View LA309B-1-4YG-PF_958887.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA309B-1/4YG-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LA309B-1/4YG-PF A 01 - Jul. - 2009
DCC
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA309B-1/4YG-PF Page 1/6
Package Dimensions
4.4 0.6 13.8
3.0
5.08X3 =15.24
20.3
2.54
1/4
0.5 TYP 2.54TYP
2.50.5 5.850.5 7.750.5 9.650.5
+12 Y 1 G 2
11.550.5
LYG2362/F181/H-PF
3.0
5.0 1.5MAX
Y
1/4
0.5 TYP 28.5MIN
G
1.0MIN 2.54TYP
1
2
+
-
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA309B-1/4YG-PF Page 2/6
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol Y Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature IF IFP PD Ir Topr Tstg 20 80 60 10 -40 ~ +85 -40 ~ +100 G 30 120 100 10 mA mA mW UNIT
g A J J
Typical Electrical & Optical Characteristics (Ta=25 J )
Forward voltage @20mA(V) Luminous Viewing intensity angle @10mA(mcd) 2c 1/2 (deg)
PART NO
MATERIAL
COLOR
Peak wave length f Pnm
Spectral halfwidth f nm
Emitted GaAsP/GaP Yellow LA309B-1/4YG-PF GaP Green
Lens 585
White Diffused
Min. 35 30 1.7 1.7
Max. Min. Typ. 2.6 2.6 1.8 1.8 4.5 4.5 100 100
565
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA309B-1/4YG-PF Page 3/6
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
100 10 1.0
Relative Intensity Normalize @20mA
2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0
0.1 1.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0 0.9 0.8 -40 -20 0 20 40 60 80 100
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA309B-1/4YG-PF Page4/6
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.5
Forward Current(mA)
100 10 1.0
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
-40
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9 0.8 -20 0 20 40 60 80 100
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA309B-1/4YG-PF Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C
2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:2655C Max Dipping Time:5 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260C
Temp(C) 2655 C5sec Max 5 /sec max
260X
120X
2 /sec max Preheat 60 Seconds Max
25X 0X0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA309B-1/4YG-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

▲Up To Search▲

Price & Availability of LA309B-1-4YG-PF

	To Download LA309B-1-4YG-PF Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .