: The PCON Register .................................................................................................................... 40 Table 36: The BRCON Register ................................................................................................................. 40 Table 37: The MISCtl0 Register .................................................................................................................. 41 Table 38: The S0CON Register .................................................................................................................. 42 Table 39: The S1CON Register .................................................................................................................. 43 Table 40: The TMOD Register .................................................................................................................... 44 Table 41: TMOD Register Bit Description ................................................................................................... 44 Table 42: Timers/Counters Mode Description ............................................................................................ 45 Table 43: The TCON Register .................................................................................................................... 46 Table 44: The IEN0 Register....................................................................................................................... 47 Table 45: The IEN1 Register....................................................................................................................... 47 Table 46: The IP0 Register ......................................................................................................................... 48 Table 47: The WDTREL Register ............................................................................................................... 48 Table 48: Direction Registers and Internal Resources for DIO Pin Groups ............................................... 49 Table 49: UDIR Control Bit.......................................................................................................................... 49 Table 50: Selectable Controls Using the UxIS Bits ..................................................................................... 49 Table 51: The USRIntCtl1 Register ............................................................................................................ 50 Table 52: The USRIntCtl2 Register ............................................................................................................ 50 Table 53: The USRIntCtl3 Register ............................................................................................................ 50 Table 54: The USRIntCtl4 Register ............................................................................................................ 50 Table 55: The ACOMP Register ................................................................................................................. 51 Table 56: The INT6Ctl Register .................................................................................................................. 52 Rev. 1.2 5
73S1209F Data Sheet
DS_1209F_004
Table 57: The LEDCtl Register ................................................................................................................... 53 Table 58: The DAR Register ....................................................................................................................... 57 Table 59: The WDR Register ...................................................................................................................... 57 Table 60: The SWDR Register.................................................................................................................... 58 Table 61: The RDR Register ....................................................................................................................... 58 Table 62: The SRDR Register .................................................................................................................... 59 Table 63: The CSR Register ....................................................................................................................... 59 Table 64: The INT6Ctl Register .................................................................................................................. 60 Table 65: The KCOL Register ..................................................................................................................... 64 Table 66: The KROW Register ................................................................................................................... 64 Table 67: The KSCAN Register .................................................................................................................. 65 Table 68: The KSTAT Register ................................................................................................................... 65 Table 69: The KSIZE Register .................................................................................................................... 66 Table 70: The KORDERL Register ............................................................................................................. 66 Table 71: The KORDERH Register ............................................................................................................ 67 Table 72: The INT5Ctl Register .................................................................................................................. 67 Table 73: The SCSel Register .................................................................................................................... 79 Table 74: The SCInt Register...................................................................................................................... 80 Table 75: The SCIE Register ...................................................................................................................... 81 Table 76: The VccCtl Register .................................................................................................................... 82 Table 77: The VccTmr Register .................................................................................................................. 83 Table 78: The CRDCtl Register .................................................................................................................. 84 Table 79: The STXCtl Register ................................................................................................................... 85 Table 80: The STXData Register ................................................................................................................ 86 Table 81: The SRXCtl Register ................................................................................................................... 86 Table 82: The SRXData Register ............................................................................................................... 87 Table 83: The SCCtl Register ..................................................................................................................... 88 Table 84: The SCECtl Register ................................................................................................................... 89 Table 85: The SCDIR Register ................................................................................................................... 90 Table 86: The SPrtcol Register ................................................................................................................... 91 Table 87: The SCCLK Register................................................................................................................... 92 Table 88: The SCECLK Register ................................................................................................................ 92 Table 89: The SParCtl Register .................................................................................................................. 93 Table 90: The SByteCtl Register................................................................................................................. 94 Table 91: The FDReg Register ................................................................................................................... 95 Table 92: Divider Ratios Provided by the ETU Counter ............................................................................. 95 Table 93: Divider Values for the ETU Clock ............................................................................................... 96 Table 94: The CRCMsB Register ............................................................................................................... 97 Table 95: The CRCLsB Register ................................................................................................................ 97 Table 96: The BGT Register ....................................................................................................................... 98 Table 97: The EGT Register ....................................................................................................................... 98 Table 98: The BWTB0 Register .................................................................................................................. 99 Table 99: The BWTB1 Register .................................................................................................................. 99 Table 100: The BWTB2 Register ................................................................................................................ 99 Table 101: The BWTB3 Register ................................................................................................................ 99 Table 102: The CWTB0 Register ................................................................................................................ 99 Table 103: The CWTB1 Register ................................................................................................................ 99 Table 104: The ATRLsB Register ............................................................................................................. 100 Table 105: The ATRMsB Register ............................................................................................................ 100 Table 106: The STSTO Register............................................................................................................... 100 Table 107: The RLength Register ............................................................................................................. 100 Table 108: Smart Card SFR Table ........................................................................................................... 101 Table 109: The VDDFCtl Register ............................................................................................................ 102 Table 110: Order Numbers and Packaging Marks ................................................................................... 121
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
RESET
ANA_IN
TEST
TCLK
ISBR
RXTX
ERST
GND
TBUS3
ICE INTERFACE VDD VDD PLL and TIMEBASES
TBUS2
TBUS0
TBUS1
SEC
VDD
VOLTAGE REFERENCE AND FUSE TRIM CIRCUITRY VPD REGULATOR
VCC CONTROL LOGIC
VPC
VCC GND
RST X12IN X12OUT 12MHz OSCILLATOR CLK SMART CARD LOGIC ISO UART and CLOCK GENERATOR SMART CARD ISO INTERFACE I/O AUX1 AUX2
OCDSI
GND
FLASH/ROM PROGRAM MEMORY 32KB
MEMORY_ CONTROL
CONTROL UNIT
ROW0 ROW1 ROW2 ROW3 ROW4 ROW5 COL0 COL1 COL2 COL3 COL4
RAM_ SFR_ CONTROL
TIMER_0_ 1
PRES PRESB EXTERNAL SMART CARD INTERFACE
KEYPAD INTERFACE
FLASH INTERFACE
SCRATCH IRAM 256B ALU
CORE
SCLK SIO
DATA XRAM 2KB
PMU
WATCHDOG TIMER INT2 ISR INT3
2
PORTS
SERIAL USR0 USR1 USR2 USR3 USR4 USR5 USR6 USR7 USR8
IC MASTER INT.
USR(8:0) DRIVERS GND RXD TXD
SCL SDA
PERIPHERAL INTERFACE and SFR LOGIC
LED DRIVERS
Pins only avaiable on 68 pin package.
Figure 1: IC Functional Block Diagram
Rev. 1.2
LED1
LED0
Pins avaiable on both 68 and 44 pin packages.
7
73S1209F Data Sheet
DS_1209F_004
1 Hardware Description
1.1 Pin Description
Table 1: 73S1209F Pinout Description Pin (68 QFN) Pin (44 QFN)
Equivalent Circuit* Figure 26 Figure 26 Figure 32 Figure 33 Figure 29 Figure 28 Figure 27 Figure 34 Figure 31 Figure 28 Figure 31
Pin Name
Description
Type
X12IN X12OUT ROW (5:0) 0 1 2 3 4 5 COL(4:0) 0 1 2 3 4 USR(8:0) 0 1 2 3 4 5 6 7 8 SCL
10 11 21 22 24 34 37 38 12 13 14 16 19
8 9
I O I
MPU clock crystal oscillator input pin. A 1M resistor is required between pins X12IN and X12OUT. MPU clock crystal oscillator output pin. Keypad row input sense.
O
Keypad column output scan pins.
IO 36 35 33 31 30 29 23 20 32 5 24 23 22 21 20 19 14 13 5 O
General-purpose user pins, individually configurable as inputs or outputs or as external input interrupt ports.
I2C (master mode) compatible Clock signal. Note: the pin is configured as an open drain output. When the I2C interface is being used, an external pull up resistor is required. A value of 3K is recommended. I2C (master mode) compatible data I/O. Note: this pin is bi-directional. When the pin is configured as output, it is an open drain output. When the I2C interface is being used, an external pull up resistor is required. A value of 3K is recommended. Special output drivers, programmable pull-down current to drive LEDs. May also be used as inputs. Serial UART Receive data pin. Serial UART Transmit data pin. General purpose interrupt input. Rev. 1.2
SDA
6
6
IO
LED(1:0) 0 1 RXD TXD INT3 8
1 3 17 18 51
3 4 11 12
IO I O I
DS_1209F_004
73S1209F Data Sheet
Pin (68 QFN)
Pin (44 QFN)
Pin Name
Equivalent Circuit* Figure 31 Figure 27 Figure 28 Figure 39 Figure 40 Figure 37 Figure 37 Figure 38 Figure 38 Figure 38 Figure 36 Figure 35 Figure 35
Description
INT2 SIO SCLK PRES
52 50 48 64
32 31 30 43
Type I IO O I
General purpose interrupt input. IO data signal for use with external Smart Card interface circuit such as 73S8010. Clock signal for use with external Smart Card interface circuit. Smart Card presence. Active high. Note: the pin has a very weak pull down resistor. In noisy environments, an external pull down may be desired to insure against a false card event. Smart Card presence. Active low. Note: the pin has a very weak pull up resistor. In noisy environments, an external pull up may be desired to insure against a false card event. Smart card clock signal. Smart card Reset signal. Smart card Data IO signal. Auxiliary Smart Card IO signal (C4). Auxiliary Smart Card IO signal (C8). Smart Card VCC supply voltage output. A 0.47F capacitor is required and should be located at the smart card connector. The capacitor should be a ceramic type with low ESR. Smart Card Ground. Smart Card LDO regulator power supply source. A 10F and a 0.1F capacitor are required at the VPC input. The 10F capacitor should be a ceramic type with low ESR.
PRESB
56
35
I
CLK RST IO AUX1 AUX2 VCC
57 59 63 62 61 60
36 38 42 41 40 39
O O IO IO IO PSO
GND VPC
58 55
37 34
GND PSI
TBUS(3:0) 0 1 2 3 RXTX ERST ISBR TCLK ANA_IN SEC TEST
IO 53 49 47 43 45 40 68 41 15 67 54 26 10 2 33 28 25 IO IO IO I AI I DI Trace bus signals for ICE.
ICE control. ICE control. ICE control. ICE control. Analog input pin. This signal goes to a programmable comparator and is used to sense the value of an external voltage. Input pin for use in programming security fuse. It should be connected to ground when not in use. Test pin, should be connected to ground.
Rev. 1.2
9
73S1209F Data Sheet
DS_1209F_004
Pin (68 QFN)
Pin (44 QFN)
Equivalent Circuit* Figure 31
Pin Name
Description
VDD
28 42 65
18 27 44
Type I
General positive power supply pins. All digital IO is referred to this supply voltage. There is an on-chip regulator that uses VDD to provide power for internal circuits (VPD). A 0.1F capacitor is recommended at each VDD pin.
N/C
2 4 7 8 26 27 39 46 9 25 44 66
16 17 29 No connect.
GND
7 15 1
GND General ground supply pins for all IO and logic circuits. I Reset input, positive assertion. Resets logic and registers to default condition.
RESET
* See the figures in the Equivalent Circuits section.
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
1.2 Hardware Overview
The 73S1209F single smart card controller integrates all primary functional blocks required to implement a smart card reader. Included on chip are an 8051-compatible microprocessor (MPU) which executes up to one instruction per clock cycle (80515), a fully integrated IS0-7816 compliant smart card interface, expansion smart card interface, serial interface, I2C interface, 6 x 5 keypad interface, 2 LED drivers, RAM, FLASH memory, and a variety of I/O pins. A functional block diagram of the 73S1209F is shown in Figure 1.
1.3 80515 MPU Core
1.3.1 80515 Overview
The 73S1209F includes an 80515 MPU (8-bit, 8051-compatible) that performs most instructions in one clock cycle. The 80515 architecture eliminates redundant bus states and implements parallel execution of fetch and execution phases. Normally a machine cycle is aligned with a memory fetch, therefore, most of the 1-byte instructions are performed in a single cycle. This leads to an 8x performance (average) improvement (in terms of MIPS) over the Intel 8051 device running at the same clock frequency. Actual processor clocking speed can be adjusted to the total processing demand of the application (cryptographic calculations, key management, memory management, and I/O management) using the XRAM special function register MPUCKCtl. Typical smart card, serial, keyboard and I2C management functions are available for the MPU as part of Teridian's standard library. A standard ANSI "C" 80515-application programming interface library is available to help reduce design cycle. Refer to the 73S12xxF Software User's Guide.
1.3.2
Memory Organization
The 80515 MPU core incorporates the Harvard architecture with separate code and data spaces. Memory organization in the 80515 is similar to that of the industry standard 8051. There are three memory areas: Program memory (Flash), external data memory (XRAM), and internal data memory (IRAM). Data bus address space is allocated to on-chip memory as shown Table 2 Table 2: MPU Data Memory Map Address (hex) 0000-7FFF 0000-07FF FC00-FFFF Memory Technology Flash Memory Static RAM External SFR Memory Type Non-volatile Volatile Volatile Typical Usage Program and non-volatile data MPU data XRAM Peripheral control Memory Size (bytes) 32KB 2KB 1KB
Note: The IRAM is part of the core and is addressed differently. Program Memory: The 80515 can address up to 32KB of program memory space from 0x0000 to 0x7FFF. Program memory is read when the MPU fetches instructions or performs a MOVC operation. After reset, the MPU starts program execution from location 0x0000. The lower part of the program memory includes reset and interrupt vectors. The interrupt vectors are spaced at 8-byte intervals, starting from 0x0003. Reset is located at 0x0000. Flash Memory: The program memory consists of flash memory. The flash memory is intended to primarily contain MPU program code. Flash erasure is initiated by writing a specific data pattern to specific SFR registers in the proper sequence. These special pattern/sequence requirements prevent inadvertent erasure of the flash memory.
Rev. 1.2
11
73S1209F Data Sheet The mass erase sequence is: 1. Write 1 to the FLSH_MEEN bit in the FLSHCTL register (SFR address 0xB2[1]). 2. Write pattern 0xAA to ERASE (SFR address 0x94). Note: The mass erase cycle can only be initiated when the ICE port is enabled. The page erase sequence is: 1. Write the page address to PGADDR (SFR address 0xB7[7:1]) 2. Write pattern 0x55 to ERASE (SFR address 0x94)
DS_1209F_004
The PGADDR register denotes the page address for page erase. The page size is 512 (200h) bytes and there are 128 pages within the flash memory. The PGADDR denotes the upper seven bits of the flash memory address such that bit 7:1 of the PGADDR corresponds to bit 15:9 of the flash memory address. Bit 0 of the PGADDR is not used and is ignored. The MPU may write to the flash memory. This is one of the non-volatile storage options available to the user. The FLSHCTL SFR bit FLSH_PWE (flash program write enable) differentiates 80515 data store instructions (MOVX@DPTR,A) between Flash and XRAM writes. Before setting FLSH_PWE, all interrupts need to be disabled by setting EAL = 1. Table 3 shows the location and description of the 73S1209F flash-specific SFRs. Any flash modifications must set the CPUCLK to operate at 3.6923 MHz (MPUCLKCtl = 0x0C) before any flash memory operations are executed to insure the proper timing when modifying the flash memory.
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Rev. 1.2
DS_1209F_004 Table 3: Flash Special Function Registers Register ERASE SFR Address 0x94 R/W W Description
73S1209F Data Sheet
This register is used to initiate either the Flash Mass Erase cycle or the Flash Page Erase cycle. Specific patterns are expected for ERASE in order to initiate the appropriate Erase cycle (default = 0x00).
0x55 - Initiate Flash Page Erase cycle. PGADDR @ SFR 0xB7. Must be proceeded by a write to
0xAA - Initiate Flash Mass Erase cycle. Must be proceeded by a write to FLSH_MEEN @ SFR 0xB2 and the debug port must be enabled. Any other pattern written to ERASE will have no effect. PGADDR 0xB7 R/W Flash Page Erase Address register containing the flash memory page address (page 0 through 127) that will be erased during the Page Erase cycle (default = 0x00). Note: the page address is shifted left by one bit (see detailed description above). Must be re-written for each new Page Erase cycle. FLSHCTL 0xB2 R/W Bit 0 (FLSH_PWE): Program Write Enable: 0 - MOVX commands refer to XRAM Space, normal operation (default). 1 - MOVX @DPTR,A moves A to Program Space (Flash) @ DPTR. This bit is automatically reset after each byte written to flash. Writes to this bit are inhibited when interrupts are enabled. Bit 1 (FLSH_MEEN): Mass Erase Enable: 0 - Mass Erase disabled (default). 1 - Mass Erase enabled. Must be re-written for each new Mass Erase cycle. Bit 6 (SECURE): Enables security provisions that prevent external reading of flash memory and CE program RAM. This bit is reset on chip reset and may only be set. Attempts to write zero are ignored.
W
R/W
Rev. 1.2
13
73S1209F Data Sheet
DS_1209F_004
Internal Data Memory: The Internal data memory provides 256 bytes (0x00 to 0xFF) of data memory. The internal data memory address is always one byte wide and can be accessed by either direct or indirect addressing. The Special Function Registers occupy the upper 128 bytes. This SFR area is available only by direct addressing. Indirect addressing accesses the upper 128 bytes of Internal RAM. The lower 128 bytes contain working registers and bit-addressable memory. The lower 32 bytes form four banks of eight registers (R0-R7). Two bits on the program memory status word (PSW) select which bank is in use. The next 16 bytes form a block of bit-addressable memory space at bit addressees 0x000x7F. All of the bytes in the lower 128 bytes are accessible through direct or indirect addressing. Table 4 shows the internal data memory map. Table 4: Internal Data Memory Map Address 0xFF 0x80 0x7F 0x30 0x2F 0x20 0x1F 0x00 Direct Addressing Special Function Registers (SFRs) Byte-addressable area Byte or bit-addressable area Register banks R0...R7 (x4) Indirect Addressing RAM
External Data Memory: While the 80515 can address up to 64KB of external data memory in the space from 0x0000 to 0xFFFF, only the memory ranges shown in Figure 2 contain physical memory. The 80515 writes into external data memory when the MPU executes a MOVX @Ri,A or MOVX @DPTR,A instruction. The MPU reads external data memory by executing a MOVX A,@Ri or MOVX A,@DPTR instruction. There are two types of instructions, differing in whether they provide an eight-bit or sixteen-bit indirect address to the external data RAM. In the first type (MOVX A,@Ri), the contents of R0 or R1, in the current register bank, provide the eight lower-ordered bits of address. This method allows the user access to the first 256 bytes of the 2KB of external data RAM. In the second type of MOVX instruction (MOVX A,@DPTR), the data pointer generates a sixteen-bit address.
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
Address 0xFFFF 0XFF80 0xFF7F 0XFE00 Address 0x7FFF 0x0800 0x07FF Use 0xFBFF
Use Peripheral Control Registers (128b) Smart Card Control (384b)
--Use Address 0xFF 0x80 0x7F Flash Program memory 32K Bytes 0x48 0x47 XRAM 0x20 0x1F 0x18 0x17 0x10 0x0F 0x08 0x07 Indirect Access Byte RAM Direct Access SFRs
Byte RAM Bit/Byte RAM Register bank 3 Register bank 2 Register bank 1 Register bank 0 Internal Data Memory
0x0000 Program Memory
0x0000 External Data Memory Figure 2: Memory Map
0x00
Dual Data Pointer: The Dual Data Pointer accelerates the block moves of data. The standard DPTR is a 16-bit register that is used to address external memory. In the 80515 core, the standard data pointer is called DPTR, the second data pointer is called DPTR1. The data pointer select bit chooses the active pointer. The data pointer select bit is located at the LSB of the DPS IRAM special function register (DPS.0). DPTR is selected when DPS.0 = 0 and DPTR1 is selected when DPS.0 = 1. The user switches between pointers by toggling the LSB of the DPS register. All DPTR-related instructions use the currently selected DPTR for any activity. Note: The second data pointer may not be supported by certain compilers.
Rev. 1.2
15
73S1209F Data Sheet
DS_1209F_004
1.4 Program Security
Two levels of program and data security are available. Each level requires a specific fuse to be blown in order to enable or set the specific security mode. Mode 0 security is enabled by setting the SECURE bit (bit 6 of SFR register FLSHCTL 0xB2) Mode 0 limits the ICE interface to only allow bulk erase of the flash program memory. All other ICE operations are blocked. This guarantees the security of the user's MPU program code. Security (Mode 0) is enabled by MPU code that sets the SECURE bit. The MPU code must execute the setting of the SECURE bit immediately after a reset to properly enable Mode 0. This should be the first instruction after the reset vector jump has been executed. If the "startup.a51" assembly file is used in an application, then it must be modified to set the SECURE bit after the reset vector jump. If not using "startup.a51", then this should be the first instruction in main(). Once security Mode 0 is enabled, the only way to disable it is to perform a global erase of the flash followed by a full circuit reset. Once the flash has been erased and the reset has been executed, security Mode 0 is disabled and the ICE has full control of the core. The flash can be reprogrammed after the bulk erase operation is completed. Global erase of the flash will also clear the data XRAM memory. The security enable bit (SECURE) is reset whenever the MPU is reset. Hardware associated with the bit only allows it to be set. As a result, the code may set the SECURE bit to enable the security Mode 0 feature but may not reset it. Once the SECURE bit is set, the code is protected and no external read of program code in flash or data (in XRAM) is possible. In order to invoke the security Mode 0, the SECSET0 (bit 1 of XRAM SFR register SECReg 0xFFD7) fuse must be blown beforehand or the security mode 0 will not be enabled. The SECSET0 and SECSET1 fuses once blown, cannot be overridden. Specifically, when SECURE is set: * The ICE is limited to bulk flash erase only. * Page zero of flash memory may not be page-erased by either MPU or ICE. Page zero may only be erased with global flash erase. Note that global flash erase erases XRAM whether the SECURE bit is set or not. * Writes to page zero, whether by MPU or ICE, are inhibited. Security mode 1 is in effect when the SECSET1 fuse has been programmed (blown open). In security mode 1, the ICE is completely and permanently disabled. The Flash program memory and the MPU are not available for alteration, observation, or control. As soon as the fuse has been blown, the ICE is disabled. The testing of the SECSET1 fuse will occur during the reset and before the start of pre-boot and boot cycles. This mode is not reversible, nor recoverable. In order to blow the SECSET1 fuse, the SEC pin must be held high for the fuse burning sequence to be executed properly. The firmware can check to see if this pin is held high by reading the SECPIN bit (bit 5 of XRAM SFR register SECReg 0xFFD7). If this bit is set and the firmware desires, it can blow the SECSET1 fuse. The burning of the SECSET0 does not require the SEC pin to be held high. In order to blow the fuse for SECSET1 and SECSET0, a particular set of register writes in a specific order need to be followed. There are two additional registers that need to have a specific value written to them in order for the desired fuse to be blown. These registers are FUSECtl (0xFFD2) and TRIMPCtl (0xFFD1). The sequence for blowing the fuse is as follows: 1. Write 0x54H to FUSECtl. 2. Write 0x81H for security mode 0 Write 0x82H for security mode 1 3. Write 0xA6 to TRIMPCtl. 4. Delay about 500 us 5. Write 0x00 to TRIMPCtl. Note: only program one security mode at a time. Note: SEC pin must be high for security mode 1.
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Rev. 1.2
DS_1209F_004 Table 5: Security Control Registers Register FLSHCTL SFR Address 0xB2 R/W R/W Description
73S1209F Data Sheet
Bit 0 (FLSH_PWE): Program Write Enable: 0 - MOVX commands refer to XRAM Space, normal operation (default). 1 - MOVX @DPTR,A moves A to Program Space (Flash) @ DPTR. This bit is automatically reset after each byte written to flash. Writes to this bit are inhibited when interrupts are enabled. Bit 1 (FLSH_MEEN): Mass Erase Enable: 0 - Mass Erase disabled (default). 1 - Mass Erase enabled. Must be re-written for each new Mass Erase cycle. Bit 6 (SECURE): Enables security provisions that prevent external reading of flash memory and CE program RAM. This bit is reset on chip reset and may only be set. Attempts to write zero are ignored. 0xA6 value will cause the selected fuse to be blown. All other values will stop the burning process. 0x54 value will set up for security fuse control. All other values are reserved and should not be used. Bit 7 (PARAMSEC): 0 - Normal operation 1 - Enable permanent programming of the security fuses. Bit 5 (SECPIN): Indicates the state of the SEC pin. The SEC pin is held low by a pull-down resistor. The user can force this pin high during boot sequence time to indicate to the firmware that sec mode 1 is desired.
W
R/W
TRIMPCtl FUSECtl SECReg
0xFFD1 0xFFD2 0xFFD7
W W W
R
R/W R/W
Bit 1 (SECSET1): See Program Security section. Bit 0 (SECSET0): See Program Security section.
Rev. 1.2
17
73S1209F Data Sheet
DS_1209F_004
1.5 Special Function Registers (SFRs)
The 73S1209F utilizes numerous SFRs to communicate with the 73S1209F s many peripherals. This results in the need for more SFR locations outside the direct address IRAM space (0x80 to 0xFF). While some peripherals are mapped to unused IRAM SFR locations, additional SFRs for the smart card and other peripheral functions are mapped to the top of the XRAM data space (0xFC00 to 0xFFFF).
1.5.1
Internal Data Special Function Registers (SFRs)
A map of the Special Function Registers is shown in Table 6. Table 6: IRAM Special Function Registers Locations Hex\ Bin F8 F0 E8 E0 D8 D0 C8 C0 B8 B0 A8 A0 98 90 88 80 X000 B A BRCON PSW T2CON IRCON IEN1 IEN0 USR8 S0CON USR70 TCON X001 X010 X011 X100 X101 X110 X111 Bin/ Hex FF F7 EF E7 DF D7 CF C7 BF B7 AF A7 9F 97 8F 87
KCOL
KROW
KSCAN
KSTAT
KSIZE
KORDERL KORDERH
IP1 IP0 UDIR8 S0BUF UDIR70 TMOD SP
S0RELH S1RELH FLSHCTL S0RELL IEN2 DPS TL0 DPL S1CON TL1 DPH S1BUF S1RELL ERASE TH0 TH1 DPL1 DPH1
PGADDR
WDTREL
MCLKCtl PCON
Only a few addresses are used, the others are not implemented. SFRs specific to the 73S1209F are shown in bold print (gray background). Any read access to unimplemented addresses will return undefined data, while most write access will have no effect. However, a few locations are reserved and not user configurable in the 73S1209F. Writes to the unused SFR locations can affect the operation of the core and therefore must not be written to. This applies to all the SFR areas in both the IRAM and XRAM spaces. In addition, all unused bit locations within valid SFR registers must be left in their default (power on default) states.
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
1.5.2
IRAM Special Function Registers (Generic 80515 SFRs)
Table 7 shows the location of the SFRs and the value they assume at reset or power-up. Table 7: IRAM Special Function Registers Reset Values Name SP DPL DPH DPL1 DPH1 WDTREL PCON TCON TMOD TL0 TL1 TH0 TH1 MCLKCtl USR70 UDIR70 DPS ERASE S0CON S0BUF IEN2 S1CON S1BUF S1RELL USR8 UDIR8 IEN0 IP0 S0RELL FLSHCTL PGADDR IEN1 IP1 S0RELH S1RELH IRCON T2CON Rev. 1.2 Location Reset Value 0x81 0x82 0x83 0x84 0x85 0x86 0x87 0x88 0x89 0x8A 0x8B 0x8C 0x8D 0x8F 0x90 0x91 0x92 0x94 0x98 0x99 0x9A 0x9B 0x9C 0x9D 0xA0 0xA1 0xA8 0xA9 0xAA 0xB2 0xB7 0xB8 0xB9 0xBA 0xBB 0xC0 0xC8 0x07 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x0A 0xFF 0xFF 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x01 0x00 0x00 0xD9 0x00 0x00 0x00 0x00 0x03 0x03 0x00 0x00 Description Stack Pointer Data Pointer Low 0 Data Pointer High 0 Data Pointer Low 1 Data Pointer High 1 Watchdog Timer Reload register Power Control Timer/Counter Control Timer Mode Control Timer 0, low byte Timer 1, high byte Timer 0, low byte Timer 1, high byte Master Clock Control User Port Data (7:0) User Port Direction (7:0) Data Pointer select Register Flash Erase Serial Port 0, Control Register Serial Port 0, Data Buffer Interrupt Enable Register 2 Serial Port 1, Control Register Serial Port 1, Data Buffer Serial Port 1, Reload Register, low byte User Port Data (8) User Port Direction (8) Interrupt Enable Register 0 Interrupt Priority Register 0 Serial Port 0, Reload Register, low byte Flash Control Flash Page Address Interrupt Enable Register 1 Interrupt Priority Register 1 Serial Port 0, Reload Register, high byte Serial Port 1, Reload Register, high byte Interrupt Request Control Register Timer 2 Control 19
73S1209F Data Sheet Name PSW KCOL KROW KSCAN KSTAT KSIZE KORDERL KORDERH BRCON A B Location Reset Value 0xD0 0XD1 0XD2 0XD3 0XD4 0XD5 0XD6 0XD7 0xD8 0xE0 0xF0 0x00 0x1F 0x3F 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 Description Program Status Word Keypad Column Keypad Row Keypad Scan Time Keypad Control/Status Keypad Size Keypad Column LS Scan Order Keypad Column MS Scan Order
DS_1209F_004
Baud Rate Control Register (only BRCON.7 bit used) Accumulator B Register
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
1.5.3
External Data Special Function Registers (SFRs)
A map of the XRAM Special Function Registers is shown in Table 6. . The smart card registers are listed separately in Table 108. Table 8: XRAM Special Function Registers Reset Values Name DAR WDR SWDR RDR SRDR CSR USRIntCtl1 USRIntCtl2 USRIntCtl3 USRIntCtl4 INT5Ctl INT6Ctl MPUCKCtl ACOMP TRIMPCtl FUSECtl VDDFCtl SECReg MISCtl0 MISCtl1 LEDCtl Location Reset Value 0x FF80 0x FF81 0x FF82 0x FF83 0x FF84 0x FF85 0x FF90 0x FF91 0x FF92 0x FF93 0x FF94 0x FF95 0x FFA1 0x FFD0 0x FFD1 0x FFD2 0x FFD4 0x FFD7 0x FFF1 0x FFF2 0x FFF3 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x0C 0x00 0x00 0x00 0x00 0x00 0x00 0x10 0xFF Description Device Address Register (I2C) Write Data Register (I2C) Secondary Write Data Register (I2C) Read Data Register (I2C) Secondary Read Data Register (I2C) Control and Status Register (I2C) External Interrupt Control 1 External Interrupt Control 2 External Interrupt Control 3 External Interrupt Control 4 External Interrupt Control 5 External Interrupt Control 6 MPU Clock Control Analog Compare Register TRIM Pulse Control FUSE Control VDDFault Control Security Register Miscellaneous Control Register 0 Miscellaneous Control Register 1 LED Control Register
Accumulator (ACC, A): ACC is the accumulator register. Most instructions use the accumulator to hold the operand. The mnemonics for accumulator-specific instructions refer to accumulator as "A", not ACC. B Register: The B register is used during multiply and divide instructions. It can also be used as a scratch-pad register to hold temporary data.
Rev. 1.2
21
73S1209F Data Sheet Program Status Word (PSW): Table 9: PSW Register Flags MSB CV Bit PSW.7 PSW.6 PSW.5 PSW.4 Symbol CV AC F0 RS1 Carry flag. Auxiliary Carry flag for BCD operations. General purpose Flag 0 available for user. AC F0 RS1 RS OV Function - LSB P
DS_1209F_004
Register bank select control bits. The contents of RS1 and RS0 select the working register bank: RS1/RS0 Bank Selected Bank 0 Bank 1 Bank 2 Bank 3 Location (0x00 - 0x07) (0x08 - 0x0F) (0x10 - 0x17) (0x18 - 0x1F) 00 01 10 11
PSW.3
RS0
PSW.2 PSW.1 PSW.0
OV F1 P
Overflow flag. General purpose Flag 1 available for user. Parity flag, affected by hardware to indicate odd / even number of "one" bits in the Accumulator, i.e. even parity.
Stack Pointer (SP): The stack pointer is a 1-byte register initialized to 0x07 after reset. This register is incremented before PUSH and CALL instructions, causing the stack to begin at location 0x08. Data Pointer: The data pointer (DPTR) is 2 bytes wide. The lower part is DPL, and the highest is DPH. It can be loaded as a 2-byte register (MOV DPTR,#data16) or as two registers (e.g. MOV DPL,#data8). It is generally used to access external code or data space (e.g. MOVC A,@A+DPTR or MOVX A,@DPTR respectively). Program Counter: The program counter (PC) is 2 bytes wide initialized to 0x0000 after reset. This register is incremented during the fetching operation code or when operating on data from program memory. Note: The program counter is not mapped to the SFR area. Port Registers: The I/O ports are controlled by Special Function Registers USR70 and USR8. The contents of the SFR can be observed on corresponding pins on the chip. Writing a 1 to any of the ports (see Table 10) causes the corresponding pin to be at high level (3.3V), and writing a 0 causes the corresponding pin to be held at low level (GND). The data direction registers UDIR70 and UDIR8 define individual pins as input or output pins (see the User (USR) Ports section for details).
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Rev. 1.2
DS_1209F_004 Table 10: Port Registers Register USR70 UDIR70 USR8 UDIR8 SFR Address 0x90 0x91 0xA0 0xA1 R/W R/W R/W R/W R/W Description
73S1209F Data Sheet
Register for User port bit 7:0 read and write operations (pins USR0... USR7). Data direction register for User port bits 0:7. Setting a bit to 0 means that the corresponding pin is an output. Register for User port bit 8 read and write operations (pin *USR8). Data direction register for port 1.
All ports on the chip are bi-directional. Each consists of a Latch (SFR USR70 to USR8), an output driver, and an input buffer, therefore the MPU can output or read data through any of these ports if they are not used for alternate purposes.
1.6 Instruction Set
All instructions of the generic 8051 microcontroller are supported. A complete list of the instruction set and of the associated op-codes is contained in the 73S12xxF Software User's Guide.
1.7 Peripheral Descriptions
1.7.1 Oscillator and Clock Generation
The 73S1209F has a single oscillator circuit for the main CPU clock. The oscillator circuit is designed to operate with various crystal or external clock frequencies. An internal divider working in conjunction with a PLL and VCO provides a 96MHz internal clock within the 73S1209F. 96 MHz is the recommended frequency for proper operation of specific peripheral blocks such as the specific timers, ISO-7816 UART and interfaces and keypad. The clock generation and control circuits are shown in Figure 3.
Rev. 1.2
23
73S1209F Data Sheet
DS_1209F_004
MCount(2:0)
12.00MHz
M DIVIDER /(2*N + 4) MCLK 96MHz
HOSCen
DIVIDER /93760
KEYCLK
1kHz
X12IN
12.00MHz
HIGH XTAL OSC
HCLK
Phase Freq DET
VCO
X12OUT CPU CLOCK DIVIDER 6 bits
1.5-48MHz
7.386MHz
ICLK
7.386MHz
div 2
CPUCKDiv
MPU CLOCK - CPCLK
3.6923MHz
DIVIDE by 120 DIVIDE by 96
div 2
I2CCLK
400kHz
I2C_2x
800kHz
CLK1M
1MHz
SC/SCE CLOCK Prescaler 6bits SCLK CLOCK Prescaler 6bits
SEL
SMART CARD LOGIC BLOCK CLOCK SCCLK ETU CLOCK DIVIDER 12 bits ETUCLK SCECLK
div 2
div 2
SELSC
See SC Clock descriptions for more accurate diagram SCCKenb
Figure 3: Clock Generation and Control Circuits
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
The master clock control register enables different sections of the clock circuitry and specifies the value of the VCO Mcount divider. The MCLK must be configured to operate at 96MHz to ensure proper operation of some of the peripheral blocks according to the following formula: MCLK = (Mcount * 2 + 4) * FXTAL = 96MHz Mcount is configured in the MCLKCtl register must be bound between a value of 1 to 7. The possible crystal or external clock frequencies for getting MCLK = 96MHz are shown in Table 11. Table 11: Frequencies and Mcount Values for MCLK = 96MHz FXTAL (MHz) 12.00 9.60 8.00 6.86 6.00 Master Clock Control Register (MCLKCtl): 0x8F 0x0A Mcount (N) 2 3 4 5 6
Table 12: The MCLKCtl Register MSB HSOEN Bit MCLKCtl.7 MCLKCtl.6 MCLKCtl.5 MCLKCtl.4 MCLKCtl.3 MCLKCtl.2 MCLKCtl.1 MCLKCtl.0 KBEN SCEN - - MCT.2 MCT.1 LSB MCT.0
Symbol HSOEN KBEN SCEN - - MCT.2 MCT.1 MCT.0
Function High-speed oscillator disable. When set = 1, disables the high-speed crystal oscillator and VCO/PLL system. Do not set this bit = 1. 1 = Disable the keypad logic clock. 1 = Disable the smart card logic clock.
This value determines the ratio of the VCO frequency (MCLK) to the highspeed crystal oscillator frequency such that: MCLK = (MCount*2 + 4)* FXTAL. The default value is MCount = 2h such that MCLK = (2*2 + 4)*12.00MHz = 96MHz.
The MPU clock that drives the CPU core defaults to 3.6923MHz after reset. The MPU clock is scalable by configuring the MPU Clock Control register.
Rev. 1.2
25
73S1209F Data Sheet MPU Clock Control Register (MPUCKCtl): 0xFFA1 0x0C
DS_1209F_004
Table 13: The MPUCKCtl Register MSB - Bit MPUCKCtl.7 MPUCKCtl.6 MPUCKCtl.5 MPUCKCtl.4 MPUCKCtl.3 MPUCKCtl.2 MPUCKCtl.1 MPUCKCtl.0 Symbol - - MDIV.5 MDIV.4 MDIV.3 MDIV.2 MDIV.1 MDIV.0 This value determines the ratio of the MPU master clock frequency to the VCO frequency (MCLK) such that MPUClk = MCLK/(2 * (MPUCKDiv(5:0) + 1)). Do not use values of 0 or 1 for MPUCKDiv(n). Default is 0Ch to set CPCLK = 3.6923MHz. - LSB MDIV.5 MDIV.4 MDIV.3 MDIV.2 MDIV.1 MDIV.0 Function
The oscillator circuits are designed to connect directly to standard parallel resonant crystal in a Pierce oscillator configuration. Each side of the crystal should include a 22pF capacitor to ground for both oscillator circuits and a 1M resistor is required across the 12MHz crystal. The CPU clock is available as an output on pin CPUCLK (68-pin version only).
X12IN
1M 12MHz 22pF 22pF
Note: The crystal should be placed as close as possible to the IC, and vias should be avoided. Figure 4: Oscillator Circuit
26
X12OUT
73S1209F
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
1.7.2
Power Control Modes
The 73S1209F contains circuitry to disable portions of the device and place it into lower power standby modes. This is accomplished by either shutting off the power or disabling the clock going to the block. The miscellaneous control registers MISCtl0, MISCtl1 and the Master Clock Control register (MCLKCtl) provide control over the power modes. There is also a device power down mode that will stop the core, clock subsystem and the peripherals connected to it. The PWRDN bit in MISCtl0 will setup the 73S1209F for power down and disable all clocks. The power down mode should only be initiated by setting the PWRDN bit in the MISCtl0 register and not by manipulating individual control bits in various registers. Figure 5 shows how the PWRDN bit controls the various functions that comprise power down state.
Note: the PWRDN Signal is not the direct version of the PWRDN Bit. There are delays from assertion of the PWRDN bit to the assertion of the PWRDN Signal (32 MPU clocks) Refer to the Power Down sequence diagram. MISCtl0 - PWRDN
PWRDN Signal
Analog functions (VCO, PLL, reference and bias circuits, etc.)
VDDFCtl - VDDFEN
+ + + + +
VDDFAULT
ACOMP - CMPEN
ANALOG COMPARE High Speed OSC
MCLCKCtl - HOSEN
SCVCCCtl - SCPRDN MISCtl1 - FRPEN These are the registers and the names of the control bits.
Smart Card Power Flash Read Pulse one-shot circuit These are the block references.
Figure 5: Power-Down Control When the PWRDN bit is set, the clock subsystem will provide a delay of 32 MPUCLK cycles to allow the program to set the STOP bit in the PCON register. This delay will enable the program to properly halt the core before the analog circuits shut down (high speed oscillator, VCO/PLL, voltage reference and bias circuitry, etc.). The PDMUX bit in SFR INT5Ctl should be set prior to setting the PWRDN bit in order to configure the wake up interrupt logic. The power down mode is de-asserted by any of the interrupts connected to external interrupts 0, 4 and 5 (external USR[0:7], smart card and Keypad). These interrupt sources are OR'ed together and routed through some delay logic into INT0 to provide this functionality. The interrupt will turn on the power to all sections that were shut off and start the clock subsystem. After the clock subsystem clocks start running, the MPUCLK begins to clock a 512 count delay counter. When the counter times out, the interrupt will then be active on INT0 and the program can resume. Figure 6 shows the detailed logic for waking up the 73S1209F from a power down state using these specific interrupt sources. Figure 7 shows the timing associated with the power down mode.
Rev. 1.2
27
73S1209F Data Sheet
PDMUX (FF94h:bit7) USR[7:0] Control
USRxINTSrc set to 4(ext INT0 high) or 6(ext INT0 low)
DS_1209F_004
USR0 USR1 USR2 USR3 USR4 USR5 USR6 USR7
MPU 0 INT0 1
INT4 INT5 CE TC
9 BIT CNTR
CLR
RESETB
D
CLR
Q
PWRDN (FFF1h:bit7)
PWRDN_analog
RESETB
CE
TC
Notes: 1. The counters are clocked by the MPUCLK 2. TC - Terminal count (high at overflow) 3. CE - Count enable
5 BIT CNTR
CLR
RESETB
Figure 6: Detail of Power-Down Interrupt Logic
t0 text
PWRDN BIT
t1
PWRDN SIG
t4
EXT. EVENT
t6 t7
INT0 to MPU MPU STOP ANALOG Enable
t2
t3
t5
PLL CLOCKS
t0: MPU sets PWRDN bit. t1: 32 MPU clock cycles after t0, the PWRDN SIG is asserted, turning all analog functions OFF. t2: MPU executes STOP instruction, must be done prior to t1. t3: Analog functions go to OFF condition. No Vref, PLL/VCO, Ibias, etc. text: An external event (RTC, Keypad, Card event, USB) occurs. t4: PWRDN bit and PWRDN signal are cleared by external event. t5: High-speed oscillator/PLL/VCO operating. t6: After 512 MPU clock cycles, INT0 to MPU is asserted. t7: INT0 causes MPU to exit STOP condition.
Figure 7: Power-Down Sequencing 28 Rev. 1.2
DS_1209F_004 External Interrupt Control Register (INT5Ctl): 0xFF94 0x00
73S1209F Data Sheet
Table 14: The INT5Ctl Register MSB PDMUX Bit Symbol - - - - - KPIEN LSB KPINT
Function When set=1, enables interrupts from Keypad (normally going to int5), Smart Card interrupts (normally going to int4), or USR(7:0) pins (int0) to cause interrupt on int0. The assertion of the interrupt to int0 is delayed by 512 MPU clocks to allow the analog circuits, including the clock system, to stabilize. This bit must be set prior to asserting the PWRDN bit in order to properly configure the interrupts that will wake up the circuit. This bit is reset=0 when this register is read.
INT5Ctl.7
PDMUX
INT5Ctl.6 INT5Ctl.5 INT5Ctl.4 INT5Ctl.3 INT5Ctl.2 INT5Ctl.1 INT5Ctl.0
- - - - - KPIEN KPINT Keypad interrupt enable. Keypad interrupt flag. 0x00
Miscellaneous Control Register 0 (MISCtl0): 0xFFF1
Table 15: The MISCtl0 Register MSB PWRDN Bit Symbol - - - - - Function This bit sets the circuit into a low-power condition. All analog (high speed oscillator and VCO/PLL) functions are disabled 32 MPU clock cycles after this bit is set=1. This allows time for the next instruction to set the STOP bit in the PCON register to stop the CPU core. The MPU is not operative in this mode. When set, this bit overrides the individual control bits that otherwise control power consumption. SLPBK LSB SSEL
MISCtl0.7
PWRDN
MISCtl0.6 MISCtl0.5 MISCtl0.4 MISCtl0.3 MISCtl0.2 MISCtl0.1 MISCtl0.0
- - - - - SLPBK SSEL UART loop back testing mode. Serial port pins select.
Rev. 1.2
29
73S1209F Data Sheet Miscellaneous Control Register 1 (MISCtl1): 0xFFF2 0x10
DS_1209F_004
Table 16: The MISCtl1 Register MSB - Bit MISCtl1.7 MISCtl1.6 Symbol - - Flash Read Pulse enable (low). If FRPEN=1, the Flash Read signal is passed through with no change. When FRPEN=0, a one-shot circuit that shortens the Flash Read signal is enabled to save power. The Flash Read pulse will shorten to 40 or 66ns (approximate based on the setting of the FLSH66 bit) in duration, regardless of the MPU clock rate. For MPU clock frequencies greater than 10MHz, this bit should be set high. When high, creates a 66ns Flash read pulse, otherwise creates a 40ns read pulse when FRPEN is set. - FRPEN FLSH66 - - Function - - LSB
MISCtl1.5
FRPEN
MISCtl1.4 MISCtl1.3 MISCtl1.2 MISCtl1.1 MISCtl1.0
FLSH66 - - - -
Master Clock Control Register (MCLKCtl): 0x8F
0x0A
Table 17: The MCLKCtl Register MSB HSOEN Bit MCLKCtl.7 MCLKCtl.6 KBEN SCEN - - MCT.2 Function High-speed oscillator enable. When set = 1, disables the high-speed crystal oscillator and VCO/PLL system. This bit is not changed when the PWRDN bit is set but the oscillator/VCO/PLL is disabled. 1 = Disable the keypad logic clock. This bit is not changed in PWRDN mode but the function is disabled. 1 = Disable the smart card logic clock. This bit is not changed in PWRDN mode but the function is disabled. Interrupt logic for card insertion/removal remains operable even with smart card clock disabled. MCT.1 LSB MCT.0
Symbol HSOEN* KBEN
MCLKCtl.5 MCLKCtl.4 MCLKCtl.3 MCLKCtl.2 MCLKCtl.1 MCLKCtl.0
SCEN - - MCT.2 MCT.1 MCT.0
This value determines the ratio of the VCO frequency (MCLK) to the high-speed crystal oscillator frequency such that: MCLK=(MCount*2 + 4)*Fxtal. The default value is MCount= 2h such that MCLK = (2*2 + 4)*12.00MHz = 96MHz.
*Note: The HSOEN bit should never be set under normal circumstances. Power down control should only be initiated via use of the PWRDN bit in MISCtl0.
30
Rev. 1.2
DS_1209F_004 Power Control Register 0 (PCON): 0x87 0x00
73S1209F Data Sheet
The SMOD bit used for the baud rate generator is setup via this register. Table 18: The PCON Register MSB SMOD Bit PCON.7 PCON.6 PCON.5 PCON.4 PCON.3 PCON.2 PCON.1 PCON.0 Symbol SMOD - - - GF1 GF0 STOP IDLE General purpose flag 1. General purpose flag 1. Sets CPU to Stop mode. Sets CPU to Idle mode. - - - GF1 GF0 Function If SM0D = 1, the baud rate is doubled. STOP LSB IDLE
Rev. 1.2
31
73S1209F Data Sheet
DS_1209F_004
1.7.3
Interrupts
The 80515 core provides 10 interrupt sources with four priority levels. Each source has its own request flag(s) located in a special function register (TCON, IRCON, and SCON). Each interrupt requested by the corresponding flag can be individually enabled or disabled by the enable bits in SFRs IEN0, IEN1, and IEN2. Some of the 10 sources are multiplexed in order to expand the number of interrupt sources. These will be described in more detail in the respective sections. External interrupts are the interrupts external to the 80515 core, i.e. signals that originate in other parts of the 73S1209F, for example the USR I/O, smart card interface, analog comparators, etc. The external interrupt configuration is shown in Figure 8.
PDMUXCtl USR0 USR1 USR2 USR3 USR4 USR5 USR6 USR7 INT2 INT3 Card_Det CRDCtl INT Pads USR Pads USR USR USR IntUSR Int CtlInt CtlInt Ctl Ctl 0 1 t0 int0 t1 int1 Clear PWRDN bit
+
Delay int2 int3
+
VCC_OK VccCTL
Wait Timeout Card Event VCC_TMR RxData TX_Event Tx_Sent TX_Error RX_Error
+
SCInt SCIE int4
MPU CORE
KeyPad
INT5 Ctl
During STOP, IDLE when PWRDN bit is set int5
I2C VDD_Fault Analog Comp Serial Ch 0 Serial Ch 1 INT6 Ctl int6
SerChan 0 int
SerChan 1 int
Figure 8: External Interrupt Configuration
32
Rev. 1.2
DS_1209F_004
1.7.3.1 Interrupt Overview
73S1209F Data Sheet
When an interrupt occurs, the MPU will vector to the predetermined address as shown in Table 32. Once the interrupt service has begun, it can only be interrupted by a higher priority interrupt. The interrupt service is terminated by a return from the RETI instruction. When a RETI is performed, the processor will return to the instruction that would have been next when the interrupt occurred. When the interrupt condition occurs, the processor will also indicate this by setting a flag bit. This bit is set regardless of whether the interrupt is enabled or disabled. Each interrupt flag is sampled once per machine cycle, then samples are polled by the hardware. If the sample indicates a pending interrupt when the interrupt is enabled, then the interrupt request flag is set. On the next instruction cycle, the interrupt will be acknowledged by hardware forcing an LCALL to the appropriate vector address. Interrupt response will require a varying amount of time depending on the state of the MPU when the interrupt occurs. If the MPU is performing an interrupt service with equal or greater priority, the new interrupt will not be invoked. In other cases, the response time depends on the current instruction. The fastest possible response to an interrupt is 7 machine cycles. This includes one machine cycle for detecting the interrupt and six cycles to perform the LCALL.
1.7.3.2 Special Function Registers for Interrupts
Interrupt Enable 0 Register (IEN0): 0xA8
0x00
Table 19: The IEN0 Register MSB EAL Bit IEN0.7 IEN0.6 IEN0.5 IEN0.4 IEN0.3 IEN0.2 IEN0.1 IEN0.0 Symbol EAL WDT - ES0 ET1 EX1 ET0 EX0 ES0 = 0 - disable serial channel 0 interrupt. ET1 = 0 - disable timer 1 overflow interrupt. EX1 = 0 - disable external interrupt 1. ET0 = 0 - disable timer 0 overflow interrupt. EX0 = 0 - disable external interrupt 0. EAL = 0 - disable all interrupts. Not used for interrupt control. WDT - ES0 ET1 EX1 ET0 LSB EX0
Function
Rev. 1.2
33
73S1209F Data Sheet Interrupt Enable 1 Register (IEN1): 0xB8 0x00
DS_1209F_004
Table 20: The IEN1 Register MSB - Bit IEN1.7 IEN1.6 IEN1.5 IEN1.4 IEN1.3 IEN1.2 IEN1.1 IEN1.0 Symbol - SWDT EX6 EX5 EX4 EX3 EX2 - 0x00 Not used for interrupt control. EX6 = 0 - disable external interrupt 6. EX5 = 0 - disable external interrupt 5. EX4 = 0 - disable external interrupt 4. EX3 = 0 - disable external interrupt 3. EX2 = 0 - disable external interrupt 2. SWDT EX6 EX5 EX4 EX3 Function EX2 - LSB
Interrupt Enable 2 Register (IEN2): 0x9A
Table 21: The IEN2 Register MSB - Bit IEN2.0 Symbol ES1 - - - - - Function ES1 = 0 - disable serial channel interrupt. - LSB ES1
34
Rev. 1.2
DS_1209F_004 Timer/Counter Control Register (TCON): 0x88 0x00
73S1209F Data Sheet
Table 22: The TCON Register MSB TF1 Bit TCON.7 TCON.6 TCON.5 TCON.4 TCON.3 TCON.2 TCON.1 TCON.0 Symbol TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 Timer 1 overflow flag. Not used for interrupt control. Timer 0 overflow flag. Not used for interrupt control. Interrupt 1 edge flag is set by hardware when the falling edge on external interrupt int1 is observed. Cleared when an interrupt is processed. Interrupt 1 type control bit. 1 selects falling edge and 0 selects low level for input pin to cause an interrupt. Interrupt 0 edge flag is set by hardware when the falling edge on external interrupt int0 is observed. Cleared when an interrupt is processed. Interrupt 0 type control bit. 1 selects falling edge and 0 sets low level for input pin to cause interrupt. 0x00 TR1 TF0 TR0 IE1 IT1 Function IE0 LSB IT0
Timer/Interrupt 2 Control Register (T2CON): 0xC8
Table 23: The T2CON Register MSB - Bit T2CON.7 T2CON.6 Symbol - I3FR External interrupt 3 failing/rising edge flag. I3FR = 0 external interrupt 3 negative transition active. I3FR = 1 external interrupt 3 positive transition active. External interrupt 3 failing/rising edge flag. I2FR = 0 external interrupt 3 negative transition active. I2FR = 1 external interrupt 3 positive transition active. I3FR I2FR - - - Function - LSB -
T2CON.5 T2CON.4 T2CON.3 T2CON.2 T2CON.1 T2CON.0
I2FR - - - - -
Rev. 1.2
35
73S1209F Data Sheet Interrupt Request Register (IRCON): 0xC0 0x00
DS_1209F_004
Table 24: The IRCON Register MSB - Bit IRCON.7 IRCON.6 IRCON.5 IRCON.4 IRCON.3 IRCON.2 IRCON.1 IRCON.0
1.7.3.3
LSB - EX6 IEX5 IEX4 IEX3 IEX2 -
Symbol - - IEX6 IEX5 IEX4 IEX3 IEX2 - External interrupt 6 flag. External interrupt 5 flag. External interrupt 4 flag. External interrupt 3 flag. External interrupt 2 flag.
Function
External Interrupts
The external interrupts (external to the CPU core) are connected as shown in Table 25. Interrupts with multiple sources are OR'ed together and individual interrupt source control is provided in XRAM SFRs to mask the individual interrupt sources and provide the corresponding interrupt flags. Multifunction USR [7:0] pins control Interrupts 0 and 1. Dedicated external interrupt pins INT2 and INT3 control interrupts 2 and 3. The polarity of interrupts 2 and 3 is programmable in the MPU. Interrupts 4, 5 and 6 have multiple peripheral sources and are multiplexed to one of these three interrupts. The peripheral functions will be described in subsequent sections. Generic 80515 MPU literature states that interrupts 4 through 6 are defined as rising edge sensitive. Thus, the hardware signals attached to interrupts 4, 5 and 6 are converted to rising edge level by the hardware. SFR (special function register) enable bits must be set to permit any of these interrupts to occur. Likewise, each interrupt has its own flag bit that is set by the interrupt hardware and is reset automatically by the MPU interrupt handler. Table 25: External MPU Interrupts External Interrupt 0 1 2 3 4 5 6 Connection USR I/O High Priority USR I/O Low Priority External Interrupt Pin INT2 External Interrupt Pin INT3 Smart Card Interrupts USB, RTC and Keypad I C, VDD_Fault, Analog Comp
2
Polarity see USRxIntCtlx see USRxIntCtlx Edge selectable Edge selectable N/A N/A N/A
Flag Reset Automatic Automatic Automatic Automatic Automatic Automatic Automatic
Note 1: Interrupts 4, 5 and 6 have multiple interrupt sources and the flag bits are cleared upon reading of the corresponding register. To prevent any interrupts from being ignored, the register containing multiple interrupt flags should be stored temporary to allow each interrupt flag to be tested separately to see which interrupt(s) is/are pending.
36
Rev. 1.2
DS_1209F_004 Table 26: Control Bits for External Interrupts Enable Bit EX0 EX1 EX2 EX3 EX4 EX5 EX6
1.7.3.4
73S1209F Data Sheet
Description Enable external interrupt 0 Enable external interrupt 1 Enable external interrupt 2 Enable external interrupt 3 Enable external interrupt 4 Enable external interrupt 5 Enable external interrupt 6
Flag Bit IE0 IE1 IEX2 IEX3 IEX4 IEX5 IEX6
Description External interrupt 0 flag External interrupt 1 flag External interrupt 2 flag External interrupt 3 flag External interrupt 4 flag External interrupt 5 flag External interrupt 6 flag
Power Down Interrupt Logic
The 73S1209F contains special interrupt logic to allow INT0 to wake up the CPU from a power down (CPU STOP) state. See the Power Control Modes section for details.
1.7.3.5 Interrupt Priority Level Structure
All interrupt sources are combined in groups, as shown in Table 27. Table 27: Priority Level Groups Group 0 1 2 3 4 5 External interrupt 0 Timer 0 interrupt External interrupt 1 Timer 1 interrupt Serial channel 0 interrupt - Serial channel 1 interrupt - - - - - External interrupt 2 External interrupt 3 External interrupt 4 External interrupt 5 External interrupt 6
Each group of interrupt sources can be programmed individually to one of four priority levels by setting or clearing one bit in the special function register IP0 and one in IP1. If requests of the same priority level are received simultaneously, an internal polling sequence as per Table 31 determines which request is serviced first. IEN enable bits must be set to permit any of these interrupts to occur. Likewise, each interrupt has its own flag bit that is set by the interrupt hardware. Interrupt Priority 0 Register (IP0): 0xA9 0x00
Table 28: The IP0 Register MSB - WDTS IP0.5 IP0.4 IP0.3 IP0.2 IP0.1 LSB IP0.0
Note: WDTS is not used for interrupt controls.
Rev. 1.2
37
73S1209F Data Sheet Interrupt Priority 1 Register (IP1): 0xB9 0x00
DS_1209F_004
Table 29: The IP1 Register MSB - - IP1.5 IP1.4 IP1.3 IP1.2 IP1.1 LSB IP1.0
Table 30: Priority Levels IP1.x 0 0 1 1 IP0.x 0 1 0 1 Priority Level Level0 (lowest) Level1 Level2 Level3 (highest)
Table 31: Interrupt Polling Sequence External interrupt 0 Serial channel 1 interrupt Timer 0 interrupt External interrupt 2 External interrupt 1 External interrupt 3 Timer 1 interrupt Serial channel 0 interrupt External interrupt 4 External interrupt 5 External interrupt 6
1.7.3.6 Interrupt Sources and Vectors
Table 32 shows the interrupts with their associated flags and vector addresses. Table 32: Interrupt Vectors Interrupt Request Flag N/A IE0 TF0 IE1 TF1 RI0/TI0 RI1/TI1 IEX2 IEX3 IEX4 IEX5 IEX6 38 Description Chip Reset External interrupt 0 Timer 0 interrupt External interrupt 1 Timer 1 interrupt Serial channel 0 interrupt Serial channel 1 interrupt External interrupt 2 External interrupt 3 External interrupt 4 External interrupt 5 External interrupt 6 Interrupt Vector Address 0x0000 0x0003 0x000B 0x0013 0x001B 0x0023 0x0083 0x004B 0x0053 0x005B 0x0063 0x006B Rev. 1.2
Polling sequence
DS_1209F_004
73S1209F Data Sheet
1.7.4
UART
The 80515 core of the 73S1209F includes two separate UARTs that can be programmed to communicate with a host. The 73S1209F can only connect one UART at a time since there is only one set of TX and Rx pins. The MISCtl0 register is used to select which UART is connected to the TX and RX pins. Each UART has a different set of operating modes that the user can select according to their needs. The UART is a dedicated 2-wire serial interface, which can communicate with an external host processor at up to 115,200 bits/s. The TX and RX pins operate at the VDD supply voltage levels and should never exceed 3.6V. The operation of each pin is as follows: RX: Serial input data is applied at this pin. Conforming to RS-232 standard, the bytes are input LSB first. The voltage applied at RX must not exceed 3.6V. TX: This pin is used to output the serial data. The bytes are output LSB first. The 73S1209F has several UART-related read/write registers. All UART transfers are programmable for parity enable, parity select, 2 stop bits/1 stop bit and XON/XOFF options for variable communication baud rates from 300 to 115200 bps. Table 33 shows the selectable UART operation modes and Table 34 shows how the baud rates are calculated. Table 33: UART Modes UART 0 Mode 0 Mode 1 Mode 2 Mode 3 N/A Start bit, 8 data bits, stop bit, variable baud rate (internal baud rate generator or timer 1) Start bit, 8 data bits, parity, stop bit, fixed baud rate 1/32 or 1/64 of fCKMPU Start bit, 8 data bits, parity, stop bit, variable baud rate (internal baud rate generator or timer 1) UART 1 Start bit, 8 data bits, parity, stop bit, variable baud rate (internal baud rate generator) Start bit, 8 data bits, stop bit, variable baud rate (internal baud rate generator) N/A N/A
Note: Parity of serial data is available through the P flag of the accumulator. Seven-bit serial modes with parity, such as those used by the FLAG protocol, can be simulated by setting and reading bit 7 of 8-bit output data. Seven-bit serial modes without parity can be simulated by setting bit 7 to a constant 1.8-bit serial modes with parity can be simulated by setting and reading the 9th bit, using the control bits S0CON3 and S1CON3 in the S0COn and S1CON SFRs. Table 34: Baud Rate Generation Using Timer 1 Serial Interface 0 Serial Interface 1 2
smod
Using Internal Baud Rate Generator 2smod * fCKMPU/(64 * (210-S0REL)) fCKMPU/(32 * (210-S1REL))
* fCKMPU/ (384 * (256-TH1)) N/A
Note: S0REL (9:0) and S1REL (9:0) are 10-bit values derived by combining bits from the respective timer reload registers SxRELH (bits 1:0) and SxRELL (bits 7:0). TH1 is the high byte of timer 1. The SMOD bit is located in the PCON SFR.
Rev. 1.2
39
73S1209F Data Sheet Power Control Register 0 (PCON): 0x87 0x00
DS_1209F_004
The SMOD bit used for the baud rate generator is set up via this register. Table 35: The PCON Register MSB SMOD Bit PCON.7 PCON.6 PCON.5 PCON.4 PCON.3 PCON.2 PCON.1 PCON.0 - Symbol SMOD - - - GF1 GF0 STOP IDLE General purpose flag 1. General purpose flag 1. Sets CPU to Stop mode. Sets CPU to Idle mode. 0x00 - - GF1 GF0 Function If SM0D = 1, the baud rate is doubled. STOP LSB IDLE
Baud Rate Control Register 0 (BRCON): 0xD8
The BSEL bit used to enable the baud rate generator is set up via this register. Table 36: The BRCON Register MSB BSEL Bit BRCON.7 BRCON.6 BRCON.5 BRCON.4 BRCON.3 BRCON.2 BRCON.1 BRCON.0 - Symbol BSEL - - - - - - - . - - - - Function If BSEL = 0, the baud rate is derived using timer 1. If BSEL = 1 the baud rate generator circuit is used. - LSB -
40
Rev. 1.2
DS_1209F_004 Miscellaneous Control Register 0 (MISCtl0): 0xFFF1 0x00
73S1209F Data Sheet
Transmit and receive (TX and RX) pin selection and loop back test configuration are set up via this register. Table 37: The MISCtl0 Register MSB PWRDN Bit MISCtl0.7 MISCtl0.6 MISCtl0.5 MISCtl0.4 MISCtl0.3 MISCtl0.2 - - - - - SLPBK LSB SSEL
Symbol PWRDN - - - - -
Function This bit places the 73S1209F into a power down state.
MISCtl0.1
SLPBK
1 = UART loop back testing mode. The pins TXD and RXD are to be connected together externally (with SLPBK =1) and therefore: SLPBK SSEL Mode 0 0 normal using Serial_0 0 1 normal using Serial_1 1 0 Serial_0 TX feeds Serial_1 RX 1 1 Serial_1 TX feeds Serial_0 RX Selects either Serial_1 if set =1 or Serial_0 if set = 0 to be connected to RXD and TXD pins.
MISCtl0.0
1.7.4.1
SSEL
Serial Interface 0
The Serial Interface 0 can operate in four modes: * Mode 0 Pin RX serves as input and output. TX outputs the shift clock. Eight bits are transmitted with the LSB first. The baud rate is fixed at 1/12 of the crystal frequency. Reception is initialized in Mode 0 by setting the flags in S0CON as follows: RI0 = 0 and REN0 = 1. In other modes, a start bit when REN0 = 1 starts receiving serial data. Mode 1 Pin RX serves as input, and TX serves as serial output. No external shift clock is used, 10 bits are transmitted: a start bit (always 0), 8 data bits (LSB first), and a stop bit (always 1). On receive, a start bit synchronizes the transmission, 8 data bits are available by reading S0BUF, and stop bit sets the flag RB80 in the Special Function Register S0CON. In mode 1 either internal baud rate generator or timer 1 can be use to specify baud rate. Mode 2 This mode is similar to Mode 1, with two differences. The baud rate is fixed at 1/32 or 1/64 of oscillator frequency and 11 bits are transmitted or received: a start bit (0), 8 data bits (LSB first), a programmable 9th bit, and a stop bit (1). The 9th bit can be used to control the parity of the serial interface: at transmission, bit TB80 in S0CON is output as the 9th bit, and at receive, the 9th bit affects RB80 in Special Function Register S0CON. Mode 3 The only difference between Mode 2 and Mode 3 is that in Mode 3 either internal baud rate generator or timer 1 can be use to specify baud rate.
*
*
*
The S0BUF register is used to read/write data to/from the serial 0 interface.
Rev. 1.2
41
73S1209F Data Sheet Serial Interface 0 Control Register (S0CON): 0x9B 0x00
DS_1209F_004
Transmit and receive data are transferred via this register. Table 38: The S0CON Register MSB SM0 Bit S0CON.7 SM1 SM20 REN0 TB80 RB80 Function These two bits set the UART0 mode: Mode 0 S0CON.6 SM1 1 2 3 S0CON.5 S0CON.4 S0CON.3 SM20 REN0 TB80 Description N/A 8-bit UART 9-bit UART 9-bit UART SM0 0 0 1 1 SM1 0 1 0 1 TI0 LSB RI0
Symbol SM0
Enables the inter-processor communication feature. If set, enables serial reception. Cleared by software to disable reception. The 9th transmitted data bit in Modes 2 and 3. Set or cleared by the MPU, depending on the function it performs (parity check, multiprocessor communication etc.). In Modes 2 and 3 it is the 9th data bit received. In Mode 1, if SM20 is 0, RB80 is the stop bit. In Mode 0 this bit is not used. Must be cleared by software. Transmit interrupt flag, set by hardware after completion of a serial transfer. Must be cleared by software. Receive interrupt flag, set by hardware after completion of a serial reception. Must be cleared by software.
S0CON.2
RB80
S0CON.1 S0CON.0
TI0 RI0
1.7.4.2
Serial Interface 1
The Serial Interface 1 can operate in 2 modes: * Mode A This mode is similar to Mode 2 and 3 of Serial interface 0, 11 bits are transmitted or received: a start bit (0), 8 data bits (LSB first), a programmable 9th bit, and a stop bit (1). The 9th bit can be used to control the parity of the serial interface: at transmission, bit TB81 in S1CON is outputted as the 9th bit, and at receive, the 9th bit affects RB81 in Special Function Register S1CON. The only difference between Mode 3 and A is that in Mode A only the internal baud rate generator can be use to specify baud rate. Mode B This mode is similar to Mode 1 of Serial interface 0. Pin RX serves as input, and TX serves as serial output. No external shift clock is used, 10 bits are transmitted: a start bit (always 0), 8 data bits (LSB first), and a stop bit (always 1). On receive, a start bit synchronizes the transmission, 8 data bits are available by reading S1BUF, and stop bit sets the flag RB81 in the Special Function Register S1CON. In mode 1, the internal baud rate generator is use to specify the baud rate.
*
The S1BUF register is used to read/write data to/from the serial 1 interface.
42
Rev. 1.2
DS_1209F_004 Serial Interface Control Register (S1CON): 0x9B 0x00
73S1209F Data Sheet
The function of the serial port depends on the setting of the Serial Port Control Register S1CON. Table 39: The S1CON Register MSB SM Bit S1CON.7 - Symbol SM SM 0 1 S1CON.6 S1CON.5 S1CON.4 S1CON.3 - SM21 REN1 TB81 Enables the inter-processor communication feature. If set, enables serial reception. Cleared by software to disable reception. The 9th transmitted data bit in Mode A. Set or cleared by the MPU, depending on the function it performs (parity check, multiprocessor communication etc.). In Mode B, if sm21 is 0, rb81 is the stop bit. Must be cleared by software. Transmit interrupt flag, set by hardware after completion of a serial transfer. Must be cleared by software. Receive interrupt flag, set by hardware after completion of a serial reception. Must be cleared by software. Mode A B SM21 REN1 TB81 RB81 Function Sets the UART operation mode. Description 9-bit UART 8-bit UART Baud Rate variable variable TI1 LSB RI1
S1CON.2 S1CON.1 S1CON.0
RB81 TI1 RI1
Multiprocessor operation mode: The feature of receiving 9 bits in Modes 2 and 3 of Serial Interface 0 or in Mode A of Serial Interface 1 can be used for multiprocessor communication. In this case, the slave processors have bit SM20 in S0CON or SM21 in S1CON set to 1. When the master processor outputs slave's address, it sets the 9th bit to 1, causing a serial port receive interrupt in all the slaves. The slave processors compare the received byte with their network address. If there is a match, the addressed slave will clear SM20 or SM21 and receive the rest of the message, while other slaves will leave the SM20 or SM21 bit unaffected and ignore this message. After addressing the slave, the host will output the rest of the message with the 9th bit set to 0, so no serial port receive interrupt will be generated in unselected slaves.
Rev. 1.2
43
73S1209F Data Sheet
DS_1209F_004
1.7.5
Timers and Counters
The 80515 has two 16-bit timer/counter registers: Timer 0 and Timer 1. These registers can be configured for counter or timer operations. In timer mode, the register is incremented every machine cycle, meaning that it counts up after every 12 periods of the MPU clock signal. In counter mode, the register is incremented when the falling edge is observed at the corresponding input signal T0 or T1 (T0 and T1 are the timer gating inputs derived from USR[0:7] pins, see the User (USR) Ports section). Since it takes 2 machine cycles to recognize a 1-to-0 event, the maximum input count rate is 1/2 of the oscillator frequency. There are no restrictions on the duty cycle, however to ensure proper recognition of 0 or 1 state, an input should be stable for at least 1 machine cycle. Four operating modes can be selected for Timer 0 and Timer 1. Two Special Function Registers (TMOD and TCON) are used to select the appropriate mode. The Timer 0 load registers are designated as TL0 and TH0 and the Timer 1 load registers are designated as TL1 and TH1. Timer/Counter Mode Control Register (TMOD): 0x89 0x00
Table 40: The TMOD Register MSB GATE C/T M1 M0 GATE C/T M1 Timer 1 Timer 0 LSB M0
Bits TR1 and TR0 in the TCON register start their associated timers when set. Table 41: TMOD Register Bit Description Bit TMOD.7 TMOD.3 Symbol Gate Function If set, enables external gate control (USR pin(s) connected to T0 or T1 for Counter 0 or 1, respectively). When T0 or T1 is high, and TRx bit is set (see the TCON register), a counter is incremented every falling edge on T0 or T1 input pin. If not set, the TRx bit controls the corresponding timer. Selects Timer or Counter operation. When set to 1, the counter operation is performed based on the falling edge of T0 or T1. When cleared to 0, the corresponding register will function as a timer. Selects the mode for Timer/Counter 0 or Timer/Counter 1, as shown in the TMOD description. Selects the mode for Timer/Counter 0 or Timer/Counter 1, as shown in the TMOD description.
TMOD.6 TMOD.2 TMOD.5 TMOD.1 TMOD.4 TMOD.0
C/T
M1 M0
44
Rev. 1.2
DS_1209F_004 Table 42: Timers/Counters Mode Description M1 0 0 1 1 M0 0 1 0 1 Mode Mode 0 Mode 1 Mode 2 Mode 3 13-bit Counter/Timer. 16-bit Counter/Timer. 8-bit auto-reload Counter/Timer. Function
73S1209F Data Sheet
If Timer 1 M1 and M0 bits are set to '1', Timer 1 stops. If Timer 0 M1 and M0 bits are set to '1', Timer 0 acts as two independent 8-bit Timer/Counters.
Mode 0 Putting either timer/counter into mode 0 configures it as an 8-bit timer/counter with a divide-by-32 prescaler. In this mode, the timer register is configured as a 13-bit register. As the count rolls over from all 1's to all 0's, it sets the timer overflow flag TF0. The overflow flag TF0 then can be used to request an interrupt. The counted input is enabled to the timer when TRx = 1 and either GATE = 0 or TX = 1 (setting GATE = 1 allows the timer to be controlled by external input TX, to facilitate pulse width measurements). TRx are control bits in the special function register TCON; GATE is in TMOD. The 13-bit register consists of all 8 bits of TH1 and the lower 5 bits of TL0. The upper 3 bits of TL0 are indeterminate and should be ignored. Setting the run flag (TRx) does not clear the registers. Mode 0 operation is the same for timer 0 as for timer 1. Mode 1 Mode 1 is the same as mode 0, except that the timer register is run with all 16 bits. Mode 2 Mode 2 configures the timer register as an 8-bit counter (TLx) with automatic reload. The overflow from TLx not only sets TFx, but also reloads TLx with the contents of THx, which is preset by software. The reload leaves THx unchanged. Mode 3 Mode 3 has different effects on timer 0 and timer 1. Timer 1 in mode 3 simply holds its count. The effect is the same as setting TR1 = 0. Timer 0 in mode 3 establishes TL0 and TH0 as two separate counters. TL0 uses the timer 0 control bits: C/T, GATE, TR0, INT0, and TF0. TH0 is locked into a timer function (counting machine cycles) and takes over the use of TR1 and TF1 from timer 1. Thus, TH0 now controls the "timer 1" interrupt. Mode 3 is provided for applications requiring an extra 8-bit timer or counter. When timer 0 is in mode 3, timer 1 can be turned on and off by switching it out of and into its own mode 3, or can still be used by the serial channel as a baud rate generator, or in fact, in any application not requiring an interrupt from timer 1 itself.
Rev. 1.2
45
73S1209F Data Sheet Timer/Counter Control Register (TCON): 0x88 0x00
DS_1209F_004
Table 43: The TCON Register MSB TF1 Bit TCON.7 TCON.6 TCON.5 TCON.4 TCON.3 TCON.2 TCON.1 TCON.0 TR1 TF0 TR0 IE1 IT1 Function The Timer 1 overflow flag is set by hardware when Timer 1 overflows. This flag can be cleared by software and is automatically cleared when an interrupt is processed. Timer 1 Run control bit. If cleared, Timer 1 stops. Timer 0 overflow flag set by hardware when Timer 0 overflows. This flag can be cleared by software and is automatically cleared when an interrupt is processed. Timer 0 Run control bit. If cleared, Timer 0 stops. External Interrupt 1 edge flag. External interrupt 1 type control bit. External Interrupt 0 edge flag. External Interrupt 0 type control bit. IE0 LSB IT0
Symbol TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0
1.7.6
WD Timer (Software Watchdog Timer)
The software watchdog timer is a 16-bit counter that is incremented once every 24 or 384 clock cycles. After a reset, the watchdog timer is disabled and all registers are set to zero. The watchdog consists of a 16-bit counter (WDT), a reload register (WDTREL), prescalers (by 2 and by 16), and control logic. Once the watchdog starts, it cannot be stopped unless the internal reset signal becomes active. WD Timer Start Procedure: The WDT is started by setting the SWDT flag. When the WDT register enters the state 0x7CFF, an asynchronous WDTS signal will become active. The signal WDTS sets bit 6 in the IP0 register and requests a reset state. WDTS is cleared either by the reset signal or by changing the state of the WDT timer. Refreshing the WD Timer: The watchdog timer must be refreshed regularly to prevent the reset request signal from becoming active. This requirement imposes an obligation on the programmer to issue two instructions. The first instruction sets WDT and the second instruction sets SWDT. The maximum delay allowed between setting WDT and SWDT is 12 clock cycles. If this period has expired and SWDT has not been set, WDT is automatically reset, otherwise the watchdog timer is reloaded with the content of the WDTREL register and WDT is automatically reset.
46
Rev. 1.2
DS_1209F_004 Interrupt Enable 0 Register (IEN0): 0xA8 0x00
73S1209F Data Sheet
Table 44: The IEN0 Register MSB EAL Bit IEN0.7 IEN0.6 Symbol EAL WDT EAL = 0 - disable all interrupts. Watchdog timer refresh flag. Set to initiate a refresh of the watchdog timer. Must be set directly before SWDT is set to prevent an unintentional refresh of the watchdog timer. WDT is reset by hardware 12 clock cycles after it has been set. IEN0.5 IEN0.4 IEN0.3 IEN0.2 IEN0.1 IEN0.0 - ES0 ET1 EX1 ET0 EX0 ES0 = 0 - disable serial channel 0 interrupt. ET1 = 0 - disable timer 1 overflow interrupt. EX1 = 0 - disable external interrupt 1. ET0 = 0 - disable timer 0 overflow interrupt. EX0 = 0 - disable external interrupt 0. 0x00 WDT ET2 ES0 ET1 EX1 Function ET0 LSB EX0
Interrupt Enable 1 Register (IEN1): 0xB8
Table 45: The IEN1 Register MSB - Bit IEN1.7 IEN1.6 Symbol - SWDT Watchdog timer start/refresh flag. Set to activate/refresh the watchdog timer. When directly set after setting WDT, a watchdog timer refresh is performed. Bit SWDT is reset by the hardware 12 clock cycles after it has been set. EX6 = 0 - disable external interrupt 6. EX5 = 0 - disable external interrupt 5. EX4 = 0 - disable external interrupt 4. EX3 = 0 - disable external interrupt 3. EX2 = 0 - disable external interrupt 2. SWDT EX6 EX5 EX4 EX3 Function EX2 LSB
IEN1.5 IEN1.4 IEN1.3 IEN1.2 IEN1.1 IEN1.0
EX6 EX5 EX4 EX3 EX2 -
Rev. 1.2
47
73S1209F Data Sheet Interrupt Priority 0 Register (IP0): 0xA9 0x00
DS_1209F_004
Table 46: The IP0 Register MSB - Bit IP0.6 WDTS IP0.5 IP0.4 IP0.3 IP0.2 Function Watchdog timer status flag. Set when the watchdog timer has expired. The internal reset will be generated, but this bit will not be cleared by the reset. This allows the user program to determine if the watchdog timer caused the reset to occur and respond accordingly. Can be read and cleared by software. IP0.1 LSB IP0.0
Symbol WDTS
Note: The remaining bits in the IP0 register are not used for watchdog control. Watchdog Timer Reload Register (WDTREL): 0x86 0x00
Table 47: The WDTREL Register MSB LSB WDPSEL WDREL6 WDREL5 WDREL4 WDREL3 WDREL2 WDREL1 WDREL0 Bit WDTREL.7 WDTREL.6 to WDTREL.0 Symbol WDPSEL WDREL6-0 Function Prescaler select bit. When set, the watchdog is clocked through an additional divide-by-16 prescaler. Seven bit reload value for the high-byte of the watchdog timer. This value is loaded to the WDT when a refresh is triggered by a consecutive setting of bits WDT and SWDT.
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DS_1209F_004
73S1209F Data Sheet
1.7.7
User (USR) Ports
The 73S1209F includes 9 pins of general purpose digital I/O (GPIO). On reset or power-up, all USR pins are inputs until they are configured for the desired direction. The pins are configured and controlled by the USR and UDIR SFRs. Each pin declared as USR can be configured independently as an input or output with the bits of the UDIRn registers. Table 48 lists the direction registers and configurability associated with each group of USR pins. USR pins 0 to 7 are multiple use pins that can be used for general purpose I/O, external interrupts and timer control. Table 49 shows the configuration for a USR pin through its associated bit in its UDIR register. Values read from and written into the GPIO ports use the data registers USR70 and USR8. Note: After reset, all USR pins are defaulted as inputs and pulled up to VDD until any write to the corresponding UDIR register is performed. This insures all USR pins are set to a known value until set by the firmware. Unused USR pins can be set for output if unused and unconnected to prevent them from floating. Alternatively, unused USR pins can be set for input and tied to ground or VDD. Table 48: Direction Registers and Internal Resources for DIO Pin Groups Direction Register Name UDIR70 UDIR8 Direction Register (SFR) Location 0x91 [7:0] 0xA1 [0] Data Register Name USR70 USR8 Data Register (SFR) Location 0x90 [7:0] 0xA0 [0]
USR Pin Group USR_0...USR_7 USR_8
Type Multi-use GPIO only
Table 49: UDIR Control Bit UDIR Bit 0 USR Pin Function output 1 input
Four XRAM SFR registers (USRIntCtl1, USRIntCtl2, USRIntCtl3, and USRIntCtl4) control the use of the USR [7:0] pins. Each of the USR [7:0] pins can be configured as GPIO or individually be assigned an internal resource such as an interrupt or a timer/counter control. Each of the four registers contains two 3-bit configuration words named UxIS (where x corresponds to the USR pin). The control resources selectable for the USR pins are listed in Table 74 through Table 78. If more than one input is connected to the same resource, the resources are combined using a logical OR. Table 50: Selectable Controls Using the UxIS Bits UxIS Value 0 1 2 3 4 5 6 7 Resource Selected for USRx Pin None None T0 (counter0 gate/clock) T1 (counter1 gate/clock) Interrupt 0 rising edge/high level on USRx Interrupt 1 rising edge/high level on USRx Interrupt 0 falling edge/low level on USRx Interrupt 1 falling edge/low level on USRx
Note: x denotes the corresponding USR pin. Interrupt edge or level control is assigned in the IT0 and IT1 bits in the TCON register.
Rev. 1.2
49
73S1209F Data Sheet External Interrupt Control Register (USRIntCtl1) : 0xFF90 0x00
DS_1209F_004
Table 51: The USRIntCtl1 Register MSB - U1IS.6 U1IS.5 U1IS.4 - U0IS.2 0x00 U0IS.1 LSB U0IS.0
External Interrupt Control Register (USRIntCtl2) : 0xFF91
Table 52: The USRIntCtl2 Register MSB - U3IS.6 U3IS.5 U3IS.4 - U2IS.2 0x00 U2IS.1 LSB U2IS.0
External Interrupt Control Register (USRIntCtl3) : 0xFF92
Table 53: The USRIntCtl3 Register MSB - U5IS.6 U5IS.5 U5IS.4 - U4IS.2 0x00 U4IS.1 LSB U4IS.0
External Interrupt Control Register (USRIntCtl4) : 0xFF93
Table 54: The USRIntCtl4 Register MSB - U7IS.6 U7IS.5 U7IS.4 - U6IS.2 U6IS.1 LSB U6IS.0
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Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
1.7.8
Analog Voltage Comparator
The 73S1209F includes a programmable comparator that is connected to the ANA_IN pin. The comparator can be configured to trigger an interrupt if the input voltage rises above or falls below a selectable threshold voltage. The comparator control register should not be modified when the analog interrupt (ANAIEN bit in the INT6Ctl register) is enabled to guard against any false interrupt that might be generated when modifying the threshold. The comparator has a built-in hysteresis to prevent the comparator from repeatedly responding to low-amplitude noise. This hysteresis is approximately 20mV. Interrupt control is handled in the INT6Ctl register. Analog Compare Control Register (ACOMP): 0xFFD0 0x00
Table 55: The ACOMP Register MSB ANALVL Bit ACOMP.7 ACOMP.6 ACOMP.5 ACOMP.4 ACOMP.3 ACOMP.2 ACOMP.1 Symbol ANALVL ONCHG CPOL CMPEN TSEL.2 TSEL.1 If set, the Ana_interrupt is invoked on any change above or below the threshold, bit 4 is ignored. If set = 1, Ana_interrupt is invoked when signal rises above selected threshold. If set = 0, Ana_interrupt is invoked when signal goes below selected threshold (default). Enables power to the analog comparator. 1= Enabled. 0 = Disabled (default). Sets the voltage threshold for comparison to the voltage on pin ANA_IN. Thresholds are as follows: TSEL.2 TSEL.1 TSEL.0 Voltage Threshold 0 0 0 1.00V 0 0 1 1.24V 0 1 0 1.40V 0 1 1 1.50V 1 0 0 1.75V 1 0 1 2.00V 1 1 0 2.30V 1 1 1 2.50V - ONCHG CPOL CMPEN LSB TSEL.2 TSEL.1 TSEL.0
Function When read, indicates whether the input level is above or below the threshold. This is a real time value and is not latched, so it may change from the time of the interrupt trigger until read.
ACOMP.0
TSEL.0
Rev. 1.2
51
73S1209F Data Sheet External Interrupt Control Register (INT6Ctl): 0xFF95 0x00
DS_1209F_004
Table 56: The INT6Ctl Register MSB - Bit INT6Ctl.7 INT6Ctl.6 INT6Ctl.5 INT6Ctl.4 INT6Ctl.3 INT6Ctl.2 INT6Ctl.1 Symbol - - VFTIEN VFTINT I2CIEN I2CINT ANIEN VDD fault interrupt enable. VDD fault interrupt flag. I2C interrupt enabled. I2C interrupt flag. If ANIEN = 1 Analog Compare event interrupt is enabled. When masked (ANIEN = 0), ANINT (bit 0) may be set, but no interrupt is generated. (Read Only) Set when the selected ANA_IN signal changes with respect to the selected threshold if Compare_Enable is asserted. Cleared on read of register. - VFTIEN VFTINT I2CIEN I2CINT Function ANIEN LSB ANINT
INT6Ctl.0
ANINT
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DS_1209F_004
73S1209F Data Sheet
1.7.9
LED Drivers
The 73S1209F provides two dedicated output pins for driving LEDs. The LED driver pins can be configured as current sources that will pull to ground to drive LEDs that are connected to VDD without the need for external current limiting resistors. These pins may be used as general purpose outputs with the programmed pull-down current and a strong (CMOS) pull-up, if enabled. The analog block must be enabled when these outputs are being used to drive the selected output current. The pins may be used as inputs with consideration of the programmed output current and level. The register bit when read, indicates the state of the pin. LED Control Register (LEDCtl): 0xFFF3 0xFF
Table 57: The LEDCtl Register MSB - Bit LEDCtl.7 LEDCtl.6 LEDCtl.5 LPUEN ISET.1 ISET.0 - - LSB LEDD 1 LEDD0
Symbol - LPUEN ISET.1
Function 0 = Pull-ups are enabled for all of the LED pins. These two bits control the drive current (to ground) for all of the LED driver pins. Current levels are: 00 = 0ma(off) 01 = 2ma 10 = 4ma 11 = 10ma
LEDCtl.4 LEDCtl.3 LEDCtl.2 LEDCtl.1 LEDCtl.0
ISET.0 - - LEDD1 LEDD0
Write data controls output level of pin LED1. Read will report level of pin LED1. Write data controls output level of pin LED0. Read will report level of pin LED0.
Rev. 1.2
53
73S1209F Data Sheet
DS_1209F_004
1.7.10 I2C Master Interface
The 73S1209F includes a dedicated fast mode, 400kHz I2C Master interface. The I2C interface can read or write 1 or 2 bytes of data per data transfer frame. The MPU communicates with the interface through six dedicated SFR registers: * * * * * * Device Address (DAR) Write Data (WDR) Secondary Write Data (SWDR) Read Data (RDR) Secondary Read Data (SRDR) Control and Status (CSR)
The DAR register is used to set up the slave address and specify if the transaction is a read or write operation. The CSR register sets up, starts the transaction and reports any errors that may occur. When the I2C transaction is complete, the I2C interrupt is reported via external interrupt 6. The I2C interrupt is automatically de-asserted when a subsequent I2C transaction is started. The I2C interface uses a 400kHz clock from the time-base circuits.
1.7.10.1 I2C Write Sequence
To write data on the I2C Master Bus, the 80515 has to program the following registers according to the following sequence: 1. Write slave device address to Device Address register (DAR). The data contains 7 bits for the slave device address and 1 bit of op-code. The op-code bit should be written with a 0 to indicate a write operation. 2. Write data to Write Data register (WDR). This data will be transferred to the slave device. 3. If writing 2 bytes, set bit 0 of the Control and Status register (CSR) and load the second data byte to Secondary Write Data register (SWDR). 4. Set bit 1 of the CSR register to start I2C Master Bus. 5. Wait for I2C interrupt to be asserted. It indicates that the write on I2C Master Bus is done. Refer to information about the INT6Ctl, IEN1 and IRCON register for masking and flag operation.
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Rev. 1.2
DS_1209F_004 Figure 9 shows the timing of the I2C write mode.
Transfer length (CSR bit0) Start I2C (CSR bit1)
73S1209F Data Sheet
I2C_Interrupt SDA Device Address [7:0] MSB 1-7 LSB 8 9 ACK bit Write Data [7:0 MSB 10-17 LSB 18 ACK bit
SCL
START condition
STOP condition
Transfer length (CSR bit0) Start I2C (CSR bit1)
I2C_Interrupt SDA Device Address [7:0] MSB 1-7 LSB 8 9 ACK bit Write Data [7:0] MSB 10-17 LSB 18 ACK bit Secondary Write Data [7:0] MSB 19-26 LSB 27 ACK bit
SCL
START condition
STOP condition
Figure 9: I2C Write Mode Operation
1.7.10.2 I2C Read Sequence
To read data on the I2C Master Bus from a slave device, the 80515 has to program the following registers in this sequence: 1. Write slave device address to Device Address register (DAR). The data contains 7 bits device address and 1 bit of op-code. The op-code bit should be written with a 1. 2. Write control data to Control and Status register (CSR). Write a 1 to bit 1 to start I2C Master Bus. Also write a 1 to bit 0 if the Secondary Read Data register (SRDR) is to be captured from the I2C Slave device. 3. Wait for I2C interrupt to be asserted. It indicates that the read operation on the I2C bus is done. Refer to information about the INT6Ctl, IEN1 and IRCON registers for masking and flag operation. 4. Read data from the Read Data register (RDR). 5. Read data from Secondary Read Data register (SRDR) if bit 0 of Control and Status register (CSR) is written with a 1.
Rev. 1.2
55
73S1209F Data Sheet Figure 10 shows the timing of the I2C read mode.
Transfer length (CSR bit0) Start I2C (CSR bit1)
DS_1209F_004
I2c_Interrupt SDA Device Address [7:0] MSB 1-7 LSB 8 9 ACK bit Read Data [7:0 MSB 10-17 LSB 18 No ACK bit
SCL
START condition
STOP condition
Transfer length (CSR bit0) Start I2C (CSR bit1)
I2c_Interrupt SDA Device Address [7:0] MSB 1-7 LSB 8 9 ACK bit Read Data [7:0] MSB 10-17 LSB 18 ACK bit 19-26 27 No ACK bit Secondary Read Data[7:0]
SCL
START condition
STOP condition
Figure 10: I2C Read Operation
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Rev. 1.2
DS_1209F_004 Device Address Register (DAR): 0xFF80 0x00
73S1209F Data Sheet
Table 58: The DAR Register MSB DVADR.6 Bit DAR.7 DAR.6 DAR.5 DAR.4 DAR.3 DAR.2 DAR.1 DAR.0 I2CRW If set = 0, the transaction is a write operation. If set = 1, read. 0x00 DVADR [0:6] Slave device address. DVADR.5 DVADR.4 DVADR.3 DVADR.2 DVADR.1 DVADR.0 LSB I2CRW
Symbol
Function
I2C Write Data Register (WDR): 0XFF81
Table 59: The WDR Register MSB WDR.7 Bit WDR.7 WDR.6 WDR.5 WDR.4 WDR.3 WDR.2 WDR.1 WDR.0 Data to be written to the I2C slave device. WDR.6 WDR.5 WDR.4 WDR.3 Function WDR.2 WDR.1 LSB WDR.0
Rev. 1.2
57
73S1209F Data Sheet I2C Secondary Write Data Register (SWDR): 0XFF82 0x00
DS_1209F_004
Table 60: The SWDR Register MSB SWDR.7 Bit SWDR.7 SWDR.6 SWDR.5 SWDR.4 SWDR.3 SWDR.2 SWDR.1 SWDR.0 I2C Read Data Register (RDR): 0XFF83 0x00 Second Data byte to be written to the I2C slave device if bit 0 (I2CLEN) of the Control and Status register (CSR) is set = 1. SWDR.6 SWDR.5 SWDR.4 SWDR.3 SWDR.2 SWDR.1 LSB SWDR.0
Function
Table 61: The RDR Register MSB RDR.7 Bit RDR.7 RDR.6 RDR.5 RDR.4 RDR.3 RDR.2 RDR.1 RDR.0 Data read from the I2C slave device. RDR.6 RDR.5 RDR.4 RDR.3 Function RDR.2 RDR.1 LSB RDR.0
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Rev. 1.2
DS_1209F_004 I2C Secondary Read Data Register (SRDR): 0XFF84 0x00
73S1209F Data Sheet
Table 62: The SRDR Register MSB SRDR.7 Bit SRDR.7 SRDR.6 SRDR.5 SRDR.4 SRDR.3 SRDR.2 SRDR.1 SRDR.0 I2C Control and Status Register (CSR): 0xFF85 0x00 Second Data byte to be read from the I2C slave device if bit 0 (I2CLEN) of the Control and Status register (CSR) is set = 1. SRDR.6 SRDR.5 SRDR.4 SRDR.3 SRDR.2 SRDR.1 LSB SRDR.0
Function
Table 63: The CSR Register MSB - Bit CSR.7 CSR.6 CSR.5 CSR.4 CSR.3 CSR.2 Symbol - - - - - AKERR Set to 1 if acknowledge bit from Slave Device is not 0. Automatically reset when the new bus transaction is started. Write a 1 to start I2C transaction. Automatically reset to 0 when the bus transaction is done. This bit should be treated as a "busy" indicator on reading. If it is high, the serial read/write operations are not completed and no new address or data should be written. Set to 1 for 2-byte read or write operations. Set to 0 for 1-byte operations. - - - - AKERR Function I2CST LSB I2CLEN
CSR.1 CSR.0
I2CST I2CLEN
Rev. 1.2
59
73S1209F Data Sheet External Interrupt Control Register (INT6Ctl): 0xFF95 0x00
DS_1209F_004
Table 64: The INT6Ctl Register MSB - Bit INT6Ctl.7 INT6Ctl.6 INT6Ctl.5 INT6Ctl.4 INT6Ctl.3 INT6Ctl.2 INT6Ctl.1 INT6Ctl.0 Symbol - - VFTIEN VFTINT I2CIEN I2CINT ANIEN ANINT VDD fault interrupt enable. VDD fault interrupt flag. When set = 1, the I2C interrupt is enabled. When set =1, the I2C transaction has completed. Cleared upon the start of a subsequent I2C transaction. Analog compare interrupt enable. Analog compare interrupt flag. - VFTIEN VFTINT I2CIEN I2CINT ANIEN LSB ANINT
Function
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DS_1209F_004
73S1209F Data Sheet
1.7.11 Keypad Interface
The 73S1209F supports a 30-button (6 row x 5 column) keypad (SPST Mechanical Contact Switches) interface using 11 dedicated I/O pins. Figure 11 shows a simplified block diagram of the keypad interface.
KORDERL / H Registers
7 7 6 6 5 5 4 4 3 3 2 2 1 1 0 0
Column Scan Order
VDD
pull-up
Keypad Clock
COL4:0
Column Value 5 7 6 5 4 3 2 1 0
Scan
KCOL Register(1)
7 6 5 4 3 2 1 0
Keypad Clock Row Value 6 7 6 5 4 3 2 1 0
Debouncing
KROW Register
Key_Detect
7
6
5
4
3
2
1
0
6
KSTAT Register
0 Scan Time 1 2 3 4 5 6 7
Debounce Time
Hardware Scan Enable
Key_Detect_Enable
KSCAN Register
1kHz
73S1209F
Dividers
Figure 11: Simplified Keypad Block Diagram There are 5 drive lines (outputs) corresponding to columns and 6 sense lines (inputs) corresponding to rows. Hysteresis and pull-ups are provided on all inputs (rows), which eliminate the need for external resistors in the keypad. Key scanning happens by asserting one of the 5 column lines low and looking for a low on a sense line indicating that a key is pressed (switch closed) at the intersection of the drive/sense (col/row) line in the keypad. Key detection is performed by hardware with an incorporated debounce timer. Debouncing time is adjustable through the KSCAN Register. Internal hardware circuitry performs column scanning at an adjustable scanning rate and column scanning order through registers KSCAN and KORDERL / KORDERH. Key scanning is disabled at reset and must be enabled by firmware. When a valid key is detected, an interrupt is generated and the valid value of the pressed key is automatically Rev. 1.2 61
ROW5:0
If smaller keypad than 6 x 5 is to be implemented, unused row inputs should be connected to VDD. Unused column outputs should be left unconnected. (1) KCOL is normally used as Read only register. When hardware keyscan mode is disabled, this register is to be used by firmware to write the column data to handle firmware scanning.
KSIZE Register
VDD
pullup
73S1209F Data Sheet
DS_1209F_004
written into KCOL and KROW registers. The keypad interface uses a 1kHz clock derived from the 12MHz crystal. The clock is enabled by setting bit 6 - KBEN - in the MCLKCtl register (see the Oscillator and Clock Generation section) to carry out scanning and debouncing. The keypad size can be adjusted within the KSIZE register. Normal scanning is performed by hardware when the SCNEN bit is set to 1 in the KSTAT register. Figure 12 shows the flowchart of how the hardware scanning operates. In order to minimize power, scanning does not occur until a key-press is detected. Once hardware key scanning is enabled, the hardware drives all column outputs low and waits for a low to be detected on one of the inputs. When a low is detected on any row, and before key scanning starts, the hardware checks that the low level is still detected after a debounce time. The debounce time is defined by firmware in the KSCAN register (bits 7:0, DBTIME). Debounce times from 4ms to 256ms in 4ms increments are supported. If a key is not pressed after the debounce time, the hardware will go back to looking for any input to be low. If a key is confirmed to be pressed, key scanning begins. Key scanning asserts one of the 5 drive lines (COL 4:0) low and looks for a low on a sense line indicating that a key is pressed at the intersection of the drive/sense line in the keypad. After all sense lines have been checked without a key-press being detected, the next column line is asserted. The time between checking each sense line is the scan time and is defined by firmware in the KSCAN register (bits 0:1 - SCTIME). Scan times from 1ms to 4ms are supported. Scanning order does not affect the scan time. This scanning continues until the entire keypad is scanned. If only one key is pressed, a valid key is detected. Simultaneous key presses are not considered as valid (If two keys are pressed, no key is reported to firmware). Possible scrambling of the column scan order is provided by means of KORDERL and KORDERH registers that define the order of column scanning. Values in these registers must be updated every time a new keyboard scan order is desired. It is not possible to change the order of scanning the sense lines. The column and row intersection for the detected valid key are stored in the KCOL and KROW registers. When a valid key is detected, an interrupt is generated. Firmware can then read those registers to determine which key had been pressed. After reading the KCOL and KROW registers, the firmware can update the KORDERL / KORDERH registers if a new scan order is needed. When the SCNEN bit is enabled in the KSTAT register, the KCOL and KROW registers are only updated after a valid key has been identified. The hardware does not wait for the firmware to service the interrupt in order to proceed with the key scanning process. Once the valid key (or invalid key - e.g. two keys pressed) is detected, the hardware waits for the key to be released. Once the key is released, the debounce timer is started. If the key is not still released after the debounce time, the debounce counter starts again. After a key release, all columns will be driven low as before and the process will repeat waiting for any key to be pressed. When the SCNEN bit is disabled, all drive outputs are set to the value in the KCOL register. If firmware clears the SCNEN bit in the middle of a key scan, the KCOL register contains the last value stored in there which will then be reflected on the output pins. A bypass mode is provided so that the firmware can do the key scanning manually (SCNEN bit must be cleared). In bypass mode, the firmware writes/reads the Column and Row registers to perform the key scanning.
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Keypad Initialization All Column Outputs = 0
KSTAT Register: Enable HW Scanning Enable Keypad Interrupt
73S1209F Data Sheet
Any Row Input = 0 ? No Yes No Deboucing Timer
KSCAN Register: Debouncing Time
Any Row Input still = 0 ?
KSIZE Register: Keypad Size Definition KORDERL / H Registers: Column Scan Order
Keypad Scanning
KSCAN Register: Scanning Rate
More than 1 key
How Many keys have been detected? 1 key
0 key
Download of the key row and column values in KROW and KCOL registers Keypad Interrupt generation No Deboucing Timer Is (are) the key(s) released ? (*) No
KCOL Register: Value of the valid key column KROW Register: Value of the valid key row
KSTAT Register: Key Detect Interrupt
Yes
Is (are) the key(s) still released ? (*) Yes
KSCAN Register: Debouncing Time
Register Used to Control the hardware keypad interface Register written by the hardware keypad interface
(*) Key release is cheked by looking for a low level on any row.
Figure 12: Keypad Interface Flow Chart
Rev. 1.2
63
73S1209F Data Sheet Keypad Column Register (KCOL): 0xD1 0x1F
DS_1209F_004
This register contains the value of the column of a key detected as valid by the hardware. In bypass mode, this register firmware writes directly this register to carry out manual scanning. Table 65: The KCOL Register MSB - Bit KCOL.7 KCOL.6 KCOL.5 KCOL.4 KCOL.3 KCOL.2 KCOL.1 KCOL.0 Symbol - - - COL.4 COL.3 COL.2 COL.1 COL.0 Drive lines bit mapped to corresponding with pins COL(4:0). When a key is detected, firmware reads this register to determine column. In bypass (S/W keyscan) mode, Firmware writes this register directly. 0x1E = COL(0) low, all others high. 0x0F = COL(4) low, all others high. 0x1F = COL(4:0) all high. 0x3F - - COL.4 COL.3 COL.2 Function COL.1 LSB COL.0
Keypad Row Register (KROW): 0xD2
This register contains the value of the row of a key detected as valid by the hardware. In bypass mode, this register firmware reads directly this register to carry out manual detection. Table 66: The KROW Register MSB - Bit KROW.7 KROW.6 KROW.5 KROW.4 KROW.3 KROW.2 KROW.1 KROW.0 Symbol - - ROW.6 ROW.4 ROW.3 ROW.2 ROW.1 ROW.0 Sense lines bit mapped to correspond with pins ROW(5:0). When key detected, firmware reads this register to determine row. In bypass mode, firmware reads rows and has to determine if there was a key press or not. 0x3E = ROW(0) low, all others high. 0x1F = ROW(5) low, all others high. 0x3F = ROW(5:0) all high. - ROW.5 ROW.4 ROW.3 ROW.2 Function ROW.1 LSB ROW.0
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Rev. 1.2
DS_1209F_004 Keypad Scan Time Register (KSCAN): 0xD3 0x00
73S1209F Data Sheet
This register contains the values of scanning time and debouncing time. Table 67: The KSCAN Register MSB DBTIME.5 Bit KSCAN.7 KSCAN.6 KSCAN.5 KSCAN.4 KSCAN.3 KSCAN.2 KSCAN.1 KSCAN.0 DBTIME.4 Symbol DBTIME.5 DBTIME.4 DBTIME.3 DBTIME.2 DBTIME.1 DBTIME.0 SCTIME.1 SCTIME.0 Scan time in ms. 01 = 1ms, 02 = 2ms, 00 = 3ms, 00 = 4ms. Time between checking each key during keypad scanning. 0x00 De-bounce time in 4ms increments. 1 = 4ms de-bounce time, 0x3F = 252ms, 0x00 = 256ms. Key presses and key releases are de-bounced by this amount of time. DBTIME.3 DBTIME.2 DBTIME.1 DBTIME.0 LSB SCTIME.1 SCTIME.0
Function
Keypad Control/Status Register (KSTAT): 0xD4
This register is used to control the hardware keypad scanning and detection capabilities, as well as the keypad interrupt control and status. Table 68: The KSTAT Register MSB - Bit KSTAT.7 KSTAT.6 KSTAT.5 KSTAT.4 KSTAT.3 KSTAT.2 - Symbol - - - - KEYCLK HWSCEN The current state of the keyboard clock can be read from this bit. Hardware Scan Enable - When set, the hardware will perform automatic key scanning. When cleared, the firmware must perform the key scanning manually (bypass mode). Key Detect - When HWSCEN = 1 this bit is set causing an interrupt that indicates a valid key press was detected and the key location can be read from the Keypad Column and Row registers. When HWSCEN = 0, this bit is an interrupt which indicates a falling edge on any Row input if all Row inputs had been high previously (note: multiple Key Detect interrupts may occur in this case due to the keypad switch bouncing). In all cases, this bit is cleared when read. When HWSCEN = 0 and the keypad interface 1kHz clock is disabled, a key press will still set this bit and cause an interrupt. Key Detect Enable - When set, the KEYDET bit can cause an interrupt and when cleared the KEYDET cannot cause an interrupt. KEYDET can still get set even if the interrupt is not enabled. - - LSB KEYCLK HWSCEN KEYDET KYDTEN Function
KSTAT.1
KEYDET
KSTAT.0
KYDTEN
Rev. 1.2
65
73S1209F Data Sheet Keypad Scan Time Register (KSIZE): 0xD5 0x00
DS_1209F_004
This register is not applicable when HWSCEN is not set. Unused row inputs should be connected to VDD. Table 69: The KSIZE Register MSB - Bit KSIZE.7 KSIZE.6 KSIZE.5 KSIZE.4 KSIZE.3 KSIZE.2 KSIZE.1 KSIZE.0 - ROWSIZ.2 ROWSIZ.1 LSB ROWSIZ.0 COLSIZ.2 COLSIZ.1 COLSIZ.0 Function
Symbol - - ROWSIZ.2 ROWSIZ.1 ROWSIZ.0 COLSIZ.2 COLSIZ.1 COLSIZ.0
Defines the number of rows in the keypad. Maximum number is 6 given the number of row pins on the package. Allows for a reduced keypad size for scanning. Defines the number of columns in the keypad. Maximum number is 5 given the number of column pins on the package. Allows for a reduced keypad size for scanning. 0x00
Keypad Column LS Scan Order Register (KORDERL): 0xD6
In registers KORDERL and KORDERH, Column Scan Order(14:0) is grouped into 5 sets of 3 bits each. Each set determines which column (COL(4:0) pin) to activate by loading the column number into the 3 bits. When in HW_Scan_Enable mode, the hardware will step through the sets from 1Col to 5Col (up to the number of columns in Colsize) and scan the column defined in the 3 bits. To scan in sequential order, set a counting pattern with 0 in set 0, and 1 in set 1,and 2 in set 2, and 3 in set 3, and 4 in set 4. The firmware should update this as part of the interrupt service routine so that the new scan order is loaded prior to the next key being pressed. For example, to scan COL(0) first, 1Col(2:0) should be loaded with 000'b. To scan COL(4) fifth, 5Col(2:0) should be loaded with 100'b. Table 70: The KORDERL Register MSB 3COL.1 Bit KORDERL.7 KORDERL.6 KORDERL.5 KORDERL.4 KORDERL.3 KORDERL.2 KORDERL.1 KORDERL.0 3COL.0 Symbol 3COL.1 3COL.0 2COL.2 2COL.1 2COL.0 1COL.2 1COL.1 1COL.0 Column to scan 1st. Column to scan 2nd. Column to scan 3rd (lsb's). 2COL.2 2COL.1 2COL.0 1COL.2 Function 1COL.1 LSB 1COL.0
66
Rev. 1.2
DS_1209F_004 Keypad Column MS Scan Order Register (KORDERH): 0xD7 MSB - Bit KORDERH.7 KORDERH.6 KORDERH.5 KORDERH.4 KORDERH.3 KORDERH.2 KORDERH.1 KORDERH.0 5COL.2 Symbol - 5COL.2 5COL.1 5COL.0 4COL.2 4COL.1 4COL.0 3COL.2 Column to scan 3rd (msb). 0x00 Column to scan 4th. Column to scan 5th. 5COL.1 5COL.0 4COL.2 4COL.1 Function 0x00
73S1209F Data Sheet
Table 71: The KORDERH Register LSB 4COL.0 3COL.2
External Interrupt Control Register (INT5Ctl): 0xFF94
Table 72: The INT5Ctl Register MSB PDMUX Bit INT5Ctl.7 INT5Ctl.6 INT5Ctl.5 INT5Ctl.4 INT5Ctl.3 INT5Ctl.2 INT5Ctl.1 INT5Ctl.0 - RTCIEN RTCINT USBIEN USBINT Function Power down multiplexer control. When set =1, enables RTC interrupt. When set =1, indicates interrupt from Real Time Clock function. Cleared on read of register. USB interrupt enable. USB interrupt flag. Enables Keypad interrupt when set = 1. This bit indicates the Keypad logic has set Key_Detect bit and a key location may be read. Cleared on read of register. KPIEN LSB KPINT
Symbol PDMUX - RTCIEN RTCINT USBIEN USBINT KPIEN KPINT
1.7.12 Emulator Port
The emulator port, consisting of the pins E_RST, E_TCLK and E_RXTX, provides control of the MPU through an external in-circuit emulator. The E_TBUS[3:0] pins, together with the E_ISYNC/BRKRQ, add trace capability to the emulator. The emulator port is compatible with the ADM51 emulators manufactured by Signum Systems. If code trace capability is needed on this interface, 20pF capacitors (to ground) need to be added to allow the trace function capability to run properly. These capacitors should be attached to the TBUS0:3 and ISBR signals.
Rev. 1.2
67
73S1209F Data Sheet
DS_1209F_004
1.7.13 Smart Card Interface Function
The 73S1209F integrates one ISO-7816 (T=0, T=1) UART, one complete ICC electrical interface as well as an external smart card interface to allow multiple smart cards to be connected using the Teridian 8010 family of interface devices. Figure 13 shows the simplified block diagram of the card circuitry (UART + interfaces), with detail of dedicated XRAM registers.
ICC Event
SCInt SCIE
Card Interrupt Management
ICC Pwr_event
SParCtl SByteCtl FDReg SCCtl SCECtl SCPrtcol STXCtl STXData SRXCtl SRXData BGT/EGT BGT0/1/2/3/ CWT0/1 ATRMsB/LsB STSTO RLength
Card Insertion
PRES
UART T=0 T=1
Serial UART
Direct Mode
TX
RX
Activation / Deactivation Sequencer
VccCtl/ VccTMR VCC Card Generation
VCC
I/OExt. ICC
2-Byte Tx FIFO 2-Byte Rx FIFO
Card and Mode Selection
Bypass Mode
I/O ICC#1
Buffer / Level Shifter
I/O
Buffer / Level Shifter
RST
SCSel
SCCLK/SCSCLK
Buffer / Level Shifter
CLK
Timers
Buffer / Level Shifter
C4
Buffer / Level Shifter
C8
SCDir
SCCLK
CLK ICC 7.2MHz
Card Clock Management
Internal ICC Interface
CLKExt. ICC
SIO
SCLK
XRAM Registers
SCCLK/ SCSCLK
SCSCLK
External ICC Interface
Figure 13: Smart Card Interface Block Diagram Card interrupts are managed through two dedicated registers SCIE (Interrupt Enable to define which interrupt is enabled) and SCInt (Interrupt status). They allow the firmware to determine the source of an interrupt, that can be a card insertion / removal, card power fault, or a transmission (TX) or reception (RX) event / fault. It should be noted that even when card clock is disabled, an ICC interrupt can be generated 68 Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
on a card insertion / removal to allow power saving modes. Card insertion / removal is generated from the respective card switch detection inputs (whose polarity is programmable). The built-in ICC Interface has a low dropout regulator (VCC generator) capable of driving 1.8, 3.0 and 5.0V smart cards in accordance with the ISO-7816-3 and EMV4.0 standards. This converter requires a separate 5.0V input supply source designated as VPC. Auxiliary I/O lines C4 and C8 are only provided for the built-in interface. If support for the auxiliary lines is necessary for the external interfaces, they need to be handled manually through the USR GPIO pins. The external 8010 devices directly connect the I/O (SIO) and clock (SCLK) signals and control is handled via the I2C interface. Figure 14 shows how multiple 8010 devices can be connected to the 73S1209F.
VPC VPC PRES PRES VCC RST CLK C4 C8 I/O GND
SC1
SIO SCLK
73S1209F
INT SCL PRES SDA IOUC XTALIN SAD(0:2)
73S8010
SC(n)
INT SCL SDA PRES
IOUC XTALIN SAD(0:2)
73S8010
SC3
INT3 SDA SCL
INT SCL SDA PRES
IOUC XTALIN SAD(0:2)
73S8010
SC2
Figure 14: External Smart Card Interface Block Diagram
Rev. 1.2
69
73S1209F Data Sheet
1.7.13.1 ISO 7816 UART
DS_1209F_004
An embedded ISO 7816 (hardware) UART is provided to control communications between a smart card and the 73S1209F MPU. The UART can be shared between the one built-in ICC interface and the external ICC interface. Selection of the desired interface is made by register SCSel. Control of the external interface is handled by the I2C interface for any external 8010 devices. The following is a list of features for the ISO 7816 UART: * * * * * * * * * * * * Two-byte FIFO for temporary data storage on both TX and Rx data. Parity checking in T=0. This feature can be enabled/disabled by firmware. Parity error reporting to firmware and Break generation to ICC can be controlled independently. Parity error generation for test purposes. Retransmission of last byte if ICC indicates T=0 parity error. This feature can be enabled/disabled by firmware. Deletion of last byte received if ICC indicates T=0 parity error. This feature can be enabled/disabled by firmware. CRC/LRC generation and checking. CRC/LRC is automatically inserted into T=1 data stream by the hardware. This feature can be enabled/disabled by firmware. Support baud rates: 230000, 115200, 57600, 38400, 28800, 19200, 14400, 9600 under firmware control (assuming 12MHz crystal) with various F/D settings Firmware manages F/D. All F/D combinations are supported in which F/D is directly divisible by 31 or 32 (i.e. F/D is a multiple of either 31 or 32). Flexible ETU clock generation and control. Detection of convention (direct or indirect) character TS. This affects both polarity and order of bits in byte. Convention can be overridden by firmware. Supports WTX Timeout with an expanded Wait Time Counter (28 bits). A Bypass Mode is provided to bypass the hardware UART in order for the software to emulate the UART (for non-standard operating modes). In such a case, the I/O line value is reflected in SFR SCCtl or SCECtl respectively for the built-in or external interfaces. This mode is appropriate for some synchronous and non T=0 / T=1 cards.
The single integrated smart card UART is capable of supporting T=0 and T=1 cards in hardware therefore offloading the bit manipulation tasks from the firmware. The embedded firmware instructs the hardware which smart card it should communicate with at any point in time. Firmware reconfigures the UART as required when switching between smart cards. When the 73S1209F has transmitted a message with an expected response, the firmware should not switch the UART to another smart card until the first smart card has responded. If the smart card responds while another smart card is selected, that first smart card's response will be ignored.
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DS_1209F_004
1.7.13.2 Answer to Reset Processing
73S1209F Data Sheet
A card insertion event generates an interrupt to the firmware, which is then responsible for the configuration of the electrical interface, the UART and activation of the card. The activation sequencer goes through the power up sequence as defined in the ISO 7816-3 specification. An asynchronous activation timing diagram is shown in Figure 15. After the card reset is de-asserted, the firmware instructs the hardware to look for a TS byte that begins the ATR response. If a response is not provided within the pre-programmed timeout period, an interrupt is generated and the firmware can then take appropriate action, including instructing the 73S1209F to begin a deactivation sequence. Once commanded, the deactivation sequencer goes through the power down sequence as defined in the ISO 7816-3 specification. If an ATR response is received, the hardware looks for a TS byte that determines direct/inverse convention. The hardware handles the indirect convention conversion such that the embedded firmware only receives direct convention. This feature can be disabled by firmware within SByteCtl register. Parity checking and break generation is performed on the TS byte unless disabled by firmware. If during the card session, a card removal, over-current or other error event is detected, the hardware will automatically perform the deactivation sequence and then generate an interrupt to the firmware. The firmware can then perform any other error handling required for proper system operation. Smart card RST, I/O and CLK, C4, C8 shall be low before the end of the deactivation sequence. Figure 16 shows the timing for a deactivation sequence.
SELSC bits VCCSEL bits VCC VCCOK bit RSTCRD bit RST CLK IO
t1 t2 t3 t4 t5 ATR starts See Note t4
tto
t1: SELSC.1 bit set (selects internal ICC interface) and a non-zero value in VCCSEL bits (calling for a value of Vcc of 1.8, 3.0, or 5.0 volts) will begin the activation sequence. t1 is the time for Vcc to rise to acceptable level, declared as Vcc OK (bit VCCOK gets set). This time depends on filter capacitor value and card Icc load. tto: The time allowed for Vcc to rise to Vcc OK status after setting of the VCCSEL bits. This time is generated by the VCCTMR counter. If Vcc OK is not set, (bit VCCOK) at this time, a deactivation will be initiated. VCCSEL bits are not automatically cleared. The firmware must clear the VCCSEL bits before starting a new activation. t2: Time from VCCTmr timeout and VCC OK to IO reception (high), typically 2-3 CLK cycles if RDYST = 0. If RDYST = 1, t2 starts when VCCOK = 1. t3: Time from IO = high to CLK start, typically 2-3 CLK cycles. t4: Time allowed for start of CLK to de-assertion of RST. Programmable by RLength register. t5: Time allowed for ATR timeout, set by the STSTO register. Note: If the RSTCRD bit is set, RST is asserted (low). Upon clearing RSTCRD bit, RST will be de-asserted after t4. Rev. 1.2 71
73S1209F Data Sheet Figure 15: Asynchronous Activation Sequence Timing
Firmware sets VCCSEL to 00 t5 delay or Card Event IO RST
t5
DS_1209F_004
CLK
CMDVCCnB
VCC
t1 t2
t3 t4
t1: Time after either a "card event" occurs or firmware sets the VCCSela and VCCSelb bits to 0 (see t5, VCCOff_tmr) occurs until RST is asserted low. t2: Time after RST goes low until CLK stops. t3: Time after CLK stops until IO goes low. t4: Time after IO goes low until VCC is powered down. t5: Delayed VCC off time (in ETUs per VCCOff_tmr bits). Only in effect due to firmware deactivation. Figure 16: Deactivation Sequence
1.7.13.3 Data Reception/Transmission
When a 12Mhz crystal is used, the smart card UART will generate a 3.69Mhz (default) clock to both smart card interfaces. This will allow approximately 9600bps (1/ETU) communication during ATR (ISO 7816 default). As part of the PPS negotiation between the smart card and the reader, the firmware may determine that the smart card parameters F & D may be changed. After this negotiation, the firmware may change the ETU by writing to the SFR FDReg to adjust the ETU and CLK. The firmware may also change the smart card clock frequency by writing to the SFR SCCLK (SCECLK for external interface). Independent clock frequency control is provided to each smart card interface. Clock stop high or Clock stop low is supported in asynchronous mode. Figure 17 shows the ETU and CLK control circuits. The firmware determines when clock stop is supported by the smart card and when it is appropriate to go into that mode (and when to come out of it). The smart card UART is clocked by the same clock that is provided to the selected smart card. The transition between smart card clocks is handled in hardware to eliminate any glitches for the UART during switchover. The external smart card clock is not affected when switching the UART to communicate with the internal smart card.
72
Rev. 1.2
DS_1209F_004
FDReg(3:0) FDReg(7:4)
73S1209F Data Sheet
F/D Register
FI Decoder
Pre-Scaler 6 bits
1/13
ETUCLK
7.38M
ETU Divider 12 bits
1/744
EDGE
9926 CENTER
SCSel(3:2)
SYNC
SCCLK(5:0) MSCLK SCSCLK(5:0) MCLK = 96MHz
7.38M
DIV by 2
3.69M
CLK
PLL
Pre-Scaler 6 bits
1/13
MSCLKE
7.38M
DIV by 2
Defaults in Italics
3.69M
SCLK
Figure 17: Smart Card CLK and ETU Generation There are two, two-byte FIFOs that are used to buffer transmit and receive data. During a T=0 processing, if a parity error is detected by the 73S1209F during message reception, an error signal (BREAK) will be generated to the smart card. The byte received will be discarded and the firmware notified of the error. Break generation and receive byte dropping can be disabled under firmware control. During the transmission of a byte, if an error signal (BREAK) is detected, the last byte is retransmitted again and the firmware notified. Retransmission can be disabled by firmware. When a correct byte is received, an interrupt is generated to the firmware, which then reads the byte from the receive FIFO. Receive overruns are detected by the hardware and reported via an interrupt. During transmission of a message, the firmware will write bytes into the transmit FIFO. The hardware will send them to the smart card. When the last byte of a message has been written, the firmware will need to set the LASTTX bit in the STXCtl SFR. This will cause the hardware to insert the CRC/LRC if in a T=1 protocol mode. CRC/LRC generation/checking is only provided during T=1 processing. Firmware will need to instruct the smart function to go into receive mode after this last transmit data byte if it expects a response from the smart card. At the end of the smart card response, the firmware will put the interface back into transmit mode if appropriate. The hardware can check for the following card-related timeouts: * * * Character Waiting Time (CWT) Block Waiting Time (BWT) Initial Waiting Time (IWT)
The firmware will load the Wait Time registers with the appropriate value for the operating mode at the appropriate time. Figure 18 shows the guard, block, wait and ATR time definitions. If a timeout occurs, an interrupt will be generated and the firmware can take appropriate recovery steps. Support is provided for adding additional guard times between characters using the Extra Guard Time register (EGT) and between the last byte received by the 73S1209F and the first byte transmitted by the 73S1209F using the
Rev. 1.2
73
73S1209F Data Sheet
DS_1209F_004
Block Guard Time register (BGT). Other than the protocol checks described above, the firmware is responsible for all protocol checking and error recovery.
T = 0 Mode
> EGT
CHAR 1 CHAR 2
< WWT
WWT is set by the value in the BWT registers.
T = 1 Mode
TRANSMISSION BLOCK1
CHAR 1
(By seting Last_TXByte and TX/RXB=0 during CHAR N, RX mode will start after last TX byte)
RECEPTION BLOCK2
CHAR N+1 CHAR N+2 CHAR N+3 TX BGT(4:0)
CHAR 2
CHAR N
EGT
> BWT
< CWT
ATR Timing Parameters
CHAR 1 CHAR 2 CHAR N
IO
TSTO(7:0) ATRTO(15:0)
RST
IWT(15:0) RLen(7:0) VCC_OK
Figure 18: Guard, Block, Wait and ATR Time Definitions
1.7.13.4 Bypass Mode
It is possible to bypass the smart card UART in order for the firmware to support non-T=0/T=1 smart cards. This is called Bypass mode. In this mode the embedded firmware will communicate directly with the selected smart card and drive I/O during transmit and read I/O during receive in order to communicate with the smart card. In this mode, ATR processing is under firmware control. The firmware must sequence the interface signals as required. Firmware must perform TS processing, parity checking, break generation and CRC/LRC calculation (if required).
1.7.13.5 Synchronous Operation Mode
The 73S1209F supports synchronous operation. When sync mode is selected for either interface, the CLK signal is generated by the ETU counter. The values in FDReg, SCCLK, and SCECLK must be set to obtain the desired sync CLK rate. There is only one ETU counter and therefore, in sync mode, the interface must 74 Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
be selected to obtain a smart card clock signal. In sync mode, input data is sampled on the rise of CLK, and output data is changed on the fall of CLK. Special Notes Regarding Synchronous Mode Operation When the SCISYN or SCESNC bits (SPrtcol, bit 7, bit 5, respectively) are set, the selected smart card interface operates in synchronous mode and there are changes in the definition and behavior of pertinent register bits and associated circuitry. The following requirements are to be noted: 1. The source for the smart card clock (CLK or SCLK) is the ETU counter. Only the actively selected interface can have a running synchronous clock. In contrast, an unselected interface may have a running clock in the asynchronous mode of operation. 2. The control bits CLKLVL, SCLKLVL, CLKOFF, and SCLKOFF are functional in synchronous mode. When the CLKOFF bit is set, it will not truncate either the logic low or logic high period when the (stop at) level is of opposite polarity. The CLK/SCLK signal will complete a correct logic low or logic high duty cycle before stopping at the selected level. The CLK "start" is a result of the falling edge of the CLKOFF bit. Setting clock to run when it is stopped low will result in a half period of low before going high. Setting clock to run when it is stopped high will result in the clock going low immediately and then running at the selected rate with 50% duty cycle (within the limitations of the ETU divisor value). 3. The Rlen(7:0) is configured to count the falling edges of the ETU clock (CLK or SCLK) after it has been loaded with a value from 1 to 255. A value of 0 disables the counting function and RLen functions such as I/O source selection (I/O signal bypasses the FIFOs and is controlled by the SCCLK/SCECLK SFRs). When the RLen counter reaches the "max" (loaded) value, it sets the WAITTO interrupt (SEInt, bit 7), which is maskable via WTOIEN (SCIE, bit 7). It must be reloaded in order to start the counting/clocking process again. This allows the processor to select the number of CLK cycles and hence, the number of bits to be read or written to/from the card. 4. The FIFO is not clocked by the first CLK (falling) edge resulting from a CLKOFF de-assertion (a clock start event) when the CLK was stopped in the high state and RLen has been loaded but not yet clocked. 5. The state of the pin IO or SIO is sampled on the rising edge of CLK/SCLK and stored in bit 5 of the SCCtl/SCECtl register. 6. When Rlen = max or 0 and I2CMODE= 1 (STXCtl, b7), the IO or SIO signal is directly controlled by the data and direction bits in the respective SCCtl and SCECtl register. The state of the data in the TX FIFO is bypassed. 7. In the SPrtcol register, bit 6 (MODE9/8B) becomes active. When set, the RXData FIFO will read nine-bit words with the state of the ninth bit being readable in SRXCtl, bit 7 (B9DAT). The RXDAV interrupt will occur when the ninth bit has been clocked in (rising edge of CLK or SCLK). 8. Care must be taken to clear the RX and TX FIFOs at the start of any transaction. The user shall read the RX FIFO until it indicates empty status. Reading the TX FIFO twice will reset the input byte pointer and the next write to the TX FIFO will load the byte to the "first out" position. Note that the bit pointer (serializer/deserializer) is reset to bit 0 on any change of the TX/RXD bit. Special bits that are only active for sync mode include: SRXCtl, b7 "BIT9DAT", SPrtcol b6 "MODE9/8B", STXCtl, b7 "I2CMODE", and the definition of SCInt b7, was "WAITTO", becomes RLenINT interrupt, and SCIE b7, was "WTOIEN", becomes RLenIEN.
Rev. 1.2
75
73S1209F Data Sheet
VCCSEL bits VCC VCCOK RSTCRD RST CLK IO
t1 tto t4 t2 t3
DS_1209F_004
t1: The time from setting VCCSEL bits until VCCOK = 1. tto: The time from setting VCCSEL bits until VCCTMR times out. At t1 (if RDYST = 1) or tto (if RDYST = 0), activation starts. It is suggested to have RDYST = 0 and use the VCCTMR interrupt to let MPU know when sequence is starting. t2: time from start of activation (no external indication) until IO goes into reception mode (= 1). This is approximately 4 SCCLK (or SCECLK) clock cycles. t3: minimum one half of ETU period. t4: ETU period. Note that in Sync mode, IO as input is sampled on the rising edge of CLK. IO changes on the falling edge of CLK, either from the card or from the 73S1209F. The RST signal to the card is directly controlled by the RSTCRD bit (non-inverted) via the MPU and is shown as an example of a possible RST pattern.
Figure 19: Synchronous Activation
IO reception on RST CLK CLKOFF 1 2 5
CLKLVL RLength Count RLenght = 1 Rlength Interrupt TX/RXB Mode bit (TX = '1') t1 Count MAX 3 6 4 7
1. Clear CLKOFF after Card is in reception mode. 2. Set RST bit. 3. Interrupt is generated when Rlength counter is MAX. 4. Read and clear Interrupt. 5. Clear RST bit. 6. Toggle TX/RXB to reset bit counter. 7. Reload RLength Counter.
t1. CLK wll start at least 1/2 ETU after CLKOFF is set low when CLKLVL = 0
Figure 20: Example of Sync Mode Operation: Generating/Reading ATR Signals 76 Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
START Bit CLK IO Data from Card -end of ATR RLength Count MAX 1 2 6 RLen=0 Data from TX FIFO Rlen=1
RLength Count - was set for length of ATR RLength Interrupt CLK Stop CLK Stop Level IO Bit IODir Bit TX/RX Mode Bit TX = '1'
5
3 7
6 4
1. Interrupt generated when Rlength counter is MAX. 2. Read and clear Interrupt. 3. Set CLK Stop and CLK Stop level high in Interrupt routine. 4. Set TX/RX Bit to TX mode. 5. Reload Rlength Counter. 6. Set IO Bit low and IODir = Output. Since Rlen=(MAX or 0) and TX/RX =1, IO pin is controlled by IO bit. 7. Clear CLK Stop and CLK Stop level. Note: Data in TX fifo should not be Empty here. Synchronous Clock Start/Stop Mode style Start bit procedure. This procedure should be used to generate the start bit insertion in Synchronous mode for Synchronous Clock Start/Stop Mode protocol.
Figure 21: Creation of Synchronous Clock Start/Stop Mode Start Bit in Sync Mode
STOP Bit I2CMode = 1: Data to/from Card I2CMode = 0: Data from TX fifo I2CMode = 1:ACK Bit (to/from card) I2CMode = 0: Data from TX fifo RLength Count MAX 1 2 6
CLK IO RLength Count (Rlength = 9) RLength Interrupt CLK Stop CLK Stop Level IO Bit IODir Bit TX/RX Mode Bit TX = '1' 3 4
Min 1/2 ETU
7
5
1. Interrupt generated when Rlength counter is MAX. 2. Read and clear Interrupt. 3. Set CLK Stop and CLK Stop level high, set IO Bit low and IODir = Output. 4. Set IO Bit High and IODir = Output. 5. Set TX/RX Bit to RX mode. 6. Reload Rlength Counter. 7. Clear CLK Stop and CLK Stop level. Synchronous Clock Start/Stop Mode Stop bit procedure. This procedure should be used to generate the Stop bit in Synchronous Mode.
Figure 22: Creation of Synchronous Clock Start/Stop Mode Stop Bit in Sync Mode Rev. 1.2 77
73S1209F Data Sheet
DS_1209F_004
CLK IO RLength Count RLength = 9 RLength Interrupt RX data Protection Bit Data (Bit 9) TX/RX Mode Bit TX = '1' 1._ Interrupt generated when Rlength counter is Max 2._ Read and clear Interrupt 3._ Reload RLength counter RX FIFO (Data from Card is ready for CPU read) Protection Bit is ready for CPU read Data from Card (Bit 8) Rlen=8 Protection Bit (Bit 9) RLength Count MAX Rlen=9 Rlen=0 Data from Card (Bit 1) Rlen =1
Receive data in 9 bit mode
CLK RLength Count RLength = 9 RLength Interrupt Rlen=8 RLength Count MAX Rlen=9
CLK Stop CLK Stop Level = 0 1._ Interrupt generated when Rlength counter is Max 2._Stop CLK after the last byte and protection bit
Stop CLK after receiving the last byte and protection bit.
Figure 23: Operation of 9-bit Mode in Sync Mode Synchronous card operation is broken down into three primary types. These are commonly referred to as 2-wire, 3-wire and I2C synchronous cards. Each card type requires different control and timing and therefore requires different algorithms to access. Teridian has created an application note to provide detailed algorithms for each card type. Refer to the application note titled 73S12xxF Synchronous Card Design Application Note.
78
Rev. 1.2
DS_1209F_004
1.7.13.6 Smart Card SFRs
73S1209F Data Sheet
Smart Card Select Register (SCSel): 0xFE00
0x00
The smart card select register is used to determine which smart card interface is using the ISO UART. The internal Smart Card has integrated 7816-3 compliant sequencer circuitry to drive an external smart card interface. The external smart card interface relies on 73S8010x parts to generate the ISO 7816-3 compatible signals and sequences. Multiple 73S8010x devices can be connected to the external smart card interface. Table 73: The SCSel Register MSB - - - - SELSC.1 SELSC.0 BYPASS - LSB
Bit SCSel.7 SCSel.6 SCSel.5 SCSel.4 SCSel.3
Symbol - - - - SELSC.1
Function
Select Smart Card Interface - These bits select the interface that is using the IS0 UART. These bits do not activate the interface. Activation is performed by the VccCtl register. 00 = No smart card interface selected. 01 = External Smart Card Interface selected (using SCLK, SIO). 1X = Internal Smart Card Interface selected. 1 = Enabled, 0 = Disabled. When enabled, ISO UART is bypassed and the I/O line is controlled via the SCCtl and SCECtl registers.
SCSel.2
SELSC.0
SCSel.1 SCSel.0
BYPASS -
Rev. 1.2
79
73S1209F Data Sheet Smart Card Interrupt Register (SCInt): 0xFE01 0x00
DS_1209F_004
When the smart card interrupt is asserted, the firmware can read this register to determine the actual cause of the interrupt. The bits are cleared when this register is read. Each interrupt can be disabled by the Smart Card Interrupt Enable register. Error processing must be handled by the firmware. This register relates to the interface that is active - see the SCSel register (above). Table 74: The SCInt Register MSB WAITTO CRDEVT VCCTMRI Bit Symbol RXDAV TXEVT TXSENT Function Wait Timeout - An ATR or card wait timeout has occurred. In sync mode, this interrupt is asserted when the RLen counter (it advances on falling edges of CLK/ETU) reaches the loaded (max) value. This bit is cleared when the SCInt register is read. When running in Synchronous Clock Stop Mode, this bit becomes RLenINT interrupt (set when the Rlen counter reaches the terminal count). Card Event - A card event is signaled via pin DETCARD either when the Card was inserted or removed (read the CRDCtl register to determine card presence) or there was a fault condition in the interface circuitry. This bit is functional even if the smart card logic clock is disabled and when the PWRDN bit is set. This bit is cleared when the SCInt register is read. VCC Timer - This bit is set when the VCCTMR times out. This bit is cleared when the SCInt register is read. Rx Data Available - Data was received from the smart card because the Rx FIFO is not empty. In bypass mode, this interrupt is generated on a falling edge of the smart card I/O line. After receiving this interrupt in bypass mode, firmware should disable it until the firmware has received the entire byte and is waiting for the next start delimiter. This bit is cleared when there is no RX data available in the RX FIFO. TX Event - Set whenever the TXEMTY or TXFULL bits are set in the SRXCtl SFR. This bit is cleared when the STXCtl register is read. TX Sent - Set whenever the ISO UART has successfully transmitted a byte to the smart card. Also set when a CRC/LRC byte is sent in T=1 mode. Will not be set in T=0 when a break is detected at the end of a byte (when break detection is enabled). This bit is cleared when the SCInt register is read. TX Error - An error was detected during the transmission of data to the smart card as indicated by either BREAKD or TXUNDR bit being set in the STXCtl SFR. Additional information can be found in that register description. This bit is cleared when the STXCtl register is read. RX Error - An error was detected during the reception of data from the smart card. Additional information can be found in the SRXCtl register. This interrupt will be asserted for RXOVRR, or RX Parity error events. This bit is cleared when the SRXCtl register is read. TXERR LSB RXERR
SCInt.7
WAITTO
SCInt.6
CRDEVT
SCInt.5
VCCTMRI
SCInt.4
RXDAV
SCInt.3
TXEVNT
SCInt.2
TXSENT
SCInt.1
TXERR
SCInt.0
RXERR
80
Rev. 1.2
DS_1209F_004 Smart Card Interrupt Enable Register (SCIE): 0xFE02 0x00
73S1209F Data Sheet
When set to a 1, the respective condition can cause a smart card interrupt. When set to a 0, the respective condition cannot cause an interrupt. When disabled, the respective bit in the Smart Card Interrupt register can still be set, but it will not interrupt the MPU. Table 75: The SCIE Register MSB WTOIEN CDEVEN Bit SCIE.7 SCIE.6 SCIE.5 SCIE.4 SCIE.3 SCIE.2 SCIE.1 SCIE.0 Symbol WTOIEN CDEVEN VTMREN RXDAEN TXEVEN TXSNTEN TXEREN RXEREN VTMREN RXDAEN TXEVEN TXSNTEN TXEREN LSB RXEREN
Function Wait Timeout Interrupt Enable - Enable for ATR or Wait Timeout Interrupt. In sync mode, function is RLIEN (RLen = max.) interrupt enable. Card Event Interrupt Enable. VCC Timer Interrupt Enable. Rx Data Available Interrupt Enable. TX Event Interrupt Enable. TX Sent Interrupt Enable. TX Error Interrupt Enable. RX Error Interrupt Enable.
Rev. 1.2
81
73S1209F Data Sheet Smart Card VCC Control/Status Register (VccCtl): 0xFE03 0x00
DS_1209F_004
This register is used to control the power up and power down of the integrated smart card interface. It is used to determine whether to apply 5V, 3V, or 1.8V to the smart card. Perform the voltage selection with one write operation, setting both VCCSEL.1 and VCCSEL.0 bits simultaneously. The VDDFLT bit (if enabled) will provide an emergency deactivation of the internal smart card slot. See the VDD Fault Detect Function section for more detail. Table 76: The VccCtl Register MSB VCCSEL.1 VCCSEL.0 Bit Symbol VDDFLT RDYST VCCOK - Function Setting non-zero value for bits 7,6 will begin activation sequence with target Vcc as given below: State VCCSEL.1 VCCSEL.0 VCC 1 0 0 0V 2 0 1 1.8V 3 1 0 3.0V 4 1 1 5V A card event or VCCOK going low will initiate a deactivation sequence. When the deactivation sequence for RST, CLK and I/O is complete, VCC will be turned off. When this type of deactivation occurs, the bits must be reset before initiating another activation. If this bit is set = 0, the CMDVCC3B and CMDVCC5B outputs are immediately set = 1 to signal to the companion circuit to begin deactivation when there is a VDD Fault event. If this bit is set = 1 and there is a VDD Fault, the firmware should perform a deactivation sequence and then set CMDVCC3B or CMDVCC5B = 1 to signal the companion circuit to set VCC = 0. If this bit is set = 1, the activation sequence will start when bit VCCOK is set = 1. If not set, the deactivation sequence shall start when the VCCTMR times out. (Read only). Indicates that VCC output voltage is stable. - LSB SCPWRDN
VccCtl.7
VCCSEL.1
VccCtl.6
VCCSEL.0
VccCtl.5
VDDFLT
VccCtl.4 VccCtl.3 VccCtl.2 VccCtl.1 VccCtl.0
RDYST VCCOK - - SCPWRDN
This bit controls the power-down mode of the 73S1209F circuit. 1 = power down, 0 = normal operation.
82
Rev. 1.2
DS_1209F_004 VCC Stable Timer Register (VccTmr): 0xFE04 0x0F
73S1209F Data Sheet
A programmable timer is provided to set the time from activation start (setting the VCCSEL.1 and VCCSEL.0 bits to non-zero) to when VCC_OK is evaluated. VCC_OK must be true at the end of this timers programmed interval (tto in Figure 15) in order for the activation sequence to continue. If VCC_OK is not true and the end of the interval (tto), the Card Event interrupt will be set, and a deactivation sequence shall begin including clearing of the VCCSEL bits. Table 77: The VccTmr Register MSB LSB OFFTMR.3 OFFTMR.2 OFFTMR.1 OFFTMR.0 VCCTMR.3 VCCTMR.2 VCCTMR.1 VCCTMR.0 Bit VccTmr.7 VccTmr.6 VccTmr.5 VccTmr.4 VccTmr.3 VccTmr.2 VccTmr.1 VccTmr.0 Symbol OFFTMR.3 OFFTMR.2 OFFTMR.1 OFFTMR.0 VCCTMR.3 VCCTMR.2 VCCTMR.1 VCCTMR.0 Function VCC Off Timer - The bits set the delay (in number of ETUs) for deactivation after the VCCSEL.1 and VCC SEL.0 have been set to 0. The time value is a count of the 32768Hz clock and is given by tto = OFFTMR(7:4) * 30.5s. This delay does not affect emergency deactivations due to VDD Fault or card events. A value of 0000 results in no additional delay. VCC Timer - VCCOK must be true at the time set by the value in these bits in order for the activation sequence to continue. If not, the VCCSEL bits will be cleared. The time value is a count of the 32768Hz clock and is given by tto = VCCTMR(3:0) * 30.5s. A value of 0000 results in no timeout, not zero time, and activation requires that RDYST is set and RDY goes high.
Rev. 1.2
83
73S1209F Data Sheet Card Status/Control Register (CRDCtl): 0xFE05 0x00
DS_1209F_004
This register is used to configure the card detect pin (DETCARD) and monitor card detect status. This register be written to properly configure Debounce, Detect_Polarity (= 0 or = 1), and the pull-up/down enable before setting CDETEN. The card detect logic is functional even without smart card logic clock. When the PWRDN bit is set = 1, no debounce is provided but card presence is operable. Table 78: The CRDCtl Register MSB DEBOUN CDETEN Bit Symbol - - DETPOL PUENB Function Debounce - When set = 1, this will enable hardware de-bounce of the card detect pin. The de-bounce function shall wait for 64ms of stable card detect assertion before setting the CARDIN bit. This counter/timer uses the keypad clock as a source of 1kHz signal. De-assertion of the CARDIN bit is immediate upon de-assertion of the card detect pin(s). Card Detect Enable - When set = 1, activates card detection input. Default upon power-on reset is 0. PDEN LSB CARDIN
CRDCtl.7
DEBOUN
CRDCtl.6 CRDCtl.5 CRDCtl.4 CRDCtl.3 CRDCtl.2 CRDCtl.1 CRDCtl.0
CDETEN - - DETPOL PUENB PDEN CARDIN
Detect Polarity - When set = 1, the DETCARD pin shall interpret a logic 1 as card present. Enable pull-up current on DETCARD pin (active low). Enable pull-down current on DETCARD pin. Card Inserted - (Read only). 1 = card inserted, 0 = card not inserted. A change in the value of this bit is a "card event." A read of this bit indicates whether smart card is inserted or not inserted in conjunction with the DETPOL setting.
84
Rev. 1.2
DS_1209F_004 TX Control/Status Register (STXCtl): 0xFE06 0x00
73S1209F Data Sheet
This register is used to control transmission of data to the smart card. Some control and some status bits are in this register. Table 79: The STXCtl Register MSB SYCKST Bit STXCtl.7 STXCtl.6 STXCtl.5 Symbol - TXFULL TXEMTY TXUNDR LASTTX Function TX/RXB LSB BREAKD
I2C Mode - When in sync mode and this bit is set, and when the RLen count value = max or 0, the source of the smart card data for IO pin (or SIO pin) will I2CMODE be connected to the IO bit in SCCtl (or SCECtl) register rather than the TX FIFO. See the description for the Protocol Mode Register for more detail. - TXFULL TX FIFO is full. Additional writes may corrupt the contents of the FIFO. This bit it will remain set as long as the TX FIFO is full. Generates TX_Event interrupt upon going full. 1 = TX FIFO is empty, 0 = TX FIFO is not empty. If there is data in the TX FIFO, the circuit will transmit it to the smart card if in transmit mode. In T=1 mode, if the LASTTX bit is set and the hardware is configured to transmit the CRC/LRC, the TXEMTY will not be set until the CRC/LRC is transmitted. In T=0, if the LASTTX bit is set, TXEMTY will be set after the last word has been successfully transmitted to the smart card. Generates TXEVNT interrupt upon going empty. TX Underrrun - (Read only) Asserted when a transmit under-run condition has occurred. An under-run condition is defined as an empty TX FIFO when the last data word has been successfully transmitted to the smart card and the LASTTX bit was not set. No special processing is performed by the hardware if this condition occurs. Cleared when read by firmware. This bit generates TXERR interrupt. Last TX Byte - Set by firmware (in both T=0 and T=1) when the last byte in the current message has been written into the transmit FIFO. In T=1 mode, the CRC/LRC will be appended to the message. Should be set after the last byte has been written into the transmit FIFO. Should be cleared by firmware before writing first byte of next message into the transmit FIFO. Used in T=0 to determine when to set TXEMTY. 1 = Transmit mode, 0 = Receive mode. Configures the hardware to be receiving from or transmitting to the smart card. Determines which counters should be enabled. This bit should be set to receive mode prior to switching to another interface. Setting and resetting this bit shall initialize the CRC logic. If LASTTX is set, this bit can be reset to RX mode and UART logic will automatically change mode to RX when TX operation is completed (TX_Empty =1). Break Detected - (Read only) 1 = A break has been detected on the I/O line indicating that the smart card detected a parity error. Cleared when read. This bit generates TXERR interrupt.
STXCtl.4
TXEMTY
STXCtl.3
TXUNDR
STXCtl.2
LASTTX
STXCtl.1
TX/RXB
STXCtl.0
BREAKD
Rev. 1.2
85
73S1209F Data Sheet STX Data Register (STXData): 0xFE07 0x00
DS_1209F_004
Table 80: The STXData Register MSB STXDAT.7 Bit STXData.7 STXData.6 STXData.5 STXData.4 STXData.3 STXData.2 STXData.1 STXData.0 SRX Control/Status Register (SRXCtl): 0xFE08 0x00 Data to be transmitted to smart card. Gets stored in the TX FIFO and then extracted by the hardware and sent to the selected smart card. When the MPU reads this register, the byte pointer is changed to effectively "read out" the data. Thus, two reads will always result in an "empty" FIFO condition. The contents of the FIFO registers are not cleared, but will be overwritten by writes. STXDAT.6 STXDAT.5 STXDAT.4 STXDAT.3 Function STXDAT.2 STXDAT.1 LSB STXDAT.0
This register is used to monitor reception of data from the smart card. Table 81: The SRXCtl Register MSB BIT9DAT Bit SRXCtl.7 SRXCtl.6 SRXCtl.5 SRXCtl.4 SRXCtl.3 SRXCtl.2 Symbol BIT9DAT - LASTRX CRCERR RXFULL RXEMTY Last RX Byte - User sets this bit during the reception of the last byte. When byte is received and this bit is set, logic checks CRC to match 0x1D0F (T=1 mode) or LRC to match 00h (T=1 mode), otherwise a CRC or LRC error is asserted. (Read only) 1 = CRC (or LRC) error has been detected. (Read only) RX FIFO is full. Status bit to indicate RX FIFO is full. (Read only) RX FIFO is empty. This is only a status bit and does not generate a RX interrupt. RX Overrun - (Read Only) Asserted when a receive-over-run condition has occurred. An over-run is defined as a byte was received from the smart card when the RX FIFO was full. Invalid data may be in the receive FIFO. Firmware should take appropriate action. Cleared when read. Additional writes to the RX FIFO are discarded when a RXOVRR occurs until the overrun condition is cleared. Will generate RXERR interrupt. Parity Error - (Read only) 1 = The logic detected a parity error on incoming data from the smart card. Cleared when read. Will generate RXERR interrupt. - LASTRX CRCERR RXFULL RXEMTY LSB RXOVRR PARITYE
Function Bit 9 Data - When in sync mode and with MODE9/8B set, this bit will contain the data on IO (or SIO) pin that was sampled on the ninth CLK (or SCLK) rising edge. This is used to read data in synchronous 9-bit formats.
SRXCtl.1
RXOVRR
SRXCtl.0
PARITYE
86
Rev. 1.2
DS_1209F_004 SRX Data Register (SRXData): 0xFE09 0x00
73S1209F Data Sheet
Table 82: The SRXData Register MSB LSB SRXDAT.7 SRXDAT.6 SRXDAT.5 SRXDAT.4 SRXDAT.3 SRXDAT.2 SRXDAT.1 SRXDAT.0 Bit SRXData.7 SRXData.6 SRXData.5 SRXData.4 SRXData.3 SRXData.2 SRXData.1 SRXData.0 (Read only) Data received from the smart card. Data received from the smart card gets stored in a FIFO that is read by the firmware. Function
Rev. 1.2
87
73S1209F Data Sheet Smart Card Control Register (SCCtl): 0xFE0A 0x21
DS_1209F_004
This register is used to monitor reception of data from the smart card. Table 83: The SCCtl Register MSB RSTCRD Bit - IO IOD C8 C4 Function 1 = Asserts the RST (set RST = 0) to the smart card interface, 0 = De-assert the RST (set RST = 1) to the smart card interface. Can be used to extend RST to the smart card. Refer to the RLength register description. This bit is operational in all modes and can be used to extend RST during activation or perform a "Warm Reset" as required. In auto-sequence mode, this bit should be set = 0 to allow the sequencer to de-assert RST per the RLength parameters. In sync mode (see the SPrtcol register) the sense of this bit is non-inverted, if set =1 , RST = 1, if set = 0, RST = 0. Rlen has no effect on Reset in sync mode. Smart Card I/O. Read is state of I/O signal (Caution, this signal is not synchronized to the MPU clock). In Bypass mode, write value is state of signal on I/O. In sync mode, this bit will contain the value of I/O pin on the latest rising edge of CLK. Smart Card I/O Direction control Bypass mode or sync mode. 1 = input (default), 0 = output. Smart Card C8. When C8 is an output, the value written to this bit will appear on the C8 line. The value read when C8 is an output is the value stored in the register. When C8 is an input, the value read is the value on the C8 pin (Caution, this signal is not synchronized to the MPU clock). When C8 is an input, the value written will be stored in the register but not presented to the C8 pin. Smart Card C4. When C4 is an output, the value written to this bit will appear on the C4 line. The value read when C4 is an output is the value stored in the register. When C4 is an input, the value read is the value on the C4 pin (Caution, this signal is not synchronized to the MPU clock). When C4 is an input, the value written will be stored in the register but not presented to the C4 pin. 1 = High, 0 = Low. If CLKOFF is set = 1, the CLK to smart card will be at the logic level indicated by this bit. If in bypass mode, this bit directly controls the state of CLK. 0 = CLK is enabled. 1 = CLK is not enabled. When asserted, the CLK will stop at the level selected by CLKLVL. This bit has no effect if in bypass mode. CLKLVL LSB CLKOFF
Symbol
SCCtl.7
RSTCRD
SCCtl.6 SCCtl.5
- IO
SCCtl.4
IOD
SCCtl.3
C8
SCCtl.2
C4
SCCtl.1
CLKLVL
SCCtl.0
CLKOFF
88
Rev. 1.2
DS_1209F_004 External Smart Card Control Register (SCECtl): 0xFE0B 0x00
73S1209F Data Sheet
This register is used to directly set and sample signals of External Smart Card interface. There are three modes of asynchronous operation, an "automatic sequence" mode, and bypass mode. Clock stop per the ISO 7816-3 interface is also supported but firmware must handle the protocol for SIO and SCLK for I2C clock stop and start. Control for Reset (to make RST signal), activation control, voltage select, etc. should be handled via the I2C interface when using external 73S73S8010x devices. USR(n) pins shall be used for C4, C8 functions if necessary. Table 84: The SCECtl Register MSB - Bit SCECtl.7 SCECtl.6 - Symbol - - External Smart Card I/O. Bit when read indicates state of pin SIO for SIOD = 1 (Caution, this signal is not synchronized to the MPU clock), when written, sets state of pin SIO for SIOD = 0. Ignored if not in bypass or sync modes. In sync mode, this bit will contain the value of IO pin on the latest rising edge of SCLK. 1 = input, 0 = output. External Smart Card I/O Direction control. Ignored if not in bypass or sync modes. SIO SIOD - - LSB SCLKLVL SCLKOFF
Function
SCECtl.5
SIO
SCECtl.4 SCECtl.3 SCECtl.2 SCECtl.1 SCECtl.0
SIOD - - SCLKLVL SCLKOFF
Sets the state of SCLK when disabled by SCLKOFF bit. If in bypass mode, this bit directly controls the state of SCLK. 0 = SCLK enabled, 1 = SCLK disabled. When disabled, SCLK level is determined by SCLKLVL. This bit has no effect if in bypass mode.
Rev. 1.2
89
73S1209F Data Sheet C4/C8 Data Direction Register (SCDIR): 0xFE0C 0x00
DS_1209F_004
This register determines the direction of the internal interface C4/C8 lines. After reset, all signals are tri-stated. Table 85: The SCDIR Register MSB - Bit SCDIR.7 SCDIR.6 SCDIR.5 SCDIR.4 SCDIR.3 SCDIR.2 SCDIR.1 SCDIR.0 Symbol - - - - C8D C4D - - 1 = input, 0 = output. Smart Card C8 direction. 1 = input, 0 = output. Smart Card C4 direction. - - - C8D C4D - - LSB
Function
90
Rev. 1.2
DS_1209F_004 Protocol Mode Register (SPrtcol): 0xFE0D 0x03
73S1209F Data Sheet
This register determines the protocol to be use when communicating with the selected smart card. This register should be updated as required when switching between smart card interfaces. Table 86: The SPrtcol Register MSB SCISYN Bit SPrtcol.7 MOD9/8B SCESYN 0 TMODE CRCEN CRCMS LSB RCVATR
Symbol SCISYN
Function Smart Card Internal Synchronous mode - Configures internal smart card interface for synchronous mode. This mode routes the internal interface buffers for RST, IO, C4, C8 to SCCtl register bits for direct firmware control. CLK is generated by the ETU counter. Synchronous 8/9 bit mode select - For sync mode, in protocols with 9-bit words, set this bit. The first eight bits read go into the RX FIFO and the ninth bit read will be stored in the IO (or SIO) data bit of the SRXCtl register. Smart Card External Synchronous mode - Configures External Smart Card interface for synchronous mode. This mode routes the external smart card interface buffers for SIO to SCECtl register bits for direct firmware control. SCLK is generated by the ETU counter. Reserved bit, must always be set to 0. Protocol mode select - 0: T=0, 1: T=1. Determines which smart card protocol is to be used during message processing. CRC Enable - 1 = Enabled, 0 = Disabled. Enables the checking/generation of CRC/LRC while in T=1 mode. Has no effect in T=0 mode. If enabled and a message is being transmitted to the smart card, the CRC/LRC will be inserted into the message stream after the last TX byte is transmitted to the smart card. If enabled, CRC/LRC will be checked on incoming messages and the value made available to the firmware via the CRC LS/MS registers. CRC Mode Select - 1 = CRC, 0 = LRC. Determines type of checking algorithm to be used. Receive ATR - 1 = Enable ATR timeout, 0 = Disable ATR timeout. Set by firmware after the smart card has been turned on and the hardware is expecting ATR.
SPrtcol.6
MOD9/8B
SPrtcol.5 SPrtcol.4 SPrtcol.3
SCESYN 0 TMODE
SPrtcol.2
CRCEN
SPrtcol.1 SPrtcol.0
CRCMS RCVATR
Rev. 1.2
91
73S1209F Data Sheet SC Clock Configuration Register (SCCLK): 0xFE0F 0x0C
DS_1209F_004
This register controls the internal smart card (CLK) clock generation. Table 87: The SCCLK Register MSB - Bit SCCLK.7 SCCLK.6 SCCLK.5 SCCLK.4 SCCLK.3 SCCLK.2 SCCLK.1 SCCLK.0 - Symbol - - ICLKFS.5 ICLKFS.4 ICLKFS.3 ICLKFS.2 ICLKFS.1 ICLKFS.0 Internal Smart Card CLK Frequency Select - Division factor to determine internal smart card CLK frequency. MCLK clock is divided by (register value + 1) to clock the ETU divider, and then by 2 to generate CLK. Default ratio is 13. The programmed value in this register is applied to the divider after this value is written, in such a manner as to produce a glitch-free output, regardless of the selection of active interface. A register value = 0 will default to the same effect as register value = 1. LSB ICLKFS.5 ICLKFS.4 ICLKFS.3 ICLKFS.2 ICLKFS.1 ICLKFS.0 Function
External SC Clock Configuration Register (SCECLK): 0xFE10
0x0C
This register controls the external smart card (SCLK) clock generation. Table 88: The SCECLK Register MSB - - ECLKFS.5 ECLKFS.4 ECLKFS. 3 LSB ECLKFS.2 ECLKFS.1 ECLKFS.0
Bit SCECLK.7 SCECLK.6 SCECLK.5 SCECLK.4 SCECLK.3 SCECLK.2 SCECLK.1 SCECLK.0
Symbol - - ECLKFS.5 ECLKFS.4 ECLKFS.3 ECLKFS.2 ECLKFS.1 ECLKFS.0
Function
External Smart Card CLK Frequency Select - Division factor to determine external smart card CLK frequency. MCLK clock is divided by (register value + 1) to clock the ETU divider, and then by 2 to generate SCLK. Default ratio is 13. The programmed value in this register is applied to the divider after this value is written, in such a manner as to produce a glitchfree output, regardless of the selection of active interface. A register value = 0 will default to the same effect as register value = 1.
92
Rev. 1.2
DS_1209F_004 Parity Control Register (SParCtl): 0xFE11 0x00
73S1209F Data Sheet
This register provides the ability to configure the parity circuitry on the smart card interface. The settings apply to both integrated smart card interfaces. Table 89: The SParCtl Register MSB - Bit SParCtl.7 SParCtl.6 DISPAR BRKGEN BRKDET RETRAN Symbol - DISPAR Disable Parity Check - 1 = disabled, 0 = enabled. If enabled, the UART will check for even parity (the number of 1's including the parity bit is even) on every character. This also applies to the TS during ATR. Break Generation Disable - 1 = disabled, 0 = enabled. If enabled, and T=0 protocol, the UART will generate a Break to the smart card if a parity error is detected on a receive character. No Break will be generated if parity checking is disabled. This also applies to TS during ATR. Break Detection Disable - 1 = disabled, 0 = enabled. If enabled, and T=0 protocol, the UART will detect the generation of a Break by the smart card. Retransmit Byte - 1 = enabled, 0 = disabled. If enabled and a Break is detected from the smart card (Break Detection must be enabled), the last character will be transmitted again. This bit applies to T=0 protocol. Discard Received Byte - 1 = enabled, 0 = disabled. If enabled and a parity error is detected (Parity checking must be enabled), the last character received will be discarded. This bit applies to T=0 protocol. Insert Parity Error - 1 = enabled, 0 = disabled. Used for test purposes. If enabled, the UART will insert a parity error in every character transmitted by generating odd parity instead of even parity for the character. Force Parity Error - 1 = enabled, 0 = disabled. Used for test purposes. If enabled, the UART will generate a parity error on a character received from the smart card. DISCRX INSPE LSB FORCPE
Function
SParCtl.5
BRKGEN
SParCtl.4 SParCtl.3
BRKDET RETRAN
SParCtl.2
DISCRX
SParCtl.1
INSPE
SParCtl.0
FORCPE
Rev. 1.2
93
73S1209F Data Sheet Byte Control Register (SByteCtl): 0xFE12 0x2C
DS_1209F_004
This register controls the processing of characters and the detection of the TS byte. When receiving, a Break is asserted at 10.5 ETU after the beginning of the start bit. Break from the card is sampled at 11 ETU. Table 90: The SByteCtl Register MSB - DETTS DIRTS BRKDUR.1 BRKDUR. 0 - - - LSB
Bit SByteCtl.7
Symbol -
Function Detect TS Byte - 1 = Next Byte is TS, 0 = Next byte is not TS. When set, the hardware will treat the next character received as the TS and determine if direct or indirect convention is being used. Direct convention is the default used if firmware does not set this bit prior to transmission of TS by the smart card to the firmware. The hardware will check parity and generate a break as defined by the DISPAR and BRKGEN bits in the parity control register. This bit is cleared by hardware after TS is received. TS is decoded before being stored in the receive FIFO. Direct Mode TS Select - 1 = direct mode, 0 = indirect mode. Set/cleared by hardware when TS is processed indicating either direct/indirect mode of operation. When switching between smart cards, the firmware should write the bit appropriately since this register is not unique to an individual smart card (firmware should keep track of this bit). Break Duration Select - 00 = 1 ETU, 01 = 1.5 ETU, 10 = 2 ETU, 11 = reserved. Determines the length of a Break signal which is generated when detecting a parity error on a character reception in T=0 mode.
SByteCtl.6
DETTS
SByteCtl.5
DIRTS
SByteCtl.4 SByteCtl.3 SByteCtl.2 SByteCtl.1 SByteCtl.0
BRKDUR.1 BRKDUR.0 - - -
94
Rev. 1.2
DS_1209F_004 FD Control Register (FDReg): 0xFE13 0x11
73S1209F Data Sheet
Table 91: The FDReg Register MSB FVAL.3 Bit FDReg.7 FDReg.6 FDReg.5 FDReg.4 FDReg.3 FDReg.2 FDReg.1 FDReg.0 FVAL.2 Symbol FVAL.3 FVAL.2 FVAL.1 FVAL.0 DVAL.3 DVAL.2 DVAL.1 DVAL.0 Refer to Table 93 above. This value is used to set the divide ratio used to generate the smart card CLK. Default, also used for ATR, is 0001 (Di = 1). Refer to Table 93 above. This value is converted per the table to set the divide ratio used to generate the baud rate (ETU). Default, also used for ATR, is 0001 (Fi = 372). This value is used by the selected interface. FVAL.1 FVAL.0 DVAL.3 DVAL.2 Function DVAL.1 LSB DVAL.0
This register uses the transmission factors F and D to set the ETU (baud) rate. The values in this register are mapped to the ISO 7816 conversion factors as described below. The CLK signal for each interface is created by dividing a high-frequency, intermediate signal (MSCLK) by 2. The ETU baud rate is created by dividing MSCLK by 2 times the Fi/Di ratio specified by the codes below. For example, if FI = 0001 and DI = 0001, the ratio of Fi/Di is 372/1. Thus the ETU divider is configured to divide by 2 * 372 = 744. The maximum supported F/D ratio is 4096. Table 92: Divider Ratios Provided by the ETU Counter FI (code) Fi (ratio) FCLK max FI(code) Fi(ratio) FCLK max DI(code) Di(ratio) DI(code) Di(ratio) 0000 372 4 1000 512 5 0000 1 1000 12 0001 372 5 1001 512 5 0001 1 1001 20 0010 558 6 1010 768 7.5 0010 2 1010 16 0011 744 8 1011 1024 10 0011 4 1011 16 0100 1116 12 1100 1536 15 0100 8 1100 16 0101 1488 16 1101 2048 20 0101 16 1101 16 0110 1860 20 1110 2048 20 0110 32 1110 16 0111 1860 20 1111 2048 20 0111 32 1111 16
Note: values marked with are not included in the ISO definition and arbitrary values have been assigned. The values given below are used by the ETU divider to create the ETU clock. The entries that are not shaded will result in precise CLK/ETU per ISO requirements. Shaded areas are not precise but are within 1% of the target value.
Rev. 1.2
95
73S1209F Data Sheet Table 93: Divider Values for the ETU Clock Di code 0001 0010 0011 0100 1000 0101 1001 0110 Fi code F D 1 2 4 8 12 16 20 32 0000 372 744 372 186 93 62 47 37 23 0001 372 744 372 186 93 62 47 37 23 0010 558 1116 558 279 138 93 70 56 35 0011 744 1488 744 372 186 124 93 74 47 0100 1116 2232 1116 558 279 186 140 112 70
DS_1209F_004
0101 1488 2976 1488 744 372 248 186 149 93
Di code 0001 0010 0011 0100 1000 0101 1001 0110
Fi code F D 1 2 4 8 12 16 20 32
0110 1860 3720 1860 930 465 310 233 186 116
1001 512 1024 512 256 128 85 64 51 32
1010 768 1536 768 384 192 128 96 77 48
1011 1024 2048 1024 512 256 171 128 102 64
1100 1536 3072 1536 768 384 256 192 154 96
1101 2048 4096 2048 1024 512 341 256 205 128
96
Rev. 1.2
DS_1209F_004 CRC MS Value Registers (CRCMsB): 0xFE14 0xFF, (CRCLsB): 0xFE15
73S1209F Data Sheet 0xFF
Table 94: The CRCMsB Register MSB CRC.15 CRC.14 CRC.13 CRC.12 CRC.11 CRC.10 CRC.9 LSB CRC.8
Table 95: The CRCLsB Register MSB CRC.7 CRC.6 CRC.5 CRC.4 CRC.3 CRC.2 CRC.1 LSB CRC.0
The 16-bit CRC value forms the TX CRC word in TX mode (write value) and the RX CRC in RX mode (read value). The initial value of CRC to be used when generating a CRC to be transmitted at the end of a message (after the last TX byte is sent) when enabled in T=1 mode. Should be reloaded at the beginning of every message to be transmitted. When using CRC, the both CRC registers should be initialized to FF. When using LRC the CRCLsB Value register should be loaded to 00. When receiving a message, the firmware should load this with the initial value and then read this register to get the final value at the end of the message. These registers need to be reloaded for each new message to be received. When in LRC mode, bits (7:0) are used and bits (15:8) are undefined. During LRC/CRC checking and generation, this register is updated with the current value and can be read to aid in debugging. This information will be transmitted to the smart card using the timing specified by the Guard Time register. When checking CRC/LRC on an incoming message (CRC/LRC is checked against the data and CRC/LRC), the firmware reads the final value after the message has been received and determines if an error occurred (= 0x1D0F (CRC_ no error, else error; = 0 (LRC) no error, else error). When a message is received, the CRC/LRC is stored in the FIFO. The polynomial used to generate and 16 12 5 check CRC is x + x + x +1. When in indirect convention, the CRC is generated prior to the conversion into indirect convention. When in indirect convention, the CRC is checked after the conversion out of indirect convention. For a given message, the CRC generated (and readable from this register) will be the same whether indirect or direct convention is used to transmit the data to the smart card. The CRCLsB / CRCMsB registers will be updated with CRC/LRC whenever bits are being received or transmitted from/to the smart card (even if CRCEN is not set and in mode T1). They are available to the firmware to use if desired.
Rev. 1.2
97
73S1209F Data Sheet Block Guard Time Register (BGT): 0xFE16 0x10
DS_1209F_004
This register contains the Extra Guard Time Value (EGT) most-significant bit. The Extra Guard Time indicates the minimum time between the leading edges of the start bit of consecutive characters. The delay is depends on the T=0/T=1 mode. Used in transmit mode. This register also contains the Block Guard Time (BGT) value. Block Guard Time is the minimum time between the leading edge of the start bit of the last character received and the leading edge of the start bit of the first character transmitted. This should not be set less than the character length. The transmission of the first character will be held off until BGT has elapsed regardless of the TX data and TX/RX control bit timing. Table 96: The BGT Register MSB EGT.8 Bit BGT.7 BGT.6 BGT.5 BGT.4 BGT.3 BGT.2 BGT.1 BGT.0 Symbol EGT.8 - - BGT.4 BGT.3 BGT.2 BGT.1 BGT.0 0x0C Time in ETUs between the start bit of the last received character to start bit of the first character transmitted to the smart card. Default value is 22. - - BGT.4 BGT.3 BGT.1 BGT.2 LSB BGT.0
Function Most-significant bit for 9-bit EGT timer. See EGT below.
Extra Guard Time Register (EGT): 0xFE17
This register contains the Extra Guard Time Value (EGT) least-significant byte. The Extra Guard Time indicates the minimum time between the leading edges of the start bit of consecutive characters. The delay is depends on the T=0/T=1 mode. Used in transmit mode. Table 97: The EGT Register MSB EGT.7 Bit EGT.7 EGT.6 EGT.5 EGT.4 EGT.3 EGT.2 EGT.1 EGT.0 Time in ETUs between start bits of consecutive characters. In T=0 mode, the minimum is 1. In T=0, the leading edge of the next start bit may be delayed if there is a break detected from the smart card. Default value is 12. In T=0 mode, regardless of the value loaded, the minimum value is 12, and for T=1 mode, the minimum value is 11. EGT.6 EGT.5 EGT.4 EGT.3 Function EGT.1 EGT.2 LSB EGT.0
98
Rev. 1.2
DS_1209F_004 Block Wait Time Registers (BWTB0): 0xFE1B 0xFE19 0x00, (BWTB3): 0xFE18 0x00 0x00, (BWTB1): 0xFE1A
73S1209F Data Sheet 0x00, (BWTB2):
Table 98: The BWTB0 Register MSB BWT.7 BWT.6 BWT.5 BWT.4 BWT.3 BWT.1 BWT.2 LSB BWT.0
Table 99: The BWTB1 Register MSB BWT.15 BWT.14 BWT.13 BWT.12 BWT.11 BWT.10 BWT.9 LSB BWT.8
Table 100: The BWTB2 Register MSB BWT.23 BWT.22 BWT.21 BWT.20 BWT.19 BWT.18 BWT.17 LSB BWT.16
Table 101: The BWTB3 Register MSB - - - - BWT.27 BWT.26 BWT.25 LSB BWT.24
These registers (BWTB0, BWTB1, BWTB2, BWTB3) are used to set the Block Waiting Time(27:0) (BWT). All of these parameters define the maximum time the 73S1209F will have to wait for a character from the smart card. These registers serve a dual purpose. When T=1, these registers are used to set up the block wait time. The block wait time defines the time in ETUs between the beginning of the last character sent to smart card and the start bit of the first character received from smart card. It can be used to detect an unresponsive card and should be loaded by firmware prior to writing the last TX byte. When T = 0, these registers are used to set up the work wait time. The work wait time is defined as the time between the leading edge of two consecutive characters being sent to or from the card. If a timeout occurs, an interrupt is generated to the firmware. The firmware can then take appropriate action. A Wait Time Extension (WTX) is supported with the 28-bit BWT. Character Wait Time Registers (CWTB0): 0xFE1D 0x00, (CWTB1): 0xFE1C 0x00
Table 102: The CWTB0 Register MSB CWT.7 CWT.6 CWT.5 CWT.4 CWT.3 CWT.1 CWT.2 LSB CWT.0
Table 103: The CWTB1 Register MSB CWT.15 CWT.14 CWT.13 CWT.12 CWT.11 CWT.10 CWT.9 LSB CWT.8
These registers (CWTB0, CWTB1) are used to hold the Character Wait Time(15:0) (CWT) or Initial Waiting Time(15:0) (IWT) depending on the situation. Both the IWT and the CWT measure the time in ETUs between the leading edge of the start of the current character received from the smart card and the leading edge of the start of the next character received from the smart card. The only difference is the mode in which the card is operating. When T=1 these registers are used to configure the CWT and these registers configure the IWT when the ATR is being received. These registers should be loaded prior to receiving characters from the smart card. Firmware must manage which time is stored in the register. If a timeout occurs, an interrupt is generated to the firmware. The firmware can then take appropriate action.
Rev. 1.2
99
73S1209F Data Sheet ATR Timeout Registers (ATRLsB): 0xFE20 0x00, (ATRMsB): 0xFE1F 0x00
DS_1209F_004
Table 104: The ATRLsB Register MSB ATRTO.7 ATRTO.6 ATRTO.5 ATRTO.4 ATRTO.3 ATRTO.1 LSB ATRTO.2 ATRTO.0
Table 105: The ATRMsB Register MSB ATRTO.15 ATRTO.14 ATRTO.13 LSB ATRTO.12 ATRTO.11 ATRTO.10 ATRTO.9 ATRTO.8
These registers (ATRLsB and ATRLsB) form the ATR timeout (ATRTO [15:0]) parameter. Time in ETU between the leading edge of the first character and leading edge of the last character of the ATR response. Timer is enabled when the RCVATR is set and starts when leading edge of the first start bit is received and disabled when the RCVATR is cleared. An ATR timeout is generated if this time is exceeded. TS Timeout Register (STSTO): 0xFE21 0x00
Table 106: The STSTO Register MSB TST0.7 TST0.6 TST0.5 TST0.4 TST0.3 TST0.1 TST0.2 LSB TST0.0
The TS timeout is the time in ETU between the de-assertion of smart card reset and the leading edge of the TS character in the ATR (when DETTS is set). The timer is started when smart card reset is de-asserted. An ATR timeout is generated if this time is exceeded (MUTE card). Reset Time Register (RLength): 0xFE22 MSB RLen.7 RLen.6 RLen.5 RLen.4 RLen.3 RLen.1 RLen.2 0x70 LSB RLen.0
Table 107: The RLength Register Time in ETUs that the hardware delays the de-assertion of RST. If set to zero and RSTCRD = 0, the hardware adds no extra delay and the hardware will release RST after VCCOK is asserted during power-up. If set to one, it will delay the release of RST by the time in this register. When the firmware sets the RSTCRD bit, the hardware will assert reset (RST = 0 on pin). When firmware clears the bit, the hardware will release RST after the delay specified in Rlen. If firmware sets the RSTCRD bit prior to instructing the power to be applied to the smart card, the hardware will not release RST after power-up until RLen after the firmware clears the RSTCRD bit. This provides a means to power up the smart card and hold it in reset until the firmware wants to release the RST to the selected smart card. Works with the selected smart card interface.
100
Rev. 1.2
DS_1209F_004 Shaded locations indicate functions that are not provided in sync mode. Table 108: Smart Card SFR Table
Name SCSel SCInt SCIE VccCtl VccTmr CRDCtl STXCtl STXData SRXCtl SRXData SCCtl SCECtl SCDIR SPrtcol SCCLK SCECLK SParCtl SByteCtl FDReg CRCMsB CRCLsB BGT EGT BWTB3 BWTB2 BWTB1 BWTB0 CWTB1 CWTB0 ATRMsB ATRLsB STSTO RLength Address FE00 FE01 FE02 FE03 FE04 FE05 FE06 FE07 FE08 FE09 FE0A FE0B FE0C FE0D FE0F FE10 FE11 FE12 FE13 FE14 FE15 FE16 FE17 FE18 FE19 FE1A FE1B FE1C FE1D FE1F FE20 FE21 FE22 b7 WAITTO/ RLIEN WTOI/ RLIEN VCCSEL.1 DEBOUN SYCKST BIT9DAT RSTCRD b6 CRDEVT CDEVNT b5 VCCTMR VTMREN b4 RXDAVl RXDAEN RDYST
73S1209F Data Sheet
b3 b2 SelSC(1:0) TXEVNT TXSENT TXEVEN VCCOK TXSNTEN
b1 BYPASS TXERR TXERR
b0 RXERR RXERR SCPWRDN
VCCSEL.0 VDDFLT OFFTMR(3:0) CDETEN TXFULL LASTRX IO SIO MOD9/8B SCESYN
I2CMODE
DISPAR BRKGEN DETTS DIRTS FVAL(3:0)
EGT8
DETPOL TXEMTY TXUNDR TXDATA(7:0) CRCERR RXFULL RXEMTY RXOVRR RXDATA(7:0) IOD C8 C4 CLKLVL SIOD SCLKLVL C8D C4D 0 TMODE CRCEN CRCMS ICLKFS(5:0) ECLKFS(5:0) BRKDET RTRAN DISCRX INSPE BRKDUR (1:0) DVAL (3:0) CRC(15:8) CRC(7:0) BGT(4:0) EGT(7:0) BWT(27:24) BWT(23:16) BWT(15:8) BWT(7:0) CWT(15:8) CWT(7:0) ATRTO(15:8) ATRTO(7:0) TSTO(7:0) RLen(7:0)
VCCTMR(3:0) PUENB PDEN LASTTX TX/RXB
CARDIN BREAKD PARITYE CLKOFF SCLKOFF RCVATR
FORCPE
Rev. 1.2
101
73S1209F Data Sheet
DS_1209F_004
1.7.14 VDD Fault Detect Function
The 73S1209F contains a circuit to detect a low-voltage condition on the supply voltage VDD. If enabled, it will deactivate the active internal smart card interface when VDD falls below the VDD Fault threshold. The register configures the VDD Fault threshold for the nominal default of 2.3V* or a user selectable threshold. The user's code may load a different value using the FOVRVDDF bit =1 after the power-up cycle has completed VDDFault Control Register (VDDFCtl): 0xFFD4 0x00
Table 109: The VDDFCtl Register MSB - Bit VDDFCtl.7 VDDFCtl.6 VDDFCtl.5 VDDFCtl.4 VDDFCtl.3 VDDFCtl.2 VDDFCtl.1 FOVRVDDF VDDFLTEN Symbol - Setting this bit high will allow the VDDFLT(2:0) bits set in this register to FOVRVDDF control the VDDFault threshold. When this bit is set low, the VDDFault threshold will be set to the factory default setting of 2.3V*. VDDFLTEN Set = 1 will disable VDD Fault operation. - - VDDFTH.2 VDDFTH.1 VDD Fault Threshold. Bit value(2:0) VDDFault voltage 000 2.3 (nominal default) 001 2.4 010 2.5 011 2.6 100 2.7 101 2.8 110 2.9 111 3.0 - STXDAT.3 LSB VDDFTH.2 VDDFTH.1 VDDFTH.0
Function
VDDFCtl.0
VDDFTH.0
* Note: The VDD Fault factory default can be set to any threshold as defined by bits VDDFTH(2:0). The 73S1209F has the capability to burn fuses at the factory to set the factory default to any of these voltages. Contact Teridian for further details.
102
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
2 Typical Application Schematics
3.3V 5.0V Power 5.0V C1 0.1uF U1 MAX3237CAI C1+ C1DB9_RS232 P1 5 9 4 8 3 7 2 6 1 C4 0.1uF 4 VC2+ C25 6 7 10 12 8 9 11 3.3V 13 14 T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN ENB SHDNB T1IN T2IN T3IN T4IN T5IN R1OUTBF R1OUT R2OUT R3OUT GND 28 25 1 3 24 23 22 19 17 16 21 20 18 C3 0.1uF C5 0.1uF Y1 12.000MHz
3.3V Power
3.3V
V+
VCC
C2 0.1uF
27
26
R1 1M
U2
OPTIONAL LCD DISPLAY SYSTEM 16 CHARACTER BY 2 LINES
R/W*
GND
VDD
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7 14 USR3
C6 22pF
C7 22pF 5.0V
VO
10
11
12
13
MBAUD
SERIAL PORT
3
USR6
USR5
USR4
USR0
USR1
C8 + 1uF
C9 0.1uF 1
15
2
RV1 10K 2
LCD BRIGHTNESS ADJUST
D1
LED1 LED0
3.3V 3.3V 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 R4 20K C11 27p C12 27p C13 1uF J1 C1 C2 C3 C5 C6 C7 SW1 SW2 J2 VCC RST CLK C4 GND VPP I/O C8 SW-1 SW-2 Smart Card Connector
D2
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
3.3V
U3 C10
USR2
15
1
2
3
4
5
6
7
8
9
NC
RS
E
CW
RXD COL3 ANAIN COL2 COL1 COL0 X12OUT X12IN GND N/C N/C SDA SCL N/C LED1 N/C LED0
+ R2 10k
SMARTCARD SLOT #1
30-SWITCH KEYPAD
1 S1 3 1 S2 3 1 S3 3 1 S4 3 1 S5 3 USR6 SW_MOM S7
F1
SW_MOM S8
F2
SW_MOM S6
F3
ON/CE
S9
SW_MOM
A
SW_MOM 1 S10 3 USR5 USR4 USR3 USR2
1
3
1
3
1
3
1
3
SW_MOM S11
1
SW_MOM S12
2
SW_MOM S13
3
SW_MOM S14
UP
B
SW_MOM 1 S15 3
SW_MOM S16
4
SW_MOM S17
5
SW_MOM S18
6
DOWN
S19
SW_MOM
C
SW_MOM 1 S20 3
1
3
1
3
1
3
1
3
SW_MOM S21
7
SW_MOM S22
8
SW_MOM S23
9
SW_MOM S24
CLR
D
USR1 USR0 SW_MOM 1 S25 3 C14 0.1uF C15 0.1uF 3.3V R5 20K C16 0.1uF C17 10uF C18 0.1uF 5.0V
1
3
1
3
1
3
1
3
SW_MOM S26
.
SW_MOM S27
0
SW_MOM S28
/
ENTER
S29
SW_MOM
E
SW_MOM 1 S30 3
1
3
1
3
1
3
1
3
SW_MOM
W
SW_MOM
X
SW_MOM
Y
SW_MOM
Z
F
SW_MOM
Figure 24: 73S1209F Typical PINpad, Smart Card Reader Application Schematic
Rev. 1.4
35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
USR1 USR0 ROW4 ROW5 N/C ERST TCLK VDD TBUS3 GND RXTX N/C TBUS2 SCLK TBUS1 SIO INT3
1
3
1
3
1
3
1
3
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
TXD COL4 USR7 ROW0 ROW1 USR6 ROW2 GND N/C N/C VDD USR5 USR4 USR3 USR8 USR2 ROW3
73S1209F
ISBR SEC RESET VDD PRES I/O AUX1 AUX2 VCC RST GND CLK PRESB VPC TEST TBUS0 INT2
68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52
10uF
SIM/SAM Connector
R3
0
103
73S1209F Data Sheet
DS_1209F_004
3.3V C19 0.1uF U4 MAX3237CAI C1+ C1DB9_RS232 P2 5 9 4 8 3 7 2 6 1 C23 0.1uF 4 VC2+ C25 6 7 10 12 8 9 11 3.3V 13 14 T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN ENB SHDNB T1IN T2IN T3IN T4IN T5IN R1OUTBF R1OUT R2OUT R3OUT GND 28 25 1 3 24 23 22 19 17 16 21 20 18 3.3V U5 11 10 6 5 9 7 4 8 3 2 1 3.3V 44 43 42 41 40 39 38 37 36 35 34 R9 20K C27 27p C28 27p C29 0.47uF R8 0 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 J3 C1 C2 C3 C5 C6 C7 SW1 SW2 J4 VCC RST CLK C4 GND VPP I/O C8 SW-1 SW-2 Smart Card Connector C21 0.1uF C22 0.1uF C24 22pF R6 1M
V+
VCC
C20 0.1uF
27
26
Y2 12.000MHz C25 22pF D3 D4
3.3V
LED1 LED0
C26 10uF + R7 10k
SERIAL PORT
15
MBAUD
2
LED1
LED0
SDA
SCL
X12OUT
X12IN
GND
RXD
SEC
RESET
ANAIN
12 13 14 15 16 17 18 19 20 21 22
TXD USR7 USR6 GND NC NC VDD USR5 USR4 USR3
VDD
SMARTCARD SLOT #1
PRES I/O AUX1 AUX2
SIM/SAM Connector
73S1209
VCC RST GND CLK PRESB
RXTX
USR1
USR0
ERST
SCLK
TCLK
23
24
25
26
27
28
29
30
31
32
33
TEST
INT2
VDD
USR2
VPC
SIO
NC
USR1
USR0
5.0V 3.3V R10 20K C32 0.1uF C33 0.1uF C34 0.1uF C30 10uF C31 0.1uF
Figure 25: 73S1209F Typical SIM / Smart Card Reader Application Schematic
104
Rev. 1.4
DS_1209F_004
73S1209F Data Sheet
3 Electrical Specification
3.1 Absolute Maximum Ratings
Operation outside these rating limits may cause permanent damage to the device. The smart card interface pins are protected against short circuits to VCC, ground, and each other.
Parameter DC Supply voltage, VDD Rating -0.5 to 4.0 VDC
Supply Voltage VPC
Storage Temperature Pin Voltage (except card interface) Pin Voltage (card interface) ESD tolerance (except card interface) ESD tolerance (card interface) Pin Current
-0.5 to 6.5 VDC
-60 to 150C -0.3 to (VDD+0.5) VDC -0.3 to (VCC+0.5) VDC +/- 2KV +/- 6KV
200 mA
Note: ESD testing on smart card pins is HBM condition, 3 pulses, each polarity referenced to ground. Note: Smart Card pins are protected against shorts between any combinations of Smart Card pins.
3.2 Recommended Operating Conditions
Unless otherwise noted all specifications are valid over these temperatures and supply voltage ranges: Parameter DC Voltage Supply VDD Rating 2.7 to 3.6 VDC
Supply Voltage VPC for Class A-B-C Reader
Ambient Operating Temperature (Ta)
4.75 to 6.0 VDC
-40C to +85C
Rev. 1.2
105
73S1209F Data Sheet
DS_1209F_004
3.3 Digital IO Characteristics
These requirements pertain to digital I/O pin types with consideration of the specific pin function and configuration. The LED(1:0) pins have pull-ups that may be enabled. The Row pins have 100K pull-ups. Symbol Voh Vol Vih Vil Ileak Parameter Output level, high Output level, low Input voltage, high Input voltage, low Leakage current Conditions Ioh =-2mA Iol=2mA 2.7v < VDD <3.6v 2.7v < VDD <3.6v 0 < Vin < VDD All output modes disabled, pull-up/downs disabled If provided and enabled, Vout < 0.1v If provided and enabled, Vout > VDD - 0.1v Conditions Vout = 1.3V, 2.7v < VDD < 3.6v 0.0v < Voh < 0.1v when pull-up R is enabled 0.0v < Voh < 0.1v when col. is pulled low Min. Typ. 2 4 10 -100 -3 Min. 0.8 *VDD 0 1.8 -0.3 -5 Typ. Max. VDD 0.3 VDD+0.3 0.6 5 Unit V V V V A
Ipu Ipd
Pull-up current Pull-down current
-5 5
A A
Symbol Iled
Parameter LED drive current
Max.
Unit mA
Iolkrow Iolkcol
Keypad Row output low current Keypad column output high current
A mA
3.4 Oscillator Interface Requirements
Symbol Parameter Condition Min Typ. Max Unit
High-Frequency Oscillator (Xin) Parameters. XIN Is Used As Input For External Clock For Test Purposes Only. A Resistor Connecting X12in To X12out Is Required, Value = 1M. VILX12IN VIHX12IN IILXTAL Fxtal Input Low Voltage - X12IN
Input High Voltage - X12IN
-0.3 0.7*VDD GND < Vin < Vdd Fundamental mode -10 6
0.3*VDD Vdd+.0.3 10 12
V V A MHz
Input Current - X12IN Crystal resonant frequency
3.5 DC Characteristics: Analog Input
Symbol VTHTOL Parameter Voltage Threshold Tolerance Condition Selected Threshold Value Min -3% Typ. Max +3% Unit V
106
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
3.6 Smart Card Interface Requirements
Symbol Parameter Condition Min Typ. Max Unit
Card Power Supply (VCC) Regulator General conditions, -40C < T < 85C, 4.75V < VPC < 6.0V, 2.7V < VDD < 3.6V Inactive mode -0.1 Inactive mode, ICC = 1mA Active mode; ICC <65mA; 5V Active mode; ICC <65mA; 5v, NDS condition Active mode; ICC < 65mA; 3V Active mode; ICC < 40mA; 1.8V Card supply Voltage including ripple and noise Active mode; single pulse of 100mA for 2s; 5 volt, fixed load = 25mA Active mode; single pulse of 100mA for 2s; 3v, fixed load = 25mA Active mode; current pulses of 40nAs with peak |ICC | <200mA, t <400ns; 5V Active mode; current pulses of 40nAs with peak |ICC | <200mA, t <400ns; 5V Active mode; current pulses of 40nAs with peak |ICC | <200mA,t <400ns; 3V Active mode; current pulses of 20nAs with peak |ICC | <100mA,t <400ns; 1.8V VCCrip ICCmax VCC Ripple Card supply output current ICC fault current Vcc slew rate, rise Vcc slew rate, fall Vcc ready voltage (VCCOK = 1) CF External filter capacitor (VCC to GND) fRIPPLE = 20kHz - 200MHz Static load current, VCC>1.65 Static load current, VCC>4.6 or 2.7 volts as selected Class A, B (5V and 3V) Class C (1.8V) Rise rate on activate C=1.0F Fall rate on deactivate, C=1.0F 5V operation, Vcc rising 3V operation, Vcc rising 1.8V operation, Vcc rising CF should be ceramic with low ESR (<100M). 100 60 0.06 0.075 4.6 2.75 1.65 1 0.15 0.15 -0.1 4.65 4.75 2.85 1.68 4.6 2.7 4.6 4.65 2.7 1.62
0.1 0.4 5.25 5.25 3.15 1.92 5.25 3.15 5.25 5.25 3.15 1.92 350 40 90 180 130 0.25 0.6
V V V V V V V V V V V V mV mA
VCC
ICCF VSR VSF
mA V/s V/s V V V
Vrdy
3.3
F
Rev. 1.2
107
73S1209F Data Sheet
DS_1209F_004
Symbol
Parameter
Condition IOH =0 IOH = -40A IOL=1mA
Min 0.9 * VCC 0.75 VCC
Typ.
Max VCC+0.1 VCC+0.1
0.15 *VCC
Unit V V V V V V V A mA mA mA
Interface Requirements - Data Signals: I/O, AUX1 and AUX2. VOH VOL VIH VIL VINACT ILEAK IIL ISHORTL ISHORTH Output level, high (I/O, AUX1, AUX2) Output level, low (I/O, AUX1, AUX2) Input level, high (I/O, AUX1, AUX2) Input level, low (I/O, AUX1, AUX2) Output voltage when outside of session Input leakage Input current, low (I/O, AUX1, AUX2) Short circuit output current Short circuit output current IOL = 0 IOL = 1mA VIH = VCC VIL = 0 For output low, shorted to VCC through 33 For output high, shorted to ground through 33 For I/O, AUX1, AUX2, CL = 80pF, 10% to 90%. Output stable for >200ns
0.6 * VCC
VCC+0.30
0.2 * VCC
-0.15
0.1 0.3 10 0.65 15 15
tR, tF tIR, tIF RPU FDMAX VOH VOL VINACT IRST_LIM ICLK_LIM CLKSR3V CLKSR5V tR, tF
Output rise time, fall times Input rise, fall times Internal pull-up resistor Maximum data rate
100 1 8 11 14 1
ns s k MHz V V V V
Reset and Clock for Card Interface, RST, CLK Output level, high Output level, low Output voltage when outside of session Output current limit, RST Output current limit, CLK CLK slew rate CLK slew rate Output rise time, fall time VCC = 3V VCC = 5V CL = 35pF for CLK, 10% to 90% CL = 200pF for RST, 10% to 90% CL =35pF, FCLK 20MHz 45 0.3 0.5 8 100 55 IOH =-200A IOL=200A IOL = 0 IOL = 1mA 0.9 * VCC 0 VCC
0.15 *VCC
0.1 0.3 30 70
mA V/ns V/ns ns ns %
Duty cycle for CLK
108
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
3.7 DC Characteristics
Symbol Parameter Condition CPU clock @ 24MHz CPU clock @ 12MHz IDD Supply Current CPU clock @ 6MHz CPU clock @ 3.69MHz Power down (-40 to 85C) Power down (25C) VCC on, ICC=0 I/O, AUX1, AUX2=high, CLK not toggling Power down IPCOFF VPC supply current when VCC = 0 Smart card deactivated Min Typ. 20 14 10 9
8 6
Max 25 20 15 14
50
Unit mA mA mA mA
A
13 650
A
450
IPC
Supply Current
A 1 345 10 A
3.8 Voltage / Temperature Fault Detection Circuits
Symbol VPCF Parameter VPC fault (VPC Voltage supervisor threshold) VCCOK = 0 (VCC Voltage supervisor threshold) Die over temperature fault Vcc over current fault Condition VPC VPC + 0.3 4.6 2.7 1.65 145 C mA Max Unit V V V
VCCF TF ICCF
Rev. 1.2
109
73S1209F Data Sheet
DS_1209F_004
4 Equivalent Circuits
VDD
X12LIN
X12OUT
ESD
ESD
ENABLE
To circuit
Figure 26: 12 MHz Oscillator Circuit
VDD
Output Disable
STRONG PFET
TTL
PIN Data From circuit To circuit
ESD
STRONG NFET
Figure 27: Digital I/O Circuit
110
TTL
Rev. 1.2
DS_1209F_004
VDD
73S1209F Data Sheet
Output Disable
STRONG PFET
PIN Data From circuit
ESD
STRONG NFET
Figure 28: Digital Output Circuit
VDD
Pull-up Disable
VERY WEAK PFET
Output Disable
STRONG PFET
PIN Data From circuit To circuit
ESD
STRONG NFET
Figure 29: Digital I/O with Pull Up Circuit
Rev. 1.2
TTL
111
73S1209F Data Sheet
VDD
DS_1209F_004
Output Disable
STRONG PFET
PIN Data From circuit To circuit Pull-down Enable
ESD
STRONG NFET
TTL
VERY WEAK NFET
Figure 30: Digital I/O with Pull Down Circuit
To circuit
TTL
PIN
ESD
Figure 31: Digital Input Circuit
112
Rev. 1.2
DS_1209F_004
VDD
73S1209F Data Sheet
Pull-up Disable
Output Disable
STRONG PFET
100k OHM
PIN Data From circuit To circuit
ESD
STRONG NFET
Figure 32: Keypad Row Circuit
VDD
TTL
1200 OHMS
Output Disable
MEDIUM PFET
PIN Data From circuit To circuit
ESD
STRONG NFET
Figure 33: Keypad Column Circuit
Rev. 1.2
TTL
113
73S1209F Data Sheet
VDD
DS_1209F_004
Pullup Disable
STRONG PFET
PIN
ESD
Data From circuit To circuit
Current Value Control
TTL
STRONG NFET
0, 2, 4, 10mA
Figure 34: LED Circuit
This buffer has a special input threshold: Vih>0.7*VDD To Circuit Logic
ESD
PIN
R= 20k
Figure 35: Test and Security Pin Circuit
114
Rev. 1.2
DS_1209F_004
To Comparator Input
73S1209F Data Sheet
PIN
ESD
Figure 36: Analog Input Circuit
VCC
STRONG PFET
ESD
From circuit
ESD
PIN
STRONG NFET
Figure 37: Smart Card Output Circuit
Rev. 1.2
115
73S1209F Data Sheet
VCC
DS_1209F_004
STRONG PFET
125ns DELAY
ESD
RL=11K
From circuit
STRONG NFET
IO PIN
To circuit
CMOS
ESD
Figure 38: Smart Card I/O Circuit
VDD
ESD
To circuit Pull-down Enable
TTL
PIN
VERY WEAK NFET
ESD
Figure 39: PRES Input Circuit
VDD
Pull-up Enable To circuit
TTL
VERY WEAK PFET
ESD
PIN
ESD
Figure 40: PRES Input Circuit
116
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
4.1 Package Pin Designation (68-pin QFN)
CAUTION: Use handling procedures necessary for a static sensitive component
ANA_IN COL2
COL3
COL1 COL0
X12OUT
XI2IN GND
LED1
3
RXD
17
16
15
13
9
7
6
4
8
5
14
11
12
10
2
1
LED0
SDA
SCL
N/C N/C
N/C
N/C
TXD COL4 USR7 ROW0 ROW1 USR6 ROW2 GND N/C N/C VDD USR5 USR4 USR3 USR8 USR2 ROW3
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 37 35 36 38 39 40 41 42 43 44 45 46 47 48 49 50 51
68 67 66 65 64 63
ISBR SEC RESET VDD PRES IO AUX1 AUX2 VCC RST GND CLK PRESB VPC TEST TBUS0 INT2
TERIDIAN 73S1209F
62 61 60 59 58 57 56 55 54 53 52
N/C TBUS2
TBUS1
USR1
USR0
N/C ERST
TBUS3
ROW4 ROW5
Figure 41: 73S1209F Pinout
Rev. 1.2
RXTX
TCLK
SCLK
GND
SIO INT3
VDD
117
73S1209F Data Sheet
DS_1209F_004
4.2 Package Pin Designation (44-pin QFN) .2
CAUTION: Use handling procedures necessary for a static sensitive component
ANA_IN X12OUT
11
10
9
7
6
4
3
LED0 SEC
2
8
5
1
RESET
XI2IN
LED1
GND
RXD
SDA
SCL
TXD USR7 USR6 GND N/C N/C VDD USR5 USR4 USR3 USR2
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
44 43 42
VDD PRES IO AUX1 AUX2 VCC RST GND CLK PRESB VPC
TERIDIAN 73S1209F
USR1 N/C SCLK
41 40 39 38 37 36 35 34
VDD RXTX
USR0 ERST
Figure 42: 73S1209F Pinout
118
TCLK
INT2 TEST
SIO
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
4.3 Packaging Information .3
68-Pin QFN PACKAGE OUTLINE Notes: 6.3mm x 6.3mm exposed pad area must remain UNCONNECTED (clear of PCB traces or vias). Controlling dimensions are in mm.
0.65
8.00 7.75
68 1 2 3
0.85 0.2 0.00/0.05
7.75
8.00
TOP VIEW
12 SEATING PLANE PIN#1 ID R0.20 68
0.42
0.24/0.60
8.00 6.30
6.15/6.45
1 2 3
SIDE VIEW
0.00/0.05 0.20 0.15/0.25
0.45
0.42
0.24/0.60
6.30
6.15/6.45
SECTION "C-C"
6.40 8.00
CC
SCALE: NONE
C L
6.40
BOTTOM VIEW
0.40
FOR ODD TERMINAL/SIDE
TERMINAL TIP
Figure 43: 73S1209F 68 QFN Pinout
Rev. 1.2
119
73S1209F Data Sheet 44-Pin QFN PACKAGE OUTLINE
DS_1209F_004
Notes: 5.1mm x 5.1mm exposed pad area must remain UNCONNECTED (clear of PCB traces or vias). Controlling dimensions are in mm.
0.65
7.00 6.75
44 1 2 3
0.85 0.2 0.00/0.05
6.75
7.00
TOP VIEW
12 SEATING PLANE PIN#1 ID R0.20 44
0.42
0.24/0.60
7.00 5.10
4.95/5.25
1
0.45
SIDE VIEW
0.00/0.05 0.23 0.18/0.30
2 3
0.42
0.24/0.60
5.10
4.95/5.25
SECTION "C-C"
5.00 7.00
CC
SCALE: NONE
C L
5.00
BOTTOM VIEW
0.50
FOR ODD TERMINAL/SIDE
TERMINAL TIP
Figure 44: 73S1209F 44 QFN Pinout
120
Rev. 1.2
DS_1209F_004
73S1209F Data Sheet
5 Ordering Information
Table 110 lists the order numbers and packaging marks used to identify 73S1209F products. Table 110: Order Numbers and Packaging Marks Part Description 73S1209F 68-Pin QFN Lead Free 73S1209F 68-Pin QFN Lead Free, Tape and Reel 73S1209F 44-Pin QFN Lead Free 73S1209F 44-Pin QFN Lead Free, Tape and Reel Order Number 73S1209F-68IM/F 73S1209F-68IMR/F 73S1209F-44IM/F 73S1209F-44IMR/F Packaging Mark 73S1209F68IM 73S1209F68IM 73S1209F44IM 73S1209F44IM
6 Related Documentation
The following 73S1209F documents are available from Teridian Semiconductor Corporation: 73S1209F Data Sheet (this document) 73S1209F Development Board Quick Start Guide 73S1209F Software Development Kit Quick Start Guide 73S1209F Evaluation Board User's Guide 73S12xxF Software User's Guide 73S12xxF Synchronous Card Design Application Note
7 Contact Information
For more information about Teridian Semiconductor products or to check the availability of the 73S1209F, contact us at: 6440 Oak Canyon Road Suite 100 Irvine, CA 92618-5201 Telephone: (714) 508-8800 FAX: (714) 508-8878 Email: scr.support@teridian.com For a complete list of worldwide sales offices, go to http://www.teridian.com.
Rev. 1.2
121
73S1209F Data Sheet
DS_1209F_004
Revision History
Revision 1.0 1.1 Date 4/4/2007 11/7/2007 Description First publication. In Table 1, added the Type column and the Equivalent Circuit references. In Section 1.4, updated program security description to remove pre-boot and 32-cycle references. In Section 1.7.1, changed "Mcount is configured in the MCLKCtl register must be bound between a value of 1 to 7. The possible crystal or external clock are shown in Table 12." to "Mcount is configured in the MCLKCtl register must be bound between a value of 1 to 7. The possible crystal or external clock frequencies for getting MCLK = 96MHz are shown in Table 11." In the BRCON description, changed "If BSEL = 1, the baud rate is derived using timer 1." to "If BSEL = 0, the baud rate is derived using timer 1." In Section 1.7.12, removed the following from the emulator port description: "The signals of the emulator port have weak pull-ups. Adding resistor footprints for signals E_RST, E_TCLK and E_RXTX on the PCB is recommended. If necessary, adding 10K pull-up resistors on E_TCLK and E_RXTX and a 3K on E_RST will help the emulator operate normally if a problem arises." Added Section 4, Equivalent Circuits. In Ordering Information, removed the leaded part numbers. 1.2 12/16/2008 In Table 1, added more description to the SCL, SDA, PRES, PRESB, VCC, VPC, SEC, TEST and VDD pins. In Section 1.3.2, changed "FLSH_ERASE" to "ERASE" and "FLSH_PGADR" to "PGADDR". Added "The PGADDR register denotes the page address for page erase. The page size is 512 (200h) bytes and there are 128 pages within the flash memory. The PGADDR denotes the upper seven bits of the flash memory address such that bit 7:1 of the PGADDR corresponds to bit 15:9 of the flash memory address. Bit 0 of the PGADDR is not used and is ignored." In the description of the PGADDR register, added "Note: the page address is shifted left by one bit (see detailed description above)." In Table 3, change "FLSH_PGADR" to "PGADDR". In Table 3, changed "FLSHCRL" to "FLSHCTL". In Table 3, added "Note: the page address is shifted left by one bit (see detailed description above)." to the PGADDR description. In Table 5, moved the TRIMPCtl bit description to FUSECtl and moved the FUSECtl bit description to TRIMPCtl. In Table 6, changed "PGADR" to "PGADDR". In Table 7, added PGADDR. In Table 11, removed the Mcount 7 row. In Section 1.7.13.5, deleted "The ETU clock is held in reset condition until the activation sequence begins (either by VCCOK = 1 or VCCTMR timeout) and will go high 1/2 the ETU period thereafter." In Section 1.7.13.5 (number 3), deleted "If CLKOFF/SCLKOFF is high and SYCKST is set=1(STXCtl, b7=1), Rlen=max will stop the clock at the selected (CLKLVL or SCLKLVL) level." In Section 1.7.13.5, deleted number 9. 122 Rev. 1.2
DS_1209F_004
73S1209F Data Sheet In Section 1.7.13.5, deleted the Special Operating Mode for Sync and Async Operation table. In Figure 20, Figure 21 and Figure 22, replaced the timing diagrams. In Section 1.7.13.5, added "Synchronous card operation is broken down into three primary types. These are commonly referred to as 2-wire, 3-wire and I2C synchronous cards. Each card type requires different control and timing and therefore requires different algorithms to access. Teridian has created an application note to provide detailed algorithms for each card type. Refer to the application note titled 73S12xxF Synchronous Card Design Application Note." In the VccCtl.0 bit description, deleted "When in power down mode, VDD = 0V. VDD can only be turned on by pressing the ON/OFF switch or by application of 5V to VBUS. If VBUS power is available and SCPWRDN bit is set, it has no effect until VBUS is removed and VDD will shut off." In Table 79 and Table 108, changed the SYCKST bit to I2CMODE. Changed the register address for ATRMsB from FE21 to FE1F. In Table 108 (SPrtcol register), changed the SCISYN bit to I2CMODE. In Figure 24 and Figure 25, replaced the schematics with new schematics. In Section 3.4, changed the Fxtal Min value from 4 to 6. Added Section 6, Related Documentation. Added Section 7, Contact Information. Formatted the document per new standard. Added section numbering.
(c) 2008 Teridian Semiconductor Corporation. All rights reserved. Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation. Windows is a registered trademark of Microsoft Corporation. Signum Systems is a trademark of Signum Systems Corporation. ExpressCard is a registered trademarks of PCMCIA. All other trademarks are the property of their respective owners. Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly contained in the Company's warranty detailed in the Teridian Semiconductor Corporation standard Terms and Conditions. The company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice and does not make any commitment to update the information contained herein. Accordingly, the reader is cautioned to verify that this document is current by comparing it to the latest version on http://www.teridian.com or by checking with your sales representative. Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618 TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com Rev. 1.2 123

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